Breakthrough TechnologiesFor Additive Mass-ManufacturingIn Electronics

• B r e a k t h r o u g h T e c h n o l o g i e s F o r A d d i t i v e M a s s - M a n u f a c t u r i n g

ioTech: The Next Generation of Multi-Material PrintingBreakthrough Technologies For Additive Mass-Manufacturing

Printed Circuit Boards

SMT Assembly

Conformal Coating

Gaskets and Sealing

High Value Applications

Semiconductor Packaging

EMI Shielding

Etc...

The Material Challenge

COATING MATERIALS EPOXY

CONDUCTIVE BONDING

MATERIALS

Certified industrial-grade materials tend to be too viscous for existing printers, and so material approximations are used. These approximations look like the real thing, but they lack in mechanical properties and functionalities.

The “HOLY GRAIL” of Additive Manufacturing

• Thermoset

• High-viscosity

• High-loading

• Long-chain polymers

• Integrated fillers

• Large-size particles

Industrial materials

Industrial speed

High resolution

High resolution

Multi-material

Meet ioTech … No More CompromiseThe world’s only additive manufacturing solution for standard industrial materials

Innovation powerhouse: 8 granted patents, 24 patents pending

Printing unprintable industrial materials

Polymer SiliconeCeramics Metal Solder

Adhesives

High resolution

Dynamic from20µm to 500µm

Combining polymers, metals & ceramics

Up to 5 materials

Fast & efficient

Up to 3.5m/secOver 7.2M drop/hr

How We Print the UnprintableDeep innovation with 24 patent families

Build Process In-Line Post- Process

Nozzle-free technology

Layered molding process

Multi curing

UV

Thermal

Finishing

Laser sintering

Laser ablation

Delivering Multiple Benefits Across Industries

Commercial-ready functional objects

Enhanced functional properties

Manufacturing flexibility

Beyond prototyping Wide range of currently

unprintable industrial materialsVolume, design, customization,

material properties

Inspiring innovation Lower cost of ownership Faster & simpler production process

Simple maintenance

and no expensive

consumables

Integrating multiple

production steps

Unlimited designs with

multi-material

combinations

Prototyping ProductionSingle machines Manufacturing solution

for industrial applications

Conception only

1 to 5

Indirect sales

Low

Value Added

Systems Sold

Distribution

Expected Profitability

Conception to production

5 to 50+

Direct sales & OEM

High

Business Model

OEM Products

ioTech print engine

integrated in partner solution

Branded Products

Complete solution sold

to end-customers

Initial payment per unit sold Royalty on solution sale

Annual license & maintenance fee

Initial payment per unit sold

Annual lease & maintenance fee

Professional services:customer materials’ configuration

One time

Recurring

Per need

Alternative Disruptive Business Model

Equipment as a Service

One time Recurring Additional services

Initial payment per

system delivered

Revenue per unit manufactured

by customer, linked to the value

added to each specific customer

(incl. system, training, maintenance,

material set up)

Design and supply of

customer specific

materials

Applications - PCBLaser Depositing Conductive Traces and Via Filling:

Flip chips, advanced packaging, RFID tags

Clean solution

• Low waste• No wet chemistry

Trench filling

• Deposit copper inside conductive trenches, below laminate surface, zero height

• Resolution = 60μm/20μm line/space

Via filling

• Filled vias 𝜙 60-140μm• Buried vias, blind vias• Through-holes

Customized finishing

• Improve resolutions in individual areas by ablation, down to 20μm

Applications - SMT AssemblySolder paste deposition:

Speed of screen printers, with digital features of jet printers

Speed comparable to screen printers, 100x faster than state of the art dispensers

Uniform distribution of ball volumes and heights

Solder paste deposition on top of components

Reduced defect rate

Legal Disclaimer

This document is for information purposes only. It does not constitute or

form part of an offer to buy any securities. Any offer or solicitation will be

made only by means of formal confidential offering materials that will

be prepared and furnished to prospective investors at a later date. No

representation, warranty or undertaking, express or implied, is given as

to the accuracy or completeness of the information or opinions

contained herein. This document is confidential and is intended solely

for the information of the person to whom it has been delivered. It is not

to be reproduced or transmitted, in whole or in part, to third parties,

without the prior consent of IO Tech Group.

THANK YOU