ALPHA ® SnBiAg LOW TEMP SOLID SOLDER WIRE ALPHA ® Sn42 Bi57.6 Ag0.4 is a lead-free solid solder wire primarily used for rework operations and touch up soldering of low temperature based electronic assemblies. This low temp solution also delivers the following benefits: • Enables soldering processes with sensitive components or connectors. • Reduces energy consumption in soldering process versus standard lead-free alloys. • Compatible with all commonly used lead-free surface finishes. • Low temperature soldering process may enable the use of less expensive printed circuit board materials, when appropriate. Application • There is no ideal tip temperature, since that will depend on what you are soldering and how thermally demanding the assembly is. In general, tip temperatures between 200°C and 300°C would be appropriate. • For fluxing, ALPHA ® CVP-520 Flux Gel is available in 10g syringes, 30g syringes and 125g jars for use with ALPHA Sn42 Bi57.6 Ag0.4 Solid Solder Wire. • All components used with ALPHA ® Sn42Bi57.6Ag0.4 Solid Solder Wire must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100°C. Key Attributes • Alloy provided in solid wire form for convenient use. • Available in various wire diameters that are suitable for electronics assembly processes (min: 0.6mm). • More versatile than SnBiAg alloy Solid Solder Sticks. • Enables rework of low temperature alloy solder joints while maintaining the original alloy composition. • Avoids the need for additional reliability testing of solder joints reworked with an alternative alloy. REDUCED MATERIAL COST LONG-TERM RELIABILITY REDUCED ENERGY COST SPEED LIMIT

ALPHA SnBiAg LOW TEMP SOLID SOLDER WIRE · 2017. 9. 29. · AiPi F P Y. Cn 5 Hng T R n Tng n Hng ng T: 52000 AA. LOW TEMP ALLOYS ENABLE: Use of Low Tg PCBs Reduced exposure to thermal

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ALPHA® SnBiAg LOW TEMP SOLID SOLDER WIRE

ALPHA® Sn42 Bi57.6 Ag0.4 is a lead-free solid solder wire primarily used for rework operations and touch up soldering of low temperature based electronic assemblies. This low temp solution also delivers the following benefits:• Enables soldering processes with sensitive

components or connectors.• Reduces energy consumption in soldering process

versus standard lead-free alloys.• Compatible with all commonly used lead-free

surface finishes.• Low temperature soldering process may enable

the use of less expensive printed circuit board materials, when appropriate.

Application• There is no ideal tip temperature, since that will

depend on what you are soldering and how thermally demanding the assembly is. In general, tip temperatures between 200°C and 300°C would be appropriate.

• For fluxing, ALPHA® CVP-520 Flux Gel is available in 10g syringes, 30g syringes and 125g jars for use with ALPHA Sn42 Bi57.6 Ag0.4 Solid Solder Wire.

• All components used with ALPHA® Sn42Bi57.6Ag0.4 Solid Solder Wire must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100°C.

Key Attributes• Alloy provided in solid wire form for convenient use.• Available in various wire diameters that are suitable

for electronics assembly processes (min: 0.6mm).• More versatile than SnBiAg alloy Solid Solder Sticks.• Enables rework of low temperature alloy solder

joints while maintaining the original alloy composition.

• Avoids the need for additional reliability testing of solder joints reworked with an alternative alloy.

REDUCEDMATERIAL

COST

LONG-TERM RELIABILITY

REDUCEDENERGY

COST

SPEEDLIMIT