Application Processor for Smartphone€¦ · technology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in the Huawei P9 and the Samsung Exynos

©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 1

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Application Processor for SmartphonePackaging Technology & Cost ReviewAdvanced Packaging report by Stéphane ELISABETHNovember 2016

mailto:[email protected]

mailto:[email protected]

http://www.systemplus.fr/

http://www.systemplus.fr/


Table of Contents

Overview / Introduction 3

o Executive Summary

o AP I/O count & Footprint

o AP I/O count & L/S width

o Reverse Costing Methodology

Company Profile 10

o Apple, Huawei, Samsung, Qualcomm

o Apple, Huawei, Samsung, Qualcomm AP history

o Apple, Huawei, Samsung, Qualcomm Supply Chain History

o iPhone 7 Plus, Huawei P9, Samsung Galaxy S7 Teardown

o PoP Packaging Technology

Physical Analysis 32

o Synthesis of the Physical Analysis

o Physical Analysis Methodology

o A10, Kirin 955, Exynos 8, Snapdragon 820 Package 34

Package Views & Dimensions

Package Opening

Package Opening Comparison

o PoP Cross-Section 47

Package Details Cross-Section

Package Cross-Section Comparison

o Die & Land-Side Decoupling Capacitor Comparison 66

Die View & Dimensions

LSC Capacitor View & Dimensions

LSC Capacitor Footprint

Embedded LSC Capacitor Cross-Section

Soldered LSC Capacitor Cross-Section

o Summary of the physical Data 72

Manufacturing Process Flow 73

o Global Overview

o Package Fabrication Unit

Cost Analysis 76

o Synthesis of the cost analysis

o Main Steps of Economic Analysis

o Yields Explanation & Hypotheses

o Die cost 81

Front-End Cost

Wafer & Die Cost

o Package Manufacturing Cost 83

A10 Package Cost Breakdown

Kirin 955 Package Cost Breakdown

Exynos 8 Package Cost Breakdown

Snapdragon 820 Package Cost Breakdown

o Component Cost 88

Wafer/Panel & Component Cost

Component Cost Breakdown

Company services 91


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

• Located under the DRAM chip on the main board, the application processors (AP) are packaged using PoPtechnology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in theHuawei P9 and the Samsung Exynos 8 as the Qualcomm Snapdragon 820 can be found in the SamsungGalaxy S7 series depending on the world version (US and Asia for the Snapdragon and International for theExynos).

• In this report, we highlight the differences and the innovations of the packages chosen by the end-userOEMs. Whereas some AP provider like for HiSilicon or Samsung choose to consider conventional PoP withembedded land-side capacitor (LSC), others like Apple or Qualcomm used innovative technologies like Fan-Out PoP and silicon based Deep Trench LSC or embedded die packaging with advanced PCB substrate. Thedetailed comparison between the four players will give the pros and the cons of the packagingtechnologies.

• This report also compares the costs of the different approaches and includes a detailed technicalcomparison between the packaging structure of the Qualcomm Snapdragon 820, the Samsung Exynos 8,the HiSilicon Kirin 955 and the Apple A10.


Overview / Introduction

Company Profile & Supply Chain o InvenSenseo ICG-20660L Characteristics

Physical Analysis


Cost Analysis


About System Plus

Smartphones Teardown

Apple iPhone 7 Plus Main Board (Top view)

Huawei P9 Main Board (Top view)

Samsung Galaxy S7 Edge Main Board (Top view)

USA Version

EU Version




Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die


Cost Analysis


About System Plus

A10 Package View & Dimensions






Cost Analysis


About System Plus

A10 Package Opening






Cost Analysis


About System Plus

A10 Package Opening






Cost Analysis


About System Plus

Package Opening Comparison






Cost Analysis


About System Plus

A10 Package Cross-Section






Cost Analysis


About System Plus







Cost Analysis


About System Plus







Cost Analysis


About System Plus







Cost Analysis


About System Plus

Package Cross-Section Comparison






Cost Analysis


About System Plus

Dies Comparison






Cost Analysis


About System Plus

Packages Land-Side Decoupling Capacitor






Cost Analysis


About System Plus

Land-Side Decoupling Capacitor Footprint






Cost Analysis


About System Plus

Soldered Land-Side Decoupling Capacitor Cross-Section






Cost Analysis


About System Plus

Summary of the physical Data




Physical Analysis

Manufacturing Process Flowo Global Overviewo ASIC Front-End Processo MEMS Front-End Processo Packaging Process

Cost Analysis


About System Plus

Global Overview




Physical Analysis


Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo MEMS Wafer & Die Costo Back-End Costo Component Cost


About System Plus

A10 Wafer & Die Cost




Physical Analysis

Manufacturing Process Flowo Global Overviewo ASIC Front-End Processo MEMS Front-End Processo Packaging Process

Cost Analysis


About System Plus

A10 Package Manufacturing Cost




Physical Analysis




About System Plus

Component Cost




Physical Analysis




About System Plus

Component Cost


COMPANYSERVICES




Physical Analysis


Cost Analysis


About System Pluso Company serviceso Feedbackso Contacto Legal

Business Models a Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings




Physical Analysis


Cost Analysis



Feedbacks

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Physical Analysis


Cost Analysis



Contact

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Physical Analysis


Cost Analysis



Legal

DISCLAIMER

System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic componentsand systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in thereport. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of thisreport. The quoted trademarks are property of their owners.

Reverse Costing® is a deposed brand, by System Plus Consulting.

SERVICES

Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed byindustry experts.

These results are open for discussion. We can reevaluate this circuit with your information.

Documents

Application Processor for Smartphone€¦ · technology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in the Huawei P9 and the Samsung Exynos