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MODEL NAME

CUSTOMER P/NO.APPROVED DATE

Approval Sheet

PART NUMBERSMD LED

DBL-2016W2530K-2TCUSTOMER NAME

Shenzhen DongBei Technology Co,.Ltd.7F,NO.711,210 west,Tairan industrial park.,Futian,ShenzhenTel:0755-23820456 Fax:0755-28156077http://www.dongbei.com

DBL

Flash LED Type

DBL-2016W2530K-2T

Features ‧Top view white LED ˙High luminous flux output ˙Wide viewing angle ˙Pb-free ˙RoHS compliant

Description The Amicc 686 package has high efficacy, high power consumption, wide viewing angle and a compact form factor. These features make this package an ideal LED for all lighting applications.

Applications ‧ General lighting ‧ Decorative and Entertainment Lighting ‧ Indicators ‧ Illumination ‧ Switch lights ‧ Flash lights

Device Selection Guide

Chip Materials Emitted Color Resin Color

InGaN Warm White Yellow Diffused

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Absolute Maximum Ratings (TSoldering=25℃)

Parameter Symbol Rating Unit

Forward Current IF 250 mA

Peak Forward Current (Duty 1/10 @300ms) IFP 500 mA

Power Dissipation Pd 1700 mW

Operating Temperature Topr -40 ~ +85 ℃

Storage Temperature Tstg -40 ~ +100 ℃

Junction Temperature T j 115 ℃

Soldering Temperature Tsol Reflow Soldering : 260 ℃ for 10 sec.

Hand Soldering : 350 ℃ for 3 sec. Note: The products are sensitive to static electricity and must be carefully taken when handling products.

Electro-Optical Characteristics (TSoldering=25℃)

Parameter Symbol Min. Typ. Max. Unit Condition

Luminous Flux Φ 34 ----- 52 lm IF=150mA

Luminous Flux Φ ----- 55 ----- lm IF=250mA

Luminous Flux*3 Φ ----- 80 ----- lm IFP=350mA

Luminous Flux*3 Φ ----- 90 ----- lm IFP=450mA

Forward Voltage VF 3.0 ----- 3.6 V IF=150mA

Viewing Angle 2θ1/2 ----- 120 ----- deg IF=150mA

Reverse Current IR ----- ----- 10 μA VR =5V

Notes: 1. Tolerance of Luminous Flux: ±10%. 2. Tolerance of Forward Voltage : ±0.05V. 3. Peak Forward Current ( T=1.3ms, tp=0.3s)

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Bin Range of Luminous Flux

Bin Code Min. Max. Unit Condition

L37 34 36

lm IF=150mA

L38 36 38 L39 38 40 L40 40 44 L41 44 48 L42 48 52

Note: Tolerance of Luminous Flux: ±10%.

Bin Range of Forward Voltage

Bin Code Min. Max. Unit Condition

37 3.0 3.1

V IF=150mA

38 3.1 3.2 39 3.2 3.3 40 3.3 3.4 41 3.4 3.5 42 3.5 3.6

Note:

Tolerance of Forward Voltage: ±0.05V.

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Bin Range of Chromaticity Coordinates

Bin Code CIE_x CIE_y Bin Code CIE_x CIE_y

N2

0.4767 0.4366

N3

0.4671 0.4196

0.4945 0.4395 0.4840 0.4235

0.4840 0.4235 0.4740 0.4070

0.4671 0.4196 0.4577 0.4029

N4

0.4577 0.4029

M2

0.4614 0.4333

0.4740 0.4070 0.4767 0.4366

0.4640 0.3912 0.4671 0.4196

0.4490 0.3875 0.4525 0.4162

M3

0.4525 0.4162

M4

0.4436 0.3991

0.4671 0.4196 0.4577 0.4029

0.4577 0.4029 0.4490 0.3875

0.4436 0.3991 0.4356 0.3837

L2

0.4456 0.4287

L3

0.4376 0.4116

0.4614 0.4333 0.4525 0.4162

0.4525 0.4162 0.4436 0.3991

0.4376 0.4116 0.4294 0.3943

L4

0.4294 0.3943

0.4436 0.3991

0.4356 0.3837

0.4221 0.3790 Note: 1. The value is based on driving current by 150mA. 2. Tolerance of Chromaticity Coordinates: ±0.01.

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The C.I.E. 1931 Chromaticity Diagram

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Spectrum Distribution

Typical Electro-Optical Characteristics Curves

Fig.1-Forword Voltage Shift vs.Juntion Temperature

Tj-Juntion Temperature (C)0-25-50

Forw

ord

Vol

tage

Shi

ft -V

0.00

-0.10

-0.20

-0.15

-0.05

0.05

0.10

0.15

0.20

vs. Forword Current

150

Forward Current25 50 75 100 100500

Rel

ativ

e Lu

min

ous

Inte

nsity

(Nor

mal

ized

at 1

50m

A)

0.8

0.4

0.0

0.2

0.6

1.0

1.2

1.4

1.6

200 250 300

FI (mA)

Ts=25C

Fig.2-Relative Luminous Intensity

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Typical Electro-Optical Characteristics Curves

Forw

ard

Cur

rent

0.6

Rel

ativ

e lu

min

ous

inte

nsity

(%)

vs.Soldering Temperture

Tj-Juntion Temperature (C)

Soldering Temperature Ts (C)

Fig.5-Max.Driving Forward Current

00

20 40

Forw

ard

Cur

rent

100

300

200

I (m

A)

400

F

500

-500.2

0.4

-25 0 3.0

Fig.6-Radiation Diagram0

Forward Voltage V (V)

8560 1000.5 0.3 0.1

0.8

0.7

0.9

1.0

5025 75 100102.0 2.5

40

80

0.60.2 0.490

70

60

50

Ta=25C

10 20

30

4.03.5

F

vs.Juntion Temperature Fig.3-Relative Luminous Intensity

0.8

1.2

1.0

1.4

Forward VoltageFig.4-Forward Current vs.

1000

100

I (m

A)F

Ta=25C

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Package Dimension

(2)(1) (2)(1)

0.48

0.51.0 1.6

Recommended Solder Pad

1.3

0.250.

65

1.3

1.35

1.51

1.6

1.170.55

1.2

(2)(1)

2.2

1.75

2.0

Polarity

(1) (2)

Note: Tolerance unless mentioned is ±0.1mm,Unit = mm.

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Moisture Resistant Packing Materials

Label Explanation

AMICC CHANGZHOU AMICC OPTO-ELECTRONICSTECHNOLOGY Co.,LTD

P/N:×××××××××

IV:

HUE:

VF:

CODE MIN MAX UNIT

×× ×× ××

LOT NO:××××××××

MADE IN CHINA

QYT:××××

×× ×× ××

×× ×× ×× V

lm

TYPE:×-×××××××××

‧CPN: Customer’s Product Number ‧P/N: Product Number ‧QTY: Packing Quantity ‧CAT: Luminous Flux Rank ‧HUE: Chromaticity Coordinates Rank ‧REF: Forward Voltage Rank ‧LOT No: Lot Number

Reel Dimensions

Note: Tolerances unless mentioned ±0.1mm, Unit = mm.

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Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel

Progressive direction

polarity

Note: 1.Tolerance unless mentioned is ±0.1mm; Unit = mm. 2.Minimum packing amount is 500/1000 pcs per reel.

Moisture Resistant Packing Process

Desiccant

Aluminum moisture-proof bag

Label

Label

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Reliability Test Items and Conditions

The reliability of products shall be satisfied with items listed below. Confidence level：90% LTPD：10%

No. Items Test Condition Test Hours/Cycles Sample Size Ac/Re

1 Reflow Soldering Temp. : 260℃/10sec. 6 Min. 22 PCS. 0/1

2 Thermal Shock H : +100℃ 5min

∫ 10 sec L : -10℃ 5min

300 Cycles 22 PCS. 0/1

3 Temperature Cycle H : +100℃ 15min

∫ 5 min L : -40℃ 15min

300 Cycles 22 PCS. 0/1

4 High Temperature/Humidity Reverse Bias Ta=85℃,85%RH 1000 Hrs. 22 PCS. 0/1

5 Low Temperature Storage Ta=-40℃ 1000 Hrs. 22 PCS. 0/1

6 High Temperature Storage Ta=100℃ 1000 Hrs. 22 PCS. 0/1

7 DC Operation Life Ts=25℃, IF = 150 mA

1000 Hrs. 22 PCS. 0/1

8 Peak Forward Current

Operation Life ( T=1.3ms, tp=0.3s)

Ta=25℃, IFP = 500 mA 100000 cycles 5 PCS. 0/1

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Precautions for Use

1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 After opening the package: The LED's floor life is 168 Hrs under 30℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages.

2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment: 60±5℃ for 24 hours.

3. Soldering Condition 3.1 Pb-free solder temperature profile

260 Max.

10sec. Max.

6 C/sec.Max.

Above255 C

30sec.Max.

C

Above 21760~150 sec.

3 C/sec.Max.

Pre-heating

150~200 C

60~120sec.

3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board.

4. Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.

5. Repairing

Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.

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