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August 2008 Slide 1
How to drive open innovation in front end research
the ASML model
Tony Chao Managing Director ASML Center of Excellence (ACE)
22 August 2008
August 2008 Slide 2
Agenda
ASML’s global success based on solid fundamentals
ASML’s key success factors – open innovation
ASML Center of Excellence in Linkou, Taiwan
August 2008 Slide 3
ASML: a short profile
World’s leading manufacturer of lithography systems for the semiconductor industry with 65% market share
A global company founded in 1984 and headquartered in the Netherlands
Located in 16 countries around the world
Worldwide research, production and support centers
Net sales in 2007 of €3.8B (USD5.7B) and more then 6500 employees
Unique business model to enable innovation
August 2008 Slide 4
ASML employees in US:1,744
Source: ASML Q1 2008
Over 60 sales and service offices located worldwide in 16 countries
ASML employees in Europe:3,705
ASML employees in Asia:1,316
ASML – leading semiconductorlithography provider with 65% worldwide market share
with ~70% total revenue from Asia today
24% sales to US 69%
sales to ASIA
7% sales to Europe
USA 24%
Taiwan 15%
Korea 32%
Japan 7%Europe 7%
China 14%
Q1 08 Revenue€919M (US1.4B)
Other 1%
August 2008 Slide 5
$256 B Semiconductor
Chips
$1,550 B Electronic Applications
$8,6 B Semiconductor
Litho market
Source: VLSI, SIA, Gartner
From silicon to smart electronics
August 2008 Slide 6
Lithography is the key to smaller and more powerful chips
The Semiconductor Manufacturing Process
A variety of complementary suppliers provide the other tools, materials and packaging equipment necessary to make ICs
August 2008 Slide 7
Lithography determines chip and feature size
Source: ICE
1 µm
Pitch + OV
CD+∆CDCD+∆C
D Spacing >
OV + ∆CD
Gate
OV: Overlay
CD: Critical dimension
∆CD: CD variation
August 2008 Slide 8
Minimum feature size 40 nmPositional accuracy +/- 4 nm
Note: 1nm = 1/1,000,000 mm
300 mm
Source: ASML
Corresponds to 4 cmPositional accuracy +/- 0.4 cm
300 km300 kmX1 million
Enlarging a 300 mm wafer 1 million times
August 2008 Slide 9
ASML system deliverables
Two TWINSCANTM scanner stages operate at a speed of 550 mm/s with an accuracy
of 2 nanometer,
which compares to two 747 jumbo jets flying at 1000 km/hr
the exact same route to an accuracy of 0.001 millimeter
The reticle stage acceleratesfrom 0 to 100 km/hour in 0.7 seconds,leaving every sports car behind.
Reticle stage
Wafer stages
August 2008 Slide 10
Multiple opportunitiesfor growth
The chip industry is growing
ASML is not dependent on chip revenue but on chip unit sales
Chips become more complex
Chip processing becomes more challenging
Technology leadership brings increased market share
August 2008 Slide 11
Smaller and cheaper chips means growthexample: NAND Flash memory
1 GB
USB stick
4 GB
Digital cameras
8 GB
MP3 player
10 - 20 GB
3G smart-phones
Source: ASML MCC, WSTS, Gartner
60 - 80 GB
Hybrid HDD
FLASH camcorders
Solid state disk-based laptops
2 -16 GB
80 - 150 GB
0
100
200
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400
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1300
1400
1500
’95 ’96 ’97 ’98 ’99 ’00 ’01 ’02 ’03 ’04 ’05 ’06 ’07 ’08 ’09 ’10
Year
FLA
SH
IC
Mar
ket
(mill
ions
of
units
)
FLASH units history
FLASH units forecast
Several new NAND-based applications on the horizon
August 2008 Slide 12
’02 ’03 ’04 ’05 ’06 ’07 ’08 ’09 ’10 ’11 ’12 ’13 ’14
Year of production start*
Res
olut
ion,
"S
hrin
k" (
nm)
100
80
60
40
Logic
NAND Flash
DRAM
30
20
50
*Process development 1.5 ~ 2 years in advance (updated 12/07)
200
Chip shrink will continue (based on the average of multiple customers’ input)
ASML products
EUVXT:1950i
XT:1700i
AT:1200
XT:1400
XT:1900i
August 2008 Slide 13
Agenda
ASML’s global success based on solid fundamentals
ASML’s key success factors – open innovation
ASML Center of Excellence in Linkou, Taiwan
August 2008 Slide 14
Open innovation: a definition
Open innovation is a way of working which creates an international, cross-company environment that enables out-of-the-box
thinking to create a better product or service than any company can achieve separately.
August 2008 Slide 15
The key success factors
Factor 1: Investments in Research and Development
Factor 2: Very large network of suppliers and research institutes
Factor 3: Unique company culture which stimulates innovation
Factor 4: Relentless focus on customers
August 2008 Slide 16
Factors of Success: 1. Research & Development
• R&D budget >500M€ per year (13 – 15% of revenue)• Second largest, non-government R&D investor in the Netherlands• >1800 R&D employees (27% of total) plus 900 contractors and specialists
Source: ASML
0
500
1000
1500
2000
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3000
3500
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’92 ’93 ’94 ’95 ’96 ’97 ’98 ’99 ’00 ’01 ’02 ’03 ’04 ’05 ’06 ’07
R&D investment M€
Total sales M€
500
450
400
350
300
250
200
150
0
April 2008 / Slide 18
Wafer Stage(Expose)
ProjectionOptics
Wafer Stage (Measure)
IlluminationOptics
ReticleHandler
WaferHandler
UserInterface
ReticleStage
MeasurementSystems
Factors of Success: 2. Integrated knowledge network
August 2008 Slide 19
Source: ASML
Factors of Success: 2. Integrated knowledge network
Semiconductor producersCustomer
OEM partnerR&D partner
Govern-ment
funding
Total solutionpartners
Philips NatlabAppTechTNOTechnical UniversitiesIMECAlbany nanotech
Zeiss SMTAgilentCymer> 700 others
TISamsungTSMC
ReticlesResistTracksMetrology
August 2008 Slide 20
Source: ASML
Worldwide 6.765 employees (Q1)
R&D:>1,800 payroll
+ >900 contracted
200PhD/Dr.
Integrated knowledge network:another 20,000 jobs
More than 600 suppliers compete to offer the best technology first
Factors of Success: 2. Integrated knowledge networkASML works with best research and development partners:
network of high tech companies and suppliers boosts competences
August 2008 Slide 21
Factors of Success: 3. Company culture that stimulates innovation
“Flat” organisation without much hiërarchy
Consensus based with the following characteristics:
Preparation time is longer, but overall project time is shorter with less errors
Work in multidisciplinary teams which is opportunity for learning and mutual understanding
Research Develop Feasibility Validation Innovation Forward
August 2008 Slide 22
Factors of Success: 4. Relentless focus on customers
Extensive worldwide customer support network:Taiwan, China, Singapore, Japan, Korea, Malaysia, France, Germany, Ireland, Italy,the UK and the USA
Training facilities in Asia, Europe and the USA
Applications support centers to help customers optimize systems in their production process
Advanced customer joint development projects
New investment of ASML Center of Excellence (ACE) in Taiwan is an long term expansion of worldwide support
August 2008 Slide 23
Factors of Success: 4. Relentless focus on customers
Source : VLSI Research, June 2008
For the sixth consecutive year, ASML is in the top three of VLSI’s “10 Best” list, the highest rating of any lithography exposure system supplier
August 2008 Slide 24
18 of top 20 wafer fabs choose ASML
Top 20 CapEx budgets for 2007
Rank123456789
1011121314151617181920
CompanySamsungIntelHynixMicron Technology ToshibaTSMC NanyaPowerchipInfineon ProMOSAMDSanDiskElpidaSony UMCSTMicroelectronicsFujitsuIBMCharteredTexas Instruments
Capex (M$)83304900460036002805 26002475 2150 1875 18751700137513501085 1000 960 850 750 750 700
ASML Customer
90%is
ASMLcustomer
Source: IC Insights 2008, McClean report, 2008 edition
August 2008 Slide 25
Agenda
ASML’s global success based on solid fundamentals
ASML’s key success factors
ASML Center of Excellence in Linkou, Taiwan
August 2008 Slide 26
ACE vision and key objectives
• Provide closer proximity support to worldwide customers
• Increase customer intimacy and satisfaction
• Attract and retain worldwide talent
• Provide access to global sourcing of modules, components, and services
• Provide potential nucleus for future ASML growth initiatives
Objectives
Korea China
Taiwan
ASML center of
excellence(ACE)Singapore
Japan
ASML HQ
Worldwide Talent
Worldwide Suppliers
Worldwide customers
More systematic customer feedback
Better design and delivery of product and services
Worldwide ASML customers
Vision
An innovative, forward-looking ASML organization providing worldwide resources in new technology development, process methodology, and talent incubation
August 2008 Slide 27
• Application optimization services
• New applications support and development
• Sourcing support
• Application development
Organization
Global Support Center
Equipment Performance
&Maintenance Engineering
Training Sourcing Development & Engineering
ApplicationsServices
Logistics Repair & Refurbishment
• Remote diagnostic and technical support
• Competency development and management
• Equipment performance management
• Best know methods
• TWINSCAN training
• Training program development
• Learning management
• Supply chain engineering
• Procurement• Supply chain
expansion
• Business operations infrastructure
• Supply chain logistics
• Parts quality
• Factory parts repair
• System refurbishment
Facilities Management
ASML Center of Excellence
(ACE)
• Facility operations• EHS compliance• ISO certification• General affairs• Community relations
Facility operational by Q4 2008
ConfidentialAugust 2008 Slide 28
About the future
August 2008 Slide 29
The future of lithography: EUV
Reflective optics in vacuum chamber
13.5 nm laser or plasma produced
lightsource
Twinscan 300 mm waferstage
Key specifications
Wavelength 13.5 nmNumerical Aperture 0.25Exposure field 26 x 33 mm2
Magnification 4x reductionResolution ≤ 32 nmOverlay ≤ 4nmReticle stage and
handling for 6” reticles
August 2008 Slide 30
Reflective optics in vacuum chamber
Twinscan 300 mm waferstage
Average height Dutchman
13.5 nm laser or plasma produced
lightsource
Reticle stage and handling for 6” reticles
Two alpha tools in IMEC & Nanotech
August 2008 Slide 31
Commitment
