Cicor AMS - short version

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AMS DivisionCicor Group

Version July 2015

Cicor AMS Division 02.05.2023

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The Cicor Group

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Cicor's global footprint

Global and local presence

Production / sales sitesSales representations

2015

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Cicor AMS DivisionAdvanced Microelectronics and Substrates Divison

Cicor AMS Division

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Cicor AMS Division


Production Sites

Radeberg

Thick film Micro assembly Packaging Screening / Test

Wangs

Thin film Thin film

polymer/ multilayer

High ohmic R layer

RF MEMS

Moudon

Rigid circuits Single and Double Sided

High Volume Production Site

Boudry

Flex, Rigid and Rigid/Flex Multilayer HDI Circuits

Reel-to-Reel

Ulm

Thin film Thin film flex

boards Thin film

polymer/ multilayer

Filled via

SWITZERLAND GERMANY

SALES : USA, EUROPE & ASIA

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Markets SegmentsCicor AMS Division

Cicor AMS Division

Aerospace & Defense

24%

Others

4%

Automotive & Transport

8%

Telecom

14%

Industrial

14%

Consumer

16%

Medical

20%

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Development Prototyping Pre-Series Ramp-up Series Recycling

Technologies for the entire vertical value chain, from single steps to a complete solution

One-stop-shopCicor AMS Service


Engineering

Substrates

Components

Assembly

Packaging

Test

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SubstratesThe Cicor Group – AMS Division

Printed Circuit Boards High-end flex, rigid-flex, and rigid MLBs Rigid PCBs with 1-32 layers Impedanz-controlled PCBs +/- 5% Panel and reel-to-reel production lines HDIs: laser and mechanical drilling Laser openings (cavities) + depth controlled routing Final finishings: ENIG, ENEPIG, Imm.Sn, Imm.Ag,

ASIG, OSP, electroplated Au Electroless and electroplated copper, copper filled

blind vias (stacked and staggered vias) Lines/spaces down to 25/25 μm (1 mil) Microvias down to 30 μm (1.2 mil) Non conductive epoxy via plugging


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SubstratesThe Cicor Group – AMS Division

Thin- and Thick-film Technology Thin-film (polymer, multilayer, ceramic, steel, glass,

ferrites)

Thin-film flexboards

Filled vias

Thick Cu

Thick-film (ceramic, steel)

High ohmic R layerBild durch Klicken auf Symbol hinzufügen


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MicroelectronicsThe Cicor Group – AMS Division

Board Assembly and Packaging Die attach, COB, flip chip, bare die, MMICs, SMD

(min. 01005)

(μ) BGA

Wire/ribbon bonding

Automatic ball-wedge and wedge-wedge wire bonding

Soldering, epoxy, eutectic

Packaging, glob top

MEMS / RF MEMS packaging

Hermetic housing (metal, ceramic)

Bild durch Klicken auf Symbol hinzufügen

Bild durch Klicken auf Symbol hinzufügen


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Core competences & customer benefitsCicor AMS Service

One-stop-shop Customization and flexibility to match with market needs Expertise and know-how at all stages All processes in house

Group strength Benefit from technology know-how of leading European companies Strong customer portfolio Market oriented investments

Quality products Customized products matching your technological requirements Sophisticated products for high demands on quality, accuracy and reliability Constant technology development


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MedicalApplication Examples

Cicor AMS Division

Implants

PacemakerHearing aid

Eye pressure sensorCatheter

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Cicor AMS Division

I/R Sensor

Galileo SAR-Transponder

Silicon Tracker Module

MEMSScanner

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Cicor AMS Division

Airbag

NetworkT/R Module

HF LinesWatches

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We look forward to a pleasant cooperation!

Further information:www.cicor.com


Documents

Cicor AMS - short version