BIPOLAR ANALOG INTEGRATED CIRCUIT

PC8182TB 3 V, 2.9 GHz SILICON MMIC

MEDIUM OUTPUT POWER AMPLIFIER

FOR MOBILE COMMUNICATIONS

Document No. PU10206EJ01V0DS (1st edition) (Previous No. P14543EJ2V0DS00) Date Published December 2002 CP (K)

DESCRIPTION

The PC8182TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This

IC operates at 3 V. The medium output power is suitable for RF-TX of mobile communications system.

This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This

process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface

from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.

FEATURES

• Supply voltage: VCC = 2.7 to 3.3 V

• Circuit current: ICC = 30 mA TYP. @ VCC = 3.0 V

• Medium output power: PO (1dB) = +9.5 dBm TYP. @ f = 0.9 GHz

PO (1dB) = +9.0 dBm TYP. @ f = 1.9 GHz

PO (1dB) = +8.0 dBm TYP. @ f = 2.4 GHz

• Power gain: GP = 21.5 dB TYP. @ f = 0.9 GHz

GP = 20.5 dB TYP. @ f = 1.9 GHz

GP = 20.5 dB TYP. @ f = 2.4 GHz

• Upper limit operating frequency: fu = 2.9 GHz TYP. @ 3 dB bandwidth

• High-density surface mounting: 6-pin super minimold package (2.0 1.25 0.9 mm)

APPLICAION

• Buffer amplifiers on 1.9 to 2.4 GHz mobile communications system

ORDERING INFORMATION (Solder Contains Lead)

Part Number Package Marking Supplying Form

PC8182TB-E3 6-pin super minimold C3F • Embossed tape 8 mm wide

• Pin 1, 2, 3 face the perforation side of the tape

• Qty 3 kpcs/reel

Remark To order evaluation samples, contact you’re nearby sales office. Part number for sample order:

PC8182TB-AZ

ORDERING INFORMATION (Pb-Free)

Part Number Package Marking Supplying Form

PC8182TB-E3-AZ* 6-pin super minimold C3F • Embossed tape 8 mm wide

• Pin 1, 2, 3 face the perforation side of the tape

• Qty 3 kpcs/reel

*NOTE: Please refer to the last page of this data sheet, “Compliance with EU Directives” for Pb-Free RoHS

Compliance Information.

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 2

PC8182TB

PIN CONNECTIONS

Pin No. Pin Name

1 INPUT

2 GND

3 GND

4 OUTPUT

5 GND

6 VCC

PRODUCT LINE-UP (TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 )

Part No. fu

(GHz)

PO (1 dB)

(dBm)

GP

(dB)

ICC

(mA) Package Marking

PC8182TB 2.9 +9.5 @ f = 0.9 GHz 21.5 @ f = 0.9 GHz 30.0 6-pin super minimold C3F

+9.0 @ f = 1.9 GHz 20.5 @ f = 1.9 GHz

+8.0 @ f = 2.4 GHz 20.5 @ f = 2.4 GHz

PC2762T 2.9 +8.0 @ f = 0.9 GHz 13.0 @ f = 0.9 GHz 26.5 6-pin minimold C1Z

PC2762TB +7.0 @ f = 1.9 GHz 15.5 @ f = 1.9 GHz 6-pin super minimold

PC2763T 2.7 +9.5 @ f = 0.9 GHz 20.0 @ f = 0.9 GHz 27.0 6-pin minimold C2A

PC2763TB +6.5 @ f = 1.9 GHz 21.0 @ f = 1.9 GHz 6-pin super minimold

PC2771T 2.2 +11.5 @ f = 0.9 GHz 21.0 @ f = 0.9 GHz 36.0 6-pin minimold C2H

PC2771TB +9.5 @ f = 1.5 GHz 21.0 @ f = 1.5 GHz 6-pin super minimold

PC8181TB 4.0 +8.0 @ f = 0.9 GHz 19.0 @ f = 0.9 GHz 23.0 6-pin super minimold C3E

+7.0 @ f = 1.9 GHz 21.0 @ f = 1.9 GHz

+7.0 @ f = 2.4 GHz 22.0 @ f = 2.4 GHz

Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.

Caution The package size distinguishes between minimold and super minimold.

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 3

PC8182TB

SYSTEM APPLICATION EXAMPLE

Digital cellular telephone

Caution The insertion point is different due to the specifications of conjunct devices.

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 4

PC8182TB

PIN EXPLANATION

Pin No. Pin Name

Applied

Voltage

(V)

Pin

Voltage

(V) Note

Function and Applications Internal Equivalent Circuit

1 INPUT – 0.99 Signal input pin. A internal

matching circuit, configured with

resistors, enables 50 connection

over a wide band.

A multi-feedback circuit is designed

to cancel the deviations of hFE and

resistance.

This pin must be coupled to signal

source with capacitor for DC cut.

4 OUTPUT Voltage

as same as

VCC through

external

inductor

– Signal output pin. The inductor

must be attached between VCC and

output pins to supply current to the

internal output transistors.

6 VCC 2.7 to 3.3 – Power supply pin, which biases the

internal input transistor.

This pin should be externally

equipped with bypass capacitor to

minimize its impedance.

2

3

5

GND 0 – Ground pin. This pin should be

connected to system ground with

minimum inductance. Ground

pattern on the board should be

formed as wide as possible.

All the ground pins must be

connected together with wide

ground pattern to decrease

impedance difference.

Note Pin voltage is measured at VCC = 3.0 V.

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 5

PC8182TB

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Test Conditions Ratings Unit

Supply Voltage VCC TA = +25C, pin 4 and pin 6 3.6 V

Total Circuit Current ICC TA = +25C 60 mA

Power Dissipation PD TA = +85°C Note 270 mW

Operating Ambient Temperature TA 40 to +85 C

Storage Temperature Tstg 55 to +150 C

Input Power Pin TA = +25C +10 dBm

Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB

RECOMMENDED OPERATING RANGE

Parameter Symbol MIN. TYP. MAX. Unit Remarks

Supply Voltage VCC 2.7 3.0 3.3 V Same voltage should be applied

to pin 4 and pin 6.

Operating Ambient Temperature TA 40 +25 +85 C

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 6

PC8182TB

ELECTRICAL CHARACTERISTICS

(TA = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 , unless otherwise specified)

Parameter Symbol Test Conditions MIN. TYP. MAX. Unit

Circuit Current ICC No signal 30.0 38.0 mA

Power Gain GP f = 0.9 GHz

f = 1.9 GHz

f = 2.4 GHz

19.0

18.0

18.0

21.5

20.5

20.5

25.0

24.0

24.0

dB

Noise Figure NF f = 0.9 GHz

f = 1.9 GHz

f = 2.4 GHz

4.5

4.5

5.0

6.0

6.0

6.5

dB

Upper Limit Operating Frequency fu 3 dB down below from gain at f = 0.1 GHz 2.6 2.9 GHz

Isolation ISL f = 0.9 GHz

f = 1.9 GHz

f = 2.4 GHz

28

27

26

33

32

31

dB

Input Return Loss RLin f = 0.9 GHz

f = 1.9 GHz

f = 2.4 GHz

5

7

9

8

10

12

dB

Output Return Loss RLout f = 0.9 GHz

f = 1.9 GHz

f = 2.4 GHz

7

8

11

10

11

14

dB

Gain 1 dB Compression Output

Power

PO(1dB) f = 0.9 GHz

f = 1.9 GHz

f = 2.4 GHz

+7.0

+6.5

+5.5

+9.5

+9.0

+8.0

dBm

Saturated Output Power PO(sat) f = 0.9 GHz, Pin = 5 dBm

f = 1.9 GHz, Pin = 5 dBm

f = 2.4 GHz, Pin = 5 dBm

+11.0

+10.5

+10.0

dBm

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 7

PC8182TB

TEST CIRCUITS

COMPONENTS OF TEST CIRCUIT EXAMPLE OF ACTUAL APPLICATION COMPONENTS

FOR MEASURING ELECTRICAL

CHARACTERISTICS

Type Value Type Value Operating Frequency

C1, C2 Bias Tee 1 000 pF C1 to C3 Chip capacitor 1 000 pF 100 MHz or higher

C3 Capacitor 1 000 pF L Chip inductor 100 nH 100 MHz or higher

L Bias Tee 1 000 nH 10 nH 2.0 GHz or higher

INDUCTOR FOR THE OUTPUT PIN

The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output

transistor, connect an inductor between the Vcc pin (pin 6) and output pin (pin 4). Select large value inductance, as

listed above.

The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum

voltage drop to output enable high level. In terms of AC, the inductor makes output-port-impedance higher to get

enough gain. In this case, large inductance and Q is suitable.

For above reason, select an inductance of 100 or over impedance in the operating frequency. The gain is a

peak in the operating frequency band, and suppressed at lower frequencies.

The recommendable inductance can be chosen from example of actual application components list as shown

above.

CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS

Capacitors of 1 000 pF are recommendable as the bypass capacitor for the Vcc pin and the coupling capacitors

for the input and output pins.

The bypass capacitor connected to the Vcc pin is used to minimize ground impedance of Vcc pin. So, stable bias

can be supplied against Vcc fluctuation.

The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial

impedance. Their capacitance are therefore selected as lower impedance against a 50 load. The capacitors thus

perform as high pass filters, suppressing low frequencies to DC.

To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under

10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are

determined by equation, C = 1/(2Rfc).

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 8

PC8182TB

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD

COMPONENT LIST

Value

C 1 000 pF

L Example: 10 nH

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 9

PC8182TB

TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 10

PC8182TB

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 11

PC8182TB

Remark The graphs indicate nominal characteristics.

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 12

PC8182TB

SMITH CHART (VCC = Vout = 3.0 V)

S11-FREQUENCY

S22-FREQUENCY

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 13

PC8182TB

S-PARAMETERS

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 14

PC8182TB

PACKAGE DIMENSIONS

6-PIN SUPER MINIMOLD (UNIT: mm)

DISCONTIN

UED

Data Sheet PU10206EJ01V0DS 15

PC8182TB

NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired

oscillation).

All the ground pins must be connected together with wide ground pattern to decrease impedance difference.

(3) The bypass capacitor should be attached to the VCC pin.

(4) The inductor must be attached between VCC and output pins. The inductance value should be determined in

accordance with desired frequency.

(5) The DC cut capacitor must be attached to input and output pin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions. For soldering

methods and conditions other than those recommended below, contact your nearby sales office.

Soldering Method Soldering Conditions Condition Symbol

Infrared Reflow Peak temperature (package surface temperature) : 260C or below

Time at peak temperature : 10 seconds or less

Time at temperature of 220C or higher : 60 seconds or less

Preheating time at 120 to 180C : 12030 seconds

Maximum number of reflow processes : 3 times

Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below

IR260

VPS Peak temperature (package surface temperature) : 215C or below

Time at temperature of 200C or higher : 25 to 40 seconds

Preheating time at 120 to 150C : 30 to 60 seconds

Maximum number of reflow processes : 3 times

Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below

VP215

Wave Soldering Peak temperature (molten solder temperature) : 260C or below

Time at peak temperature : 10 seconds or less

Preheating temperature (package surface temperature) : 120C or below

Maximum number of flow processes : 1 time

Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below

WS260

Partial Heating Peak temperature (pin temperature) : 350C or below

Soldering time (per side of device) : 3 seconds or less

Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below

HS350

Caution Do not use different soldering methods together (except for partial heating).

DISCONTIN

UED