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VLSITechnology
Implementa3onTrioAdiono
www.paume.itb.ac.id/~tadiono/el-4040/
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DesignParameters
ByWhichDesignSuccessisMeasured: PerformanceSpecs-func3on,3ming,speed,power SizeofDie-manufacturingcost TimetoDesign-engineeringcostandschedule EaseofTestGenera3on&Testability-engineeringcost,
manufacturing,cost,schedule
Manufacturability-resilienttocircuit/processvariability
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Implementa3onChoices
Custom
Standard CellsCompiled Cells Macro Cells
Cell-based
Pre-diffused(Gate Arrays)
Pre-wired(FPGA's)
Array-based
Semicustom
Digital Circuit Implementation Approaches
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DesignandTechnologyStyles
CustomDesignMostlymanualdesign,longdesigncycleHighperformance,highvolumeMicroprocessors,analog,leafcells,IP
SemiCustom:StandardCell
Pre-designedcells,CAD,shortdesigncycleMediumperformance,ASIC
FPGA/PLDPre-fabricated,fastautomateddesign,lowcostPrototyping,reconfigurablecompu3ng
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ChipSizeforDifferentTechnology
Gate Array
Standard Cell
Full Custom
Chip Area Ratios:3:2:1
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PerformancevsDesignTIme
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FullCustom
CustomDesignisusedwhenperformanceordesigndensityistheprimaryimportance.
CustomDesign:laborintensivehighcostandlong!metomarket
Onlyjus3fiedeconomicallyunderthefollowingcondi3ons:Thecustomblockcanbereusedmany3mes(for
example,asalibrarycell)
Thecostcanbeamor3zedoveralargevolume.(forexample,memories)
Costisnottheprimedesigncriterion,asitisinsupercomputersorhypersupercomputers.
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CustomCircuitDesign
CustomdesigninIntelPen3um4,onlythemostperformance-cri3calmodulessuchasthePLLandtheclockbuffer.
Customdesignisusedindesigninglibrarycell.Intel 4004
Courtesy Intel
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CustomDesignEnvironment
LayoutEditors Electrical-RuleCheckers(ERC) Design-RuleChecker(DRC) Verifica3onTool Simula3onTool Extrac3onToolModelingTool
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Example:CustomDesign
Basicbuildingblock:SRAMCell Holdsonebitofinforma3on,likealatch Mustbereadandwri]en
12-transistor(12T)SRAMcell Useasimplelatchconnectedtobitline 46x75unitcell
bit
write
write_b
read
read_b
Schematic Layout8/20/12 EL-4040 Perancangan Sistem VLSI 10
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DesignRuleChecker(DRC)
Poly_not_fet to all_diff minimum
spacing = 0.14 um.
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StandardCell
ReusingalimitedlibraryofcellsStandardizedesignentrylevelatthelogicgate Standardiza3onisachievedatthelogicorfunc3onlevel
Specificdesignsforeachgatecandevelopedandstoredinasowaredatabaseorcelllibrary.
(Behavioral,Structural,andPhysicalDomaindescrip3onspercell)
Layoutisusuallyautoma3callyplacedandroutedusingCADsoware
Predominantfull-customdesignstyle Adesigniscapturedasaschema3c
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StandardCell
Advantage:CellsonlyneedtobedesignedandverifiedonceCanbereusedmany3mes
Disadvantage:Reducethepossibilityoffine-tuningthedesignReducetheintegra3ondensityand/orperformance.
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StandardCell
Librarycontainsawideselec3onoflogicgates:
SSIlogic:e.g.nand,nor,xor,inverters,buffers,latches,registers
+Eachgatecanhavemul3pleimplementa3onstoprovideproperdrivefordifferentfan-outs,e.g.standardsize,2x,4x
MSIlogic:e.g.decoders,encoders,adders,comparatorsDatapath:e.g.ALUs,adders,registerfiles,shiersMemories:e.g.RAM,ROM Systemlevelblocks:e.g.mul3pliers,microcontrollers
Multiplier Adder
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StandardCell
Routing channelrequirements are
reduced by presence
of more interconnect
layers
Layoutisautoma2callygenerated
restric2ononlayoutop2onsCellsare
-Placedinrowsthatisseparatedby
rou2ngchannels.
-Allcellsinthelibraryhavetohave
iden2calheights.
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StandardCells
UniformcellheightUniformwellheight
M1VDDandGNDrails M2AccesstoI/Os Well/substratetaps Exploitsregularity
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SynthesizedStandardCell
SynthesizeHDLintogate-levelnetlist Place&Routeusingstandardcelllibrary Asubstan3alfrac3onofareadevotedtosignalrou3ng. Thegoalofplacementandrou3ngtoolsistominimizedinterconnectoverhead. Byfeed-throughcells Byaddingmoreinterconnectlayer
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StandardCell
SSI/LSI blocks: layout style is rows of constant hight blocksseparated by rows of routing.
SSI/LSI standard cell concept is extended to higher levelfunctions, often available as parameterized modules.
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StandardCell
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StandardCell
Layoutstrategy: Supplylinearedistributehorizontallyandsharedbetweencellsinthesamerow Inputsignalsarewiredver3callyusingpolysilicon Input/outputterminalsarelocatedthroughoutthecellbody
Thesuccessofthestandardcellapproachanbea]ributedto:
Theincreasedqualityoftheautoma3ccellplacementandrou3ngtools
Theadventofsophis3catedlogic-synthesistools:usingmul3levelofabstrac3ons
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StandardCellExample
[Brodersen92]
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StandardCell
Cell-structurehidden under
interconnect layers
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StandardCell-Example
3-input NAND cell
(from ST Microelectronics):C = Load capacitanceT = input rise/fall time
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Automa3cCellGenera3on
Courtesy Acadabra
Initial transistor
geometries
Placed
transistors
Routed
cell
Compacted
cell
Finished
cell
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MacroModules
25632 (or 8192 bit) SRAMGenerated by hard-macro module generator
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SoMacroModules
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IntellectualProperty
A Protocol Processor for Wireless
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SemicustomDesignFlow
HDL
Logic Synthesis
Floorplanning
Placement
Routing
Tape-out
Circuit Extraction
Pre-LayoutSimulation
Post-LayoutSimulation
Structural
Physical
BehavioralDesign Capture
DesignIt
eration
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TheDesignClosureProblem
Courtesy Synopsys
Iterative Removal of Timing Violations (white lines)
h h h l
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Integra3ngSynthesiswithPhysicalDesign
Physical Synthesis
RTL (Timing) Constraints
Place-and-RouteOptimization
Artwork
Netlist withPlace-and-Route Info
MacromodulesFixed netlists
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G t A
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Gate Array" Gate Array: A gate array is where the logic network can be
programmed into the device near the end of its manufacture,
during the metallization phase. " Advantages: Fast time-to-market, low Non-Recurring
Engineering (NRE) charges, lower cost." Disadvantages: Poor silicon utilization, limited mixed-signal
capability, poor per-formance relative to the cell-basedapproach." Alt. Designations: Sea-of-gates, embedded array,
embedded in an array (considered by In-Stat/MDR as astandard cell)."
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( )
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ProgrammableLogicArray(PLA)
x0 x1 x2
ANDplane
x0x1
x2
Product terms
ORplane
f0 f1
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l
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Two-LevelLogic
Inverting format (NOR-
NOR) more effective
Every logic function can beexpressed in sum-of-products
format (AND-OR)
minterm
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PLA L t E l i3 l it
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PLALayoutExploi3ngularity
f0
f1
x0
x0
x1
x1x2
x2
Pull-up devices Pull-up devices
VDD GNDAnd-Plane Or-Plane
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B hi S N Lif i PLA
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BreathingSomeNewLifeinPLAs
RiverPLAs
Acascadeofmulple-output PLAs. AdjacentPLAsareconnectedviariverroung.
PRE-CHARGE
PRE-
CHARGE
PRE-CHARGE
PRE-CHARGE
BUFFER
BUFFER
BUFFER
BUFFER
PRE-CHARGE
PRE-CHARGE
BUFFER
BUFFER
PRE-CHARGE
PRE-
CHARGE
BUFFER
BUFFER
No placement and routing needed. Output buffers and the input buffers
of the next stage are shared.
Courtesy B. Brayton8/20/12 EL-4040 Perancangan Sistem VLSI 35
elay
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ExperimentalResults
LayoutofC2670
Network of PLAs,
4 layers OTC
River PLA,
2 layers no additional routing
Standard cell,
2 layers channel routing
Standard cell,
3 layers OTC
0.2
0.6
1
1.4
0 2 4 6 area
de
SC NPLA RPLA
Area:RPLAs (2 layers) 1.23SCs (3 layers) - 1.00,
NPLAs (4 layers) 1.31
DelayRPLAs 1.04SCs 1.00NPLAs 1.09
Synthesis time: for RPLA , synthesis time equals design time;SCs and NPLAs still need P&R.
Also: RPLAs are regular and predictable
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L t Bi di I l t 3
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Pre-diffused(Gate Arrays)
Pre-wired(FPGA's)
Array-based
Late-BindingImplementa3on
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G t A S f t
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GateArraySea-of-gates
rows of
cells
routing
channel
uncommitted
VDD
GND
polysilicon
metal
possible
contact
In1 In2 In3 In4
Out
Uncommited
Cell
CommittedCell
(4-input NOR)
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Sea of gate Primi3 e Cells
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Sea-of-gatePrimi3veCells
N M O S
P M O S
O x id e - i s o l a t io n
P M O S
N M O S
N M O S
Using oxide-isolation Using gate-isolation
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Sea of gates
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Sea-of-gates
Random Logic
MemorySubsystem
LSI Logic LEA300K(0.6 m CMOS)
Courtesy LSI Logic
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The return of gate arrays?
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Thereturnofgatearrays?
The image cannot be displayed. Yourcomputer may not have enoughmemory to open the image, or theimage may have been corrupted.Restart your computer, and then openthe file again. If the red x still appears,you may have to delete the image andthen insert it again.
The image cannot be displayed. Yourcomputer may not have enoughmemory to open the image, or theimage may have been corrupted.Restart your computer, and then openthe file again. If the red x stillappears, you may have to delete theimage and then insert it again.
metal-5 metal-6
Via-programmable cross-point
programmable via
Via programmable gate array
(VPGA)
[Pileggi02] Exploits regularity of interconnect
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User Programmable Logic
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User-Programmable Logic" User-Programmable Logic: User-Programmable Logic (UPL) is
comprised of three unique product families; Simple Programmable Logic
Devices (SPLDs), Complex Programmable Logic Devices (CPLDs), andField-Programmable Gate Arrays (FPGAs), with FPGAs being the mostcommonly used UPL. Memory programming architectures mostcommonly used in these products are static RAM, EEPROM, flashmemory and anti-fuse. Density measurements of user-programmablelogic products vary with the product, with the most common for FPGAs
being system gates, and for CPLDs, Look Up Tables (LUTs). Dependingupon whom one talks to, a system gate can range anywhere from 8-12ASIC gates."
Advantages: Very low, if any, non-recurring engineering charges, veryrapid time-to- market, and depending on particular product andarchitecture, can be of very low cost, with the emphasis on can. Unless
it is a fused or ant-fused architecture, UPL can be reconfigured in thefield."
Disadvantages: Poor silicon utilization, considerably lower performancecompared to an equivalent cell-based design, extremely limited analogcapability."
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Prewired Arrays
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PrewiredArrays
Classifica3onofprewiredarrays(orfield-programmable
devices): BasedonProgrammingTechnique
Fuse-based(program-once)Non-vola3leEPROMbased RAMbased
ProgrammableLogicStyle Array-Based Look-upTable
ProgrammableInterconnectStyle Channel-rou3ngMeshnetworks
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RAM based FPGA
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RAM-basedFPGA
Xilinx XC4000exCourtesy Xilinx8/20/12 EL-4040 Perancangan Sistem VLSI 44
A Low Energy FPGA (UC Bey)
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ALow-EnergyFPGA(UCBey)
qArray Size: 8x8 (2 x 4LUT)
q Power Supply: 1.5V &0.8V
q Configuration: Mapped asRAM
q Toggle Frequency:125MHz
qArea: 3mm x 3mm
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Larger Granularity FPGAs
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LargerGranularityFPGAs
q 1-mm 2-metalCMOS tech
q 1.2 x 1.2 mm2q
600k transistors
q 208-pin PGAq fclock = 50 MHz
q Pav = 3.6 W @ 5Vq Basic Module: Datapath
PADDI-2 (UC Berkeley)
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Structured ASIC
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Structured ASIC" Structured ASIC: A MOS cell-based design, which includes
the capability to be repro-grammed, as well as having its logic
reconfigured, by one of several approaches, includingembedded gate array, FPGA and fuse."
Advantages: Rapid time-to-market, lower non-recurring NREcharges than those associated with the cell-based approach,excellent mixed-signal capability, multi-applicationalpossibilities."
Disadvantages: As a customer, you have to be involvedearly in the device design cycle, so costs will be higher thanthose associated with the gate array, for example."
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Structured ASICs
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StructuredASICs
StructuredASICsareanewbreedofcustomdevicethatapproachtheperformanceoftoday'sStandardCellASICwhiledrama3callysimplifyingthedesigncomplexity.StructuredASICsofferdesignersasetofdeviceswithspecific,customizablemetallayersalongwithpredefinedmetallayers,whichcancontaintheunderlyingpa]ernof
logiccells,memory,andI/O.
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Design at a Crossroad
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DesignataCrossroad
System-on-a-Chip
RAM
500 k Gates FPGA
+ 1 Gbit DRAM
Preprocessing
Multi-
Spectral
Imager
Csystem
+2 Gbit
DRAMRecog-
nition
A
nalog
64 SIMD Processor
Array + SRAM
Image Conditioning100 GOPS
q Embedded applicationswhere cost,performance,
and energy are the real
issues!
q DSP and control intensiveq Mixed-modeq Combines programmable
and application-specificmodules
q Software plays crucial role
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T i3 t A t 3 d R l St t
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Transi3ontoAutoma3onandRegularStructures
Intel 4004 (71) Intel 8080
Intel 8085
Intel 8286 Intel 8486Courtesy Intel
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Architecture Re-Use
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ArchitectureRe-Use
SiliconSystemPlaorm Flexiblearchitectureforhardwareandsoware Specific(programmable)components Networkarchitecture Sowaremodules RulesandguidelinesfordesignofHWandSW
HasbeensuccessfulinPCs Dominanceofafewplayerswhospecifyandcontrolarchitecture
Applica3on-domainspecific(differenceinconstraints) Speed(computepower) Dissipa3on Costs Real/non-real3medata
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Berkeley Pleiades Processor
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BerkeleyPleiadesProcessor
0.25um 6-level metal CMOS !5.2mm x 6.7mm!1.2 Million transistors!40 MHz at 1V!2 extra supplies: 0.4V, 1.5V!1.5~2 mW power dissipation!
Interface
Reconfigurable
Data-path
FPGA
ARM8 Core
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Heterogeneous Programmable Plaorms
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HeterogeneousProgrammablePlaorms
Xilinx Vertex-II Pro
Courtesy Xilinx High-speed I/O
Embedded PowerPc
Embedded memories
Hardwired multipliers
FPGA Fabric
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Regularity
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Regularity
DESIGNTHECHIPHIERARCHYINTOIDENTICALORSIMILARMODULESEXTENDEDUSEOFREGULARITYSIMPLIFIESTHEDESIGNPROCESS
REGULARITYCANEXISTATALLLEVELSOFDESIGNHIERARCHY
CircuitLevel:uniformtransistorsizesratherthanmanuallyop3mizingeachdevice
LogicLevel:iden3calgatestructuresratherthancustomizeeverygate
ArchitectureLevel:constructarchitecuresthatuseanumberofiden3calProcessorstructures
8/20/12 EL-4040 Perancangan Sistem VLSI 54
Linear Array
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LinearArray
LinearArray:Theanalogworldsanswertothegatearray.Aseriesoftransistors,resistorsandcapacitors,whichare
interconnectedduringthemetalliza3onprocess,toformvarious
analogfunc3ons.Someofthesedeviceswillcontainlimitedlogic
(ormixed-signal)capability,usuallylimitedtoonlyafewthousand
gates.Whilethistechnologysegmenthassurvivedandgrownover
theyears,itisprimarilylimitedtoanalog-onlydesigns.Thistechnologyisavailablefromonlyafewsuppliers,mostofwhich
aresecond-3erplayers.However,itisimportanttonotethata
widevarietyofembeddableandconfigurableanalogcoresare
availablefromawidesupplierbase,includingbothIDMsandIP
providers.