Architectural Overview of the Apple A4 APL0398 ARM ... Overview of the Apple A4 APL0398 ARM Applications Processor found on the iPad Report ID#: MKT-24018-2010 ii

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Architectural Overview of the Apple A4 APL0398 ARM Applications Processor found on the iPad Report ID#: MKT-24018-2010

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Device Summary

Manufacturer Apple

Part Number APL0398

Description ARM Applications Processor

Package Type 531 PoP (Package on Package)

Package Markings (top) (Apple logo) A4 K4X2G643GE-JGCB APL0398 339S0084 YNJ222PE 1001 N25VCOO 1004

Die Markings APL0398B01

Die Size 7.3mm x 7.3mm = 53.3 mm²

Number of Metal Levels 9

Number of Poly Levels 1

Foundry Samsung

Interconnect Level (Width / Pitch (µm))

Metal Level - M1 0.09 / 0.14 (Measured (X-Section))

Metal Level - M2 0.09/ 0.14 (Measured (X-Section))

Metal Level - M3 0.1 / 0.14 (Measured (X-Section))

Metal Level – M4 0.09 / 0.14 (Measured (X-Section))






Poly Layer - P1 0.05 / Not Specified (Measured (X-Section))

Process Type CMOS (Copper)

Process Generation 0.045 µm

Feature Measured to Determine Process Generation

Gate Length (Logic, SEM)

Transistor Gate Length 0.05 µm

Cell Size 0.382 um²


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1.0 Introduction

The Samsung APL0398 is the applications processor extracted from the Apple iPad tablet computer. It is packaged with DRAM in a package on package (POP) architecture where the package markings identify the packaged processor and memory as A4. The processor is manufactured with a 45 nm, 9 metal, single poly, CMOS process. Information available to the public on the APL0398 is scarce, however, speculation on the internet suggests the SoC (system on a chip) includes:

32-bit ARM Cortex A8 or A9 processor core; Integrated GPU; Memory controller.

The device has approximately 2503 KB of embedded memory divided among two SRAM cell structures, as well as ROM. There are embedded blocks of 6T AND 8T SRAM.



2.0 Architectural Overview

This section contains an overview of the package and die including images of the package and package markings, x-ray, die and die markings. 2.1 Package Overview The Apple APL0398 is packaged inside a 531-pin BGA that is configured as a package on package (PoP) with memory adjoining the processor. There are 316 additional solderballs between the two packages in the stack. Photographs 2.1.1 through 2.1.4 are the package top, bottom and X-ray images. Markings on the top of the memory package were: (Apple logo) A4 K4X2G643GE-JGCB APL0398 339S0084 YNJ222PE N25VCOO 1004

Photograph 2.1.1: Package top.

Photograph 2.1.2: Package bottom.



Photograph 2.1.3: Package X-ray.

Photograph 2.1.4: Package X-ray, side view.

Pin 1 Indicator



2.2 Die Overview The Apple APL0398 measures 7.3 mm x 7.3 mm, has a total die area of 53.3 mm2 and is presented in Photograph 2.2.1. The die contains the following markings (Photograph 2.2.2): APL0398B01

Photograph 2.2.1: Die photograph.



Photograph 2.2.2: Die markings.



2.3 Process Generation The APL0398 is manufactured with a nine metal, single poly CMOS process. The minimum observed feature was a logic gate that measured 50 nm. Photograph 2.3.1 is a SEM cross-section image of the minimum observed feature. In consideration of the minimum gate length, high density 6T SRAM cell area, and the minimum metal layer widths and pitches, we believe the device is fabricated at the 45 nm process node. The foundry is likely Samsung.

Photograph 2.3.1: SEM cross section through the minimum

observed transistor (glass etch).



3.0 Functional Overview

3.1 Device Functionality Although there is lots of speculation regarding the iPad applications processor in various websites on the internet, Apple has been very successful in maintaining an air of secrecy around the functions embedded in the device. Many believe the chip to be the first design of the recently acquired PA1,2, although at least one dissenting website3 believes the design team to be from Intensity. Most speculate the inclusion of an ARM core; specifically the Cortex A8 or A9 based on the high processing frequency. In the past, Apple has included the ARM logo in the packaging marks of the processors used in various generations of the iPhone or iPod. There are no ARM markings found on the package or die of this device. Other websites speculate on the integration of a GPU4 (graphics processor unit). A memory controller is also believed to be integrated into the device. Until Apple discloses the processor features, or extensive reverse engineering is performed, much of the above will remain speculation.

1http://www.brightsideofnews.com/news/2010/1/27/apple-a4-soc-unveiled---its-an-arm-cpu-and-the-gpu!.aspx 2 http://www.tomshardware.com/news/apple-ipad-iphone-ipod,9522.html 3 http://spectrum.ieee.org/semiconductors/processors/evidence-for-intrinsity-in-the-ipad 4 http://www.tipb.com/2010/01/28/apple-a4-ipad-chipset-arm-multicore-cortex-a9-mali-50-gpu/

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Architectural Overview of the Apple A4 APL0398 ARM ... Overview of the Apple A4 APL0398 ARM Applications Processor found on the iPad Report ID#: MKT-24018-2010 ii