Automotive T591 High Performance Automotive Grade Polymer ...€¦ · T591 Hig Performance utomotive Grade Polymer Electrolytic, 2.5 – 50 DC. Ordering Information. T 591. D 107

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2073_T591 • 7/15/2015 1One world. One KEMET

Benefits

• Ultra-low ESR • QualificationpackagebasedonAEC-Q200• Highreliabilityupto500hourswith85°C/85%RHload• TS16949certifiedplant• MeetsorexceedsEIAstandard535BAAC• TapedandreeledperEIA481

Overview

TheKEMETOrganicCapacitor(KO-CAP)isasolidelectrolyticcapacitorwithaconductivepolymercathodecapableofdeliveringverylowESRandimprovedcapacitanceretentionathighfrequencies.KO-CAPcombinesthelowESRofmultilayerceramic,thehighcapacitanceofaluminumelectrolyticandthevolumetricefficiencyoftantalumintoasinglesurfacemountpackage.Unlikeliquidelectrolyte-basedcapacitors,KO-CAPhasaverylongoperationallifeandhighripplecurrentcapabilities.

TheT591HighPerformanceAutomotiveGradePolymerElectrolyticdelivershighercapacitanceandESRstabilityunderharshenvironmentalconditions.EnhancementstothedesignandselectedmaterialupgradesrenderthisthefirstKO-CAPcapableofstableperformanceafter500hoursat85°C/85%RH/VR.TheT591ismanufacturedinaISOTS16949certifiedplant.PartsareavailablewithPPAP/PSWandchangecontrol.

KEMETOrganicCapacitor(KO-CAP®)–Automotive

T591 High Performance Automotive Grade Polymer Electrolytic, 2.5 – 50 VDC

ApplicationsTypicalapplicationsincludedecouplingandfilteringinavarietyofmarketsegments,withspecialemphasisinautomotiveapplicationssuchasinfotainmentandinput/outputinDC/DCconverterswhereharshconditionssuchashighhumidityandtemperatureareaconcern.

Environmental ComplianceRoHSCompliant(6/6)accordingtoDirective2002/95/ECwhenorderedwith100%Snsolder.

SPICEForadetailedanalysisofspecificpartnumbers,pleasevisitwww.kemet.comforafreedownloadofKEMET'sSPICEsoftware.TheKEMETSPICEprogramisfreewareintendedtoaiddesignengineersinanalyzingtheperformanceofthesecapacitorsoverfrequency,temperature,ripple,andDCbiasconditions.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2073_T591 • 7/15/2015 22

KEMET Organic Capacitor (KO-CAP®) – AutomotiveT591 High Performance Automotive Grade Polymer Electrolytic, 2.5 – 50 VDC

Ordering Information

T 591 D 107 M 010 A T E025Capacitor

Class Series CaseSize CapacitanceCode(pF) Capacitance Tolerance

RatedVoltage(VDC)

Failure Rate/ Design

TerminationFinish ESR

T = Tantalum 591 = AutomotiveGradePolymer

B,D,V Firsttwodigitsrepresentsignificantfigures.Thirddigitspecifiesnumberof

zeros.

M=±20% 2R5 = 2.5 006 = 6.3 010 = 10 016 = 16 020 = 20 025 = 25 035 = 35 050 = 50

A=N/A T=100%Tin(Sn)

Maximum ESR inmΩ,

025=25mΩ

Performance Characteristics

Item Performance CharacteristicsOperatingTemperature -55°Cto105°C/125°C

RatedCapacitanceRange 33–330µFat120Hz/25°C

Capacitance Tolerance MTolerance(20%)

RatedVoltageRange 2.5–50V

DF(120Hz) RefertoPartNumberElectricalSpecificationTable

ESR(100kHz) RefertoPartNumberElectricalSpecificationTable

LeakageCurrent ≤0.1CV(µA)atratedvoltageafter5minutes



Qualification

Test Condition Characteristics

Endurance 105°Catratedvoltage,2,000hours**125°Cat2/3ratedvoltage,1,000hours**

ΔC/C Within-20%/+10%ofinitialvalueDF Within2xInitialLimitsDCL Within2xInitialLimitESR Within2xInitialLimit

StorageLife 105°Cat0volts,2,000hours**125°Cat0volts,1,000hours

ΔC/C Within-20%/+10%ofinitialvalueDF Within2xInitialLimitsDCL Within2xInitialLimitESR Within2xInitialLimit

Humidity 85°C,85%RH,Load,500hours

ΔC/C Within-5%/+35%ofinitialvalueDF Within1.5xInitialLimitsDCL WithinInitialLimitESR Within2xInitialLimit

ThermalShock MIL-STD-202,Method107,ConditionB,mounted, -55C°to105°C/125°C,1,000cycles

ΔC/C Within-20%/+10%ofinitialvalueDF WithinInitialLimitsDCL WithinInitialLimitESR Within2xInitialLimits

SurgeVoltage 105°C,1.32xratedvoltage,1,000cycles,33Ωinseries125°C,1.32xratedvoltage,1,000cycles,33Ωinseries

ΔC/C Within-20%/+10%ofinitialvalueDF WithininitiallimitsDCL WithininitiallimitsESR Withininitiallimits

TemperatureStability

Extreme temperature exposure at a successionofcontinuousstepsat +25ºC,-55ºC,+25ºC,+85ºC,+105ºC/+125ºC***,+25ºC

+25°C -55°C +85°C +105°C/+125°CΔC/C IL* ±20% ±20% ±30%DF IL IL 1.2xIL 1.5xILDCL IL N/A 10xIL 10xIL

MechanicalShock/VibrationAEC-Q200(MIL-STD-202,Method213,Figure1,ConditionF)

ΔC/C Within±10%ofinitialvalueDF Withininitiallimits

AEC-Q200(MIL-STD-202,Method204,5gsfor20min/12cycleseachof3orientations.Testfrom10–2,000Hz).

ESR WithininitiallimitsDCL Withininitiallimits

* IL = Initial Limit** Minimum temperature test condition at 85°C*** Refer to part number specifications for individual temperature classification

Certification

KEMET’sInternalQualificationPlanforthistantalumseriesofcapacitorsfollowsAEC-Q200guidelines.Thehumiditybiasislimitedtoamaximumof500hours.



Electrical Characteristics

100

1,000

1

Capa

citan

ce (µ

F)

Frequency (Hz)

100 1,000 10,000 100,000 1,000,000 10,000,000

10

591B476M010_Cap (µF)

591D107M010_Cap (µF)

591V227M2R5_Cap (µF)

591D106M050_Cap (µF)

591D476M016_Cap (µF)

Capacitancevs.FrequencyESRvs.Frequency

Impe

danc

e, ES

R (O

hms)

Frequency (Hz)

1,000

100

10

1

0.1

0.01

0.001100 1,000 10,000 100,000 1,000,000 10,000,000

591B476M010_IMP

591B476M010_ESR

591D107M010_IMP

591D107M010_ESR

591D476M016_IMP

591D476M016_ESR

591V227M2R5_IMP

591V227M2R5_ESR

591D106M050_IMP

591D106M050_ESR

Dimensions – Millimeters (Inches)Metricwillgovern

H

X T

B B

F

A

L R

P

SIDE VIEW ANODE (+) END VIEW BOTTOM VIEWCATHODE (-) END VIEW

W

S STermination cutout at KEMET's option,

either end

Glue pad shape/design at KEMET's option

Case Size Component Dimensions Weight

KEMET EIA L W H F ±0.1 ±(0.004)

S ±0.3 ±(0.012)

B±0.15(Ref)±0.006 X(Ref) P(Ref) R(Ref) T(Ref) A

(Minimum) (mg)

B 3528–21 3.5 ±0.2 (0.138 ±0.008)

2.8 ±0.2 (0.110 ±0.008)

1.9 ±0.1 (0.075 ±0.004) 2.2 (0.087) 0.8 (0.031) 0.4 (0.016) 0.10 ±0.10

(0.004 ±0.004) 0.5 (0.020) 1.0 (0.039) 0.13 (0.005) 1.1 (0.043) 94.85

D 7343–31 7.3 ±0.3 (0.287 ±0.012)

4.3 ±0.3 (0.169 ±0.012)

2.8 ±0.3 (0.110 ±0.012) 2.4 (0.094) 1.3 (0.051) 0.5 (0.020) 0.10 ±0.10

(0.004 ±0.004) 0.9 (0.035) 1.0 (0.039) 0.13 (0.005) 3.8 (0.150) 434.83

V 7343–19 7.3 ±0.3 (0.287 ±0.012)

4.3 ±0.3 (0.169 ±0.012)

1.9 ±0.1 (0.075 ±0.004) 2.4 (0.094) 1.3 (0.051) N/A 0.05 (0.002) N/A N/A 0.13 (0.005) 3.8 (0.150) 274.30

Notes: (Ref) – Dimensions provided for reference only. For low profile cases, no dimensions are provided for B, P or R because these cases do not have a bevel or a notch.



Table 1 – Ratings & Part Number Reference

Refer to Ordering Information for additional detail.

Rated Voltage

Rated Cap

Case Code/ Case Size

KEMET Part Number

DC Leakage DF ESR

Maximum Allowable

Ripple CurrentMSL

Maximum Operating

TempVDC at 105ºC µF KEMET/EIA (See below for

part options)µA at+25ºCMax/5 Min

% at +25ºC120 Hz Max

mΩ at +25ºC100 kHz Max

mA at +45ºC 100 kHz

Reflow Temp ≤ 260ºC ºC

2.5 220 V/7343-20 T591V227M2R5ATE009 55 10 9 4558 3 1052.5 220 V/7343-20 T591V227M2R5ATE012 55 10 12 3947 3 1052.5 220 V/7343-20 T591V227M2R5ATE015 55 10 15 3531 3 1052.5 330 V/7343-20 T591V337M2R5ATE012 83 10 12 3947 3 1052.5 330 V/7343-20 T591V337M2R5ATE025 83 10 25 2735 3 1056.3 33 B/3528-21 T591B336M006ATE080 20.8 8 80 1260 3 1256.3 47 B/3528-21 T591B476M006ATE070 29.6 8 70 1347 3 1256.3 150 V/7343-20 T591V157M006ATE025 95 10 25 2735 3 1256.3 150 V/7343-20 T591V157M006ATE045 95 10 45 2039 3 1256.3 330 D/7343-31 T591D337M006ATE025 208 10 25 3000 3 1256.3 330 D/7343-31 T591D337M006ATE040 208 10 40 2372 3 1256.3 330 D/7343-31 T591D337M006ATE080 208 10 80 1677 3 12510 33 B/3528-21 T591B336M010ATE080 33 8 80 1260 3 12510 47 B/3528-21 T591B476M010ATE070 47 8 70 1347 3 12510 100 D/7343-31 T591D107M010ATE025 100 10 25 3000 3 12510 100 D/7343-31 T591D107M010ATE040 100 10 40 2372 3 12510 100 D/7343-31 T591D107M010ATE080 100 10 80 1677 3 12510 100 V/7343-20 T591V107M010ATE025 100 10 25 2735 3 12510 100 V/7343-20 T591V107M010ATE045 100 10 45 2039 3 12510 220 D/7343-31 T591D227M010ATE025 220 10 25 3000 3 12510 220 D/7343-31 T591D227M010ATE040 220 10 40 2372 3 12510 220 D/7343-31 T591D227M010ATE080 220 10 80 1677 3 12516 47 D/7343-31 T591D476M016ATE070 75.2 10 70 1793 3 12516 100 D/7343-31 T591D107M016ATE050 160 10 50 2121 3 12520 47 D/7343-31 T591D476M020ATE060 94 10 60 1936 3 12525 22 D/7343-31 T591D226M025ATE060 55 10 60 1936 3 12525 33 D/7343-31 T591D336M025ATE060 82.5 10 60 1936 3 12535 10 D/7343-31 T591D106M035ATE120 35 10 120 1369 3 12535 10 V/7343-20 T591V106M035ATE120 35 10 120 1248 3 12550 10 D/7343-31 T591D106M050ATE090 50 10 90 1581 3 125



Derating Guidelines

50%

55%

60%

65%

70%

75%

80%

85%

90%

95%

100%

-55 25 45 85 105 125

Recommended Application Voltage > 16 V

Maximum Transient Voltage

Recommended Application Voltage VR ≤ 10 V

67%

60%

54%

% R

ated

Vol

tage

Temperature (˚C)

Voltage Rating

Maximum Recommended

Steady State Voltage

Maximum Recommended Transient

Voltage (1 ms – 1 µs)

Maximum Recommended

Steady State Voltage

Maximum Recommended Transient

Voltage (1 ms – 1 µs) -55°Cto105°C 105°Cto125°C

2.5V≤VR≤10V 90%ofVR VR 60%ofVR 67%ofVR

VR ≥16V 80%ofVR VR 54%ofVR 67%ofVR

VR = Rated Voltage



Ripple Current/Ripple Voltage

PermissibleACripplevoltageandcurrentarerelatedtoequivalentseriesresistance(ESR)andthepowerdissipationcapabilitiesofthedevice.PermissibleACripplevoltagewhichmaybeappliedislimitedbytwocriteria: 1.ThepositivepeakACvoltageplustheDCbiasvoltage,ifany,mustnotexceedtheDCvoltageratingofthecapacitor.

2.ThenegativepeakACvoltageincombinationwithbiasvoltage,ifany,mustnotexceedtheallowablelimitsspecifiedforreversevoltage.SeetheReverseVoltagesectionforallowablelimits.

Themaximumpowerdissipationbycasesizecanbedeterminedusingthetableatright.Themaximumpowerdissipationratingstatedinthetablemustbereducedwithincreasingenvironmentaloperatingtemperatures.Refertothetablebelowfortemperaturecompensationrequirements.

Temperature Compensation Multipliers for Maximum Ripple Current

T≤45°C 45°C<T≤85°C 85°C<T≤105°C T≤125°C1.00 0.90 0.40 0.25

T= Environmental Temperature

UsingthePmaxofthedevice,themaximumallowablermsripplecurrentorvoltagemaybedetermined.

I(max) = √P max/RE(max) = Z √P max/R

I = rms ripple current (amperes)E = rms ripple voltage (volts)P max = maximum power dissipation (watts)

Case Code EIA Case Code

Maximum Power Dissipation (P max)

mWatts at 45°C with +30°C Rise

B 3528-21 127D 7343-31 225V 7343-20 187

The maximum power dissipation rating must be reduced with increasing environmental operating temperatures. Refer to the Temperature Compensation Multiplier table for details.

R = ESR at specified frequency (ohms)Z = Impedance at specified frequency (ohms)

Reverse Voltage

Polymerelectrolyticcapacitorsarepolardevicesandmaybepermanentlydamagedordestroyedifconnectedinthewrongpolarity.Thesedeviceswillwithstandasmalldegreeoftransientvoltagereversalforshortperiodsasshowninthebelowtable.

Temperature Permissible Transient Reverse Voltage25°C 15%ofRatedVoltage55°C 10%ofRatedVoltage85°C 5%ofRatedVoltage105°C 3%ofRatedVoltage125°C* 1%ofRatedVoltage

*For series rated to 125°C



Table 2 – Land Dimensions/Courtyard

KEMET Metric Size Code

Density Level A: Maximum (Most) Land

Protrusion (mm)

Density Level B: Median (Nominal) Land

Protrusion (mm)

Density Level C: Minimum (Least) Land

Protrusion (mm)Case EIA W L S V1 V2 W L S V1 V2 W L S V1 V2

B 3528–21 2.35 2.21 0.92 6.32 4.00 2.23 1.80 1.12 5.22 3.50 2.13 1.42 1.28 4.36 3.24

D 7343–31 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84

V 7343–20 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.Density Level C: For high component desity product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351).¹ Height of these chips may create problems in wave soldering.2 Land pattern geometry is too small for silkscreen outline.

L

S

W W

L

V1

V2

Grid Placement Courtyard



Soldering Process

KEMET’sfamiliesofsurfacemountcapacitorsarecompatiblewithwave(singleordual),convection,IR,orvaporphasereflowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermalstress.KEMET'srecommendedprofileconditionsforconvectionandIRreflowreflecttheprofileconditionsoftheIPC/J–STD–020Dstandardformoisturesensitivitytesting.Thedevicescansafelywithstandamaximumofthreereflowpassesattheseconditions.

PleasenotethatalthoughtheX/7343–43casesizecanwithstandwavesoldering,thetallprofile(4.3mmmaximum)dictatescareinwaveprocessdevelopment.

Handsolderingshouldbeperformedwithcareduetothedifficultyinprocesscontrol.Ifperformed,careshouldbetakentoavoidcontactofthesolderingirontothemoldedcase.Theironshouldbeusedtoheatthesolderpad,applyingsolderbetweenthepadandthetermination,untilreflowoccurs.Oncereflowoccurs,theironshouldberemovedimmediately.“Wiping”theedgesofachipandheatingthetopsurfaceisnotrecommended.

Profile Feature SnPb Assembly Pb-Free AssemblyPreheat/Soak

Temperature Minimum (TSmin) 100°C 150°CTemperature Maximum (TSmax) 150°C 200°C

Time (ts)fromTsmin to Tsmax) 60–120seconds 60–120secondsRamp-up Rate (TL to TP) 3°C/secondsmaximum 3°C/secondsmaximum

LiquidousTemperature(TL) 183°C 217°CTimeAboveLiquidous(tL) 60–150seconds 60–150seconds

Peak Temperature (TP) 220°C*235°C**

250°C*260°C**

Timewithin5°CofMaximum Peak Temperature (tP) 20secondsmaximum 30secondsmaximum

Ramp-downRate(TP to TL) 6°C/secondsmaximum 6°C/secondsmaximum

Time25°CtoPeakTemperature 6 minutes maximum 8 minutes maximum

Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. *Case Size D, E, P, Y, and X **Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z

Storage

AllKO-CAPseriesareshippedinmoisturebarrierbagswithadesiccantandmoistureindicatorcard.TheseseriesareclassifiedasMSL3(MoistureSensitivityLevel3).Productcontainedwithinthemoisturebarrierbagsshouldbestoredinnormalworkingenvironmentswithtemperaturesnottoexceed40°Candhumiditynotinexcessof90%RH.

Time

Temp

erat

ure

Tsmin

25ºC to Peak

t L

t S

25

t P

Tsmax

TL

TP Maximum Ramp Up Rate = 3ºC/secondsMaximum Ramp Down Rate = 6ºC/seconds



Construction

Leadframe(- Cathode)

Leadframe(+ Anode)

Wire

Molded Epoxy Case

Molded Epoxy Case

Weld(to attach wire)

Silver Adhesive

Polarity Bevel (+)

Polarity Stripe (+) Detailed Cross Section

Wire

Tantalum

Ta2O5 Dielectric(First Layer)

Carbon(Third Layer)

Silver Paint(Fourth Layer)

Polymer(Second Layer)

Capacitor Marking

* 442 = 42nd week of 2014

Polarity Indicator (+)

Rated Voltage

Picofarad Code

KEMET ID

Date Code*

Date Code *1stdigit=LastnumberofYear 4 = 2014

5 = 20156 = 2016

2ndand3rddigit=WeekoftheYear 01 = 1stweekoftheYearto 52 = 52ndweekoftheYear



Tape & Reel Packaging Information

KEMET’smoldedchipcapacitorfamiliesarepackagedin8and12mmplastictapeon7"and13"reelsinaccordancewithEIA Standard 481:EmbossedCarrierTapingofSurfaceMountComponentsforAutomaticHandling.Thispackagingsystemiscompatiblewithalltape-fedautomaticpick-and-placesystems.

Table 3 – Packaging Quantity

Case Code Tape Width (mm) 7" Reel* 13" Reel*

KEMET EIAS 3216-12 8 2,500 10,000T 3528-12 8 2,500 10,000M 3528-15 8 2,000 8,000U 6032-15 12 1,000 5,000L 6032-19 12 1,000 3,000W 7343-15 12 1,000 3,000Z 7343-17 12 1,000 3,000V 7343-20 12 1,000 3,000A 3216-18 8 2,000 9,000B 3528-21 8 2,000 8,000C 6032-28 12 500 3,000D 7343-31 12 500 2,500Q 7343-12 12 1,000 3,000Y 7343-40 12 500 2,000X 7343-43 12 500 2,000

E/T428P 7360-38 12 500 2,000H 7360-20 12 1,000 2,500

* No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging.

Top Tape Thickness0.10 mm (0.004")

Maximum Thickness

8 mm (0.315")or

12 mm (0.472") 180 mm (7.0")or

330 mm (13.0")



Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

PoT

F

W

Center Lines of Cavity

Ao

Bo

User Direction of Unreeling

Cover Tape

Ko

B1 is for tape feeder reference only, including draft concentric about B o.

T2

ØD1

ØDo

B1

S1

T1

E1

E2

P1

P2

EmbossmentFor cavity size,see Note 1 Table 4

[10 pitches cumulativetolerance on tape ± 0.2 mm]

Table 4 – Embossed (Plastic) Carrier Tape DimensionsMetricwillgovern

Constant Dimensions — Millimeters (Inches) TapeSize D0

D1 MinimumNote1 E1 P0 P2

RReferenceNote2

S1 MinimumNote3 T Maximum T1 Maximum

8 mm1.5+0.10/-0.0

(0.059+0.004/-0.0)

1.0 (0.039)

1.75 ±0.10 (0.069 ±0.004)

4.0 ±0.10 (0.157 ±0.004)

2.0 ±0.05(0.079 ±0.002)

25.0 (0.984)

0.600 (0.024)

0.600 (0.024)

0.100 (0.004)12 mm 1.5

(0.059)30

(1.181)16 mm 2.0 ±0.1(0.079 ±0.059)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other.

2. The tape, with or without components, shall pass around R without damage (see Figure 4).3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).4. B1 dimension is a reference dimension for tape feeder clearance only.5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 3). (e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements.

Variable Dimensions — Millimeters (Inches) TapeSize Pitch B1 Maximum

Note4 E2 Minimum F P1 T2 Maximum WMaximum A0, B0 & K0

8 mm Single(4mm) 4.35 (0.171)

6.25 (0.246)

3.5 ±0.05 (0.138 ±0.002)

2.0 ±0.05 or 4.0 ±0.10(0.079 ±0.002 or 0.157 ±0.004)

2.5 (0.098)

8.3 (0.327)

Note512 mm Single(4mm)&Double(8mm)

8.2 (0.323)

10.25 (0.404)

5.5 ±0.05 (0.217 ±0.002)

2.0 ±0.05 (0.079 ±0.002) or 4.0 ±0.10 (0.157 ±0.004) or 8.0 ±0.10

(0.315 ±0.004)

4.6 (0.181)

12.3 (0.484)

16 mm Triple (12 mm) 12.1 (0.476)

14.25 (0.561)

7.5±0.10 (0.295 ±0.004)

4.0 ±0.10 (0.157 ±0.004) to 12.0 ±0.10 (0.472 ±0.004) 8.0 (0.315) 16.3

(0.642)



Packaging Information Performance Notes

1. Cover Tape Break Force:1.0Kgminimum.2. Cover Tape Peel Strength: Thetotalpeelstrengthofthecovertapefromthecarriertapeshallbe:

Tape Width Peel Strength8 mm 0.1to1.0Newton(10to100gf)

12and16mm 0.1to1.3Newton(10to130gf)

Thedirectionofthepullshallbeoppositethedirectionofthecarriertapetravel.Thepullangleofthecarriertapeshallbe165°to180°fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof300±10mm/minute.3. Labeling:Barcodelabeling(standardorcustom)shallbeonthesideofthereeloppositethesprocketholes.Refer to EIA Standards 556 and 624.

Figure 2 – Maximum Component Rotation

Ao

Bo

°T

°s

Maximum Component RotationTop View

Maximum Component RotationSide View

Tape MaximumWidth (mm) Rotation ( °

T)8,12 20 16 – 200 10 Tape Maximum

Width (mm) Rotation ( °S)

8,12 20 16 – 56 1072 – 200 5

Typical Pocket Centerline

Typical Component Centerline

Figure 3 – Maximum Lateral Movement

0.5 mm maximum0.5 mm maximum

8 mm & 12 mm Tape

1.0 mm maximum1.0 mm maximum

16 mm Tape

Figure 4 – Bending Radius

RRBending

Radius

EmbossedCarrier

PunchedCarrier



Figure 5 – Reel Dimensions

A D (See Note)

Full Radius,See Note

B (see Note)

Access Hole atSlot Location(Ø 40 mm minimum)

If present,tape slot in corefor tape start:2.5 mm minimum width x10.0 mm minimum depth

W3 (Includes flange distortion at outer edge)

W2 (Measured at hub)

W1 (Measured at hub)

C(Arbor holediameter)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

N

Table 5 – Reel DimensionsMetricwillgovern

Constant Dimensions — Millimeters (Inches) TapeSize A B Minimum C DMinimum

8 mm 178 ±0.20 (7.008 ±0.008)

or330 ±0.20

(13.000 ±0.008)

1.5 (0.059)

13.0+0.5/-0.2(0.521+0.02/-0.008)

20.2 (0.795)12 mm

16 mm

Variable Dimensions — Millimeters (Inches) TapeSize NMinimum W1 W2 Maximum W3

8 mm

50 (1.969)

8.4+1.5/-0.0(0.331+0.059/-0.0)

14.4 (0.567)

Shallaccommodatetapewidthwithoutinterference12 mm 12.4+2.0/-0.0

(0.488+0.078/-0.0)18.4

(0.724)

16 mm 16.4+2.0/-0.0(0.646+0.078/-0.0)

22.4 (0.882)



Figure 6 – Tape Leader & Trailer Dimensions

Trailer160 mm Minimum

Carrier Tape

END STARTRound Sprocket Holes

Elongated Sprocket Holes(32 mm tape and wider)

Top Cover Tape

Top Cover Tape

Punched Carrier8 mm & 12 mm only

Embossed Carrier

Components

100 mm Minimum Leader

400 mm Minimum

Figure 7 – Maximum Camber

Carrier TapeRound Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

Elongated sprocket holes(32 mm & wider tapes)



KEMET Corporation World Headquarters

2835KEMETWaySimpsonville, SC 29681

MailingAddress:P.O. Box 5928 Greenville, SC 29606

www.kemet.com Tel:864-963-6300Fax:864-963-6521

Corporate Offi cesFortLauderdale,FLTel:954-766-2800

North America

SoutheastLakeMary,FLTel:407-855-8886

NortheastWilmington,MATel:978-658-1663

CentralNovi,MITel:248-994-1030

WestMilpitas,CATel:408-433-9950

Mexico Guadalajara,JaliscoTel:52-33-3123-2141

Europe

Southern EuropeSassoMarconi,ItalyTel:39-051-939111

Skopje,MacedoniaTel:389-2-55-14-623

Central EuropeLandsberg,GermanyTel:49-8191-3350800

Kamen,GermanyTel:49-2307-438110

Northern EuropeWyboston,UnitedKingdomTel:44-1480-273082

Espoo,FinlandTel:358-9-5406-5000

Asia

Northeast AsiaHongKongTel:852-2305-1168

Shenzhen,ChinaTel:86-755-2518-1306

Beijing,ChinaTel:86-10-5877-1075

Shanghai,ChinaTel:86-21-6447-0707

Seoul,SouthKoreaTel:82-2-6294-0550

Taipei, TaiwanTel:886-2-27528585

Southeast AsiaSingaporeTel:65-6701-8033

Penang,MalaysiaTel:60-4-6430200

Bangalore,IndiaTel:91-806-53-76817

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation.



DisclaimerAllproductspecifications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.ThecustomerisresponsibleforcheckingandverifyingtheextenttowhichtheInformationcontainedinthispublicationisapplicabletoanorderatthetimetheorderisplaced.

AllInformationgivenhereinisbelievedtobeaccurateandreliable,butitispresentedwithoutguarantee,warranty,orresponsibilityofanykind,expressedorimplied.

StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET”)knowledgeoftypicaloperatingconditionsforsuchapplications,butarenotintendedtoconstitute–andKEMETspecificallydisclaims–anywarrantyconcerningsuitabilityforaspecificcustomerapplicationoruse.TheInformationisintendedforuseonlybycustomerswhohavetherequisiteexperienceandcapabilitytodeterminethecorrectproductsfortheirapplication.AnytechnicaladviceinferredfromthisInformationorotherwiseprovidedbyKEMETwithreferencetotheuseofKEMET’sproductsisgivengratis,andKEMETassumesnoobligationorliabilityfortheadvicegivenorresultsobtained.

AlthoughKEMETdesignsandmanufacturesitsproductstothemoststringentqualityandsafetystandards,giventhecurrentstateoftheart,isolatedcomponentfailuresmaystilloccur.Accordingly,customerapplicationswhichrequireahighdegreeofreliabilityorsafetyshouldemploysuitabledesignsorothersafeguards(suchasinstallationofprotectivecircuitryorredundancies)inordertoensurethatthefailureofanelectricalcomponentdoesnotresultinariskofpersonalinjuryorpropertydamage.

Althoughallproduct–relatedwarnings,cautionsandnotesmustbeobserved,thecustomershouldnotassumethatallsafetymeasuresareindictedorthatothermeasuresmaynotberequired.

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