Automation of TestWhat’s solutions and how to implement

Automation of TestWhat’s solutions and how to implementimplementimplement

• 1-OVERVIEW :- Teradyne overview - Teradyne Test Systems overview

 2-AUTOMATION- Example of existing solutions

V i “I li ” i l t ti- Various “In-line” implementation-Specific concerns for automation

3-TERADYNE Implementation‐ Teradyne concept and implementationTeradyne Automation Board Test solutions

Slide 1

- Teradyne Automation Board Test solutions

TeradyneTeradyne

TERADYNE OverviewTERADYNE Overview

TERADYNE activities: From chip TEST to final product TESTTERADYNE activities: From chip TEST to final product TEST

WafersWafers Packaged Devices

Packaged Devices

Printed Circuit Boards

Printed Circuit Boards Wireless ProductsWireless ProductsHard Disk

DriveHard Disk

Drive

Industrial Automation Industrial Automation

Slide 3

Final Product TestFinal Product TestSub SystemTest

Sub SystemTestChip TestChip Test

Teradyne operating segments

System-On-Chip Test

Semiconductor Test• System-On-Chip (SOC) Test

• Leading wireless, mixed signal, microcontroller and performance analog test systems

Annual Revenue(1)

2007 $1,038Mand performance analog test systems

• Memory Test• Highest Throughput Flash and High

Speed DRAM Solutions• Largest installed base for SOC test

• 9,000+ UltraFLEX, FLEX, J750, IP750, ETS, and Magnum systems installed at IDM and OSAT customers

2008 $1,048M2009 $777M2010 $1,566Msystems installed at IDM and OSAT customers

System Test Group• Defense & Aerospace Board Test

• Defacto standard for digital test across major

2010 $1,566M2011 $1,429M2012 $1,657M2013: $1 437MDefacto standard for digital test across major

branches of DoD• Storage Test

• Industry’s most productive 2.5” HDD Systems• Board Test Production

• Patented low voltage test technology delivers highest yield in-circuit board test

21%

77%

2013: $1,437M2014: $1,648M

2015: $1,640Mhighest yield in circuit board test

Wireless Products• Unique tester architecture focused on production test• Products deliver highest throughput and shortest time

to market

Slide 5

to market• Serves ~$1B wireless product test market, growing

8% - 10% per year

Globally Aligned to Meet Customer NeedsGlobally Aligned to Meet Customer Needs

Japan Korea

~4,200 employees serving WW customer base

US EuropeRest of Asia

•Applications Development

Japan Korea•Design Center

•Applications Development 

•Sales & Support

•Sales & Support

•Sales & Support

•Material Hub1

Development 

•Sales & Support

•Repair Center

•Global Sourcing Group

•Headquarters

•Product Development

•Sales & Support•Sales & Support

•New Product Introduction

Costa Rica

•Repair Center

Slide 6

Teradyne System Test Group Structurey y p

Teradyne

WIRELESS System TestGroup

SemiconductorTest Divisionp

Industrial Automation Industrial Automation

Hard diskdrives

Military&

AerospaceBusiness Unit

ElectronicsPCB AssemblyBusiness Unit

SOICBusiness Unit

Memory TestBusiness Unit

LCDBusiness Unit

Slide 7

Slide 2

System Test Group: from PCB Production to Repair CenterSystem Test Group: from PCB Production to Repair Center

Mil-aero Business

Mil/Aero SRU/LRU (Functional Test)

SPECTRUM 9100PCB Test in Production(ICT & Functional Test)

Spectrum HS/FX(PXI)

(VXI)( )

and AUTOMATION( )

T t St ti SE

Slide 8

Test Station(TS121,TSLH)

Test Station SE ( Spectrum 8862)

Test Station In lineMULTISITE

( Tsi, TSh,TSo) Board Test Production Business

Teradyne’s Board Test Systems Install base and Global Service organizationTeradyne’s Board Test Systems Install base and Global Service organization

• Teradyne’s ICT install base > 8,500S tSystems

• Current generation > 2,500SystemsSystems

Slide 10

Teradyne company proprietary information. Not for disclosure.

Global Services Organization

Teradyne Production Test

BOARD TEST AUTOMATIONBOARD TEST AUTOMATION

y

EXAMPLE OF SOLUTIONS & IMPLEMENTATION

EXAMPLE OF SOLUTIONS & IMPLEMENTATION

Slide 11

1- traditionnal Handler IN-LINE solutions 1- traditionnal Handler IN-LINE solutions

Slide 12

“INLINE Tester integration” example“INLINE Tester integration” example

Dual 21 slot backplanes (testers)

Ex: In-line dual – 256 pin systems

•Dual 21 slot backplanes (testers)•384 pins/tester capacity •Independent systems•Integrated fixturingg g•5 foot length•30 inch conveyor height•Front side maintenance access

Long cable issues:

Fixturing cost & Performance ??

Long cable issues:Limiting performances

Slide 13

And Front-sitemaintenance issue

11/2/201613

AGILENT INLINE: BIG AND BOLT-ONAGILENT INLINE: BIG AND BOLT-ONBridge solution : Bride over a stand alone test system => floor space and test coverage/quality issues….

Two testers - one box

p g q y

Two testers one box

8 feet long8 feet long

Long signal path

Slide 14Teradyne company proprietary information. Not for external distribution14 11/2/2016

Cabling connections impact on Analog Measurement DegradationCabling connections impact on Analog Measurement Degradation!

• Cable Parasitics Degrade Tests • Cable length & routing can vary

• Low value Caps• Drifting values over time• Cable Capacitance 10x target

CUUT

Ribbon Cable• Tester to tester variation

• Example 3M™ 3756 RCL Specs:

• Cable Capacitance 10x target• Leads to Manual Offsets• Frequent recalibration• Generally not possible with

Ribbon Cable

Cable Wire pF

• Resistor Measurement Error4 i R b t id

• CP/CPk Impact

ycable lengths longer than 1m Tester

Resources

• 4-wire R error becomes too wide • Wider limits required to prevent false fails• Test results have an offset• Cable variation can result in varying test

stability40

50

nt E

rror In-Circuit Guard Error

3 Meter Cable Residuals Rs=Rm = 3.1, Rg = 2.7, Ra=Rb=50 stability

• Adding cables will likely push some measurements outside CPk limits

10

20

30

Mea

sure

me Fixture Residuals

Rs=Rm=0.8, Rg=0.4, Ra=Rb=50

Analog Accuracy IMPACT:

Slide 157

00 500 1000 1500 2000

%

Rx (Ohms)Teradyne 3 Meter Cable Error Teradyne Direct Connect Error

Analog Accuracy IMPACT:> +/-20% !!

2-Fixture Automation or PDU2-Fixture Automation or PDU

Slide 16

3- Board handling Automation with ROBOTS : 3- Board handling Automation with ROBOTS :

Slide 17

What solution is best ?????What’s key parameters ??What solution is best ?????What’s key parameters ??

Slide 19

Key AUTOMATION CONCERNS Key AUTOMATION CONCERNS

• Automation Impacts: • Floor space ( how many bays and test heads required…?)• Test Time /Handling Time versus TAC time?• Board identification (bar code), MES link/connection, repair station?• Test strategy : Manufacturing Steps required : ICT , Funct, Flashing,..?gy g p q , , g,• Cabling impact on performances and Maintenance (%,Measure,Cpk,..) • ….and much more

• Panel Board Testing Capability• How to speed up Test Time versus reduced requirements?

V i t t / P l t f l d ti• Variant management / Panel management for volume production

• Cost Impact : cost of ownership versus cost of test head

Slide 20

• Cost of Full solution: Number of fixtures/ coverage /cost per bd…..• price-performance => ROI of FULL LINE SOLUTION20

Customer Requirements and needsq

•  Listen to main Automotive customer and EMS Industry following Criteria are most important

- Manufacturing space becomes very expensive( mainly in Europe )

- More speed is required -> reduce Test stages /Tooling cost

- Automation is becoming even more important( No human intervention, often required in Automotive )( Eliminate cost of operator )

Slide 21

( Eliminate cost of operator )

Slide 17

Teradyne Production Test

BOARD TEST AUTOMATIONBOARD TEST AUTOMATION

y

TERADYNE CONCEPT AND IMPLEMENTATION

TERADYNE CONCEPT AND IMPLEMENTATION

Slide 22

After 20 years of TERADYNE In-Line Automated SolutionsAfter 20 years of TERADYNE In-Line Automated Solutions

Traditional integrated SolutionTraditional integrated Solution

Solution TestStation LH•Small footprint•Scalable configuration depends on technology ,

test Capacity, pin count, process,…

Bar code reader,Test head into

Scalable configuration

Bar code reader,Test head into19” rack or multiple bays…

UUT Power supplies , PC, valves,…I t 2nd b ( d f ki

Slide 23

Standard Test Head integrated into standardHandler vendor

Into 2nd bay(used for marking or other step

NEW MULTISITE ConceptNEW MULTISITE Concept

TestStation LH

Single Site Test SystemsTestStation Multi-site Offline• Dual site – 1280 pins per site

Multi-Site Test Systems

New•Small footprint•Scalable configuration

TestStation LX•Highest pincount capacity

• 50% - 65% smaller footprint• 2 - 4x test throughput

TestStation Multi-site Inline•Dual site – 1280 pins per site•Zero footprint Inline Automation2 4 t t th h t

New

New•Highest performance capabilities

TestStation•Compatibility platform•Direct 228X migration

•2 – 4x test throughput

TestStation TSi Handler•Native Automation Solution•Single Site and Multi-site compatible

New

NewTestStation TSR•Singe Site 2048 pin capacity

TestStation Duo• Full size expandability• Dual site – 3072 pins per site• Full parallel; 2-4x test throughput

New

•Scalable architecture • Compatible programsTestStation Family Architecture – Common Key Benefits:

Slide 24

Scalable architecture•Compatible software•Compatible hardware

p p g• Common training

24

TestStation inline - DESIGNED for AutomationTestStation inline - DESIGNED for Automation

• ‘Zero Footprint’ Test Head 8x smaller- fits entirely inside automation

Wi l di t t Hi h i l i t it Wireless direct connect - High signal integrity Simple front maintenance

• Clean Connect into Automation Supports multiple automation vendors Multiple fixture integration methods

NO CABLE CONNECTIONS

• Modular Test Head Format

NO CABLE CONNECTIONS

Slide 25

Increased productivity with multisite parallel test Automation can produce 2-4x units per hour

Max Hybrid Pins1280 2560 5120

25

Space: New TS Multisite offline (TSO)Space: New TS Multisite offline (TSO)( )( )

• High density small footprint package• Small footprint: Dual site: 0 7m2• Small footprint: Dual site: 0.7m• 550mm (w) x 1200 mm (d) x 700mm (h)

Si l & D l it t t h d fi ti• Single & Dual site test head configurations

• Standard test fixturing NO CABLE CONNECTIONS

• Similar fixture kits to TSLH with Multisite compatible interface

• Efficient vacuum interface

• Supports all Teradyne pin card options• Analog Only, Pure Pin, Standard

Multiplexed & High Density

Slide 27

Multiplexed, & High Density

Speed: TestStation multisite system:designed for productivitySpeed: TestStation multisite system:designed for productivity

T tSt ti 052

Both Test Head 1 & 2 Perform ALL Test & Flash in Parallel or staging mode

TestStation 052

1,280 pins (5x124L Card) Vectorless Tests

Unpowered Analog Tests

Shorts & OpensDual Site

1,280 pins (5x124L Card)

Test Head 2 Test Head 1

OR2,560 pins (5x128HD Card)

Powered Functional

Powered Analog

Vectorless TestsOR2,560 pins (5x128HD Card)

Powered Vectorless Test

Basic Digital

Boundary Scan

Programming

Cluster Functional Testing

Advanced Digital

Slide 28

Parametric Verification

Teradyne Confidential and Proprietary Intellectual Property Material

Cost down : Multisite delivers Greater UNITS Per Hour vs. conventional ICTCost down : Multisite delivers Greater UNITS Per Hour vs. conventional ICT

Test

Test100% Test

UUTs in Panel Test Time of UUT# 1

Han

dle

TTe

st

Han

dle

TTe

st

100% Parallel Testing

= 2 X Through-put

TTe

st

Time

T T

Test Head 2 Test Head 1

T

Panel#1

Panel#2

Panel#3

Test Time of UUT# 2

Revolutionary architecture: • 2 Testers in Single frame• Both UUT in the panel are tested by 2 testers in Parallel.

Reduce cost of ownership

Slide 29

Teradyne Confidential and Proprietary Intellectual Property Material

p

Teradyne multisite test head Designed for ease of maintenanceTeradyne multisite test head Designed for ease of maintenance

Front & Rear Service Access for low MTTR

Modular Subsystemsfor Easy Repair and

R fi ti

Slide 31

Reconfiguration

Teradyne Confidential and Proprietary Intellectual Property Material

TestStation Handling Solution with ROBOTS

Board HANDLING / AutomationR-TSOwUR_demo.mp

Universal ROBOTS: Collaborative Robots ( COBOTS)Universal ROBOTS: Collaborative Robots ( COBOTS)

https://www.dropbox.com/s/skxywjggmu3fh

Slide 32

https://www.dropbox.com/s/skxywjggmu3fhae/UR-TSOwCaptions.mp4?dl=0

Teststation MULTISITE Family is a configurable and Scalable PlatformTeststation MULTISITE Family is a configurable and Scalable Platform

Unpowered Analog Tests

Shorts & Opens MDA

TestStation Multi-site Offline•Dual site – 1280 pins per site•50% - 65% smaller footprint•2 - 4x test throughput

Powered Analog

Vectorless TestsTestStation Multi-site Inline•Dual site – 1280 pins per site•Zero footprint Inline Automation•2 – 4x test throughput

Basic Digital

Boundary Scan

Powered FunctionalICT

TestStation TSi Handler•Native Automation Solution•Single Site and Multi-site compatible

TestStation Duo

Advanced Digital

Powered Vectorless Test

Basic DigitalTestStation Duo•Full size expandability•Dual site – 3072 pins per site•Full parallel; 2-4x test throughput

In-System Programming

Cluster Functional Testing

• Grow test coverage without changing the tester• Programs and test fixtures are compatible

FCT

Scalable from 128 pins to 15360 pins!!!!

Slide 34

Parametric Verification• Programs and test fixtures are compatible• Operators only need to learn one test system• Software adapts to tester configuration

Flexibility Build the System You NeedFlexibility Build the System You Need

From Basic ICT capabilities to best-in-class DIGITAL test

Flash,ISPprogramming

(DSM)

Test Station LX2Automated TSh

$ UltraPin II 121a Mix UltraPin

Test Station LX2Test Station TSi

Automated TSh

$ UltraPin II 121a or 124,128

Bscan

Mix UltraPin121a and 121

B i ICTB i ICTFrameScan FX

PXI functional testBasic ICTBasic ICT

T t St ti TSO

Slide 35

Analog Vectorless FLASH/BScan Digital VectorTest Station LH

Test Station TSO

New MULTISITE Family implementation forvarious manufacturing strategy

Slide 36

Thank you!Thank you!