CLD-AP245 Rev 0 cree Xlamp Xd16 leds · 2013-1565 Cree XQ LED tip 11/6/2014 Thursday, November 06, 2014 2:52:10 PM 1.016 Ø 0.0400 0.787 Ø 0.0310 30° J. Lancaster A B …

soldering & handling

Copyright © 2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.

Cree, Inc.4600 Silicon Drive

Durham, NC 27703USA Tel: +1.919.313.5300

ww

w.c

ree.

co

m/X

lam

pC

LD-A

P245 R

ev 0

IntroductIon

This application note applies to XLamp® XD16 LeDs, which

have order codes in the following format.

XD16xxx-xx-xxxx-xxxxxxxxx

This application note explains how XLamp XD16 LeDs

and assemblies containing these LeDs should be handled

during manufacturing. Please read the entire document to

understand how to properly handle XLamp XD16 LeDs.

table of contents

Handling XLamp® XD16 LeDs ..................................................2

Circuit Board Preparation & Layouts ........................................4

Case Temperature (Ts) Measurement Point ............................4

Notes on Soldering XLamp® XD16 LeDs .................................5

Moisture Sensitivity ..................................................................6

XLamp® XD16 LED Reflow Soldering Characteristics ............7

Chemicals & Conformal Coatings ............................................8

Assembly Storage & Handling ..................................................9

Tape and Reel ......................................................................... 10

Packaging & Labels ............................................................... 11

cree® Xlamp® Xd16 leds

http://www.cree.com/Xlamp


2

XLamp® XD16 LED SoLDEring & HanDLing

HandlIng Xlamp® Xd16 leds

manual HandlingUse tweezers to grab XLamp XD16 LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do not

push on the lens.

Minimize shear force on the lens material. Pick parts at the ceramic panel and not from the lens materials. excessive force on the lens

could damage the LeD.

Cree recommends the following at all times when handling XLamp XD16 LeDs or assemblies containing these LeDs:

• Avoid putting excessive mechanical stress on the LeD lens.

• Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect

the optical performance of the LeD.

• Cree recommends always handling XD16 LeDs with appropriate eSD grounding.

• Cree recommends handling XD16 LeDs wearing clean, lint-free gloves.

Whenever possible, Cree recommends the use of a pick & place tool to remove XLamp XD16 LeDs from the factory tape & reel packaging.

esdXD16 LeDs have no electrostatic discharge (eSD) protection and are sensitive to eSD damage. Remove XD16 LeDs from their packaging at

an eSD-safe workstation and use appropriate eSD handling protocols and precautions when handling the LeD and soldering connections

to the LeD.

Pcorrect


3


pick & place nozzleFor pick and place nozzles coming into contact with silicone-covered LeD components, Cree recommends nozzles be constructed of

non-metallic materials. Cree and several of Cree’s customers have had good success using nozzles fabricated from 95a urethane. The

following pick & place tools are specific to the XD16 LEDs.

All dimensions in mm.Measurement tolerances: .xxx = .001 mm

force limitWhen using this recommended nozzle design, do not apply more than 600 gram‑force of vertical force to the top of the XLamp XD16 LED.

excessive force on the lens could damage the LeD. When using alternate nozzle designs, the vertical force limit could be reduced and the

limit should be verified by the user to avoid damage to the LED.

1.016Ø 0.0400 0.787

Ø 0.0310

30°

J. LancasterA

B

C

D

CAD GENERATED DRAWING,DO NOT MANUALLY UPDATE

SCALE SIZE

CAD FILE: DWG. NO.A

SHEETOFREV.

DATEAPPROVALSDRAWNCHECKEDRESP ENGMFG ENGQUAL ENG

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHESTOLERANCES ARE:

DECIMALS ANGLESXX = .002XXX = .001MATERIALFINISH

32DO NOT SCALE DRAWING

ITEMNO. PART ORIDENTIFYING NO. NOMENCLATUREOR DESCRIPTION MATERIAL SPECIFICATIONQTYREQDPARTS LIST

12345678

THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OFCOUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUTTHE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED.

A

B

C

D

12345678

XXXX = .0002 1/2

REVISIONSRev. DESCRIPTION DATE APPROVEDA PRINT RELEASE JDL

11/6/2014

2013-1565 Cree XQ LED tip

11/6/2014

Thursday, November 06, 2014 2:52:10 PM

1.016Ø 0.0400 0.787

Ø 0.0310

30°

J. LancasterA

B

C

D


SCALE SIZE

CAD FILE: DWG. NO.A

SHEETOFREV.






12345678


A

B

C

D

12345678

XXXX = .0002 1/2


11/6/2014


11/6/2014


1.016Ø 0.0400 0.787

Ø 0.0310

30°

J. LancasterA

B

C

D


SCALE SIZE

CAD FILE: DWG. NO.A

SHEETOFREV.






12345678


A

B

C

D

12345678

XXXX = .0002 1/2


11/6/2014


11/6/2014



4


cIrcuIt board preparatIon & layouts

Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or

soldering XLamp XD16 LeDs onto the PCB.

The diagram below shows the recommended PCB solder pad layout for XLamp XD16 LeDs.All dimensions in mm.

Measurement tolerance: .xx = .±13 mm

recommended pc board solder pad recommended stencil pattern

case temperature (ts) measurement poInt

XLamp XD16 LeD case temperature (Ts) should be measured on the PCB surface, as close to the LeD’s base as possible. Connect the

thermocouple at a point where the voltage potential is below the rating for the meter. XD16 LeDs do not have an isolated thermal pad

and care should be exercised to avoid bridging the anode and cathode together, which may occur if the thermocouple bead is large. Cree

recommends using a 36 AWG (0.01267 mm2) thermocouple wire for Ts measurements.

It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XD16 LeD itself. In testing, Cree has found such

a solder pad to have insignificant impact on the resulting Ts measurement.

SIZE

TITLE

OF

REV.

SHEETC

DRAWING NO.

DATE

DATE

DATE

CHECK

FINAL PROTECTIVE FINISH

MATERIAL

APPROVED

DRAWN BY

THIRD ANGLE PROJECTION

SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300Fax (919) 313-5558

4600 Silicon DriveDurham, N.C 27703

UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENTMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY ANDCREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION

OF CREE INC.

NOTICE

X° ± .5°.XXX ± .25.XX ± .75.X ± 1.5FOR SHEET METAL PARTS ONLY

.XX ± .25.XXX ± .125X° ± .5°

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:

SURFACE FINISH: 1.6

1.60

1.60

.78±.10

.60

1.50

.30

1.50

.38

.3

1.5

.60

1.5

.40

.50

1.40

1.20

1/145.000C2610-00078

XD16 OUTLINE

--

--

----

----

5/18/17D. CRONIN

REVISONSREV DESCRIPTION BY DATE APP'D A INITIAL RELEASE DC 5/18/17B CHANGED OVERALL HEIGHT DC 9/19/17C CHANGED SOLDERPAD AND STENCILDC 9/19/17

RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED STENCIL PATTERN

DIMENSIONS ARE ± .13 UNLESS OTHERWISE NOTED

OPTICALREFERENCE

OPTICAL REFERENCE

SIZE

TITLE

OF

REV.

SHEETC

DRAWING NO.

DATE

DATE

DATE

CHECK

FINAL PROTECTIVE FINISH

MATERIAL

APPROVED

DRAWN BY

THIRD ANGLE PROJECTION

SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300Fax (919) 313-5558

4600 Silicon DriveDurham, N.C 27703

UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENTMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY ANDCREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION

OF CREE INC.

NOTICE

X° ± .5°.XXX ± .25.XX ± .75.X ± 1.5FOR SHEET METAL PARTS ONLY

.XX ± .25.XXX ± .125X° ± .5°

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:

SURFACE FINISH: 1.6

1.60

1.60

.78±.10

.60

1.50

.30

1.50

.38

.3

1.5

.60

1.5

.40

.50

1.40

1.20

1/145.000C2610-00078

XD16 OUTLINE

--

--

----

----

5/18/17D. CRONIN

REVISONSREV DESCRIPTION BY DATE APP'D A INITIAL RELEASE DC 5/18/17B CHANGED OVERALL HEIGHT DC 9/19/17C CHANGED SOLDERPAD AND STENCILDC 9/19/17

RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED STENCIL PATTERN

DIMENSIONS ARE ± .13 UNLESS OTHERWISE NOTED

OPTICALREFERENCE

OPTICAL REFERENCE


5


notes on solderIng Xlamp® Xd16 leds

XLamp XD16 LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the PCB on

a hotplate and following the reflow soldering profile listed on page 7.

Do not wave solder XLamp XD16 LeDs. Do not hand solder XLamp XD16 LeDs.

solder paste typeCree recommends using one of several solder pastes designed for increased solder joint reliability, for example Alpha® MAXReL™ P30,

AIM ReL22™ M8 or Indium10.1.

Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).

solder paste thicknessThe choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated

dispensing system or a solder stencil printer is recommended. Cree has seen positive results with a 3-mil stencil thickness for the stencil

layout on page 4.

X Wrong

Pcorrect

Pcorrect

Pcorrect

X Wrong


6


after solderingAfter soldering, allow XLamp XD16 LeDs to return to room temperature before subsequent handling. Handling of the device, especially

around the lens, before cooling could result in damage to the LeD.

Cree recommends verifying that soldered LeDs are not tilted, a situation called tombstoning. As a general guideline, an LeD is tilted when

the part has a low edge touching the PCB surface and a high edge above the PCB surface.

Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. This can

be done by X‑ray or by shearing selected devices from the circuit board. The solder should appear completely re‑flowed (no solder grains

evident). The solder areas should show minimum evidence of voids on the backside of the package and the PCB.

cleaning pcbs after solderingCree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary,

Cree recommends the use of isopropyl alcohol (IPA).

moIsture sensItIvIty

Cree recommends keeping XLamp LeDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.

Unopened MBPs that contain XLamp LeDs do not need special storage for moisture sensitivity.

Once the MBP is opened, XLamp XD16 LEDs may be stored as MSL 1 per JEDEC J‑STD‑033, meaning they have unlimited floor life in

conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in the

original MBP.


7


Xlamp® Xd16 led refloW solderIng cHaracterIstIcs

In testing, Cree has found XLamp XD16 LeDs to be compatible with JeDeC J-STD-020C, using the parameters listed below. As a general

guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used,

and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.

Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs and configurations of

reflow soldering equipment.

profile feature lead-free solder

Average Ramp-Up Rate (Tsmax to Tp) 1.2 °C/second

Preheat: Temperature Min (Tsmin) 120 °C

Preheat: Temperature Max (Tsmax) 170 °C

Preheat: Time (Tsmin to Tsmax) 65-150 seconds

Time Maintained Above: Temperature (TL) 217 °C

Time Maintained Above: Time (tL) 45-90 seconds

Peak/Classification Temperature (Tp) 235 ‑ 245 °C

Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds

Ramp-Down Rate 1 ‑ 6 °C/second

Time 25 °C to Peak Temperature 4 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

IPC/JeDeC J-STD-020C

TP

TL

Tem

pera

ture

Timet 25˚C to Peak

Preheatts

tS

tP

25

Ramp-down

Ramp-up

Critical ZoneTL to TP

Tsmax

Tsmin


8


cHemIcals & conformal coatIngs

Below are representative lists of chemicals and materials to be used or avoided in LeD manufacturing activities. For a complete and

current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application

Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of

chemicals and materials with LeDs. You should also consult your regional Cree Field Applications engineer.

recommended cleaning solutionsCree has found the following chemicals to be safe to use with XLamp XD16 LeDs.

• Water

• Isopropyl alcohol (IPA)

chemicals tested as HarmfulIn general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to

XLamp XD16 LeDs. Cree recommends not using these chemicals anywhere in an LeD system containing XLamp XD16 LeDs. The fumes

from even small amounts of the chemicals may damage the LeDs.

• Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)

• Methyl acetate or ethyl acetate (i.e., nail polish remover)

• Cyanoacrylates (i.e., “Superglue”)

• Glycol ethers (including Radio Shack® Precision electronics Cleaner - dipropylene glycol monomethyl ether)

• Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive)

Hermetically sealing luminairesFor proper LeD operation and to avoid potential lumen depreciation and/or color shift, LeDs of all types must operate in an environment

that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically

sealing LeDs in an enclosed space is not recommended.

http://www.cree.com/led-components/media/documents/XLamp_Chemical_Comp.pdf


http://www.youtube.com/watch?v=t24bf9D_1SA



9


assembly storage & HandlIng

Do not stack PCBs or assemblies containing XLamp XD16 LeDs so that anything rests on the LeD lens. Do not handle PCBs or assemblies

containing XLamp XD16 LeDs so that anything contacts the LeD lens. Force applied to the LeD lens may result in latent damage to the

LED. PCBs or assemblies containing XLamp XD16 LEDs should be stacked in a way to allow at least 1 cm clearance above the LED lens.

Do not use bubble wrap directly on top of XLamp XD16 LeDs. Force from the bubble wrap can cause latent damage the LeD.

Do not use PCBs or assemblies containing XLamp XD16 LeDs that have been mishandled (for example, PCBs that have been dropped on

the floor) due to the risk of latent damage to the LED.

X Wrong

Pcorrect

Pcorrect


10


tape and reel

All Cree carrier tapes conform to eIA-481D, Automated Component Handling Systems Standard.

except as noted, all dimensions in mm [in].

Measurement tolerances unless indicated otherwise: .xx = ±.10 mm

Anode

1.85 [.073]Bo

.30 [.012]T

3.0°8.00 [.315]NOMINAL

8.30 [.327]MAX

W

6.25[.246]

E2Ø1.00[.039]

D1

3.50 [.138] F

1.75 [.069]E2

Ø1.50+.10/-.00[+.0039/-.0000]4.00 [.157]

Po2.00 [.079]

P2

4.00 [.157]P

1.98 [.078]

1.85 [.073]Ao

3.0°

1.20 [.047]Ko

POCKET SIZE

1.85 mm [.073”]1.85 mm [.073”]

1.20 mm [.047”]

AoBoKo

CATHODE SIDE

ANODE SIDE

1.85 [.073]Bo

.30 [.012]T

3.0°8.00 [.315]NOMINAL

8.30 [.327]MAX

W

6.25[.246]

E2Ø1.00[.039]

D1

3.50 [.138] F

1.75 [.069]E2

Ø1.50+.10/-.00[+.0039/-.0000]4.00 [.157]

Po2.00 [.079]

P2

4.00 [.157]P

1.98 [.078]

1.85 [.073]Ao

3.0°

1.20 [.047]Ko

POCKET SIZE

1.85 mm [.073”]1.85 mm [.073”]

1.20 mm [.047”]

AoBoKo

CATHODE SIDE

ANODE SIDE

1.85 [.073]Bo

.30 [.012]T

3.0°8.00 [.315]NOMINAL

8.30 [.327]MAX

W

6.25[.246]

E2Ø1.00[.039]

D1

3.50 [.138] F

1.75 [.069]E2

Ø1.50+.10/-.00[+.0039/-.0000]4.00 [.157]

Po2.00 [.079]

P2

4.00 [.157]P

1.98 [.078]

1.85 [.073]Ao

3.0°

1.20 [.047]Ko

POCKET SIZE

1.85 mm [.073”]1.85 mm [.073”]

1.20 mm [.047”]

AoBoKo

CATHODE SIDE

ANODE SIDE

1.85 [.073]Bo

.30 [.012]T

3.0°8.00 [.315]NOMINAL

8.30 [.327]MAX

W

6.25[.246]

E2Ø1.00[.039]

D1

3.50 [.138] F

1.75 [.069]E2

Ø1.50+.10/-.00[+.0039/-.0000]4.00 [.157]

Po2.00 [.079]

P2

4.00 [.157]P

1.98 [.078]

1.85 [.073]Ao

3.0°

1.20 [.047]Ko

POCKET SIZE

1.85 mm [.073”]1.85 mm [.073”]

1.20 mm [.047”]

AoBoKo

CATHODE SIDE

ANODE SIDE

Loaded Pockets3,000 Lamps

Leader400 mm (min) of

empty pockets withat least 100 mmsealed by tape

(50 empty pockets min.)

Trailer160 mm (min) ofempty pockets

sealed with tape(20 pockets min.)

STARTEND User Feed Direction


11


packagIng & labels

The diagrams below show the packaging and labels Cree uses to ship XLamp XD16 LeDs. XLamp XD16 LeDs are shipped in tape loaded

on a reel. each box contains only one reel in a moisture barrier bag.

Patent Label(on bottom of box)

Label with Cree Bin Code, Quantity, Reel ID


Label with Cree Order Code, Quantity, Reel ID, PO #

Label with Cree Order Code, Quantity, Reel ID, PO #


Unpackaged Reel

Packaged Reel

Boxed Reel

CREE Bin Code& Barcode Label

Vacuum-SealedMoisture Barrier Bag

Label with CustomerP/N, Qty, Lot #, PO #

Label with Cree Bin Code, Qty, Lot #

Label with Cree Bin Code, Qty, Lot #

Vacuum-Sealed Moisture Barrier Bag

Patent Label

Label with Customer Order Code, Qty, Reel ID, PO #

Documents

CLD-AP245 Rev 0 cree Xlamp Xd16 leds · 2013-1565 Cree XQ LED tip 11/6/2014 Thursday, November 06, 2014 2:52:10 PM 1.016 Ø 0.0400 0.787 Ø 0.0310 30° J. Lancaster A B …