Bruce Archambeault, PhD - RTP Designers Councilipc-rtp.org/PCBC2016-6B_Power-Distribution_Archambeault.pdfNovember 2016 Dr. Bruce Archambeault 20 Effective Inductance for Various Distances

PCB Effects for Power Integrity

Bruce Archambeault, PhD

IEEE Fellow, MST Adjunct Professor

IBM Distinguished Engineer Emeritus

[email protected]

November 2016 Dr. Bruce Archambeault 2

PCB Issues for

Optimum Power Integrity

• Inductance dominates performance

– Which inductance? Under what

circumstances?

• Effect of capacitance value

• Effect of number of capacitors

• Effect of capacitor density

• Effect of capacitor via configuration

• Case Study


Impedance at Port #1

Single 0.01 uF Capacitor at Various Distances (35mil Dielectric)

-40

-30

-20

-10

0

10

20

30

1.0E+07 1.0E+08 1.0E+09 1.0E+10

Frequency (Hz)

Imp

ed

an

ce (

dB

oh

ms)

no caps

300 mils

500 mils

700 mils

1000 mils


Z11 Phase Comparison as Capacitor distance Varies for 35 mils FR4

ESL = 0.5nH

-2

-1.5

-1

-0.5

0

0.5

1

1.5

2

1.0E+06 1.0E+07 1.0E+08 1.0E+09

Frequency (Hz)

Ph

ase (

rad

)

100 mils

200 mils

300 mils

400 mils

1000 mils

2000 mils

November 20165

10-4

10-2

100

10-3

10-2

10-1

100

101

102

Frequency[GHz]

Inp

ut

Imp

edan

ce a

t IC

po

rt [Ω

]

Step1 - 1 Capacitor

Step2 - 19 Capacitors

Step3 - 43 Capactors

eq planes decouplingC C C= +

highL

IC planes Decaps ijL L L M+ + +

Design Geometry, Current Path, and ZPDN


Model for Plane Recharge Investigations

Port2 Port2

(4,5)(4,5)Port1Port1

(8,7)(8,7)

a = 12a = 12

b = 10b = 10

d = 35 mild = 35 milCdec Cdec

(4.05,5)(4.05,5)

Decoupling Capacitor :

C = 1uF

ESR = 30mOhm

ESL = 0.5nH

5.4=rε

DC voltage used to DC voltage used to

charge the power charge the power

plane plane

VdcVdc

I inputI input

Port3 Port3

(4,4.95)(4,4.95)

Port2 Port2

(4,5)(4,5)Port1Port1

(8,7)(8,7)

a = 12a = 12

b = 10b = 10

d = 35 mild = 35 milCdec Cdec

(4.05,5)(4.05,5)

Decoupling Capacitor :

C = 1uF

ESR = 30mOhm

ESL = 0.5nH

5.4=rε

DC voltage used to DC voltage used to

charge the power charge the power

plane plane

VdcVdc

I inputI input

Port3 Port3

(4,4.95)(4,4.95)

Port 2 represents IC current draw


Charge Between Planes vs..

Charge Drawn by IC

Board total charge : C*V = 3.5nF*3.3V = 11nC

Pulse charge 5A peak : I*dt/2 = (1ns*5A)/2=2.5nC


Triangular pulses (5 Amps Peak)


Charge Depletion vs. Capacitor Distance


Charge Depletion for Capacitor @ 400 mils for Various connection Inductance


Effect of Multiple Capacitors While Keeping Total Capacitance Constant

(power-ground pins at IC center)

12”

10”

Port1 (8,7)(Ls 50nH)

Port2 (4,5)(power pin)

εr =4.5

Decap

Ground pin

1 inch

The decap locations are 800mils from the power pin

• C=1uF

• ESL=0.5nH

• ESR=1Ω




12”

10”


Port2 (4,5)(power pin)

εr =4.5

Decap

Ground pin

1 inch


• C=0.5uF

• ESL=0.5nH

• ESR=1Ω




12”

10”


Port2 (4,5)(power pin) εr =4.5

Decap

Ground pin

1 inch


• C=0.25uF

• ESL=0.5nH

• ESR=1Ω


Constant Capacitance

800 mil Distance


Constant Capacitance

800 mil Distance


Effect of Capacitor Value??

• Need enough charge to supply need

• Depends on connection inductance


Noise Voltage is INDEPENDENT

of Amount of Capacitance!

As long as there is ‘enough’ chargeDist=400 mils

ESR=30mOhms

ESL=0.5nH


What Happens if a 2nd Decoupling

Capacitor is placed near the First

Capacitor?

Observation

Point

Via #1Via #2 Moved in arc

around Observation

point while

maintaining 500 mil

distance to

observation point

500

mils

distance


Second Via Around a circle

Port 2

Port 1

θ

( )yx,Port 3

( ) ( )( )

+

+

+

−

+

++

r

rd

rR

rd

d

rdr

rdrRd

2

12

2

3

2

1

2

ln

ln

4ln

4 π

µ

π

µ

2sin22

1

θRd

Rd

=

=

( )( )

+

+=

3

4

)2/sin(2ln

4 rrR

rRd

θπ

µ

1d

2dR

Port 2

Port 1

θ

( )yx,Port 3

( ) ( )( )

+

+

+

−

+

++

r

rd

rR

rd

d

rdr

rdrRd

2

12

2

3

2

1

2

ln

ln

4ln

4 π

µ

π

µ

2sin22

1

θRd

Rd

=

=

( )( )

+

+=

3

4

)2/sin(2ln

4 rrR

rRd

θπ

µ

1d

2dR

theta: angle as shown in the figure in

degree

d2: distance between Port 2 and Port 3

in mil

d1: distance between Port 3 and Port 1

in mil

d: thickness of dielectric layer in mil

r: radius for all ports in mil

R: distance between Port 1 and Port 2 in

mil

Courtesy of Jingook Kim,

Jun Fan, Jim Drewniak

Missouri University of

Science and Technology


Effective Inductance for Various Distances to Decoupling CapacitorWith Second Capacitor (Via) Equal Distance Around Circle

Plane Seperation = 35 mil -- Via Diameter = 20 mil

500

600

700

800

900

1000

1100

1200

1300

1400

1500

1600

1700

1800

1900

2000

2100

0 50 100 150 200

Angle (degrees)

Ind

uctn

ace (

pH

)

250 mil

500mil

750 mil

1000 mil


Effective Inductance for Various Distances to Decoupling CapacitorWith Second Capacitor (Via) Equal Distance Around Circle


0

50

100

150

200

250

300

350

400

450

500

0 50 100 150 200

Angle (degrees)

Ind

uc

tnac

e (

pH

)

500mil

250 mil

750 mil

1000 mil


Second Via Along Side

Port 2

Port 1

( )yx,

R

Port 3

1d

2d

2

2

2

1 dRd +=

Port 2

Port 1

( )yx,

R

Port 3

1d

2d

2

2

2

1 dRd +=

d2: distance between Port 2 and Port 3 in mil

d1: distance between Port 3 and Port 1 in mil

d: thickness of dielectric layer in mil

r: radius for all ports in mil

R: distance between Port 1 and Port 2 in mil


Effective Inductance for Various Distances to Decoupling CapacitorWith Second Capacitor (Via) Positioned Adjacent to First Capacitor


500

600

700

800

900

1000

1100

1200

1300

1400

1500

1600

1700

1800

1900

2000

2100

0 100 200 300 400 500 600 700 800 900 1000

Distance Between Capacitors (mils)

Ind

uctn

ace (

pH

)

500mil

250 mil

750 mil

1000 mil


Understanding Inductance Effects and Proximity

1 via

10mm

2 via with degree 30°°°°

2 via with degree 90°°°° 2 via with degree 180°°°°

20cm

20cm

10cm

10cm


Current Density

A/m2

[m]

[m]

A/m2

[m]

[m]

A/m2

[m]

[m]

A/m2

[m]

[m]


2mm

2 shorting with 30° 2 shorting with 180°

10cm

10cm

G-S probingport

Short Vias

°°°= 180,30,0θ

0.8mm

G-S probingport

Short Vias

Shorting via

1 shorting

DUT for Experimental Validation (Single Plane pair)


100

0.1

1

10

50 400

Frequency [MHz]

Imp

edan

ce [Ω

]

Measured Input Impedance

Experimental Validation (Single Plane Pair)

• Even in the case with two

shorting vias at opposite sides

(θ =180°), the inductance

value is 68.8% of that with

one shorting via

• As two shorting vias get

closer together, mutual

inductance between two

shorting vias increases.

0 50 100 150 200 250 300 350500

550

600

650

700

750

800

850

900

1000

theta (degree)

To

tal

ind

uct

ance

[p

H]

with only 1 via (852pH)

with 2 via with 180°

(586H = 68.8% × 852pH)

with 2 vias with 30° (687pH)

Equation

( )( )

+

+3

4

)2/sin(2ln

4 rrR

rRd

θπ

µ


Multiple Capacitors

Decaps

GND

PWR

GND

PWR

Decaps

GND

PWR

GND

PWR

PWR_capGND_cap

GND

PWR

GND

PWR

Cavity1

Cavity2

Cavity3

Cavity4

PWR_capGND_cap

GND

PWR

GND

PWR

Cavity1

Cavity2

Cavity3

Cavity4


Via Spacing

Via Barrel 10 mils

60 mils

20 mils

10 mils*

9 mils9 mils

10 mils*

108 mils minimum

128 mils typical

Via Barrel 10 mils

60 mils

20 mils

10 mils*

9 mils9 mils

10 mils*

60 mils

20 mils

10 mils*

9 mils9 mils

10 mils*

108 mils minimum

128 mils typical

2.21.90.9540

1.91.60.7530

1.61.30.520

1.10.90.310

0603 SMT (nH)0402 SMT

(nH)

40 mil Spacing (nH)Distance to

Planes (mils)

November 2016 Dr. Bruce Archambeault 30Dr. Bruce Archambeault 30

0603 Size Cap Typical Mounting

Via Barrel 10 mils

60 mils

20 mils

10 mils*

9 mils9 mils

10 mils*

108 mils minimum

128 mils typical*Note: Minimum

distance is 10 mils but

more typical distance is

20 mils


Distance into board

to planes (mils)

0805 typical/minimum

(148 mils

between via

barrels)

0603

typical/minimum

(128 mils

between via

barrels)

0402 typical/minimum

(106 mils

between via

barrels)

10 1.2 nH 1.1 nH 0.9 nH

20 1.8 nH 1.6 nH 1.3 nH

30 2.2 nH 1.9 nH 1.6 nH

40 2.5 nH 2.2 nH 1.9 nH

50 2.8 nH 2.5 nH 2.1 nH

60 3.1 nH 2.7 nH 2.3 nH

70 3.4 nH 3.0 nH 2.6 nH

80 3.6 nH 3.2 nH 2.8 nH

90 3.9 nH 3.5 nH 3.0 nH

100 4.2 nH 3.7 nH 3.2 nH

Connection Inductance for Typical Capacitor Configurations


Connection Inductance for Typical Capacitor

Configurations with 50 mils from Capacitor Pad to Via Pad

Distance into board

to planes (mils)

0805

(208 mils

between via

barrels)

0603

(188 mils

between via

barrels)

0402

(166 mils

between via

barrels)

10 1.7 nH 1.6 nH 1.4 nH

20 2.5 nH 2.3 nH 2.0 nH

30 3.0 nH 2.8 nH 2.5 nH

40 3.5 nH 3.2 nH 2.8 nH

50 3.9 nH 3.5 nH 3.1 nH

60 4.2 nH 3.9 nH 3.5 nH

70 4.5 nH 4.2 nH 3.7 nH

80 4.9 nH 4.5 nH 4.0 nH

90 5.2 nH 4.7 nH 4.3 nH

100 5.5 nH 5.0 nH 4.6 nH


Possible Configurations

Dense,

non-

alternating

Dense,

alternating

Spread,

non-

alternating

Spread,

alternating

Dense,

non-

alternating

Dense,

alternating

Spread,

non-

alternating

Spread,

alternating


Effective Inductance for 16 Decoupling Capacitors for Dense and Spread

Configurations and Plane Pair Depth

0

20

40

60

80

100

120

0 5 10 15 20 25 30 35 40

Distance into PCB (mils)

Eff

ecti

ve I

nd

ucta

nce (

pH

)

Dense Non-Alternating

Dense Alternating

Spread Non-AlternatingSpread Alternating

40 mil via spacing


LDecap Convergence

50

mils

Regular

100

mils

AlternatingG

P

h

…Decaps modeled as a Short

Port

3800 4000 4200 4400 4600 4800 5000 5200

3800

4000

4200

4400

4600

4800

5000

5200

5400

Line

100

101

10-2

10-1

Number of Capacitors

[nH

]

Ldecap Comparison h=5mils

Line Alternating

Line Regular

1/n

0 10 20 30

0.05

0.1

0.15

Number of Capacitors

[nH

]

Ldecap Comparison h=5mils

Line Alternating

Line Regular

1/n


LDecap comparison (h=10mils, 0201)

AlternatingRegular Doublet

101

10-3

10-2

10-1

100

# of Decaps

L [

nH

]

LDecap vs # of Decaps, 0201

Regular

Alternating

Doublet

1/n

10 20 30 40 50 600

0.05

0.1

0.15

0.2

# of Decaps

L [

nH

]


Regular

Alternating

Doublet

1/n

10mil

Short

GND

GNDPort

…


LDecap comparison (h=10mils, 0402)Alternating Regular Doublet

101

10-3

10-2

10-1

100

# of Decaps

L [

nH

]


Regular

Alternating

Doublet

1/n

10 20 30 40 50 600

0.05

0.1

0.15

0.2

# of Decaps

L [

nH

]


Regular

Alternating

Doublet

1/n

10mil

Short

GND

GNDPort

…


LDecap comparison (h=10mils, 0603)Alternating Regular Doublet

101

10-3

10-2

10-1

100

# of Decaps

L [

nH

]


Regular

Alternating

Doublet

1/n

10 20 30 40 50 600

0.05

0.1

0.15

0.2

# of Decaps

L [

nH

]


Regular

Alternating

Doublet

1/n

10mil

Short

GND

GNDPort

…


LDecap comparison (h=10mils, 0805)

Alternating Regular Doublet

101

10-3

10-2

10-1

100

# of Decaps

L [

nH

]


Regular

Alternating

Doublet

1/n

10 20 30 40 50 600

0.05

0.1

0.15

0.2

# of Decaps

L [

nH

]


Regular

Alternating

Doublet

1/n

10mil

Short

GND

GNDPort

…


Observations

• Added via (capacitor) does not lower effective inductance to 70-75% of original single via case

• Thicker dielectric results in higher inductance

• Alternating PWR/GND can significantly reduce overall inductance


Effect of Plane width on Inductance

Case1 : 10 inches

Case2 : 5 inches

Case3 : 2 inches1 inch

Port1 Port2


Geometry Solid Plane

‘Capacitor’ Port‘IC’ Port (shorting via)

10 inches

12 inches

width

Solid Plane

‘Capacitor’ Port‘IC’ Port (shorting via)

10 inches

12 inches

width

‘IC’ Port (shorting via)

‘Capacitor’ Port

10 mils

‘IC’ Port (shorting via)

‘Capacitor’ Port

10 mils

Top View

Side View


Inductance as a Function of

Plane Width

25741

13522

7095

54510

Inductance

(pH)

Plane Width

(inches)


Inductance as a Function of

Plane Width

24065825741

16335513522

1561787095

15417354510

Inductance (pH)

(Distance=1”)

Inductance (pH)

(Distance=2”)

Inductance (pH)

(Distance=10”)

Plane

Width

(inches)


Plane Width & Current Density


Typical PCB Power Design

November 2016 Dr. Bruce Archambeault 47Dr. Bruce Archambeault

Another Example


Sharp Angles Cause Current

‘Bunching’

(Increased Inductance)


Geometry for Case Studies – Via Map

IC

region

~300 mils

16 Capacitors are

placed, to maintain

the symmetry

12”

12”

100 mils

1.2 mil

1oz Cu

1.2 mil

1oz Cu

1.2 mil

1oz Cu

0.6 mil

0.5oz

0.6 mil

0.5oz Cu

Copper

thicknessDielectric

thickness

44 Layer3 mil

3 mil

3 mil

3.5 mil

3.5 mil

Signal Net Location

Reference Net

Possible Power net

Location

16 Decap

16 Decap

16 Decap

16 Decap

16 Decap

16 Decap

Power plane at mid

Top

dec

ap

son

lyB

ott

om

dec

ap

son

ly

Un

der

th

e IC

Power plane at top Power plane at bottom

Q1 & Q2. Location of Power Layer/CapsB

ott

om

dec

ap

son

ly

Aw

ay f

rom

th

e IC

IC 16 Decaps

IC

IC

IC 16 Decaps

IC

IC

IC 16 Decaps

IC

IC

Power Net under test Reference Net Floating Net50


PWR Layer Location – Results

Bottom Cap

Under the IC

ICTop Cap

Power

layer

IC

…

10-4

10-2

100

10-4

10-2

100

102

[GHz]

Ω

|Z11

| - Top Cap

Top

Mid

Bottom

10-4

10-2

100

10-4

10-2

100

102

[GHz]

Ω

|Z11

| - Bottom Caps - Under the IC

Top

Mid

Bottom

Power layer should be closest to the IC, to minimize IC

to power plane inductance.

Geometry

and

Currents

Geometry

and

Currents

Power plane at Top

Power plane Middle

Power plane Bottom

Power plane at Top

Power plane Middle

Power plane Bottom


10-4

10-2

100

10-4

10-2

100

102

[GHz]

Ω

|Z11

|- Top Pwr

Top Cap

Bottom Cap-Away

Bottom Cap- Under the IC

Cap Location Effect - Results

Top Cap

Bottom Cap

Away from IC

Bottom Cap

Under the IC

Power

layer

10-4

10-2

100

10-4

10-2

100

102

[GHz]

Ω

|Z11

| - Middle PWR

Top Cap

Bottom Cap-Away

Bottom Cap- Under the IC

IC

……

…

• The capacitors should to be placed on the side

closest to the power plane to reduce the inductance

from the capacitor to power plane.

• Capacitor location does not affect the high

frequency inductance.


Q3. Effect of Ground Planes – Geometries

All ground planes With top nearby ground plane

With bottom nearby ground plane Only topmost and bottommost ground planes

IC IC

IC IC

Intermediate GND

planes removed

Intermediate GND

planes removed

Intermediate

GND planes

removed

Intermediate

GND planes

removed

Intermediate

GND planes

removed


Effect of Ground Planes – Results

Top Cap

Power

layer

IC

…

10-4

10-2

100

10-4

10-2

100

102

[GHz]

Ω

|Z11

| - Top Cap

All GND Planes

Top Closest

Bottom Closest

Only Topmost & Bottommost

The closest ground plane from the power plane, is most important. Other Ground planes in the

stack up will not affect the Llow or Lhigh significantly.

Geometry and current path for no

GND plane case

Geometry

Geometry and current path for all

GND planes case


Power Integrity Analysis Summary

• Physical cause of inductance (current path) identified for each portion of overall path

• Value of capacitance not as important as number of capacitors

• Via connection configuration can dramatically influence inductance

• If power/Ground-reference planes deep in PCB stackup, capacitor placement has less impact than might be expected


Design Conclusions

• PWR/GND plane pair close to IC minimizes LIC

• Capacitors close to the power layer minimize the

inductance Ldecap from the capacitor to the power plane.

• PWR/GND plane separation small

• Placing Caps under the IC can benefit the design, if board is thin, or the plane inductance is large.

• Ground plane closest to the power layer affects the

response most, all other ground layer have very little influence.

Documents

Bruce Archambeault, PhD - RTP Designers Councilipc-rtp.org/PCBC2016-6B_Power-Distribution_Archambeault.pdfNovember 2016 Dr. Bruce Archambeault 20 Effective Inductance for Various Distances