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T E C H N O L O G Y U P D A T E 2 0 1 4
As the technology move forward, the complication of the circuit board has become a bigger problem for the designer as look for a more advance PCB Manufacturer in order to support them with a higher layer counts and tighter specification.
One of our Major Goal for this 2014. We were aiming to increase our production capabilities from Maximum Layer counts of 10 Layers up to 20 Layers.
At the beginning of the year, our engineering team had started
designing the test board and copper trace for the capabilities improvement analysis.
The test sample was completed during beginning of march and we spend the entire month doing test analysis for Electrical connectivity&Isolation, structure bonding strength. PTH analysis, Delamination test, etc.
In April, we had completed all the tests and the result was “PASS”
Apart from our new 20 Layers capabilities achievement, we have also achieved these following capabilities:
- Minimum Drill hole 0.15 mm. PTH
- New PTH aspect ratio 12:1
- Maximum board thickness 3.0mm.
We go even “HIGHER”!
20 LAYERS IS HERE!
WE ARE READY
PROTOTYPE TO MASS VOLUME
TOTAL BOARD THICKNESS 3.0MM.AVERAGE HOLE WALL THICKNESS
25 µmALL LAYERS ARE BONDED WITH
OUR CCD PINLESS BONDNG
CIRCUIT INDUSTRIES
FOR MORE INFORMATION: [email protected]
HTTP://WWW.CIPCB.COM
TEL: 02-8101406
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T E C H N O L O G Y U P D A T E 2 0 1 4
Energy saving has played a major part in decision making on infrastructure development of the modern world.
LED lighting system is one of the major change to the traditional lighting bulb and tube.
People are turning to LED not only because of its energy saving benefit, it also has a longer life and giving out a brighter spectrum comparing to the old style. But the increase in
performance and lower electricity consumption comes with some draw backs.
LED gives out a brighter light which most of the energy consumed has turned into heat. This heat will have a negative effect on the LED life. Therefore, Aluminium PCB was invented to solve this problem.
By attaching Aluminium to the back of the PCB, it helps transferring a lot of heat away
from the LED and release them to the atmosphere.
By choosing to go with Aluminium PCB, we can expect a longer life time and less discoloration due to color change on LED lens from the heat.
Aluminium PCB is here!
FIRST TIME IN THAILAND. ALUMINIUM PCB IS NOW
AVAILABLE AT CI
PROTOTYPE TO MASS VOLUME
HEAT TRANSFER FROM LED NORMAL PCB AND ALPCB HEAT COMPARISON
WHITE SOLDERMASK FOR L.E.D. FOR BETTER REFLECTION
CIRCUIT INDUSTRIES
FOR MORE INFORMATION:
HTTP://WWW.CIPCB.COM TEL: 02-8101406
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T E C H N O L O G Y U P D A T E A P R I L 2 0 1 4
“We go beyond the ordinary” As the technology moves forward, the circuit board manufacturer needs to adapt to more complicated requirement from products developer in order to compete in the electronics market.
At Circuit Industries Co., Ltd. we are strived to develop our capabilities to meet such demand for the technology of the future.
Now we have completed the test run of our new 0.15mm diameter mechanical drill with copper plated through holes.
By reducing the via size that consumes a lot of space not only on the board surface for component assembly but it also restrict the inner layer trace routing. The critical point for fabricating a small via hole with copper plated through hole is the copper deposition thickness
inside the hole, because as the hole gets smaller, it is harder for the chemical to flow through during plating process.
According to IPC standard, minimum copper plating thickness is 20um. Our average plating thickness in this 0.15mm. hole is 27 um.
Less space consuming using smaller holes.
SMALLER VIA MEANS MORE SPACE FOR YOUR TRACE ROUTING AND
COMPONENT PLACEMENT.
HOLE COPPER THICKNESS CNC DRILLING MACHINE
0.15 MM. DRILL HOLE
AUTOMATIC OPTICAL INSPECTION (AOI)
FOR MORE INFORMATION:
HTTP://WWW.CIPCB.COM TEL: 02-8101406
STATE OF THE ART MACHINES
ADVANCE MACHINERY WITH TOPNOTCH PRECISION INSTALLED AT OUR FACTORY DRILL/ROUTING - POSALUX (SWITZERLAND) - SCHMOLL (GERMANY) - PLURITEC (ITALY)
AOI - ORBOTECH (ISRAEL) PRESS&BONDING - CEDAL ADARA (ITALY)
T E C H N O L O G Y U P D A T E A P R I L 2 0 1 4
CAPABILITIES
website: http://www.cipcb.com Email: [email protected]
Circuit Industries Co., Ltd.
Production Capabilities
Small Volume Mass Volume
Max. Layer Count 20 Layer 20 Layer
Aspect Ratio 12:1 12:1
Min. Drill size 0.15 mm. 0.2 mm.
Max. board thickness 3.0 mm. 3.0 mm.
Min. Prepreg thickness 0.075 mm. 0.075 mm.
Min. copper thickness 1oz(35um) 1oz(35um)
Max Copper thickness 2 oz(70um) 2 oz (70um)
Min. line/spacing (inner layer) 0.1mm. (4mil) 0.125mm (5mil)
Min. line/spacing (Outer Layer) 0.1mm. (4mil) 0.125mm (5mil)
Min. Annular Ring 0.125mm (5mil) 0.125mm (5mil)
Drill Accuracy (+/-) 35 um 35 um
image registration (+/-) 50 um 50 um
Soldermask Registration (+/-) 75 um 75 um
Rout/Score Tolerance (+/-) 0.2 mm. 0.2 mm.
Blind Via yes yes
Buried via yes yes
Production Lead time Small Volume Mass Volume
Single Sided 7-10 Days 10-12 days
Single sided Aluminium PCB 9-11 days 12-14 days
Double Sided 9-11 days 12-14 days
Multilayer 4-20 Layer 14 days 14 days
Multilayer HDI 16 days 16 days