Bluetooth Low Energy Protocol Stack Pulse Oximeter Profile · Bluetooth® Low Energy Protocol Stack Pulse Oximeter Profile R01AN3738EJ0100 Rev.1.00 Page 3 of 28 Mar 6, 2017 1. Introduction

Application Note

R01AN3738EJ0100 Rev.1.00 Page 1 of 28

Mar 6, 2017

Bluetooth® Low Energy Protocol Stack

Pulse Oximeter Profile

Introduction

This document describes information that is not included in the user's manual [R01UW0095] and rBLE command

specification[R01AN1376] for the Pulse Oximeter Profile (PLXP) that run on the Renesas Bluetooth Low Energy

microcomputer (RL78/G1D). The Pulse Oximeter profile realizes the application to transmit measurements, such as

blood oxygen saturation level (SpO2) and pulse rate, from a pulse oximeter to a collector device.

Target Device

RL78/G1D

Rerated Documents

Document Name Document Number

Bluetooth® Low Energy Protocol Stack

User’s Manual R01UW0095

API Reference Manual: Basics R01UW0088

rBLE Command Specification R01AN1376

Bluetooth® Profile Specification

Pulse Oximeter Profile v1.0.0 -

Bluetooth® Service Specification

Pulse Oximeter Service v1.0.0 -

R01AN3738EJ0100 Rev.1.00

Mar 6, 2017

Bluetooth® Low Energy Protocol Stack Pulse Oximeter Profile

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Contents

1. Introduction .................................................................................................................... 3

2. Installing Pulse Oximeter Profile ................................................................................... 3

2.1 Components Included ................................................................................................................ 3

2.2 Development Environment ......................................................................................................... 4

2.3 Installation Procedure ................................................................................................................ 5

3. Pulse Oximeter Profile ................................................................................................... 6

3.1 Use case implemented by using the Pulse Oximeter service, the Device Information

service and the Battery service ................................................................................................. 6

3.2 Use case implemented by using the Record Access Control Point characteristic ............. 7

4. Configuration Parameters.............................................................................................. 8

4.1 Pulse Oximeter Profile Enable / Disable Setting ...................................................................... 9

4.2 Pulse Oximeter Service Characteristic Setting ........................................................................ 9

5. rBLE Command Specification ..................................................................................... 10

5.1 rBLE Command ......................................................................................................................... 10

5.1.1 Sensor Command ............................................................................................................... 10

5.1.2 Collector Command ............................................................................................................ 12

5.2 rBLE Event ................................................................................................................................. 14

5.2.1 Sensor Event ....................................................................................................................... 14

5.2.2 Collector Event .................................................................................................................... 17

6. Appendix ....................................................................................................................... 20

6.1 Folder Organization .................................................................................................................. 20

6.1.1 For BLE MCU ....................................................................................................................... 20

6.1.2 For APP MCU ....................................................................................................................... 22

6.2 Implementation Guide .............................................................................................................. 23

6.2.1 BLE MCU Development Environment ............................................................................... 23

6.2.2 APP MCU Development Environment ............................................................................... 24

6.3 How to Not Expose Optional Characteristics ......................................................................... 26


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1. Introduction

This document is a summary of information on the Pulse Oximeter Profile based on the contents of the profile / service

in the related document included in the Renesas Bluetooth Low Energy Protocol Stack (BLE software) package

(RTM5F11A00NBLE0F10RZ).

Table 1-1 shows the correspondence between related documents and chapters of this document.

Table 1-1 Correspondence between related document and each chapter of this document

Chapter Rerated Documents

Document Name Chapter of related document

3 User’s Manual (R01UW0095) 7. Description of Features

4 User’s Manual (R01UW0095) 6.1.11 Setting the Profile Service

5 rBLE Command Specification (R01AN1376) 6. rBLE Command

7. rBLE Event

Refer to the corresponding part of each document to understand the contents of this document.

2. Installing Pulse Oximeter Profile

2.1 Components Included

The compressed package of the Pulse Oximeter Profile includes the followings:

Documents

Bluetooth Low Energy Protocol Stack Pulse Oximeter Profile (this manual)

Bluetooth Low Energy Protocol Stack API Reference Manual : PLXP

Project files used to create executable files for BLE MCU

Executable file

BLE software library (Pulse Oximeter Profile)

Source code (Only files that differ from BLE software V.1.20 are included)

e2 studio project files

CS+ for CC project files

CS+ for CA,CX project files

IAR Embedded Workbench for Renesas RL78 V2.20.1 workspace files

Project files used to create executable files for APP MCU

Executable file (for Windows PC)

Source code (Only files that differ from BLE software V.1.20 are included)

Microsoft Visual Studio Express 2013 project file

e2 studio project files

CS+ for CC project files

CS+ for CA,CX project files

IAR Embedded Workbench for Renesas RL78 V2.20.1 workspace files See Section 6.1 for details of included components.


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2.2 Development Environment

The environment in which Pulse Oximeter Profile was built is shown below.

Hardware environment

- Host

PC/AT™-compatible computer

Processor : At least 1.6 GHz

Main memory : At least 1 GB

Display : 1024 x 768 or higher resolution and 65,536 colors

Interface : USB 2.0 (E1 and USB-serial conversion cable)

Tools used

Renesas on-chip debugging emulator E1

Software environment

Windows 7 or later

Microsoft Visual Studio Express 2013 for Windows Desktop Update4

Microsoft .NET Framework 4 + language pack

Renesas CS+ for CC V4.00.00/ RL78 Compiler CC-RL V1.03.00

or e² studio 4.3.1.001/RL78 Family C Compiler Package V1 (without IDE) V1.03.00

or Renesas CS+ for CA, CX V3.02.00/Renesas CA78K0R V1.72

or IAR Embedded Workbench for Renesas RL78 V2.20.1

Renesas Flash Programmer v3.02.01

(available from https://www.renesas.com/products/software-tools/tools/programmer/renesas-flash-

programmer-programming-gui.html)

https://www.renesas.com/products/software-tools/tools/programmer/renesas-flash-programmer-programming-gui.html

https://www.renesas.com/products/software-tools/tools/programmer/renesas-flash-programmer-programming-gui.html


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2.3 Installation Procedure

If using the BLE software for the first time

After decompressing this package overwrite it to the installation destination of the BLE software V1.20. Refer to

Chapter 4 of Bluetooth Low Energy Protocol Stack User's Manual [R01UW0095] for installation procedure of the

BLE software V1.20.

The project files and workspace files for each development environment and configuration are stored in the

following.

Renesas CS+ for CA,CX V3.02.00

Modem \RL78_G1D\Project_Source\renesas\tools\project\CubeSuite\BLE_Modem\BLE_Modem.mtpj

Embedded \RL78_G1D\Project_Source\renesas\tools\project\CubeSuite\BLE_Embedded\BLE_Embedded.mtpj

Renesas CS+ for CC V4.00.00

Modem \RL78_G1D\Project_Source\renesas\tools\project\CS_CCRL\BLE_Modem\BLE_Modem.mtpj

Embedded \RL78_G1D\Project_Source\renesas\tools\project\CS_CCRL\BLE_Embedded\BLE_Embedded.mtpj

e2 studio 4.3.1.001

Modem \RL78_G1D\Project_Source\renesas\tools\project\e2studio\BLE_Modem\rBLE_Mdm

Embedded \RL78_G1D\Project_Source\renesas\tools\project\e2studio\BLE_Embedded\rBLE_Emb

IAR Embedded Workbench for Renesas RL78 V2.20.1

Modem \RL78_G1D\Project_Source\renesas\tools\project\iar_v2\BLE_Modem\BLE_Modem.eww

Embedded \RL78_G1D\Project_Source\renesas\tools\project\iar_v2\BLE_Embedded\BLE_Embedded.eww

If already developing an application using the BLE software

If you are already developing the user application based on the BLE software V1.20, refer to Section 6.2 and add the

Pulse Oximeter Profile to existing development environment.


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3. Pulse Oximeter Profile

The Pulse Oximeter profile realizes the application to transmit measurements, such as blood oxygen saturation level

(SpO2) and pulse rate, from a pulse oximeter to a collector device.

The Pulse Oximeter profile defines two roles: Sensor (a pulse oximeter device) and Collector (a device that collects

data from a pulse oximeter). The Sensor role has instances of the Pulse Oximeter service, the Device Information

service and the Battery service.

Figure 3-1 Pulse Oximeter Profile

3.1 Use case implemented by using the Pulse Oximeter service, the Device Information service and the Battery service

The Sensor exposes the characteristics shown in the table below by using the Pulse Oximeter service, Device

Information service and the Battery service.

Table 3-1 Pulse Oximeter Service Characteristics

Characteristics Property Description

PLX Spot-check Measurement Indicate Used to send the Spot-check measurements.

Client Characteristic

Configuration descriptor

Read, Write Indicates whether sending the above measurements is

enabled or disabled. (Can be set from the client.)

PLX Continuous Measurement Notify Used to send the Continuous measurements.



Read, Write Indicates whether sending the above measurements is


PLX Feature Read Indicates what data field are present in Spot-check /

Continuous measurements, in addition indicates the

supported features of the sensor device.

Measurement Storage for Spot-check measurements

Timestamp for Spot-check measurements

Fast metric for Continuous measurements

Slow metric for Continuous measurements

Pulse Amplitude Index

Multiple Bonds

Record Access Control Point Write,

Indicate

The Collector requests the sensor to perform a procedure,

and the Sensor indicates the performing result of the

requested procedure.

Collector

Pulse Oximeter

Sensor

Pulse Oximeter

Service

Device Information

Service

Battery Service


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Read, Write Indicates whether sending the above performing result is


Table 3-2 Device Information Service Characteristics


Manufacturer Name String Read String indicating the device manufacture name.

Model Number String Read String indicating the model number assigned by the device

vendor

Serial Number String Read String indicating the serial number of the device

Hardware Revision String Read String indicating the hardware revision

Firmware Revision String Read String indicating the firmware revision

Software Revision String Read String indicating the software revision

System ID Read String indicating the system ID (which represents a structure

containing an Organizationally Unique Identifier (OUI)

followed by a manufacturer-defined identifier and is unique

for each individual instance of the product)

IEEE 11073-20601 Regulatory

Certification Data List

Read String indicating the IEEE 11073-20601 regulatory

certification information of the device

Table 3-3 Battery Service Characteristics


Battery Level Read, Notify Used to expose or send battery level.



Read, Write Indicates whether sending the battery level above is enabled

or disabled. (Can be set from the client.)

The Collector performs Service discovery and Characteristic discovery of the services and characteristics exposed by

the Sensor shown in Table 3-1, Table 3-2 and Table 3-3. After discovery, the Collector controls the configuration of

notification / indication of each characteristic sent from the Sensor via the Client Characteristic Configuration descriptor

to acquire sensor measured SpO2 / Pulse Rate data.

For details about the profile, such as requirements for connection and reconnection, and security requirements, refer to

Pulse Oximeter Profile Specification v1.0.

3.2 Use case implemented by using the Record Access Control Point characteristic

The Record Access Control Point characteristic is used to access patient record that are stored in the Sensor from

Collector. If the Record Access Control Point is supported by Sensor, Collector enables indications via the Client

Characteristic Configuration descriptor of Record Access Control Point and PLX Spot-check Measurement, before

performing a Record Access Control Point procedure. Then Collector may request the following desired procedure.

Table 3-4 Record Access Control Point Procedure

Procedure Description

Report Stored Records Request the transfer of stored records from the Sensor.

Delete Stored Records Request deletion of stored records within the Sensor.

Abort Operation Abort a procedure that a Collector initiated.

Report Number of Stored Records Request the number of stored records within the Sensor.


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4. Configuration Parameters

The items that can be configured by the user when creating an executable file using Pulse Oximeter Profile are listed in

Table 4-1, and the configuration method is described next section.

Table 4-1 Changing the Configuration Parameters

User-Configurable Items Specifiable Value

Pulse Oximeter Profile Enable / Disable setting Enable or Disable

Pulse Oximeter Service

characteristic PLXP Features Supported features

Product information of Device

Information Service

System ID System ID

Model Number Character string indicating the model number

Serial Number Character string indicating the serial number

Firmware Revision Character string indicating the firmware

revision

Hardware Revision Character string indicating the hardware

revision

Software Revision Character string indicating the software

revision

Manufacturer Name Character string indicating the manufacturer

name

IEEE Certification Value IEEE 11073-20601 regulatory certification

data list

The user configurable parameters for the profiles and services, you can change them by using variables and macros in

the following source file.

Folder: \Renesas\BLE_Software_Ver_X_XX\RL78_G1D\Project_Source\renesas\src\arch\rl78

File: prf_config.c, prf_config.h


File: prf_sel.h

Note: GATT database structure of existing profiles that are defined in the above file shall not be changed. Therefore it

isn't possible to changes order or add/delete elements. If you do not want to expose the optional characteristics,

please use the RBLE_GATT_PERM_HIDE permission.

For details on how to not expose optional characteristics, refer to Section 6.3.


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4.1 Pulse Oximeter Profile Enable / Disable Setting

It is possible to enable / disable Pulse Oximeter Profile roll.

Table 4-2 shows the macro name to enable / disable Pulse Oximeter Profile role. Setting the value of corresponding

macro to 1 enables the profiling role.

Table 4-2 Macro name to enable / disable PXLP role

Profile Role Macro name

Pulse Oximeter Profile Collector PRF_SEL_PLXC

Sensor PRF_SEL_PLXS

To disable the Pulse Oximeter Profile role, set the value of corresponding macro to 0.

4.2 Pulse Oximeter Service Characteristic Setting

The PLXP Features characteristic value, which indicates the support functions of the pulse oximeter device, can be set

by the following variables in

Table 4-3 PLXP Features setting variable

Variable name Description Note

static const uint8_t

plxs_plx_feature

Support functions of the

pulse oximeter device

setting variable

Set this according to the product, in

accordance with the specifications of

Pulse Oximeter Service.

For more information about the Blood Pressure Feature characteristic, refer to Pulse Oximeter Service Specification

v1.0, the Section 3.3.


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5. rBLE Command Specification

The rBLE command is communication command when user application is executed by different MCU.

This configuration is called “Modem configuration”.

5.1 rBLE Command

5.1.1 Sensor Command

NO. Command Name Description

1 RBLE_PLXP_Sensor_Enable Enables the Sensor role

2 RBLE_PLXP_Sensor_Disable Disables the Sensor role

3 RBLE_PLXP_Sensor_Send_Spot_Check_Meas Sends the spot-check measurements

4 RBLE_PLXP_Sensor_Send_Continuous_Meas Sends the continuous measurements

5 RBLE_PLXP_Sensor_Send_Battery_Level Sends the battery level

6 RBLE_PLXP_Sensor_Send_RA_Control_Point Sends the RA control point information

5.1.1.1 RBLE_PLXP_Sensor_Enable

Data format:

RBLE_CMD_PLXP_SENSOR_ENABLE (OpeCode=0x1F01)

LSB Octet0 Octet1 Octet2 Octet3 MSB

conhdl sec_lvl con_type

plx_spot_chk_meas_ind_en plx_continuous_meas_ntf_en

plx_racp_ind_en battery_level_ntf_en

5.1.1.2 RBLE_PLXP_Sensor_Disable

Data format:

RBLE_CMD_PLXP_SENSOR_DISABLE (OpeCode=0x1F02)


conhdl - -

5.1.1.3 RBLE_PLXP_Sensor_Send_Spot_Check_Meas

Data format:

RBLE_CMD_PLXP_SENSOR_SEND_SPOT_CHECK_MEAS (OpeCode=0x1F03)


conhdl flags reserved

spo2 pulse_rate

year month day

hour min sec reserved

meas_status dev_and_sens_status(lower)

dev_and_sens_status(upper) pulse_idx


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5.1.1.4 RBLE_PLXP_Sensor_Send_Continuous_Meas

Data format:

RBLE_CMD_PLXP_SENSOR_SEND_CONTINUOUS_MEAS (OpeCode=0x1F04)



normal_spo2 normal_pulse_rate

fast_spo2 fast_pulse_rate

slow_spo2 slow_pulse_rate



5.1.1.5 RBLE_PLXP_Sensor_Send_Battery_Level

Data format:

RBLE_CMD_PLXP_SENSOR_SEND_BATTERY_LEVEL (OpeCode=0x1F05)


conhdl battery_level reserved

5.1.1.6 RBLE_PLXP_Sensor_Send_RA_Control_Point

Data format:

RBLE_CMD_PLXP_SENSOR_SEND_RA_CONTROL_POINT (OpeCode=0x1F06)


conhdl op_code racp_operator

num_of_records request_op_code response_code_value


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5.1.2 Collector Command

NO. Command Name Description

1 RBLE_PLXP_Collector_Enable Enables the Collector role

2 RBLE_PLXP_Collector_Disable Disables the Collector role

3 RBLE_PLXP_Collector_Read_Char Reads the characteristic value

4 RBLE_PLXP_Collector_Write_RA_Control_Point Sets the RA control point

5 RBLE_PLXP_Collector_Write_Char Write the characteristic value

5.1.2.1 RBLE_PLXP_Collector_Enable

Data format:

RBLE_CMD_PLXP_COLLECTOR_ENABLE (OpeCode=0x1F81)


conhdl con_type reserved

plx_shdl plx_ehdl

plx_spot_chk_meas_char_hdl plx_spot_chk_meas_val_hdl

plx_spot_chk_meas_cfg_hdl plx_spot_chk_meas

_prop reserved

plx_continuous_meas_char_hdl plx_continuous_meas_val_hdl

plx_continuous_meas_cfg_hdl plx_continuous_me

as_prop reserved

plx_feature_char_hdl plx_feature_val_hdl

plx_feature_prop reserved plx_ra_cp_char_hdl

plx_ra_cp_val_hdl plx_ra_cp_cfg_hdl

plx_ra_cp_prop reserved dis_shdl

dis_ehdl sys_id_char_hdl

sys_id_val_hdl sys_id_prop reserved

model_nb_char_hdl model_nb_val_hdl

model_nb_prop reserved serial_nb_char_hdl

serial_nb_val_hdl serial_nb_prop reserved

fw_rev_char_hdl fw_rev_val_hdl

fw_rev_prop reserved hw_rev_char_hdl

hw_rev_val_hdl hw_rev_prop reserved

sw_rev_char_hdl sw_rev_val_hdl

sw_rev_prop reserved manuf_name_char_hdl

manuf_name_val_hdl manuf_name_prop reserved

ieee_certif_char_hdl ieee_certif_val_hdl

ieee_certif_prop reserved bat_shdl

bat_ehdl battery_lvl_char_hdl

battery_lvl_val_hdl battery_lvl_cfg_hdl

battery_lvl_prop reserved - -

5.1.2.2 RBLE_PLXP_Collector_Disable

Data format:

RBLE_CMD_PLXP_COLLECTOR_DISABLE (OpeCode=0x1F82)


conhdl - -


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5.1.2.3 RBLE_PLXP_Collector_Read_Char

Data format:

RBLE_CMD_PLXP_COLLECTOR_READ_CHAR (OpeCode=0x1F83)


conhdl char_code reserved

5.1.2.4 RBLE_PLXP_Collector_Write_RA_Control_Point

Data format:

RBLE_CMD_PLXP_COLLECTOR_WRITE_RA_CONTROL_POINT (OpeCode=0x1F84)



5.1.2.5 RBLE_PLXP_Collector_Write_Char

Data format:

RBLE_CMD_PLXP_COLLECTOR_WRITE_CHAR (OpeCode=0x1F85)



cfg_val - -


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5.2 rBLE Event

5.2.1 Sensor Event

NO. Event Name Description

1 RBLE_PLXP_EVENT_SENSOR_ENABLE_CO

MP Sensor role enable completion event

2 RBLE_PLXP_EVENT_SENSOR_DISABLE_CO

MP Sensor role disable completion event

3 RBLE_PLXP_EVENT_SENSOR_ERROR_IND Sensor role error indication event

4 RBLE_PLXP_EVENT_SENSOR_SEND_SPOT_

CHK_MEAS_COMP

Spot-check measurements send completion

event

5 RBLE_PLXP_EVENT_SENSOR_SEND_CONTI

NUOUS_MEAS_COMP

Continuous measurements send completion

event

6 RBLE_PLXP_EVENT_SENSOR_SEND_RA_C

P_COMP RA Control Point send completion event

7 RBLE_PLXP_EVENT_SENSOR_CHG_RA_CP

_IND RA Control Point change indication event

8 RBLE_PLXP_EVENT_SENSOR_SEND_BATT_

LEVEL_COMP Battery level send completion event

9 RBLE_PLXP_EVENT_SENSOR_CFG_INDNTF

_IND

Characteristic configuration change indication

event

10 RBLE_PLXP_EVENT_SENSOR_COMMAND_D

ISALLOWED_IND

Sensor role command disallowed indication

event

5.2.1.1 RBLE_PLXP_EVENT_SENSOR_ENABLE_COMP

Data format:

RBLE_EVT_PLXP_SENSOR_ENABLE_COMP (EventCode=0x1F01)


status reserved conhdl

5.2.1.2 RBLE_PLXP_EVENT_SENSOR_DISABLE_COMP

Data format:

RBLE_EVT_PLXP_SENSOR_DISABLE_COMP (EventCode=0x1F02)


conhdl plx_spot_chk_meas_ind_en

plx_continuous_meas_ntf_en plx_racp_ind_en

battery_level_ntf_en - -

5.2.1.3 RBLE_PLXP_EVENT_SENSOR_ERROR_IND

Data format:

RBLE_EVT_PLXP_SENSOR_ERROR_IND (EventCode=0x1F03)


conhdl status -


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5.2.1.4 RBLE_PLXP_EVENT_SENSOR_SEND_SPOT_CHK_MEAS_COMP

Data format:

RBLE_EVT_PLXP_SENSOR_SEND_SPOT_CHK_MEAS_COMP (EventCode=0x1F04)


conhdl status -

5.2.1.5 RBLE_PLXP_EVENT_SENSOR_SEND_CONTINUOUS_MEAS_COMP

Data format:

RBLE_EVT_PLXP_SENSOR_SEND_CONTINUOUS_MEAS_COMP (EventCode=0x1F05)


conhdl status -

5.2.1.6 RBLE_PLXP_EVENT_SENSOR_SEND_RA_CP_COMP

Data format:

RBLE_EVT_PLXP_SENSOR_SEND_RA_CP_COMP (EventCode=0x1F06)


conhdl status -

5.2.1.7 RBLE_PLXP_EVENT_SENSOR_CHG_RA_CP_IND

Data format:

RBLE_EVT_PLXP_SENSOR_CHG_RA_CP_IND (EventCode=0x1F07)



5.2.1.8 RBLE_PLXP_EVENT_SENSOR_SEND_BATT_LEVEL_COMP

Data format:

RBLE_EVT_PLXP_SENSOR_SEND_BATT_LEVEL_COMP (EventCode=0x1F08)


conhdl status -

5.2.1.9 RBLE_PLXP_EVENT_SENSOR_CFG_INDNTF_IND

Data format:

RBLE_EVT_PLXP_SENSOR_CFG_INDNTF_IND (EventCode=0x1F09)



cfg_val - -


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5.2.1.10 RBLE_PLXP_EVENT_SENSOR_COMMAND_DISALLOWED_IND

Data format:

RBLE_EVT_PLXP_SENSOR_CMD_DISALLOWED_IND (EventCode=0x1F3F)


status reserved opcode


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5.2.2 Collector Event

NO. Event Name Description

1 RBLE_PLXP_EVENT_COLLECTOR_ENABLE_

COMP Collector role enable completion event

2 RBLE_PLXP_EVENT_COLLECTOR_DISABLE

_COMP Collector role disable completion event

3 RBLE_PLXP_EVENT_COLLECTOR_ERROR_I

ND Collector role error indication event

4 RBLE_PLXP_EVENT_COLLECTOR_SPOT_CH

K_MEAS_IND Spot-check measurements indication event

5 RBLE_PLXP_EVENT_COLLECTOR_CONTINU

OUS_MEAS_IND Continuous measurements indication event

6 RBLE_PLXP_EVENT_COLLECTOR_RA_CP_I

ND RA Control Point indication event

7 RBLE_PLXP_EVENT_COLLECTOR_BATT_LV

L_NTF Battery level notification event

8 RBLE_PLXP_EVENT_COLLECTOR_READ_C

HAR_RESPONSE Characteristic value read request response event

9 RBLE_PLXP_EVENT_COLLECTOR_WRITE_C

HAR_RESPONSE Characteristic value write request response event

10 RBLE_PLXP_EVENT_COLLECTOR_COMMAN

D_DISALLOWED_IND

Collector role command disallowed indication

event

5.2.2.1 RBLE_PLXP_EVENT_COLLECTOR_ENABLE_COMP

Data format:

RBLE_EVT_PLXP_COLLECTOR_ENABLE_COMP (EventCode=0x1F81)


status reserved conhdl

plx_shdl plx_ehdl

plx_spot_chk_meas_char_hdl plx_spot_chk_meas_val_hdl

plx_spot_chk_meas_cfg_hdl plx_spot_chk_meas

_prop reserved

plx_continuous_meas_char_hdl plx_continuous_meas_val_hdl

plx_continuous_meas_cfg_hdl plx_continuous_me

as_prop reserved

plx_feature_char_hdl plx_feature_val_hdl

plx_feature_prop reserved plx_ra_cp_char_hdl

plx_ra_cp_val_hdl plx_ra_cp_cfg_hdl

plx_ra_cp_prop reserved dis_shdl

dis_ehdl sys_id_char_hdl

sys_id_val_hdl sys_id_prop reserved

model_nb_char_hdl model_nb_val_hdl

model_nb_prop reserved serial_nb_char_hdl

serial_nb_val_hdl serial_nb_prop reserved

fw_rev_char_hdl fw_rev_val_hdl

fw_rev_prop reserved hw_rev_char_hdl

hw_rev_val_hdl hw_rev_prop reserved

sw_rev_char_hdl sw_rev_val_hdl

sw_rev_prop reserved manuf_name_char_hdl

manuf_name_val_hdl manuf_name_prop reserved


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ieee_certif_char_hdl ieee_certif_val_hdl

ieee_certif_prop reserved bat_shdl

bat_ehdl battery_lvl_char_hdl

battery_lvl_val_hdl battery_lvl_cfg_hdl

battery_lvl_prop reserved - -

5.2.2.2 RBLE_PLXP_EVENT_COLLECTOR_DISABLE_COMP

Data format:

RBLE_EVT_PLXP_COLLECTOR_DISABLE_COMP (EventCode=0x1F82)


conhdl status -

5.2.2.3 RBLE_PLXP_EVENT_COLLECTOR_ERROR_IND

Data format:

RBLE_EVT_PLXP_COLLECTOR_ERROR_IND (EventCode=0x1F83)


conhdl status -

5.2.2.4 RBLE_PLXP_EVENT_COLLECTOR_SPOT_CHK_MEAS_IND

Data format:

RBLE_EVT_PLXP_COLLECTOR_SPOT_CHK_MEAS_IND (EventCode=0x1F84)



spo2 pulse_rate

year month day

hour min sec reserved



5.2.2.5 RBLE_PLXP_EVENT_COLLECTOR_CONTINUOUS_MEAS_IND

Data format:

RBLE_EVT_PLXP_COLLECTOR_CONTINUOUS_MEAS_NTF (EventCode=0x1F85)



normal_spo2 normal_pulse_rate

fast_spo2 fast_pulse_rate

slow_spo2 slow_pulse_rate




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Mar 6, 2017

5.2.2.6 RBLE_PLXP_EVENT_COLLECTOR_RA_CP_IND

Data format:

RBLE_EVT_PLXP_COLLECTOR_RA_CP_IND (EventCode=0x1F86)



num_of_records request_op_code response_code_value

5.2.2.7 RBLE_PLXP_EVENT_COLLECTOR_BATT_LVL_NTF

Data format:

RBLE_EVT_PLXP_COLLECTOR_BATT_LVL_NTF (EventCode=0x1F87)


conhdl battery_level -

5.2.2.8 RBLE_PLXP_EVENT_COLLECTOR_READ_CHAR_RESPONSE

Data format:

RBLE_EVT_PLXP_COLLECTOR_READ_CHAR_RESPONSE (EventCode=0x1F88)


conhdl att_code reserved

each_len len data[ 0 ] data[ 1 ]

data[ 2 ] data[ 3 ] data[ 4 ] data[ 5 ]





data[ 22 ] data[ 23 ] - -

5.2.2.9 RBLE_PLXP_EVENT_COLLECTOR_WRITE_CHAR_RESPONSE

Data format:

RBLE_EVT_PLXP_COLLECTOR_WRITE_CHAR_RESPONSE (EventCode=0x1F89)


conhdl att_code -

5.2.2.10 RBLE_PLXP_EVENT_COLLECTOR_COMMAND_DISALLOWED_IND

Data format:

RBLE_EVT_PLXP_COLLECTOR_CMD_DISALLOWED_IND (EventCode=0x1FBF)


status reserved opcode


R01AN3738EJ0100 Rev.1.00 Page 20 of 28

Mar 6, 2017

6. Appendix

6.1 Folder Organization

The detail of files and folders included in this package are shown below. Only files that added or changed from the BLE

software V1.20 for the sake of the Pulse Oximeter Profile are included in this package.

6.1.1 For BLE MCU

File / Folder Name Type Overview

RL78_G1D

├ Project_Source

│ ├ bleip

│ │ └ src

│ │ └ rwble

│ │ └ rwble_config.h (Chg) BLE stack configuration header file

│ ├ rBLE

│ │ └ src

│ │ ├ include

│ │ │ ├ rble.h (Chg) rBLE header file

│ │ │ └ rble_api.h (Chg) rBLE API header file

│ │ └ sample_app

│ │ ├ rble_sample_app.c (Chg) Sample program file (Common)

│ │ ├ rble_sample_app_gap_sm_gatt.c (Chg) Sample program file (GAP/SM/GATT)

│ │ └ rble_sample_app_plxp.c (Add) Sample program file (PLXP)

│ └ renesas

│ ├ lib

│ │ ├ BLE_PROFILE_PLXP_lib.a (Add) PLXP library file for IAR Embedded Workbench V2

│ │ ├ BLE_PROFILE_PLXP_LIB.lib (Add) PLXP library file for CA78K0R

│ │ └ BLE_PROFILE_PLXP_LIB_CCRL.lib (Add) PLXP library file for CC-RL

│ ├ src

│ │ └ arch

│ │ └ rl78

│ │ ├ db_handle.h (Chg) Attribute database handles header file

│ │ ├ ke_conf.c (Chg) RWKE task management file

│ │ ├ ke_conf_simple.c (Chg) RWKE task management file for simple SCP project

│ │ ├ prf_config.c (Chg) Profile parameter file

│ │ ├ prf_config.h (Chg) Profile parameter header file

│ │ ├ prf_sel.h (Chg) Profile selection configuration header file

│ │ ├ rble_core_config.c (Chg) rBLE_Core parameter file

│ │ ├ rble_core_config.h (Chg) rBLE_Core parameter header file

│ │ ├ rble_modem_config.c (Chg) MDM_APPL parameter file

│ │ ├ rble_modem_config.h (Chg) MDM_APPL parameter header file

│ │ └ rwke_api.h (Chg) RWKE API header file

│ └ tools

│ └ project

│ ├ CS_CCRL Project folder for CS+ for CC

│ │ ├ BLE_Embedded

│ │ │ └ rBLE_Emb

│ │ │ └ rBLE_Emb.mtsp (Chg) Sub project file for Embedded configuration

│ │ └ BLE_Modem

│ │ └ rBLE_Mdm

│ │ └ rBLE_Mdm.mtsp (Chg) Sub project file for Modem configuration

│ ├ CubeSuite Project folder for CS+ for CA, CX


│ │ │ └ BLE_Emb

│ │ │ └ BLE_Emb.mtsp (Chg) Sub project file for Embedded configuration


│ │ └ rBLE_emb

│ │ └ rBLE_emb.mtsp (Chg) Sub project file for Modem configuration

│ ├ e2studio Project folder for e2 studio



R01AN3738EJ0100 Rev.1.00 Page 21 of 28

Mar 6, 2017

│ │ │ └ rBLE_Emb

│ │ │ ├ .cproject (Chg) Build option file for Embedded configuration

│ │ │ └ .project (Chg) Project file for Embedded configuration


│ │ └ rBLE_Mdm

│ │ └ .cproject (Chg) Build option file for Modem configuration

│ └ iar_v2 Project folder for IAR Embedded Workbench V2

│ ├ BLE_Embedded

│ │ └ BLE_Emb

│ │ └ BLE_Emb.ewp (Chg) Project file for Embedded configuration

│ └ BLE_Modem

│ └ BLE_Emb

│ └ BLE_Emb.ewp (Chg) Project file for Modem configuration

└ ROM_File

├ ca78k0r Folder of ROM file that was built with CS+ for CA, CX

│ ├ Embedded ROM file folder for Embedded configuration

│ │ └ RL78_G1D_CE(PLXP).hex (Add) ROM file for Embedded configuration (PLXP)

│ └ Modem ROM file folder for Modem configuration

│ └ RL78_G1D_CM(PLXP).hex (Add) ROM file for Modem configuration (PLXP)

├ ccrl Folder of ROM file that was built with CS+ for CC

│ ├ Embedded ROM file folder for Embedded configuration

│ │ └ RL78_G1D_CCE(PLXP).hex (Add) ROM file for Embedded configuration (PLXP)

│ └ Modem ROM file folder for Modem configuration

│ └ RL78_G1D_CCM(PLXP).hex (Add) ROM file for Modem configuration (PLXP)

└ iar_v2 Folder of ROM file that was built with IAR EW V2

├ Embedded ROM file folder for Embedded configuration

│ └ RL78_G1D_IE(PLXP).hex (Add) ROM file for Embedded configuration (PLXP)

└ Modem ROM file folder for Modem configuration

└ RL78_G1D_IM(PLXP).hex (Add) ROM file for Modem configuration (PLXP)

(Chg) : Changed file (Add) : Added file / folder


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Mar 6, 2017

6.1.2 For APP MCU

File / Folder Name Type Overview

BLE_Sample

├ project

│ ├ CS_CCRL

│ │ └ BLE_Sample

│ │ └ rBLE_sample

│ │ └ rBLE_sample.mtsp (Chg) CS+ for CC sub project file

│ ├ CubeSuite


│ │ └ sample

│ │ └ rBLE_sample.mtsp (Chg) CS+ for CA, CX sub project file

│ ├ e2studio


│ │ └ rBLE_sample

│ │ ├ .cproject (Chg) Build option file

│ │ └ .project (Chg) Project file

│ ├ iar_v2


│ │ └ Sample

│ │ └ Sample.ewp (Chg) IAR Embedded Workbench V2 project file

│ └ VC 2013

│ ├ Exe

│ │ └ rBLE_Sample.exe (Chg) Sample program (executable file for PC)

│ ├ rBLE_Sample_for_2013e.vcxproj (Chg) Microsoft Visual Studio Express 2013 project file

│ └ rBLE_Sample_for_2013e.vcxproj.filters (Chg) └ src

└ rBLE

└ src

├ host

│ ├ plxp

│ │ ├ rble_api_plxpc.c (Add) rBLE Host PLXP Collector file

│ │ └ rble_api_plxps.c (Add) rBLE Host PLXP Server file

│ ├ rble_host.c (Chg) rBLE Host file

│ └ rble_if_api_cb.c (Chg) rBLE Host Event file

├ include

│ ├ host

│ │ └ rble_host.h (Chg) rBLE Host header file

│ ├ prf_sel.h (Chg) Profile selection configuration header file

│ ├ rble.h (Chg) rBLE header file

│ └ rble_api.h (Chg) rBLE API header file

├ sample_app

│ ├ rble_sample_app.c (Chg) Sample Program file (Common)

│ ├ rble_sample_app_gap_sm_gatt.c (Chg) Sample Program file (GAP/SM/GATT)

│ └ rble_sample_app_plxp.c (Add) Sample Program file (PLXP)

└ sample_profile

└ db_handle.h (Chg) Attribute database handles header file

(Chg) : Changed file (Add) : Added file / folder


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Mar 6, 2017

6.2 Implementation Guide

This section describes the procedure for adding the Pulse Oximeter Profile in this package to the existing development

environment for the user application based on the BLE software V.1.20.

6.2.1 BLE MCU Development Environment

For the BLE MCU development environment, add the Pulse Oximeter Profile to the existing BLE MCU development

environment in the following procedure.

6.2.1.1 Copy Files

Copy the following library files included in this package to the existing development environment.

\RL78_G1D

└ \Project_Source

└ \renesas

└ \lib

├ BLE_PROFILE_PLXP_lib.a

├ BLE_PROFILE_PLXP_LIB.lib

└ BLE_PROFILE_PLXP_LIB_CCRL.lib

6.2.1.2 Overwrite Files

Overwrite the following files included in this package into the existing development environment.

\RL78_G1D

└ \Project_Source

└ \rBLE

└ \src

└ \include

├ rble.h

└ rble_api.h

6.2.1.3 Merge Files

Merge the following files included in this package into the existing development environment. If the following files

have not been changed, simply overwrite them.

\RL78_G1D

└ \Project_Source

├ \bleip

│ └ \src

│ └ \rwble

│ └ rwble_config.h

└ \renesas

└ \src

└ \arch

└ \rl78

├ db_handle.h

├ ke_conf.c

├ ke_conf_simple.c

├ prf_config.c

├ prf_config.h

├ prf_sel.h

├ rble_core_config.c

├ rble_core_config.h

├ rble_modem_config.c

├ rble_modem_config.h

└ rwke_api.h


R01AN3738EJ0100 Rev.1.00 Page 24 of 28

Mar 6, 2017

6.2.1.4 Merge Files as Necessary

If using the sample program for Embedded configuration, merge the following files included in this package into the

existing development environment. If the following files have not been changed, simply overwrite them.

\RL78_G1D

└ \Project_Source

└ \rBLE

└ \src

└ \sample_app

├ rble_sample_app.c merge

├ rble_sample_app_gap_sm_gatt.c merge

└ rble_sample_app_plxp.c copy

6.2.1.5 Change Project File / Workspace

In order to use the Pulse Oximeter Profile, it is necessary to link Pulse Oximeter Profile library file. Change the setting

of the existing project or workspace so that the following library file is linked.

\RL78_G1D

└ \Project_Source

└ \renesas

└ \lib

├ BLE_PROFILE_PLXP_lib.a IAR V2

├ BLE_PROFILE_PLXP_LIB.lib CS+ for CA, CX

└ BLE_PROFILE_PLXP_LIB_CCRL.lib CS+ for CC / e2 studio

Also, if using the sample program for the Embedded configuration, add the following file into the project or workspace.

\RL78_G1D

└ \Project_Source

└ \rBLE

└ \src

└ \sample_app

└ rble_sample_app_plxp.c

6.2.2 APP MCU Development Environment

For the APP MCU development environment, add the Pulse Oximeter Profile to the existing APP MCU development

environment in the following procedure.

6.2.2.1 Copy Files

Copy the following files included in this package to the existing development environment.

\BLE_Sample

└ \src

└ \rBLE

└ \src

└ \host

└ \plxp

├ rble_api_plxpc.c

└ rble_api_plxps.c

6.2.2.2 Merge Files

Merge the following files included in this package into the existing development environment. If the following files

have not been changed, simply overwrite them.

\BLE_Sample

└ \src

└ \rBLE

└ \src


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Mar 6, 2017

├ \host

│ ├ rble_host.c

│ └ rble_if_api_cb.c

├ \include

│ ├ \host

│ │ └ rble_host.h

│ ├ prf_sel.h

│ ├ rble.h

│ └ rble_api.h

└ \sample_profile

└ db_handle.h

6.2.2.3 Merge Files as Necessary

If using the sample program, merge the following files included in this package into the existing development

environment. If the following files have not been changed, simply overwrite them.

\BLE_Sample

└ \src

└ \rBLE

└ \src

└ \sample_app

├ rble_sample_app.c merge

├ rble_sample_app_gap_sm_gatt.c merge

└ rble_sample_app_plxp.c copy

6.2.2.4 Change Project File / Workspace

Add the following file into the project or workspace.

\BLE_Sample

└ \src

└ \rBLE

└ \src

└ \host

└ \plxp

├ rble_api_plxpc.c

└ rble_api_plxps.c

Also, if using the sample program, add the following file into the project or workspace.

\BLE_Sample

└ \src

└ \rBLE

└ \src

└ \sample_app

└ rble_sample_app_plxp.c


R01AN3738EJ0100 Rev.1.00 Page 26 of 28

Mar 6, 2017

6.3 How to Not Expose Optional Characteristics

For the optional characteristics that the pulse oximeter sensor does not support, set so as not to expose to a peer device

by changing the following source file.


File: prf_config.c

The setting method that does not expose each optional characteristic is shown below.

Set the “RBLE_GATT_PERM_HIDE” for each attribute.

PLX Spot-Check Measurement 2145 /* PLX Spot Chk Meas Char */

2146 { RBLE_DECL_CHARACTERISTIC,

2147 sizeof(plxs_plx_spot_chk_meas_char), sizeof(plxs_plx_spot_chk_meas_char),

TASK_ATTID(TASK_PLXS, PLXS_IDX_PLX_SPOT_CHK_MEAS_CHAR),

RBLE_GATT_PERM_HIDE|RBLE_GATT_PERM_RD,

(void *)&plxs_plx_spot_chk_meas_char },

2148 /* PLX Spot Chk Meas Value */

2149 { RBLE_CHAR_PLX_SPOT_CHK_MEAS,

2150 sizeof(plxs_plx_spot_chk_meas), sizeof(plxs_plx_spot_chk_meas),

TASK_ATTID(TASK_PLXS, PLXS_IDX_PLX_SPOT_CHK_MEAS_VAL),

RBLE_GATT_PERM_HIDE|RBLE_GATT_PERM_NI,

(void *)&plxs_plx_spot_chk_meas[0] },

2151 /* PLX Spot Chk Meas Indication Cfg Value */

2152 { RBLE_DESC_CLIENT_CHAR_CONF,

2153 sizeof(plxs_plx_spot_chk_meas_ind_en), sizeof(plxs_plx_spot_chk_meas_ind_en

TASK_ATTID(TASK_PLXS, PLXS_IDX_PLX_SPOT_CHK_MEAS_IND_CFG),

(RBLE_GATT_PERM_HIDE|RBLE_GATT_PERM_RD|RBLE_GATT_PERM_WR),

(void *)&plxs_plx_spot_chk_meas_ind_en },

PLX Continuous Measurement 2154 /* PLX Continuous Meas Char */


2156 sizeof(plxs_plx_continuous_meas_char), sizeof(plxs_plx_continuous_meas_char

TASK_ATTID(TASK_PLXS, PLXS_IDX_PLX_CONTINUOUS_MEAS_CHAR),


(void *)&plxs_plx_continuous_meas_char },

2157 /* PLX Continuous Meas Value */

2158 { RBLE_CHAR_PLX_CONTINUOUS_MEAS,

2159 sizeof(plxs_plx_continuous_meas), sizeof(plxs_plx_continuous_meas),

TASK_ATTID(TASK_PLXS, PLXS_IDX_PLX_CONTINUOUS_MEAS_VAL),


(void *)&plxs_plx_continuous_meas[0] },

2160 /* PLX Continuous Meas Notification Cfg Value */


2162 sizeof(plxs_plx_continuous_meas_ntf_en), sizeof(plxs_plx_continuous_meas_nt

TASK_ATTID(TASK_PLXS, PLXS_IDX_PLX_CONTINUOUS_MEAS_NTF_CFG),


(void *)&plxs_plx_continuous_meas_ntf_en },

Record Access Control Point 2154 /* PLX Continuous Meas Char */


2156 sizeof(plxs_plx_continuous_meas_char), sizeof(plxs_plx_continuous_meas_char

TASK_ATTID(TASK_PLXS, PLXS_IDX_PLX_CONTINUOUS_MEAS_CHAR),


(void *)&plxs_plx_continuous_meas_char },


R01AN3738EJ0100 Rev.1.00 Page 27 of 28

Mar 6, 2017

2157 /* PLX Continuous Meas Value */

2158 { RBLE_CHAR_PLX_CONTINUOUS_MEAS,

2159 sizeof(plxs_plx_continuous_meas), sizeof(plxs_plx_continuous_meas),

TASK_ATTID(TASK_PLXS, PLXS_IDX_PLX_CONTINUOUS_MEAS_VAL),


(void *)&plxs_plx_continuous_meas[0] },

2160 /* PLX Continuous Meas Notification Cfg Value */


2162 sizeof(plxs_plx_continuous_meas_ntf_en), sizeof(plxs_plx_continuous_meas_nt

TASK_ATTID(TASK_PLXS, PLXS_IDX_PLX_CONTINUOUS_MEAS_NTF_CFG),


(void *)&plxs_plx_continuous_meas_ntf_en },

Battery Level 1683 #if (USE_BATTERY_SERVICE)

1684 /*********************************

1685 * Battery Service(Instance 1) *

1686 *********************************/

1687 { RBLE_DECL_PRIMARY_SERVICE,

1688 sizeof(bas_svc1), sizeof(bas_svc1),

TASK_ATTID(TASK_SVC, BAS1_IDX_SVC),


(void *)&bas_svc1 },

1689 /* Battery Level characteristic(Instance 1) */


1691 sizeof(bas_battery_lvl_char1), sizeof(bas_battery_lvl_char1),

TASK_ATTID(TASK_SVC, BAS1_IDX_BATTERY_LVL_CHAR),


(void *)&bas_battery_lvl_char1 },

1692 /* Battery Level characteristic(Instance 1) Value */

1693 { RBLE_CHAR_BATTERY_LEVEL,

1694 sizeof(bas_inst[0].battery_lvl), sizeof(bas_inst[0].battery_lvl),

TASK_ATTID(TASK_SVC, BAS1_IDX_BATTERY_LVL_VAL),

(RBLE_GATT_PERM_HIDE|RBLE_GATT_PERM_RD|RBLE_GATT_PERM_NI),

(void *)&bas_inst[0].battery_lvl },

1695 /* Battery Level characteristic(Instance 1) Notification Cfg Value */


1697 sizeof(bas_inst[0].battery_lvl_ntf_en), sizeof(bas_inst[0].battery_lvl_ntf

TASK_ATTID(TASK_SVC, BAS1_IDX_BATTERY_LVL_CFG),


(void *)&bas_inst[0].battery_lvl_ntf_en },

1698 /* Battery Level characteristic(Instance 1) Presentation Format */

1699 { RBLE_DESC_CHAR_PRESENTATION_FMT,

1700 sizeof(bas1_char_presen), sizeof(bas1_char_presen),

TASK_ATTID(TASK_SVC, BAS1_IDX_CHAR_PRESEN_FMT),


(void *)&bas1_char_presen[0] },


R01AN3738EJ0100 Rev.1.00 Page 28 of 28

Mar 6, 2017

Website and Support

Renesas Electronics Website

http://www.renesas.com/ Inquiries

http://www.renesas.com/contact/

All trademarks and registered trademarks are the property of their respective owners.

Bluetooth is a registered trademark of Bluetooth SIG, Inc. U.S.A.

EEPROM is a trademark of Renesas Electronics Corporation.

Windows® are registered trademarks or trademarks of Microsoft Corporation in the United States and/or other

countries.

PC/AT is a trademark of International Business Machines Corporation.

http://www.renesas.com/

http://www.renesas.com/contact/

Revision Record

Rev. Issued on

Description

Page Summary

1.00 Mar 6, 2017 - First edition issued

General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products

The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.

1. Handling of Unused Pins

Handle unused pins in accordance with the directions given under Handling of Unused Pins in the

manual.

¾ The input pins of CMOS products are generally in the high-impedance state. In operation with an

unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of LSI, an

associated shoot-through current flows internally, and malfunctions occur due to the false

recognition of the pin state as an input signal become possible. Unused pins should be handled as

described under Handling of Unused Pins in the manual.

2. Processing at Power-on

The state of the product is undefined at the moment when power is supplied.

¾ The states of internal circuits in the LSI are indeterminate and the states of register settings and

pins are undefined at the moment when power is supplied.

In a finished product where the reset signal is applied to the external reset pin, the states of pins

are not guaranteed from the moment when power is supplied until the reset process is completed.

In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function

are not guaranteed from the moment when power is supplied until the power reaches the level at

which resetting has been specified.

3. Prohibition of Access to Reserved Addresses

Access to reserved addresses is prohibited.

¾ The reserved addresses are provided for the possible future expansion of functions. Do not access

these addresses; the correct operation of LSI is not guaranteed if they are accessed.

4. Clock Signals

After applying a reset, only release the reset line after the operating clock signal has become stable.

When switching the clock signal during program execution, wait until the target clock signal has

stabilized.

¾ When the clock signal is generated with an external resonator (or from an external oscillator)

during a reset, ensure that the reset line is only released after full stabilization of the clock signal.

Moreover, when switching to a clock signal produced with an external resonator (or by an external

oscillator) while program execution is in progress, wait until the target clock signal is stable.

5. Differences between Products

Before changing from one product to another, i.e. to a product with a different part number, confirm

that the change will not lead to problems.

¾ The characteristics of Microprocessing unit or Microcontroller unit products in the same group but

having a different part number may differ in terms of the internal memory capacity, layout pattern,

and other factors, which can affect the ranges of electrical characteristics, such as characteristic

values, operating margins, immunity to noise, and amount of radiated noise. When changing to a

product with a different part number, implement a system-evaluation test for the given product.

Notice1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for

the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use

of these circuits, software, or information.

2. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics

assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.

3. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or

technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or

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the product's quality grade, as indicated below.

"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic

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malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the

possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to

redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult,

please evaluate the safety of the final products or systems manufactured by you.

8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics

products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes

no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.

9. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or

regulations. You should not use Renesas Electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the

development of weapons of mass destruction. When exporting the Renesas Electronics products or technology described in this document, you should comply with the applicable export control laws and

regulations and follow the procedures required by such laws and regulations.

10. It is the responsibility of the buyer or distributor of Renesas Electronics products, who distributes, disposes of, or otherwise places the product with a third party, to notify such third party in advance of the

contents and conditions set forth in this document, Renesas Electronics assumes no responsibility for any losses incurred by you or third parties as a result of unauthorized use of Renesas Electronics

products.

11. This document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.

12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.

(Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.

(Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.

http://www.renesas.comRefer to "http://www.renesas.com/" for the latest and detailed information.

Renesas Electronics America Inc.2801 Scott Boulevard Santa Clara, CA 95050-2549, U.S.A.Tel: +1-408-588-6000, Fax: +1-408-588-6130

Renesas Electronics Canada Limited9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3Tel: +1-905-237-2004

Renesas Electronics Europe LimitedDukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.KTel: +44-1628-585-100, Fax: +44-1628-585-900

Renesas Electronics Europe GmbHArcadiastrasse 10, 40472 Düsseldorf, GermanyTel: +49-211-6503-0, Fax: +49-211-6503-1327

Renesas Electronics (China) Co., Ltd.Room 1709, Quantum Plaza, No.27 ZhiChunLu Haidian District, Beijing 100191, P.R.ChinaTel: +86-10-8235-1155, Fax: +86-10-8235-7679

Renesas Electronics (Shanghai) Co., Ltd.Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, P. R. China 200333Tel: +86-21-2226-0888, Fax: +86-21-2226-0999

Renesas Electronics Hong Kong LimitedUnit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong KongTel: +852-2265-6688, Fax: +852 2886-9022

Renesas Electronics Taiwan Co., Ltd.13F, No. 363, Fu Shing North Road, Taipei 10543, TaiwanTel: +886-2-8175-9600, Fax: +886 2-8175-9670

Renesas Electronics Singapore Pte. Ltd.80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949Tel: +65-6213-0200, Fax: +65-6213-0300

Renesas Electronics Malaysia Sdn.Bhd.Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, MalaysiaTel: +60-3-7955-9390, Fax: +60-3-7955-9510Renesas Electronics India Pvt. Ltd.No.777C, 100 Feet Road, HALII Stage, Indiranagar, Bangalore, IndiaTel: +91-80-67208700, Fax: +91-80-67208777

Renesas Electronics Korea Co., Ltd.12F., 234 Teheran-ro, Gangnam-Gu, Seoul, 135-080, KoreaTel: +82-2-558-3737, Fax: +82-2-558-5141

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