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Tomáš Trpišovský, CEO IMA s.r.o., Czech Republic Eniac IDEAS Interactive Power Devices for Efficiency in Automotive with Increased Reliability and SafetyENIAC – 304603 “eMotion in Smart Cities” 25-26 th September 2012, University of Bologna, Italy European Conference on Nanoelectronics and Embedded Systems for Electric Mobility

“eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

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Page 1: “eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

Tomáš Trpišovský, CEO IMA s.r.o., Czech Republic

Eniac IDEAS “Interactive Power Devices for Efficiency in Automotive with

Increased Reliability and Safety” ENIAC – 304603

“eMotion in Smart Cities” 25-26th September 2012, University of Bologna, Italy

European Conference on Nanoelectronics and Embedded Systems for Electric Mobility

Page 2: “eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

IDEAS Concept IDEAS deals with two different HW prerequisites: Efficient and reliable power supply module

New generation of memory systems enabling

high bandwidth secure and reliable data communication buses for enhanced safety

… and profits from their synergy when focusing on the reliability and safety of vehicles.

Page 3: “eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

IDEAS Architecture

Page 4: “eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

From the roots

Page 5: “eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

Towards IDEAS platform for e-driving

seefeelhear

Senses Instrinct/Knowledge

Driver

Deci

sion

Actions

breaksteer

others

Artificial Intelligence

Advanced DriverAssistance System:Fusion & Situation

Interpretation Deci

sion

Arbi

trat

ion

Sensors

RadarLidar

Cameraothers

realised by realised by

Real-Time Multi-Core ECU

Smart Sensors Systems

High-Speed Real-Time Network

realised by realised by

SafeeDriving

Page 6: “eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

IDEAS Objectives Reduction of the system complexity of the power supply

systems in EVs and future ICE vehicles

Energy saving and increased reliability through advanced power packaging systems

Simplified maintenance of complex systems with distributed sensing and actuating features

Increased safety with a particular emphasis on solutions that minimizes the risk of fire

Page 7: “eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

IDEAS Demonstrators 1. New secure Body Board Control Unit based on recent

advanced memory chips as high reliable car safety provision („black box“)

2. Distributed propulsion / low voltage 120 V DC link. The vehicle addresses urban mobility but it is equipped with a variety of sensors (e.g. steering wheel angle sensor, pedal angle sensors, acceleration sensors, rain and light sensors, seat occupation sensors etc).

Page 8: “eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

IDEAS Consortium

1 Tech. steering STMICROELECTRONICS SRL ST-I IT

3 Bitron BIT IT

4 Micron Semiconductors Italia MIY IT

5 Poli Model srl POLIM IT

6 Politecnico di Torino POLITO IT

7 University of Perugia UniPG IT

8 University of Roma UniRM IT

9 Lead Institut mikroelektronických aplikací s.r.o. IMA CZ

10 Institute of information theory and automation UTIA CZ

11 Brno University of Technology BUT CZ

12 Warsaw University of Technology WUT POL

13 AUTOMOTIVE Industry Institute PIMOT POL

14 DEST DEST POL

15 ISD ISD GRE

Page 9: “eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

IDEAS Cross project fertilization and synergy Across bundle of running EU projects dealing with

“Automotive & electrification of Transport”

Via the communication network with the major consortia currently active among the JTI (ENIAC and ARTEMIS) as well as the most relevant projects of Green-Car PPP

ENIAC: E3Car, END, MotorBrain ARTEMIS: Pollux, IoE PPP-EGCI: P-MOB, Castor, Wide-MOB, Hi-Wi,, SmartLIC CATRENE: EM4EM

Page 10: “eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

IDEAS Workplan and Timing

List of Milestones

Milestone no.

Milestone name WPs no's. Lead beneficiar

y

Scheduled Delivery Date

MS01

System specification freeze WP1 BIT M06

MS02 Specification ready for new packaging &interconnect and logic memory interfaces

WP2,WP3 ST-I/MIY M12

MS03

Preliminary delivery and validation of power modules and memory architectures WP2,WP3 ST-I/MIY M24

MS04

Power conversion and BBCU functionalities ready for EV test vehicle integration WP4 BIT M27

MS05

EV demonstration vehicle WP4 BIT M36

MS06

IPCA and PM WP6 IMA M03

Page 11: “eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

IDEAS Workplan and Timing

List of Workpackages

Work packag

e

Work package title Lead Beneficiary Lead Beneficiary Short Name

Start [Mx=Project

MonthX; M1=start

End

WP1 Specification, use cases definition and

integration strategy BITRON BIT M1 M21

WP2 Intelligent packaging and interconnection

technologies STMicroelectronics s.r.l. ST-I M4 M30

WP3

Advanced high bandwidth storage technologies for multi-core architecture and

control systems MICRON MYC M4 M30

WP4 Integration, demonstration and validation BITRON BIT M19 M36

WP5 Dissemination, Exploitation, Standardization WARSAW UNIVERSITY

OF TECHNOLOGY WUT M1 M36

WP6 Project management and IPR Insitut mikroelektronickych

aplikaci s.r.o. IMA M1 M36

Page 12: “eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

IDEAS Work Packages WP1 (BIT)

Specification, use case

definition and integration

strategy

WP2 (ST)

Intelligent packaging and

interconnection technologies

WP 3 (MICRON) Advanced high bandwidth storage

technologies for multicore architecture and control systems

WP 4 (BIT) Integration, demonstration and validation

WP5 (WUT) Dissemination, Exploation, Standardization

WP6 (IMA) Project management and IPR

Page 13: “eMotion in Smart Cities” · “eMotion in Smart Cities” ... currently active among the JTI (ENIAC and ARTEMIS) as ... Specification ready for new packaging &interconnect and

IDEAS Co-ordination

Contact: Tomáš Trpišovský Eniac IDEAS Project Coordinator [email protected] Tel. +420 251081023 Mobile: +420 603207900 IMA s.r.o., Na Valentince 1, 150 00 Praha 5, CZ