BASE FOR ALL INNOVATION - cube.cz · Besides the dicyandiamide cured standard material we see trend-setting material for state-of-the-art PCB in par- ... g Dicy- Curing Phenolic Curing

General Information · Technical Overview

BASE FOR ALL INNOVATION

J

www.isola-group.com

11/0

9

11/092

Base for All Innovation

Table of Contents

General 3

LaminateThicknessesandPrepregTypes 4

ProductGuide 5ProductOverview 6

SupplyForms 8

Storage/Packaging 9

PressParameters–Recommendations 10

SpecialityQualityDURAFLEX 12

SpecialityQualityNoFlowPrepreg 14

SpecialityQualityIS450 15

SpecialityQualityforIMSApplications 15

SpecialityQualitySmartCard 16

SpecialityQualityforHFApplications 17

REACH 20

TBBA 20

InnovativeTechnologies 22

Service/CustomerSupport 23

Our information and our eventual advice for the application of our products in any form (for instance oral, written or

by tests) is given carefully and by the best of our knowledge but is not binding and is provided without making any

representation or warranty, expressed or implied, and without any liability. The user is not released also in the case

of our prior testing or if the use is based on our practical application advice from it’s sole responsibility to use our

product and to insure the correct application, the condition and fitness of our product for this application as well as

the condition and fitness of the product itself.

311/09


Morethan50yearsofexperienceinmanufacturingbasematerialarestillensuringthatIsolahasaversatile,high-qualityproductportfolioencompassingepoxylaminatesofhighlyvariablespecificationsaswellashalogenfreesystemsandmaterialforhighfrequencyapplications.

Figure1showstheepoxyresinglassfibrebasematerialsaccordingtotheirTglevel.Besidesthedicyandiamidecuredstandardmaterialweseetrend-settingmaterialforstate-of-the-artPCBinpar-ticularinthermalreliable,partlycycleresistantsystems.

Tg Dicy- Curing

Phenolic Curing

Halogen free

135°C DE104*PCL240FR4-74

–

150°C – IS400 DE156*

170°C – IS410IS415IS420

PCL370HR

IS500

Figure 1: Epoxy Resin Material *DURAVER-E-Cu-#

Arangeofhighfrequencymaterialtunedtothedifferentfrequencyrangescompletestheportfolioofepoxyresinbasematerial.Figure2givesanaccordingoverview.

Frequency Range

Isola Quality

<10GHz FR408FR408HR

<50GHz IS620i

<77GHz IS680

Figure 2: High Frequency Materials

TheofferingofspecialitylaminatesroundsIsola’sport-foliooff.DURAFLEXisacost-efficientalternativetohighflexiblematerialsincaseofnopermanentflexuralstressasitcanbefounde.g.atmanyrigid-flexPCBs.Likewiseforrigid-flexPCBsIsolaoffersanumberofso-callednoflowprepregs.Moreover,weproducebasematerialforsmartcardapplications.

Furthermore,wecanprovideourcustomerswithPoly-imidewhichishighlytemperatureresistantandwithBTasaprovedchipcarrierquality.

Quality Application

DURAFLEX Semiflexrequirements

A11FR406N

P26NIS572N

NoflowPrepregs

P96/P26 thermosettingPolyimidewithTg260°C

G200 BT/Epoxy-Blendfore.g.Chip-Carrier

Figure 3: Speciality Laminates

Isolaproducesallitsqualitiesstrictlyaccordingtointer-nationalstandard.Thus,itisamatterofcoursethatwecomplywithREACHandRoHS.

11/094


Standard Laminate Thickness (Multilayer)

Nominal Thickness Thickness Tolerance

IPC-4101C Cl. B IPC-4101C Cl. C

mm inch mm mm

0.050 0.002 ±0.018 ±0.013

0.100 0.004 ±0.018 ±0.013

0.125 0.005 ±0.025 ±0.018

0.150 0.006 ±0.025 ±0.018

0.200 0.008 ±0.038 ±0.025

0.250 0.010 ±0.038 ±0.025

0.300 0.012 ±0.050 ±0.038

0.360 0.014 ±0.050 ±0.038

0.540 0.021 ±0.064 ±0.050

0.710 0.028 ±0.064 ±0.050

0.900 0.035 ±0.100 ±0.075

Other thicknesses on request.

Standard Rigid

Nominal Thickness Thickness Tolerance

IPC-4101C Cl. L IPC-4101C Cl. M

mm inch mm mm

0.8 0.031 ±0.100 ±0.075

1.0 0.039 ±0.100 ±0.075

1.2 0.047 ±0.130 ±0.075

1.5 0.059 ±0.130 ±0.075

1.55 0.061 ±0.130 ±0.075

1.6 0.063 ±0.130 ±0.075

2.0 0.079 ±0.180 ±0.010

2.4 0.094 ±0.180 ±0.010

3.2 0.126 ±0.230 ±0.013

Standard Prepreg

Prepreg type: 106

1080

2116

2125

7628

Other prepreg types on request.

Calculation of constructions for Multilayer see Multical Program (MLB Design Tool) on www.isola.de

511/09


Product Guide

Additional material grades:

•IS415(Tg170Epoxy,improveddielectrics)

•FR408(highfrequency)

•GETEK(Tg180PPO/Epoxyblend)

•DURAFLEX•Smart Card

StandardEpoxy-Laminates

GreenLaminates

Thermal ReliableEpoxy-Laminate

Signal-Integrity

High- Performance

DE104*/PCL240/FR4-74 ● ● ● 21DE104KF* (CTI400) ● ● ● ● 21DE 117*/FR406/PCL370 ● ● ● 21

DE156* ● ● ● ● ● ● 92IS500 ● ● ● ● ● ● 94

DE104i* ● ● ● ● ● ● 21IS400 ● ● ● ● ● ● ● 97/98IS410 ● ● ● ● ● 24/26PCL370HR ● ● ● ● ● ● ● 98IS420 ● ● ● ● ● ● ● 98

FR408 ● ● ● ● ● ● ● ● ● 24IS620i ● ● ● ● ● ● ● ● ● ● 30IS680 ● ● ● ● ● ● ● ● ●

G200 ● ● ● ● ● ● ● 30P96/P26 ● ● ● ● 41

Std.

-Tg 1

30-1

40 °

C

Med

ium

-Tg 1

50 °

C

High

-Tg ≥

170

°C

Ther

mal r

esist

ant,

esp.

for l

eadf

ree t

echn

ologie

s

Cycl

e re

sist

ant -

40 °

C/+1

40 °

C, 1

000

cycl

es

αz C

TE <

70

ppm

/K

αz C

TE <

50

ppm

/K

αz C

TE <

40

ppm

/K

ε r D

k < 3

.9 @

2 G

hz

Tan δ

D f <

0.0

1@ 2

Ghz

High

spe

ed, h

igh

frequ

ency

low

dam

ping

(a S

21/d

b)

CAF-

enha

nced

Filled

resin

syste

m

Duer

en

Othe

r reg

ions

IPC 41

01C-

No.

ProductionLocation

*DURAVER-E-Cu-#

11/096


Product Overview

Isola Type IPC 4101CSlash Sheet

Glass transition

temperature

Requirements / Applications Dielectric constant

Dissipation factor Coefficient of Expansion Thermal Characteristics Solder Limits

CTI (UL

class)

Flexural strength acc. IPC-4101B

Tg (DSC)

°C

thermal resistant

for leadfree soldering

cycle resistant -40 °C/

+140 °C/ 1000 cycles

CAF enhanced

RoHS conform

>0.50 mm >0.50 mm RT-TG ppm/°C > Tg ppm/°C Decomposition Temperature

Max. Operating

Temperature

288 °C N/mm²sample thickness

> 0.50 mm

1 MHz 1 GHz 1 MHz 1 GHz X Y Z X Y Z

T 260 T 288 TD UL UL

length crossmin min °C °C sec

DE104*/PCL240 /21 135 x 4.6-4.9 0.019 17 12 45 12 7 230 10 - 310 130 30 2 550 480

DE104KF* /21 135 x x 4.6-4.9 0.020 16 13 45 14 7 230 130 30 1 580 460

PCL370 /24 >160 x 4.6-4.9 0.016 17 12 60 12 7 260 >60 >10 120 274°C/20 3 600 490

DE104i* /21 135 x x x 4.6-4.9 0.019 17 12 53 12 7 265 >60 >10 350 130 30 3 600 480

IS400 /21/24/97/101 150 x x x x 4.8-5.1 0.013-0.015 15 12 40 12 5 200 >60 >15 330 130 30 3 530 450

IS410 /21/24/26/28/121/124 >170 x x x 4.8 0.018 17 13 55 15 6 217 >60 >15 350 130 30 3 590 530

IS420 /98/99/101 >170 x x x x 4.9 0.012 15 12 38 12 5 200 >60 >15 340 130 20 3 570 420

PCL370HR /21/24/26/98/101 >170 x x x x 4.9 0.012 15 12 40 12 5 225 >60 >15 330 130 30 3 510 430

FR408 /24/121/124 >170 x x x 3.8 3.7 0.010 0.010 13 13 >60 >15 360 130 20 3 538 427

IS620i /30 220 x x x 3.5-3.7 3.6 0.008 0.006 15 12 40 13 5 230 >60 >15 364 140 60 3 528 362

IS680 190 x x x 12 12 15 13 13 190 >60 >60 360 2

G200 /30 185 x x x 4.0 3.8 0.010 0.010 14 14 55 14 14 275 320 150 60 3 600 420

P96/P26 /41/42/40 260 x x 4.6 4 0.014 0.014 13 17 4

DE156* /92 150 x x x x 4.6-4.9 0.02 0.015 17 12 60 12 7 200 >60 >15 380 130 20 4 650 450

IS500 /94 >165 x x x x 4.6-5.1 0.02 17 12 40 12 7 200 >60 >15 400 130 20 3 580 480

*DURAVER-E-Cu-#TestsarecarriedoutinaccordancewithIPC-650testmethods.

711/09


Isola Type IPC 4101CSlash Sheet

Glass transition

temperature

Requirements / Applications Dielectric constant

Dissipation factor Coefficient of Expansion Thermal Characteristics Solder Limits

CTI (UL

class)

Flexural strength acc. IPC-4101B

Tg (DSC)

°C

thermal resistant

for leadfree soldering

cycle resistant -40 °C/

+140 °C/ 1000 cycles

CAF enhanced

RoHS conform

>0.50 mm >0.50 mm RT-TG ppm/°C > Tg ppm/°C Decomposition Temperature

Max. Operating

Temperature

288 °C N/mm²sample thickness

> 0.50 mm

1 MHz 1 GHz 1 MHz 1 GHz X Y Z X Y Z

T 260 T 288 TD UL UL

length crossmin min °C °C sec

DE104*/PCL240 /21 135 x 4.6-4.9 0.019 17 12 45 12 7 230 10 - 310 130 30 2 550 480

DE104KF* /21 135 x x 4.6-4.9 0.020 16 13 45 14 7 230 130 30 1 580 460

PCL370 /24 >160 x 4.6-4.9 0.016 17 12 60 12 7 260 >60 >10 120 274°C/20 3 600 490

DE104i* /21 135 x x x 4.6-4.9 0.019 17 12 53 12 7 265 >60 >10 350 130 30 3 600 480

IS400 /21/24/97/101 150 x x x x 4.8-5.1 0.013-0.015 15 12 40 12 5 200 >60 >15 330 130 30 3 530 450

IS410 /21/24/26/28/121/124 >170 x x x 4.8 0.018 17 13 55 15 6 217 >60 >15 350 130 30 3 590 530

IS420 /98/99/101 >170 x x x x 4.9 0.012 15 12 38 12 5 200 >60 >15 340 130 20 3 570 420

PCL370HR /21/24/26/98/101 >170 x x x x 4.9 0.012 15 12 40 12 5 225 >60 >15 330 130 30 3 510 430

FR408 /24/121/124 >170 x x x 3.8 3.7 0.010 0.010 13 13 >60 >15 360 130 20 3 538 427

IS620i /30 220 x x x 3.5-3.7 3.6 0.008 0.006 15 12 40 13 5 230 >60 >15 364 140 60 3 528 362

IS680 190 x x x 12 12 15 13 13 190 >60 >60 360 2

G200 /30 185 x x x 4.0 3.8 0.010 0.010 14 14 55 14 14 275 320 150 60 3 600 420

P96/P26 /41/42/40 260 x x 4.6 4 0.014 0.014 13 17 4

DE156* /92 150 x x x x 4.6-4.9 0.02 0.015 17 12 60 12 7 200 >60 >15 380 130 20 4 650 450

IS500 /94 >165 x x x x 4.6-5.1 0.02 17 12 40 12 7 200 >60 >15 400 130 20 3 580 480

11/098


Prepregs

Prepregsaresuppliedinrollsorpanels.

RollsStandardwidths(tolerance±5.0mm)1250mm(locationoriented);otherrollwidthsavailableonrequest.Standardlengthsapprox.100–300m,dependingonthetypeoffabric.

PanelsProductionaccordingtocustomerspecification(tolerance±1.0mm)

Correcthandlingandstorageoftheprepregsareessentialprerequisitesfortrouble-freeprocessing.Ifrequiredbythecustomer,theprepregpanelscanalsobetooledinaccordancewithspecifications,i.e.providedwiththereferencesystemforpin-lamtechnology.

Supply Forms

Laminates

One-sidedandtwo-sidedcopper-cladlaminatesareavail-able:Typicalcopperfoilnominalthicknesses(18,35and70µm)correspondtoIPC-4562,Grade3(HTE-quality).Forlaminateswithasubstrate<0.1mmVLP-foilswithHTEpropertiesareused,preferredRTF.

SheetsThelaminatesareproducedinthefollowingsheetsizes:1070mmx1165mmwarp1225mmx1070mmwarp1225mmx925mmwarp1070mmx1285mmwarpTolerances:+3.0mm-0mm

PanelsPanelsaresuppliedcuttospecification.Withaminimumthicknessof0.25mm,mechanicallyprofilededgesareavailableonrequest.Variousformsofidentificationarealsoavailable,suchaslasermarking,embossing,orink-jetprinting(alsoasbarcode).

Onrequestthepanelscanbestackedonplasticminipal-letswhicharesuitableforadirectbindingtotheinnerlay-erproductionline.Thus,itispossibletoreduceadditionalhandlingstepswhichhasapositiveimpactonthecoppersurfacequality.IsolathinlaminatesareadjustedtoabsorbUVlight.Thispropertyhelpstoreducethepseudo-errorrateinauto-opticalinspections(AOI),particularlywhenusingAOIlaserscannerswhichoperatewithfluorescentmethods.Undesiredthrough-exposure(ghosting)ontheoppositesideisavoidedwhenexposingthesolderresisttoUVlight.

Important note for processingThewarpandweftofthelaminatesandprepregsruninthesamedirectioninthemultilayerstobelaminated.Orderingpanels,itisthereforeimportanttospecifywhichvalueistocorrespondtothewarpdirection.

911/09


General

Ingeneral,thepackagingoughttoprovidecoveragainstclimatical(dampness)andmechanicaldamagesaswellasagainstultravioletlight.

Standard Materials

Standardmaterialsarepackedinpolyethylenebags.Thedurabilityoftheprepregsis6monthsat<5°Cor3monthsat<23°Candarelativehumidityof<50%.Whenremovingchilledproductfromstorage,takeappro-priatestepstopreventcondensation.Werecommendare-conditioningof24hours.Inprincipal,weadvisetohermeticallyrepackagelami-natesaswellasprepregsafteropeningtheoriginalpackaging.Prepregsoughttobestackedonplasticminipallets,whicharesuitableforadirectbindingtotheinnerlayerproductionline.Therebyitispossibletoreduceadditionalhandlingsteps,whichwillhaveapositiveimpactonthecoppersurfacequality.

Technical notes for the storage of prepregs for standard material

Supply Forms and Storage

Use in ML-production

Condition 1•Temperature <5°C•Shelflife ≤180days

Condition 2•Temperature <23°C•Relativehumidity <50%•Shelflife ≤90days

Removal

Storage24hoursatlay-up-

ambienttemperatures

High Performance Products (IS620i, IS680, P26/P96, G200)

1.PrepregThedurabilityoftheprepregsintheoriginalpackaging(moisturebarrierfoilincludingdrypackandhumidityin-dicatorcard)is3monthsat<23°Candrelativehumidityof<50%(seeIPC-4101).Astorageat<5°Cdoesnotprolongthedurabilityoftheseparticularprepregs.Whenremovingchilledproductfromstorage,takeappropriatestepstopreventcondensation.Werecommendare-conditioningof24hours.Inprincipal,weadvisetoher-meticallyrepackagelaminatesaswellasprepregsafteropeningtheoriginalpackaging.

2.LaminateLaminatesarepackedinmoisturebarrierfoilincludingdrypackandhumidityindicatorcard.Werecommendanad-ditionaldryingprocessat105–125°Cforapprox.4hoursifthematerialwasstoredforalongertime.

Storage of PCBsWeadviseanadditionaldryingprocessat105–125°Cforapprox.4hoursbeforesoldering/assembling.

11/0910


Theflowandpolymerizationbehaviouroftheprepregsusedformultilayerproductionaredecisivelyinfluencedbythefollowingparameters:

• Prepreg type• Type of multilayer

Format,Construction,Layout• Package

Mould,Padding,Separatingsheets,Packageheight

• Press parameters Temperatureprofile,Pressureprofile,Vacuumsupport

Recommended Press Parameters

DE104*, FR4-74, DE104i*, DE156*, IS400, DURAFLEXHydraulic Vacuum Press

0

20

40

60

80

100

120

140

160

180

200

0 10 20 30 40 50 60 70 80 90 100 110 120 130

time [min]

0

5

10

15

20

25

30

35

40

45

50

tem

pera

ture

[°C

]

spec

. pre

ssur

e [b

ar]

Temperature Pressure *DURAVER-E-Cu-#

0

20

40

60

80

100

120

140

160

180

200

0 5 10 15 20 25 30 35 40 45 50

time [min]

0

5

10

15

20

25

tem

pe

ratu

re [

°C]

spe

c. p

ress

ure

[b

ar]

Temperature Pressure *DURAVER-E-Cu-#

DE104*, FR4-74, DE104i*, DE156*, DURAFLEXADARA Press

tem

pera

ture

[°C

]

spec

. pre

ssur

e [b

ar]

Temperature Pressure

0

20

40

60

80

100

120

140

160

180

200

0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 1800

5

10

15

20

25

30

35

40

45

50

IS410, IS420, PCL370HRHydraulic Vacuum Press

time [min]

tem

pera

ture

[°C

]

spec

. pre

ssur

e [b

ar]


time [min]

0

50

100

150

200

250

0 10 20 30 40 50 60 70 80 90 100 110 1200

5

10

15

20

25

IS410, IS420, PCL370HRADARA Press

1111/09


tem

pera

ture

[°C

]

spec

. pre

ssur

e [b

ar]


time [min]

IS620iHydraulic Vacuum Press

0

50

100

150

200

250

0 20 40 60 80 100 120 140 160 180 200 220 240 260 2800

5

10

15

20

25

30

35

40

45

50

tem

pera

ture

[°C

]

spec

. pre

ssur

e [b

ar]


time [min]

IS680Hydraulic Vacuum Press

0

50

100

150

200

250

0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 3000

5

10

15

20

25

30

35

40

45

50

tem

pera

ture

[°C

]

spec

. pre

ssur

e [b

ar]


time [min]

0

20

40

60

80

100

120

140

160

180

200

0 20 40 60 80 100 120 140 160 1800

5

10

15

20

25

30

35

40

45

50

FR408Hydraulic Vacuum Press

tem

pera

ture

[°C

]

spec

. pre

ssur

e [b

ar]


time [min]

FR408HRHydraulic Vacuum Press

0

20

40

60

80

100

120

140

160

180

200

0 20 40 60 80 100 120 140 160 180 200 220 240 2600

5

10

15

20

25

30

35

40

45

50

11/0912


Speciality Laminates

➜DURAFLEX ➜No Flow Prepreg ➜IS450 ➜IMS ➜Smart Card

➜DURAFLEX

Preliminary Datasheet

Flexible base material for printed circuit board applications

DURAFLEX

DURAFLEXisanepoxybased,leadadhesiveless,semi-flexiblelaminatewhichcanreplacewell-knownflexiblebasematerialslikePolyesterandPolyimide.TypicalapplicationsforDURAFLEXarerigid-flexPCBsorbendtoassemblydesignswheredynamicbendingcharacteristicsarenotrequired.BesidesthehighflexibilityDURAFLEXhasaTgat≥150°C(DSC).UsingournewdevelopedI-Fabglassfabricswewereabletoimprovesignificantlytheflexuralstrenght(uptofactor2.5)comparedtoconventionalfabrictypes.Itsen-durancebendingstrengthhasbeenverifiedinseveraltestseries.After3xleadfreereflowthebasematerialhasbeenbendedwitharadiusof2mminanangleof180°.

DURAFLEXisavailableaslaminateandprepreg.Epoxybaseditcanbeprocessedwithstandardprocessparame-ters(relaminationaswellasPCBmanufacturingprocess).DURAFLEXdoesnotneedanadhesivelayertothecop-perfoilwhichhelpstoavoidmanyproblemsinthePCBmanufacturingprocess.

Additional characteristics-excellentsolderbathresistanceat288°C-chemicalresistancewhichreducesthedangerofresin

recession-highmechanicalstrength-nosmearingduetoabsenceofadhesivelayer-compatiblytootherIsolabasematerialsaswellastoPI

andPE-dimensionalstabilitysimilartoFR4MLcoresPolyesterorPolyimidebasedmaterialscanbeusedascoverlayer.

Standard availability50µmand100µmthickness(w/oCu-foil)

Cladding18,35µm-HDFoilsingleordoublesidedotherthicknessesonrequest

PrepregDURAFLEX106iDURAFLEX2113i

Supply form1225mmx925mmwarp1225mmx1070mmwarpsheets,panels,onroll,otherformatsonrequest

1311/09


Typical Values

Characteristics Dimension Pre-Treatment IPC 4101C/21Specification

Typical Value

Surfaceresistance MΩMΩ

C96/35/90E-24/125

1.0·104

1.0·1034.5·106

1.5·106

Volumeresistivity MΩ·cmMΩ·cm

C-96/35/90E-24/125

1.0·106

1.0·1033.4·107

5.5·106

PermittivityDk@1MHz

– A 5.4 4.7

LosstangentDf@1MHz

– A 0.035 0.013

Cu-peelstrength,35µm N/mm E 0.7 1.3

Thermalstress@288°C s A ≥10 ≥10

Moistureabsorption1) % A 0.8 0.18

Flammabilityclass2) – A V-1 V-0

Glasstransitiontemp.Tg3) °C 110–150 ≥150

50µmlaminatethickness,18/18;Radius2mm,angle180°

Numberofbendings 3xleadfreereflow – ≥150x

100µmlaminatethickness,18/18;Radius5mm,angle180°

Numberofbendings 3xleadfreereflow – ≥20x

Remarks:A=withoutpreconditioningC=preconditioningwithmoistureE=preconditioningattemperature1)=testsperformedat1.55mmthicklaminates2)=specificationUL943)=DSC-method

AlltestshavebeenperformedaccordingtotheIPC-650testmethods.

11/0914


Prepreg Characteristics

Property A11 FR406N P26N IS572N Condition

Resin Content (%)

104 75±3 A

106 65±1.5 65±1.5 66±2 A

1080(108A11only) 65±3 65±1.5 60±1.5 63±2 A

Pressed Thickness (mil)

104 2.0±0.3 A

106 1.7±0.3 1.7±0.3 1.8±0.3 A

1080(108A11only) 3.7±0.3 2.7±0.3 2.8±0.3 3.1±0.3 A

Resin Flow (%) IPCTM6502.3.17

104 2.0%max A

106 A

1080(108A11only) 2.0%max A

Modified Circle Flow (inch)

104 0.010–0.100 A

106 0.050–0.120 0.050–0.120 0.040–0.120 A

106 0.150–0.350 A

1080(108A11only) 0.010–0.100 0.050–0.120 0.050–0.120 0.040–0.120 A

1080 0.090–0.210 A

1080 0.150–0.350 A

Condition A as received

Property A11 FR406N P26N IS572N Condition

Tg-fullcurenominal 100°C 170°C 250°C 170°C E-2/105

CureTemperature

Recommendedforfullcure 171°C 188°C 218°C –

Min.forfunctionalbonding 171°C 163°C 191°C –

Flammability HB V-0 V-0 V-0 ULtest

DielectricStrength(volts/mil) 2000 1750 1600 D-48/50

DielectricConstantDk@1MHz 4.5 4.3 3.7 4.6 C-24/23/50

DissipationFactorDf@1MHz 0.033 0.018 0.0195 C-24/27/50

CTE(ppm)x-axis 18 17 13 17 AmbienttoTg

y-axis 16 20 14 13 AmbienttoTg

z-axis 80 75 55 95 AmbienttoTg

PeelStrength(N/mm)1ozcopper

1.58 1.75 1.23 1.24 AfterThermalStress

ThermalConductivity(W/m·K) 0.25 0.30 0.40 A

➜NoFlow

1511/09


Epoxy base material for improved heat dissipation

IS450 Standard prepreg and laminte constructions

Glass fabrics Prepreg

Theoretical Thickness (mm) Resin content (%)

1x106 0.070 75

1x1080 0.100 73

1x2116 0.120 53

1x7628 0.200 47

Other thicknesses on request.

Typical Applications

•Automobileelectronics•HeatSinkcircuitboards•Industrialelectronics

Special properties

•HighthermalresistanceTgapprox.170°C(DSC)T260>60minT288>20min

•Highthermalconductivityλ=1W/m·K

•Lowz-axisexpansionαz=40–50ppm/K@RT-120°C

•CAF-enhanced

➜IntermetallicSubstrates(IMS)New Product Development

Thickness ThermalResistance1)

(K/W)Copper(µm)

Dielectric(µm)

Aluminium(mm)

IMSGrade1 18–210 60 1/1.5/2.0 2.468

IMSGrade2 18–210 60 1/1.5/2.0 0.668

IMSGrade3 18,35,70 15/80 1.5 0.258

1) related to 18 µm copper, 1,5 mm Aluminium, and a surface of 10 sq. mm

Heattransmissionatelectronicdevicesisbecomingmoreandmoreimportant.

HighperformancedevicesandLEDsinparticularproduceasubstantialquantityoflostheat.Intermetallicsub-strates,shortIMS,basedonaluminium,specialdielectrics,andcopperfoilhaveproventheirworthas„heatsink“insuchapplication.

Accordingtothethicknessofthecopperfoilandofthealuminiumplatescombinedwithverythindielectricsofgoodheatconductivityefficientheattransmissioncanbeachieved.Isolahasdevelopedthreedifferentsystemswhichcanbecharacterisedasfollows:

➜IS450

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➜SmartCard

Smart Cards

Nowadays,SmartCardshavebecomeaninherentpartofourdailylife.Thenumberofapplicationsisveryversatilee.g.:

•creditcards•cashcards•healthinsurancecard•electronicpassports•accessauthorisation•SIMCard

Itistobeexpectedthatthenumberofboththeapplicationsandtheuserwillincrease.

Undertheeye-catchinggoldenpinofsuchsmartcardsthereisarathervisiblechipwhichisbroughtuponacorematerial.

Isolaproducessuchcorematerials.Accordingtotheapplicationthesematerialsareavailablecoppercladorunclad.

Duetothesubsequentproducingthisthinlaminate,usually<100µm,isavailableonrolls.Thelowthicknesstolerancesareaparticularchallenge.

NotableSmartCardproducerinEuropearealreadypurchasingthismaterialfromIsola.

1711/09


High Frequency Applications

➜FR408 ➜FR408HR ➜IS620i ➜IS680

Isola High Speed Digital Products

FR408•Tg180°C•3.5%Expansion•Dk3.75(10GHz)•Df0.0120(10GHz)

FR408HR•Tg200°C•2.8%Expansion•Dk3.65(10GHz)•Df0.0095(10GHz)

IS620i•Tg225°C•2.5%Expansion•Dk3.59(10GHz)•Df0.0069(10GHz)

IS680•Tg200°C•2.8%Expansion•Dk3.20(10GHz)•Df0.0031(10GHz)

T288–60Min.TD–400°C**

T260–60Min.TD–350°C**

Lead Free Assembly Compatible

T260–10Min.TD–300°C

Tin/Lead AssemblyCompatible

Imp

rovi

ng

Th

erm

al P

erfo

rman

ce –

T26

0 /

TD /

IST DE156 155 Tg

Halogen Free

P95 260 Tg Polyimide HB

P96 260 TgPolyimide V0/V1

FR408HR 200 Tg Low Df, Low CTE

IS680 - 200 Tg Very Low Loss Df < 0.0036 @ 10 GHz

ISE25 - 245 Tg Df < 0.0055 @ 10 GHz

nNewProducts

** Laminate Data - IST performance is a function of Hole diameter, board thickness, plating parameters and laminate attributes.

IS420 170 TgPhenolic-Filled

DE104i135 Tg

370HR 180 TgPhenolic-Filled

IS410 180 TgPhenolic

370 Turbo 180 Tg

IS415 200 TgMid Dk/Df

FR408 180 Tg Low Dk & Df

IS620i Tg 225 Low LossDf < 0.0070 @10 GHz

G200/GI 180BT Epoxy

GETEK 180 Tg Mid Dk & Df

FR406 High Tg170 Epoxy

1 GHz Improving Electrical Performance – Lower Dk/Df – Higher Speed 20 GHz

IS400 150 TgPhenolic-Filled FR406HR High Tg

190 °C Epoxy

11/0918


100 MHz 1 GHz 10 GHz 100 GHz

Medium to High Frequency Applications

Car Immobilisation30–500kHz

Car Parking Aid40kHz

RFIDLogistic CMP850–950MHz

Electr.Car Key433–868MHz

City Band27MHz

Terristic TVVHF87–230MHzUHF470x862MHz

Cable TV4MHz–1GHz

Blue Tooth2.45GHz

Navigation Systems1.2–1.575GHz

Digital Telephone1.880–1.900GHz

Mobile Phone(i-phone)850MHz–2.2GHz(UMTS)Follow-upsystems5GHz

Notebooks2.14–5.0GHz

Router5–12GHz

Server4.0–10.0GHz

Toll Systems2.4–5.8GHz

W-LAN2.4–5.725GHz

Amplifier2.5–4.0GHz

NetworkingSystems3.6–6.25GHz

Optical Systems >10GHz

TV Astra13.75–14.0GHz

Satellite TV10.7–12.75GHz

DSL Satellite13.0–15.0GHz

Avionics10.0–15.0GHz

Defence >10GHz

Car AdaptingCruise Control76–77GHz

Car DistanceControl24.0GHz

Base Materials for Different Applications

STANDARD FR-4BASE MATERIALS

MID TO HIGH FREQUENCYBASE MATERIALS

100 MHz 1 GHz 5 GHz 10 GHz 50 GHz 100 GHz

Df 0.028Dk 4.2 – 4.6

DE104iTg135

Df 0.028Dk 4.2 – 4.6

IS400Tg150

Df 0.021-0.025Dk 4.0 – 4.2

PCL370HRIS420Tg175

Df 0.013Dk 3.63

FR408Tg180

Df 0.009Dk 3.57

FR408HRTg200

Df 0.007Dk 3.57

IS620iTg225

Df 0.0028–0.0036Dk 2.80 – 3.45

IS680Tg200

1911/09


Physical Properties

Property Units FR408 FR408HR IS620i IS680

Dk2GHz – 3.67 3.68 3.58 2.80–3.45

Dk5GHz – 3.66 3.64 3.54 2.80–3.45

Dk10GHz – 3.65 3.65 3.54 2.80–3.45

Df2GHz – 0.0116 0.0092 0.006 0.0028–0.0036

Df5GHz – 0.0122 0.0098 0.0066 0.0028–0.0036

Df10GHz – 0.012 0.0095 0.0071 0.0028–0.0036

ElectricalStrength volts/mil 1400 1700 1400 1200

Peels1oz lb/in 7 7 >7 5

Flammability – 94V-0 94V-0 94V-0 94V-0

MoistureAbsorption % 0.15 0.06 0.15 0.016

ULRecognition – FR-4 FR-4 GPY non-ANSI

Frequency (GHz)

1 3 5 7 9 10

0

-5

-10

-15

2.4489 GHz-3.0029 dB

3.663 GHz-3.0184 dB

4.6216 GHz-3.0032 dB 5.0341 GHz

-3.0378 dB 5.6101 GHz-3.005 dB

6.6078 GHz-3.0218 dB

8.9942 GHz-2.6371 dB

■■■ FR408 ■■■ FR408HR ■■■ High T FR-4 ■■■ IS415 ■■■ IS620 ■■■ IS680 ■■■ Phenolic Cured system

Comparisation Simulated S21 on Isola Products 4 mil wide 6 Inch long lines 3dB BW

dB L

oss

g

Isola Products – Simulated S21 data

11/0920


REACHisthenewEuropeanCommunityregulationno.1907/2006onRegistration,EvaluationandAuthorisationofChemicals.ItenteredintoforceonJune1st,2007.Theaimistoimprovetheprotectionofhumanhealthandofenvironmentagainsttherisksthatcanbeposedbychemicals.REACHeffectsallproducers,importers,distributors,andusersofchemicalsubstancesofmorethan1tonperyear.

Isola got involved into this new regulation at an early stage:

1. In co-operation with our suppliers of chemicals, all rel-evant substances were registered with the European Chemicals Agency in Helsinki. In this way we ensure a continuous problem-free supply of our basic chemicals.

2. Being also a processor of chemicals, we consequently registered the information on these substances in the central database, too. Any products manufactured

thereof comply with the REACH guidelines and can therefore be safely delivered to customers.

3. Isola products, both laminates and prepregs, are not obligatory for registration.

Isolaconfirmsthatpurchaseandprocessingofchemi-calsubstancesatIsolacomplywiththeregulationsofREACH.

REACH

Recentlytherearemoreandmorerumoursconcerning”TBBA”causingmoreconfusionthanclarificationinthemarket.Unfortunatelytherearesomebasematerialsupplierswhotrytoabusethissituationtopushalternativeproductstofront.Therefore,Isolawantstomakeuseofthefollowinginfor-mationtobringclarityandtomakeacontributiontotheavoidanceofunnecessaryandverycost-intensivematerialqualifications.

1. What is TBBA?

TBBA(Tetrabromo-bisphenolA)isaflameretardantwhichcanbeusedasanadditiveorasareactivecomponent.IntheepoxyresintypesFR-4orFR-5itissolelyusedasareactivecomponent,whichmeansitbecomesaninseparableelementoftheresinmatrix.TBBAdoesnotbelongtothegroupofthepolybrominatedbiphenyls(PBB)ortothepolybrominatedbiphenylethers(PBBE),whichusageisprohibitedbyRoHSsince2007.AformationofhighlytoxicdioxinsordibenzofuranesisnotpossiblewithreactedinTBBAincontrasttotheadditivesPBB/PBBE.Correspondingexaminationresultsareavailable.

2. Have risk evaluations concerning TBBA been made?

Foryearsnumerous“riskassessments”havebeencarriedout.AllassessmentsreachedtheconclusionthatthereisnoriskfromreactedinTBBA.

Information on TBBA

2111/09


Theretosomeexamples:•“Draftingofbasisofvaluationtosubstituteenvironmen-

tallyrelevantflameretardant”,FederalEnvironmentAgencyBerlin,December2000,carriedoutbyÖko-InstituteFreiburggNo Risk!

•EuropeanHumanHealthRiskAssessment,February2005gNo Risk!

•EuropeanEnvironmentalRiskAssessment,June2007gNo Risk!

•EuropeanCommissionScientificCommitteeSCHER,January2008gComplies with the EU Risk Assess-ment Report!

•REAChgTBBA does not meet any of the criteria for questionable substances!

•Thereareapproximately200furtherstudiesarrivingatthesameconclusion.

3. Why is TBBA still in discussion?

SometimeagotheEuropeanCommissionmandatedtheÖko-Institutetochecktheguideline2002/95/EG(RoHS)regardingwhethertherearefurthersubstanceswhichshouldbeaddedtothebannedsubstances.TheÖko-Instituterecommendedbesideothercom-poundstoaddTBBA,butnotasreactedinTBBA,butasanadditive.Unfortunatelythisproposalhasbeenworkedoutwithouttheparticipationoftheconcernedindustryandtheconcernedassociations.Theindustrymeetsthiswithalackofunderstanding,especiallyastheelectronicindustryhasproveninthepastthatitsupportedinanac-tiveandresponsiblewayjustifiedenvironmentalissues.AsanexampleWEEE,RoHS,andREACHshouldbementioned.

4. Are the associations active?

ToavoidsuchprematurelyproposalsliketheoneoftheÖko-InstituteworkinggroupshavebeenbuiltaswellintheZVEI/VdLasintheIPC.TheycarriedtogetherfactstobeabletocreateappropriatepositionpaperswhichshouldbemadeavailabletotherelevantauthoritiesinBrusselsandBerlin,butalsototheÖko-Institute.Isolaisactivelysupportingbothassociations.

Summingupwewanttostate:•Therearenowell-groundedconclusionswhichcould

justifyabanofTBBA.•BasedonlonglastingexaminationstheEuropean

Commissiongavethego-aheadfortheunlimitedusageofTBBA.

•Wearesupportingourassociationsintheirefforttoinformthecorrespondingauthoritiesinanobjectiveway.

11/0922


•ThinDielectrics

•Hi-Pot-Resistance

•ContinuousLamination

•SpecialApplications

•SmartCard

•UncladLaminate

•Semi-flexibleBaseMaterial

Innovative Technologies

Continua

2311/09


•ApplicationEngineeringService-ProjectSupport-TechnicalCustomerService-Experiencedapplicationengineersassistinginthelaunchofnewproducts

•OnTimeDelivery-QTAService48hours

•CustomerAccessvia“https://my.isola.de”

•ServiceLaboratories-HighAnalyticalStandard

•Certificates-TS16949:2002-ISO9001:2008-ISO14001:2004-OHSAS18001:2007

•MulticalProgram(MLBDesignTool)seewww.isola.de

Service/Customer Support

MulticalProgram(MLBDesignTool)

Our information and our eventual advice for the application of our products in any form (for instance oral, written or by tests) is given carefully and by the best of our

knowledge but is not binding and is provided without making any representation or warranty, expressed or implied, and without any liability. The user is not released

also in the case of our prior testing or if the use is based on our practical application advice from it’s sole responsibility to use our product and to insure the correct

application, the condition and fitness of our product for this application as well as the condition and fitness of the product itself.

Production ProductionR&D Sales

USAIsola USA S.a.r.l.(Headquarters)3100W.RayRoad,Suite301Chandler,AZ85226,USAPhone:+1/480/8936527Fax:+1/480/8931409E-mail:[email protected]

EuropeIsola GmbH52353DürenGermanyPhone:+49(0)2421/8080Fax:+49(0)2421/80880E-mail:[email protected]

AsiaIsola Asia Pacific(Hong Kong) Ltd.Unit3512–3522,35/FNo.1HungToRoad,KwunTong,Kowloon,HongKongPhone:+852/2418–1318Fax:852/2418–1533E-mail:[email protected]

www.isola-group.com

Our sales team is pleased to provide you with further information!

J

Close to the Customer All over the World

BASE FOR ALL INNOVATION

Elk Grove, CAUSA

Chandler, AZGlobal HQ

Global R&DUSA

Ridgeway, SCUSA

GreatBritain

Dueren EU HQGermany

Isola FabricsItaly

Italy

India

JurongSingapore

KuchingMalaysia

HuizhouChina

HongkongAsian HQ

Korea

DalianChina

SuzhouChina

Taoyuan/YangmeiTaiwan

11/0

9

Documents

BASE FOR ALL INNOVATION - cube.cz · Besides the dicyandiamide cured standard material we see trend-setting material for state-of-the-art PCB in par- ... g Dicy- Curing Phenolic Curing