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Boosting: Min-Cut Placement with Improved Signal Delay Andrew B. Kahng Sherief Reda CSE & ECE Departments University of CA, San Diego La Jolla, CA 92093 [email protected] CSE Department University of CA, San Diego La Jolla, CA 92093 [email protected] Igor L. Markov EECS Department University of Michigan Ann Arbor, MI 48109 [email protected] VLSI CAD Laboratory at UCSD

Boosting: Min-Cut Placement with Improved Signal Delay

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Boosting: Min-Cut Placement with Improved Signal Delay. Andrew B. Kahng. Igor L. Markov. Sherief Reda. CSE & ECE Departments University of CA, San Diego La Jolla, CA 92093 [email protected]. EECS Department University of Michigan Ann Arbor, MI 48109 [email protected]. CSE Department - PowerPoint PPT Presentation

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Page 1: Boosting: Min-Cut Placement with Improved Signal Delay

Boosting: Min-Cut Placement with Improved Signal Delay

Andrew B. Kahng Sherief RedaCSE & ECE Departments

University of CA, San DiegoLa Jolla, CA [email protected]

CSE DepartmentUniversity of CA, San Diego

La Jolla, CA [email protected]

Igor L. MarkovEECS Department

University of MichiganAnn Arbor, MI 48109

[email protected]

VLSI CAD Laboratory at UCSD

Page 2: Boosting: Min-Cut Placement with Improved Signal Delay

Outline

Introduction and motivation

Controlling wirelength distribution

Boosting min-cut placement Effect of boosting on cut values

Experimental results Conclusions

Page 3: Boosting: Min-Cut Placement with Improved Signal Delay

Introduction: Min-Cut Placement

Min-cut objective: minimize cut partitions → minimizes total wirelength with the help of terminal propagation Min-cut partitioning produces slicing outlines

Page 4: Boosting: Min-Cut Placement with Improved Signal Delay

Introduction: Min-Cut Placement

Min-cut partitioning produces slicing outlines

Min-cut objective: minimize cut partitions → minimizes total wirelength with the help of terminal propagation

Page 5: Boosting: Min-Cut Placement with Improved Signal Delay

Min-cut placers

Motivation: Avoiding Global Interconnects

severely increase propagation delay since delay is proportional to square of the wirelength

take part of critical paths and degrade performance

require buffering for electrical sanity

have a propagation delay that is equivalent to several clock cycles

Conclusion: try to prevent global interconnects

Sequentially minimize wirelength, i.e., the routing demand Do not treat global interconnects in any special way

Global interconnects can

Page 6: Boosting: Min-Cut Placement with Improved Signal Delay

Case A

Case B

Cases A and B: same wirelength & number of cuts Case B: no global interconnects (cf. Case A)

Motivation: Example

Page 7: Boosting: Min-Cut Placement with Improved Signal Delay

Outline

Introduction and motivation

Controlling wirelength distribution

Boosting min-cut placement Effect of boosting on cut values

Experimental results Conclusions

Page 8: Boosting: Min-Cut Placement with Improved Signal Delay

Bounds on Net Length A net’s HPWL (Half Perimeter Wirelength) is bounded

from below by distances between closest points of incident partitions from above by distances between furthest points of incident partitions

These bounds are gradually refined during top-down placement

at the beginning lower bounds are ~0s, upper bounds are determined by placement region at the end, the bounds are close to (or match) HPWL

Upper bound = ¾ chip width Lower bound = ¼ chip width

Net L

Page 9: Boosting: Min-Cut Placement with Improved Signal Delay

Dichotomy of Lower and Upper bounds

Net L

Net L

Upper bound reduces; lower bound stays the same

Net L

Upper bound stays the same; lower bound increases

Page 10: Boosting: Min-Cut Placement with Improved Signal Delay

Net Extension Control

Partitioning a block extends a net L if the next two equivalent conditions occur:

(1) Cutting L increases the lower bound on its length

(2) Not cutting L decreases the upper bound on its length

Or equivalently

We use the previous conditions to detect net extension and attempt to curb it via boosting

Page 11: Boosting: Min-Cut Placement with Improved Signal Delay

Boosting Min-Cut Placement

Boosting = multiplying a hyperedge (net) weight by a factorboosting factor

Boosting is used only when a cut can increase a lower bound

L

Boost net L with a boosting factor of 2

L

Page 12: Boosting: Min-Cut Placement with Improved Signal Delay

BOOST? YES

To Boost or Not to Boost?

BOOST?

BOOST?BOOST? YES NO

NO

Page 13: Boosting: Min-Cut Placement with Improved Signal Delay

Effect of Boosting on Cut Value

v

u

v is connected to a net eligible for boosting, u is not either can be moved to the right

Boosting factor is 2: the gain of v grows from 1 to 2

Tie is broken by moving v → no degradation in wirelength, and a global wire is avoided

Case 1

Page 14: Boosting: Min-Cut Placement with Improved Signal Delay

Effect of Boosting on Cut Value

v

u

v is connected to several nets eligible for boosting, u is not

Boosting factor is 2 on each net: v’s gain grows from 3 to 6

v has a higher priority → no degradation in wirelength and a global interconnect is eliminated

Case 2

Page 15: Boosting: Min-Cut Placement with Improved Signal Delay

Effect of Boosting on Cut Value

v

u

v is connected to 2 nets eligible for boosting

Boosting factor is 2 gain for v increases (from 2 to 4); gain for u is the same (3)

v is moved → wirelength is degraded but global wires are prevented

Case 3

Page 16: Boosting: Min-Cut Placement with Improved Signal Delay

Summary

Boosting helps in eliminating global interconnects

Boosting may degrade wirelength in some cases

To reduce wirelength degradation, we only boost during first 8 levels That is where long wires are determined anyway

At the 8th placement level: → The average block perimeter is 1/256 of the original chip perimeter → Global interconnects are already established → No point in further boosting

Page 17: Boosting: Min-Cut Placement with Improved Signal Delay

Outline

Introduction and motivation

Controlling wirelength distribution

Boosting min-cut placement Effect of boosting on cut values

Experimental results Conclusions

Page 18: Boosting: Min-Cut Placement with Improved Signal Delay

Experimental Setup

Benchmark Cells Nets Core region Whitespace Metal layers

Clock period

A 21103 21230 2142x1969 13.5% 4 9.456

B 33917 39153 23157x12732 49.8% 4 30.962

C 9585 10398 8705x86968 29.7% 5 37.515

Three industrial benchmarks

Two experiments:

Effect of boosting on the wirelength distribution

Effect of boosting on timing

Page 19: Boosting: Min-Cut Placement with Improved Signal Delay

Experimental Results: Wirelength Histogram (Design A)

-40

-30

-20

-10

0

10

20

1 2 3 4 5 6 7

Percentage change in number of nets (%)

Bins (in terms of half the chip’s perimeter)

Boosting substantially reduces global interconnects

Page 20: Boosting: Min-Cut Placement with Improved Signal Delay

Experimental Results: Wirelength Histogram (Design B)

-100

-80

-60

-40

-20

0

20

1 2 3 4 5 6 7 8

Percentage change in number of nets (%)

Bins (in terms of half the chip’s perimeter)

Boosting substantially reduces global interconnects

Page 21: Boosting: Min-Cut Placement with Improved Signal Delay

Experimental Results: Timing

benchmark Flow Wirelength Slack (ns) TNS (ns)

Tool Mode

A Indust NTD 3491503 -0.660 28.107

TD 3570024 -0.368 12.022

Capo Regular 3335483 -0.607 23.360

Boost 3260184 -0.342 5.107

B Indust NTD 9080259 -31.793 68253.5

TD 9100552 -31.750 56618.6

Capo Regular 8375939 -29.595 44951.8

Boost 8711281 -25.757 49627.6

C Indust NTD 839408 -1.882 1870.3

TD 841585 -1.878 1750.8

Capo Regular 835962 -1.875 1810.6

boost 872089 -1.878 1799.5

Page 22: Boosting: Min-Cut Placement with Improved Signal Delay

Conclusions and Future work

By tracking lower/upper bounds, we identify potential long wires

By additionally increasing net weights, we decrease # of long wires

This alters wirelength distribution and reduces global interconnects Routability is slightly affected, but generally preserved

Boosting tends to improve circuit delay (timing) measured by the worst slack and total negative slack (TNS)

Ongoing work examines the impact of boosting on the number of inserted buffers

Page 23: Boosting: Min-Cut Placement with Improved Signal Delay

Thank you for your attention