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Capacitor Selection for DC/DC Convertors:
From Basic Application to Advanced Topics
TI – Silicon Valley Analog in Santa Clara California USA -
This course written by: Simple Switcher Applications Team Members:• Alan Martin
• Marc Davis-Marsh
• Giuseppe Pinto
• Ismail Jorio
Additional material provided by Chuck Tinsley of capacitor manufacturer KEMET
1
Table of Contents
2
Capacitors types for DC/DC Conversion
CeramicElectrolytic Tantalum Polymer
Advanced Applications in DC/DC Converters
Typical Characteristics
Advantages and Disadvantages
Failure ModesSelection Process
Buck Boost
Measurement of capacitor parasitics
Simple method to reduce high
frequency noise in SMPS
Estimating output voltage ripple and transient
response
RMS current ratings by topology
2
Capacitor Types
3
Capacitor Chemistry - Value and Voltage rating
4
100uF -10000uF
0.1uF-100uF
1pF – 0.1uF
Cap
acita
nce
Voltage
2V 4V 16V 25V 50V 100V
COG
X5RX5R/X7R
Tantalum
Polymer
Electrolytic
Aluminum Electrolytics - Overview • Least Expensive Capacitors for Bulk Capacitance
– Multiple vendors– Small size, surface mountable
• How is it made?– Etched foil with liquid Electrolyte– Placed in a can with a seal/vent
• Highest ESR
• Low Frequency Cap roll off due to higher ESR
• Wear Out Mechanism – Limited lifetime– Liquid electrolyte – with a vent– Cap changes over time with Voltage and Temp– ESR changes over time
• Mounting– High shock and vibration can cause failure
5
Aluminum Electrolytics - Packaging• Through hole versions, usually in a round can.
– Large ones have screw terminals or solder lugs– Radial or axial leads– Non SMT may have higher inductance because of long leads
• Surface mountable versions, are modified from radial leaded versions.– SMT versions usually have the capacitor value visibly printed on can.– SMT versions may use letter codes instead of numeric rating.
- +- +
6
Aluminum Electrolytics - Advantages
• Low Cost – Mature technology with low cost materials
• Long History– (Industry started in the 1930’s )
• Many Manufacturers to choose from.
• High capacitance values available.
• Only choice for SMPS that need high voltage and high capacitance.
7
Aluminum Electrolytics - Disadvantages• Large swings in ESR vs temperature
– Cold temps have 4-8x higher ESR than at room temperature
8
Aluminum Electrolytics - Disadvantages• Large Parasitics
– High ESR (Effective Series Resistance)– High ESL – (Effective Series Inductance).
• Electrolytic capacitors eventually degrade over the life of the product.– The electrolyte eventually dries out. – Long term storage may cause Aluminum oxide barrier layer to de-form.
• Capacitance drops• ESR increases.
– Higher ESR causes more internal heat causing it to dry out even faster. – This effect is worse at high temperatures.
– (Lesson: Don’t use “old stock” aluminum capacitors in your product.)
• Needs a ceramic in parallel for switch mode applications.– High esr and esl can cause SMPS malfunction.
• Have measurable dc leakage current.– Probably not an issue in power circuits;
• Leakage current can be a problem in timing circuits.
9
Aluminum Electrolytic - Venting failure
450V rated capacitors after accidental application of 600V
10
• Fails open or shorted.
• Catastrophic explosive venting – From Over-Voltage of the capacitor. – From exceeding the Ripple Current Rating of a capacitor
• May have the same effect as overvoltage; but it takes longer for the capacitor to overheat and vent.
Ceramics - Overview• Lowest Cost devices
– Primarily for decoupling and bypass applications– Multiple vendors, sizes– Surface mountable
• How is it made?– Alternating layers of electrodes and ceramic dielectric materials
• Significant effects for Class 2 Dielectrics i.e. X5R, X7R.– Voltage bias effect– Temperature effects– Ageing
• 2%/decade hour for X7R, • 5%/decade hour for X5R• Starts decay after soldering
– High Q • Frequency selective
11
Ceramic Dielectric – 3 Character Codes
• Class 1: (Best Performance)– Temperature Coefficient
Decoder
12
• Class 2: (Higher Capacitance)– Temperature and Capacitance
Tolerance Decoder
• Typical Values:– X5R,X7R, values up to 150uF
• Typical Values:– NP0,C0G, values up to 100,000pF
Ceramic Capacitors - Advantages
• Low Cost – Mature technology with low cost materials
• Many Manufacturers to choose from.
• Reliable and rugged– Extremely tolerant of over voltage surges
• Best Choice for local bypassing
• Not Polarized
• Lowest effective series resistance (Low ESR) – several milliohms– Leads to high RMS current rating
• Low effective series inductance (Low ESL)– < 3nH
13
Ceramic Capacitors - Disadvantages
• Capacitance limited to around 150 uF / 6.3V
• Large body sizes prone to cracking with PCB flexing. Several small units in parallel may be a better choice.
• Have both a voltage and temperature coefficient that reduces capacitance value.
• Some large package size units exhibit piezo-electric audible “singing”. – Difficult to control. (Ceramic speaker effect.)– More noticeable with Class 2 dielectrics
• Incomplete data sheets!! – ESR, ESL, SRF and Ripple Current rating often missing from data sheets – Contact the manufacturer for ripple current
• Capacitance value not printed on SMT device package. – Impossible to visually inspect for value once mounted on the PCB.
• Some power supply circuits are not stable with ceramic output capacitors.– Usually LDO’s and parts using COT control
14
Ceramics - Cracking• Flex cracking – Number 1 Failure Mode!
– Cracks formed after mounting to PCB• Mechanically stressed after assembly• Larger parts, generate cracks more easily• Usually Fails shorted
• Voltage de-rating– Not required for COG, X7R and X5R…but…
• Voltage bias or capacitance loss increases as you approach rated voltage on X5R/X7R devices
15
Voltage Bias Effect on X5R - example• X5R, 10uF, 6.3 volt Ceramic capacitor at 0, 3.15 and 6.3 volt bias
– 10uF becomes 2.9uF under 6.3V bias condition• Doesn’t include, temperature, ageing and initial tolerance!!!!!!!!!
16
10uF
2.9uF
0V Bias
6.3V Bias
3.15V Bias
Voltage Bias Effect Including Case Size
17
1uF 0603
1uF 1206
1uF 0805
X5R, 16V Rated Capacitors
Capacitance decreases more quickly with smaller Case sizes
Ceramic capacitance change due to temperature
AVX Capacitor X5R dielectric - typical of any brand
You lose another 10% over temperature
18
Y5V dielectric characteristics
DO NOT USE! Y5V and Z5U ceramic dielectrics for power supply designs
19
Tantalum – Overview (MnO2 based)• High Capacitance per unit Volume Technology
– Small package sizes available • Thin devices are available
• How is it made?– Tantalum Anode pressed around a tantalum wire– Oxide grown on surface– Cathode formed by dipping and heat conversion MnMnO– Epoxy encapsulated
• Old technology– Requires 50% Voltage derating
• PPM failure rates increase exponentially above 50% voltage derating– Can fail explosively– High ESR compared to Polymer types– Fairly low cap roll off vs. frequency
Tantalum Model
20
2
Solid Tantalum Capacitors - Packaging
Usually rectangular Surface Mount Technology – SMT machine mountable
Capacitance ratings for 1uF to 1000uF
21
+
-
+
-
- +
Solid Tantalum Capacitors - Advantages
• Lots of capacitance in a small package.– 1uF to 1000uF max
• Medium-high effective series resistance (Low ESR) – 10 to 500 milliohms– Medium level of RMS current
• Low effective series inductance (Low ESL)– < 3nH
• Numerous manufacturers
• Good datasheet vs. electrolytic
22
Solid Tantalum Capacitors - Disadvantages
• Limited voltage range 50V rating max. – Therefore for circuit voltages less than 25 or 35VDC.
• Fairly high in cost– Historically Tantalum has had supply shortages
• Limited inrush surge current capability. – Do not use tantalum for hot pluggable input capacitors!
23
Don’t Hot plug tantalum!
Solid Tantalum Capacitors – Application Safety
• ALWAYS observe voltage polarity
• DO NOT exceed voltage rating.
• DO NOT exceed inrush surge rating
• Can fail catastrophically if misapplied.
• Can fail open or short
24
Polymer - Overview• Highest Capacitance per unit Volume Technology
– Small package sizes available
• How is it made?– Tantalum Anode pressed around a tantalum wire– Oxide grown on surface– Cathode formed by dipping into Monomer and cured at room temperature– Epoxy encapsulated
• Lower ESR vs MnO2 based Tantalums– Higher frequency operation – over a Mhz…still looks like a cap!– Lower power dissipation
• Higher ripple current capability• May need less capacitance
25
Polymer & Organic Capacitors - Packaging
• SMT Block style similar to tantalum.
• Round / Radial versions in SMT and through-hole.
• Types– Tantalum polymer / Aluminum polymer / Organic semiconductor
26
-
+
-
+
- +
OSCON
PosCap
Kemet Tantalum Polymer
Polymer & Organic Capacitors - Advantages
• Low ESR – but not as low as equivalent ceramic.
• Low ESL– depending on construction method
• New technology – Designed for SMPS.
• Can be very low profile.
• High capacitance per unit volume.– Much better performance than aluminum electrolytic and much smaller in
size.
• No voltage coefficient.
• Viable alternative to solid tantalum.
27
Polymer - Continued• Voltage de-rating is 10/20% depending on rated voltage
– PPM failure rates significantly reduced
• Can withstand higher transient voltages
28
Polymer & Organic Capacitors - Disadvantages
• High cost
• Voltage surges capability depends on chemistry.– Oscon very intolerant of voltage surges
• Tend to be from a single supplier. – May have availability issues.
Polymer & Organic Capacitors – Failure Mode
• Tantalum Polymer
• Less prone to catastrophic failure than solid tantalum but will still vent and emit smoke.
• Organic (OSCON)
• Emits noxious smoke.
29
Capacitor Chemistry - Quick Comparison
Numerical Rankings from 1 (Best) to 5 (Worst)
30
Capacitor Chemistry – General Parameters
31
DC/DC Converter Topologies
32
Capacitor Selection for DC/DC converters
Design factors that are known before selecting capacitors :
33
• Switching frequency Fsw : From 50KHz (High power) to 6MHz (Low power)• Input voltage range Vin • Output voltage Vout• Switch duty factor Duty Cycle (D) ~ Vout/Vin (for Buck/Step Down)• Output current Iout• Inductance L is usually designed such that the ripple current is
~30 - 40% of Iout at the switching frequency• Topology Chosen in architectural stage
Capacitor Selection for DC/DC converters
RMS current of a capacitor is one of the most important specifications for capacitor reliability
34
It also effects the converters performance, and varies by topology
• Self-Heating Proportional to RMS Current and Internal Losses
• Voltage Ripple Higher RMS Current leads to larger voltage ripple
Let’s calculate RMS current for different topologies
35-
+
Common Topologies - BUCK
Buck Converter
Boost Converter
Buck-Boost Converter
Critical path
Switching Current exist in the input side
36
-+
Common Topologies - BUCK
Buck Converter
Boost Converter
Buck-Boost Converter
Input Capacitor RMS Current
Output Capacitor RMS Current
37
-+
Common Topologies - BOOST
Buck Converter
Boost Converter
Buck-Boost Converter
Critical path
38
-+
Common Topologies - BOOST
Buck Converter
Boost Converter
Buck-Boost Converter
Input Capacitor RMS Current
Output Capacitor RMS Current
39
-+
Common Topologies – BUCK BOOST
Buck Converter
Boost Converter
Buck-Boost Converter
-+
Critical path
Non-Inverting
Inverting
40
-+
Common Topologies – BUCK BOOST
Buck Converter
Boost Converter
Buck-Boost Converter
-+
-+
Input Cap RMS Current
Output Cap RMS Current
Mode 1 (Buck) Mode 2 (Boost)
Non-Inverting
Input Cap RMS Current
Output Cap RMS Current
Additional Topologies
41SLUW001A
Capacitor Parasitics
42
Ideal capacitor compared to actual capacitor
You buy this You get this
22uF 4V X5R 0603 Ceramic
Voltage and Temperature De-rated Capacitance
(ESL)
Effective Series Inductance
- Parasitic inductance term -
(ESR)
Effective Series Resistance
- Parasitic resistance term -
Buy one part – Get three for the price of one!
43
Know your parasitics! They are very important!
• Equipment to use to measure capacitor parasitic elements.
• RLC Analyzer– Some can apply DC bias
• RF Network Analyzer – DC bias can easily damage analyzer source and receiver inputs– AC performance measurement very accurate.– Agilent (aka Hewlett Packard) i.e. HP3755A goes to 200MHz – Many other brands
• Frequency Response Analyzer– Allows DC bias so voltage coefficient can be measured. RLC results are less
accurate. Frequency range is lower than network analyzer – 30 MHz max; Usually just 1 or 2 MHz range. May allow plotting on reactance paper
with line of constant capacitance and constant inductance. FRA is also used for loop stability analysis.
– Brands – Venable Industries – Ridley (A/P) several others.
Measure the parasitic terms and include them in the design
44
Comparison of capacitor types using Frequency Response Analyzer- Shown in reactance coordinate system -
5 different types of 22uF capacitor
45
Comparative performance of different capacitor types using RF Network Analyzer
1.0 Ohm
0.1 Ohm
0.01 Ohm
0.316 Ohm
0.0316 Ohm
0 deg
45 Deg
-45 deg
-90 deg
90 deg
Aluminum Electrolytic
Cer
amic
Lead
ed O
S-C
ON
Tant
alum
Pos
-Cap
Same Five 22uF
Capacitors
46
Reducing Ripple and Transient Response
47
Output Caps Selection
The output capacitor must be designed to fulfill mainly two requirements:
1. To keep the steady-state peak-to-peak output voltage ripple below the
maximum allowed value ∆Vopp
2. To keep the output voltage waveform within the required regulation
window [Vo ± ∆Vo_reg] during the overshoot and undershoot caused by
output current transients
The output capacitor design of a buck converter will be discussed in this presentation
48
48
Output Caps Selection – output ripple• Boundary conditions formulated separately for ESR and C of the output capacitor may lead to
selection of oversized commercial components. Please note that there is a phase shift
between the contribute of C and the contribute of ESR.
• In this presentation an approach based on Acceptability Boundary Curves which jointly
considers the effect of ESR and C will be shown.
49
49
Output Caps Selection – stray inductances in output ripple analysis
50
50
• Depending on the constant ESR x C, the output
voltage waveform can change from quasi-triangular
to quasi-sinusoidal.
• The effect of stray inductances can be easily
separated from the effect of the principal parameters
ESR and C of the capacitor. In fact, stray
inductances produce additive step-up and step-
down effects on the output voltage, whose
amplitude is given by:
Dominant ESR
NO ESL
Dominant C
Includes ESL
Ceramic Bad layout
ElectrolyticTantalum
Output Voltage Ripple by Chemistry
51
51
Inductor Current
Ceramic
Tantalum Polymer
OSCON
Electrolytic
This plot shows a comparison of the output voltage ripple of a buck converter using 4 different capacitor chemistries. All caps = 47uF. Scale = 20mV/div
Output Caps Selection – stray inductances in output ripple analysis
• In order to take in account the effect determined by the equivalent series inductance (ESL) of
the output capacitor and by the inductance of the printed circuit board trace LPCB it is sufficient
to replace the maximum allowed peak-to-peak output ripple voltage amplitude ΔVOpp with the net
effective peak-to-peak ripple voltage ΔVOppeff allowed to ESR and capacitance C, given by:
• If ESL and LPCB are unknown, the previous formula can also be used to determine the maximum
allowed ESL compatible with the ESR and capacitance C of a capacitor selected with the
algorithm not including the LPCB :
52
52
Output Caps Selection – output ripple analysis
• The remaining part of the peak to peak output ripple voltage can be determined by analyzing the
circuit in the time intervals between switching instants and can be derived by integrating the current
flowing into the output capacitor:
53
53
Where:
ON TIME
OFF TIME
ESR contributeInitial voltage charge
capacitance contribute
• Current flowing into the output capacitor is given by :
ON TIME
OFF TIME
Output Caps Selection – output ripple analysis• In order to determine analytical expression of output voltage ripple,
maximum and minimum values of output voltage waveform must be
computed.
• Instant when minimum occurs is given by:
54
54
• Instant when maximum occurs is given by:vO(tmin)
vO(tmax)
The analytical output ripple is given by:
∆VOpp = vO(tmax) - vO(tmin)
DOMINANT ESR case
Output Caps Selection – output ripple analysis
• Two different Domain Boundary Curves (DBC) can be defined as for D < 0.5 and D > 0.5
• Three different Acceptability Boundary Curves (ABC) can be defined for HIGH, MID and LOW ESR case
55
55
For D < 0.5 :
ESR ≥ Rs- HIGH ESR
Ri- < ESR < Rs- MID ESR
ESR ≤ Ri- LOW ESR
Please note that boundaries
are duty cycle and switching
frequency dependent
+ESR > Rs+
ESR < Ri+
Rs+< ESR < Ri+
HIGH ESR
HIGH ESR
MID ESR
MID ESR
LOW ESR
LOW ESR
Output Caps Selection – output ripple analysis
• The following figure shows Domain Boundary Curves (DBC) and the Acceptability Boundary Curves (ABC) in ESR-C plane for D = 33% , ∆iLpp = 0.8A, ∆Vopp_eff = 55mV, fS = 500kHz. In applications where D > 0.5 the DBC are inverted.
• ABCs allow to quickly figure out real feasible capacitors representing possible design solutions when load transient constraints are not needed. A real capacitor whose values of ESR and C correspond to a point located below ABCs (green area) is suitable to meet ripple constraints requirements.
56
56
HIGH ESR
MID ESRLOW ESR
HIGH ESRMID ESRLOW ESR
Output Caps Selection – output ripple analysis – simplified formula
57
57
• A simplified equation can be derived by calculating the fundamental component of the output ripple voltage as:
• There is an overestimation of the needed output cap nearby the MID ESR area
Output Caps Selection – load transient
58
58
• The overshoot (or undershoot) occurs because of the surplus (or deficit) of charge in the output capacitor.
• Let’s define the allowed variation for the output voltage as ∆Voreg
• Because of slope constraints due to the inductor: when D < 0.5 the overshoot is greater than the undershoot and vice versa when D > 0.5
OVERSHOOT
UNDERSHOOT
Output Caps Selection – load transient analysis
59
59
• The instant when the peak of the overshoot occurs depends on the type of the output capacitor.
• The exact point where peak overshoot is reached, and its magnitude, must be calculated by taking into account joined influence of C and ESR.
Output Caps Selection – load transient
60
60
• Three different cases can be considered when load transient occurs:
1. stepwise load transient: load transient duration TLT is much smaller than closed loop system’s response time
given by the crossover frequency fC, TLT << 1/(4fC)
2. fast load transient: load transient duration TLT is smaller than closed loop system’s response time TLT < 1/(4fC)
3. slow load transient: load transient duration TLT is larger that closed loop system’s response time TLT > 1/(4fC)
• In 1st and 2nd case the control network is not able to compensate output voltage variations suddenly
after a load variation. Hence, the output filter must be designed to keep the output voltage within the
maximum allowed range in early time after the load transient until the loop has the chance to respond.
The impact of load transient constraint on the output
capacitor size is lower in 3rd case. For this reason worst
case stepwise load transient is treated. The output
current slew rate will be considered as infinite (TLT = 0).
This is a reasonable assumption in application such
FPGA supplies where load-current slew rate may range
up to 100A/µs.
Output Caps Selection – load transient analysis
61
61
• Is it possible to analyze a buck converter during load transient by means of the following circuit.
• tLT is the instant when the load transient occurs, it can occur during ON time or during OFF time.
• Worst case condition occurs when:
• tLT = DTS for overshoot
• tLT = TS for undershoot
ON TIME OFF TIME
Let’s assume a high cross over frequency controller. Minimum duty cycle is assumed to be 0 and maximum duty cycle is assumed to be 1.
Output Caps Selection – load transient analysis – overshoot
62
62
• Assuming that the step down load transient occurs at tLT = DT (overshoot worst case), the
instant of peak variation of the output voltage and its maximum overshoot peak value are
given by:
• It tOS = DTS the magnitude of VOS is determined by ESR only (high ESR case ESRH)
• If tOS > DTS the magnitude of VOS jointly depends on C and ESR values (low ESR case ESRL)
CB
Output Caps Selection – load transient analysis – overshoot
63
63
• The three curves cross at the boundary value of capacitance CB given by:
• A real capacitor whose values of ESR and C correspond to a point located
below this curve (green area) can be considered suitable to maintain the output
voltage within the given regulation window in presence of a charging load
transient.
Zero slope
Negative slope
Positive slope
Output Caps Selection – load transient analysis – overshoot
64
64
• It makes sense to consider the effect of stray inductances LESL = ESL + LPCB only it the real
slew-rate SR of the load current transition is known.
• After the instant tr, the output voltage evolves in the time as if there was no ESL.
• Load transient constraints are met if C, ESR and ESL are such that both conditions are
fulfilled:
• The effect of LESL can be accounted by
including the following constraints for the ESR
∆VO(tr) < ∆VOreg
∆VO(tos) < ∆VOreg
∆VOreg
Output Caps Selection – load transient analysis – overshoot
65
65
• LESL = 10nH
• SR = 3 A/µs
∆VOreg
Output Caps Selection – load transient analysis – overshoot – simplified equation
66
66
• It is possible to derive simplified boundaries for C and ESR.
• Let’s assume that the minimum output capacitance required is CB previously defined as:
• It is possible to calculate the maximum allowed value of the ESR by replacing CB value into the ESRcrit formula
previously defined:
• Any capacitor whose value of capacitance and ESR is higher than Cmin and lower the ESRmax is suitable to meet
load transient requirements for a buck converter.
Capacitor - Selection Process Summary
Electrical specifications:
• Electrical performance – RMS Current in the capacitor
• Look for RMS current equation in the chosen DC/DC topology – Applied voltage at the capacitor
• De-rate the capacitor based on the chemistry
• Transient requirements – Size bulk capacitance based upon voltage deviation requirements– Check that the selected capacitor meets stability requirements
• Capacitor impedance – Does this capacitor chemistry look inductive at the frequency of interest?
67
Capacitor - Selection Process Summary• Most designs use a combinations of technologies
– Tantalums or Aluminum Electrolytics for bulk Capacitance– Ceramics for decoupling and bypass
• Depends on Mechanical Challenges– Vibration– Temperature– Cooling
• Lifetime comes into play– For longer life, improve the quality of the components– Ceramics and polymer have improved lifetime over electrolytic and tantalum
• Costs - Tradeoffs– Component cost vs Total cost of ownership
68
Capacitors – Selection Process Summary• Use Equations for selected topology
– Calculate RMS Currents, Peak voltages, Minimum capacitance, Maximum esr
• Select Chemistry based upon the designs needs– Remember to de-rate voltage by at least 20% for all chemistries– 50% for tantalum to improve reliability– 50% for class 2 ceramics to decrease capacitance lost to DC biasing– Note: Capacitor data sheet MUST include 100kHz data if the capacitor is to
be applied in a switch mode power supply (SMPS). 120 Hz only versions are not suitable for SMPS
– Consider NP0 (C0G), X7R, X5R and X7S ceramic dielectrics* - in this order.• DO NOT USE Y5V
• Place additional units in parallel if one is not enough– Combine chemistries to benefit from their various advantages
• Use polymer, electrolytic and tantalum for bulk• Use Ceramics as your primary decoupling capacitor
69
Output Caps Selection – References
70
70
• A. De Nardo, N. Femia, G. Petrone, G. Spagnuolo, “A unified method for optimal buck
converter output capacitor design”, Proc. Of ISIE2008, Cambridge, UK, pp. 56-61
• S. Maniktala, Switching Power Supply Design & Optimization, Mc Graw Hill, New York, 2004
• G. Spagnuolo, N. Femia, A. De Nardo, “Optimal Buck Converter Output Filter Design for Point
of Load applications”, IEEE Trans. Ind. Electron., DOI10.1109/TIE.2009.2030219, in press
• R.W. Erickson, D. Maksimovic, “Fundamentals of Power Electronics”, 2001 Kluwer Academic
Publishers
Paralleling capacitors to reduce high frequency output voltage ripple
71
72
A technique for reducing High Frequency output noise
• If the output capacitor(s) is not ceramic; then adding a small ceramic(s) in parallel with the output will reduce high frequency ripple.
• Choose a ceramic capacitor that has an impedance null (self resonance) that is the same as the frequency to be attenuated.
• One, two or three small ceramics can give 10X improvement (-20 dB.)
73
High frequency ripple
Switch waveform (scope trigger)
Vout ripple w/ 20 MHz bandwidth (bw)
5 mV /div 10 mv p-p
HF spikes ignored !
74
Use Zoom function to measure ring frequency
20 MHz bw
200 MHz bw
2 GHz bw
Timebase Zoomed traces
300MHz ring
10 mV/div
100 mV/div
100 mV/div
Need to add 470 pF 0603 bypass SRF ~ 300 MHz
75
Continue the method
20 MHz bw
200 MHz bw
2 GHz bw
10 mV/div
100 mV/div
100 mV/div
115 MHz ring
Measured after adding a 470 pF 0603 but before adding 2200pF 0603
Timebase Zoomed traces
76
Continue the method
20 MHz bw
200 MHz bw
2 GHz bw
10 mV/div
100 mV/div
100 mV/div
60 MHz ring
Measured after adding a 470pF 0603 and a 2200pF 0603 but before 4700pF 0805
Timebase Zoomed traces
77
Results after 3rd added small capacitor
Measured after adding a 470pF 0603, 2200pF 0603, and 4700pF 0805
Ring ~377MHz
20 MHz bw
200 MHz bw
2 GHz bw
10 mV/div
100 mV/div
100 mV/div
78
Final amplitude improvement results
20 MHz bw
200 MHz bw
2 GHz bw
10 mV/div
10 mV/div
10 mV/div
20 mV p-p @ 20MHz bw
80 mV p-p @ 200MHz bw
After 470pF 2200pF 4700pF
79
Starting point for comparison - 3 caps removed
20 MHz bw
200 MHz bw
2 GHz bw
10 mV/div
200 mV/div
200 mV/div
696mVp-p @ 200MHz bw
80
Final schematic and bill of materials: 15 minutes later
Cost Approx < $0.03 USD
3.3µH 6AL1
220µF
0.0075 ohm6.3V
COUT1
GNDGND
+3.3VDC OUT
800 kHz Buck Switcher
Spe
cial
ty P
olym
er
470 pFNP0 (C0G)
COUT2470 pFNP0 (C0G)
COUT34700 pFX7R
COUT4
GNDGND
Remember to reserve locations on the schematic and PCB for these parts.
You will not know the capacitor values until after you test the running power supply for ringing noise.
Plan ahead
1.2VDC OUT @ 5A
2200pF
81
Bench requirements• 2GHz bw / 20Gsps Digital oscilloscope with zoom feature and adjustable
channel bandwidth.
• Selection of small capacitors pre-characterized by Self Resonant Frequency.
• High quality interconnections with controlled impedances.
Example of 3 channel input adapter built for this tutorial (net 4x passive probe)
CH2 - 20MHz
CH3 - 200MHz
CH4 - 2GHz
SOURCE 3 CHANNEL INPUT
50 OHM COAX49.9
RSOURCE
1.2VDC SOURCE
Use C0G (NP0) dielectric for high frequency shunt filter capacitors – lower ESR – more stable over temp
Start with manufacturer data sheets, then measure SRF on bench to confirm
82
Thank You
Questions?
83