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8/6/2019 Bt151 Series c 1
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Philips Semiconductors Product specification
Thyristors BT151 series C
GENERAL DESCRIPTION QUICK REFERENCE DATA
Passivated thyristors in a plastic SYMBOL PARAMETER MAX. MAX. MAX. UNIT
envelope, intended for use inapplications requiring high BT151- 500C 650C 800Cbidirectional blocking voltage VDRM, Repetitive peak off-state 500 650 800 Vcapability and high thermal cycling VRRM voltagesperformance. Typical applications IT(AV) Average on-state current 7.5 7.5 7.5 Ainclude motor control, industrial IT(RMS) RMS on-state current 12 12 12 Aand domestic lighting, heating and ITSM Non-repetitive peak on-state 100 100 100 Astatic switching. current
PINNING - TO220AB PIN CONFIGURATION SYMBOL
PIN DESCRIPTION
1 cathode
2 anode
3 gate
tab anode
LIMITING VALUESLimiting values in accordance with the Absolute Maximum System (IEC 60134).
SYMBO PARAMETER CONDITIONS MIN. MAX. UNITL
-500C -650C -800CVDRM, Repetitive peak - 500
1 6501 800 VVRRM off-state voltages
IT(AV) Average on-state half sine wave; Tmb 109 C - 7.5 Acurrent
IT(RMS) RMS on-state current all conduction angles - 12 AITSM Non-repetitive peak half sine wave; Tj = 25 C
on-state current prior to surget = 10 ms - 100 At = 8.3 ms - 110 A
I2t I2t for fusing t = 10 ms - 50 A2sdIT/dt Repetitive rate of rise of I TM = 20 A; IG = 50 mA; - 50 A/ s
on-state current after dIG/dt = 50 mA/striggering
IGM Peak gate current - 2 AVGM Peak gate voltage - 5 VVRGM Peak reverse gate - 5 V
voltagePGM Peak gate power - 5 WPG(AV) Average gate power over any 20 ms period - 0.5 WTstg Storage temperature -40 150 CTj Operating junction - 125 C
temperature
a k
g1 2 3
tab
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor mayswitch to the on-state. The rate of rise of current should not exceed 15 A/s.
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Philips Semiconductors Product specification
Thyristors BT151 series C
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Rth j-mb Thermal resistance - - 1.3 K/Wjunction to mounting base
Rth j-a Thermal resistance in free air - 60 - K/Wjunction to ambient
STATIC CHARACTERISTICSTj = 25 C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
IGT Gate trigger current VD = 12 V; IT = 0.1 A - 2 15 mAIL Latching current VD = 12 V; IGT = 0.1 A - 10 40 mAIH Holding current VD = 12 V; IGT = 0.1 A - 7 20 mAVT On-state voltage IT = 23 A - 1.44 1.75 VVGT Gate trigger voltage VD = 12 V; IT = 0.1 A - 0.6 1.5 V
VD = VDRM(max); IT = 0.1 A; Tj = 125 C 0.25 0.4 - VID, IR Off-state leakage current VD = VDRM(max); VR = VRRM(max); Tj = 125 C - 0.1 0.5 mA
DYNAMIC CHARACTERISTICSTj = 25 C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
dVD/dt Critical rate of rise of V DM = 67% VDRM(max); Tj = 125 C;off-state voltage exponential waveform;
Gate open circuit 50 130 - V/ sRGK = 100 200 1000 - V/ s
tgt Gate controlled turn-on ITM = 40 A; VD = VDRM(max); IG = 0.1 A; - 2 - stime dIG/dt = 5 A/s
tq Circuit commutated VD = 67% VDRM(max); Tj = 125 C; - 70 - s
turn-off time ITM = 20 A; VR = 25 V; dITM/dt = 30 A/s;dVD/dt = 50 V/s; RGK = 100
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Philips Semiconductors Product specification
Thyristors BT151 series C
Fig.1. Maximum on-state dissipation, Ptot, versusaverage on-state current, IT(AV), where
a = form factor = IT(RMS)/ IT(AV).
Fig.2. Maximum permissible non-repetitive peakon-state current ITSM, versus pulse width tp, for
sinusoidal currents, tp 10ms.
Fig.3. Maximum permissible rms current IT(RMS) ,versus mounting base temperature Tmb.
Fig.4. Maximum permissible non-repetitive peakon-state current ITSM, versus number of cycles, for
sinusoidal currents, f = 50 Hz.
Fig.5. Maximum permissible repetitive rms on-statecurrent IT(RMS), versus surge duration, for sinusoidal
currents, f = 50 Hz; Tmb 109C.
Fig.6. Normalised gate trigger voltageVGT(Tj)/ VGT(25C), versus junction temperature Tj.
0 1 2 3 4 5 6 7 80
5
10
15
a = 1.571.9
2.2
2.8
4
IT(AV) / A
Ptot / W Tmb(max) / C
125
118.5
112
105.5conductionangle
formfactor
degrees30
60
90
120
180
4
2.8
2.2
1.9
1.57
a
1 10 100 10000
20
40
60
80
100
120
Number of half cycles at 50Hz
ITSM / A
TITSM
time
I
Tj initial = 25 C max
T
10
100
1000
10us 100us 1ms 10ms
T / s
ITSM / A
TITSM
time
I
Tj initial = 25 C max
T
dI /dt limitT
0.01 0.1 1 100
5
10
15
20
25
surge duration / s
IT(RMS) / A
-50 0 50 100 1500
5
10
15BT151
Tmb / C
IT(RMS) / A
109 C
-50 0 50 100 1500.4
0.6
0.8
1
1.2
1.4
1.6
Tj / C
VGT(Tj)VGT(25 C)
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Philips Semiconductors Product specification
Thyristors BT151 series C
Fig.7. Normalised gate trigger currentIGT(Tj)/ IGT(25C), versus junction temperature Tj.
Fig.8. Normalised latching current IL(Tj)/ IL(25C),versus junction temperature Tj.
Fig.9. Normalised holding current IH(Tj)/ IH(25C),versus junction temperature Tj.
Fig.10. Typical and maximum on-state characteristic.
Fig.11. Transient thermal impedance Zth j-mb, versuspulse width tp.
Fig.12. Typical, critical rate of rise of off-state voltage,dVD/dt versus junction temperature Tj.
-50 0 50 100 1500
0.5
1
1.5
2
2.5
3
Tj / C
IGT(Tj)IGT(25 C)
0 0.5 1 1.5 20
10
20
30
VT (V)
IT
typ
max
(A)
Vo = 1.06 V
Rs = 0.0304 ohms
Tj = 125 C
T
j
= 25 C
-50 0 50 100 1500
0.5
1
1.5
2
2.5
3BT145
Tj / C
IL(Tj)IL(25 C)
0.001
0.01
0.1
1
10
tp / s
Zth j-mb (K/W)
10us 0.1ms 1ms 10ms 0.1s 1s 10s
tpP
t
D
-50 0 50 100 1500
0.5
1
1.5
2
2.5
3
Tj / C
IH(Tj)IH(25 C)
0 50 100 15010
100
1000
10000
Tj / C
dVD/dt (V/us)
gate open circuit
RGK = 100 Ohms
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Philips Semiconductors Product specification
Thyristors BT151 series C
MECHANICAL DATA
Dimensions in mm
Net Mass: 2 g
Fig.13. SOT78 (TO220AB). pin 2 connected to mounting base.
Notes1. Refer to mounting instructions for SOT78 (TO220) envelopes.2. Epoxy meets UL94 V0 at 1/8".
10,3
max
3,7
2,8
3,03,0 max
not tinned
1,3
max
(2x)
1 2 3
2,4
0,6
4,5max
5,9min
15,8max
1,3
2,54 2,54
0,9 max (3x)
13,5min
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Philips Semiconductors Product specification
Thyristors BT151 series C
DEFINITIONS
DATA SHEET STATUS
DATA SHEET PRODUCT DEFINITIONSSTATUS2 STATUS3
Objective data Development This data sheet contains data from the objective specification forproduct development. Philips Semiconductors reserves the right tochange the specification in any manner without notice
Preliminary data Qualification This data sheet contains data from the preliminary specification.Supplementary data will be published at a later date. PhilipsSemiconductors reserves the right to change the specification withoutnotice, in order to improve the design and supply the best possibleproduct
Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time inorder to improve the design, manufacturing and supply. Changes willbe communicated according to the Customer Product/ProcessChange Notification (CPCN) procedure SNW-SQ-650A
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above oneor more of the limiting values may cause permanent damage to the device. These are stress ratings only andoperation of the device at these or at any other conditions above those given in the Characteristics sections ofthis specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of thecopyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to beaccurate and reliable and may be changed without notice. No liability will be accepted by the publisher for anyconsequence of its use. Publication thereof does not convey nor imply any license under patent or otherindustrial or intellectual property rights.
LIFE SUPPORT APPLICATIONSThese products are not designed for use in life support appliances, devices or systems where malfunction of theseproducts can be reasonably expected to result in personal injury. Philips customers using or selling these productsfor use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resultingfrom such improper use or sale.
2 Please consult the most recently issued datasheet before initiating or completing a design.
3 The product status of the device(s) described in this datasheet may have changed since this datasheet waspublished. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
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