Almit SRC Solder Paste

LFM-48W TM-HP（Y）

For High pre-heat applicationHigh performance Lead Free Solder Paste

２００７．２．１７

LFM-48W TM-HP(Y)

• Almit TM-HP series which already has good market share.Upgrade Ver. As TM-HP(Y) is now released.TM-HP(Y) can be good solution against several problems on SMD process.

Features1.Meets high pre-heat

・Flux can stand even high pre-heat & long profile.・good performance on the board.

2.Good wetting property・Minimize de-wetting BGA and Tombstones.

3. Improve continuance print performance & stencil life・keeps stable print performance for long time with good wetting

Spec design

Alloy

Code No. LFM-48

Composition Sn-3Ag-0.5Cu

Powder Size

X：25-45μm

W：20-38μm

U：10-28μm

Flux

Type Heat resistance Flux

% 12%

Ingredients

Halide % Under 0.10%

Resin capacity 40～45%

Solvent boiling Point Over 250℃

LFM-48 TM-HP(Y) Specification

Flux

Flux heat resistance = Anti oxidation + Reducing Property

Minimize oxidation

Reduce oxidation materials

Antioxidant ・・Minimize oxidation reaction

Reducing agent・・Reacts Oxidation material, reduces Oxygen

Flux Heat resistance is improved

Select materials for Sn-Ag-Cu paste PH temp.(100～200℃）

What is heat resistance ・・・?

LFM-48W TM-HP（Y） Heat resistance

LFM-48W TM-HP(Y) good Heat resistance Minimize・・・

1. Slump paste under High pre-heat profile

・Chip side solder ball

・bridges caused by slumping

2. De-wetting

・De-wetting on Big pad area

・BGA De-wetting

・Chip Tombstone

Keep good quality for Big or Ceramic Board, Board with big components etc. which need High temp. pre-heat

Chip side ball Test

Ref. TM-HP(Y)Ref. TM-HP(Y)Normal PFNormal PF High Temp. PFHigh Temp. PF

1005

(m

m)

1608

2125

1005

1608

2125

Normal PF…160～190℃ 90sec Over 220℃ 36sec Peak：235℃

High Temp …190℃ 120sec Over 220℃ 45sec Peak：237℃

Print solder paste 120% aperture （t:120μm） and reflowed

Chip side balls come up under High Temp. PF.

TM-HP(Y) minimize chip side ball even under the condition.

Board wetting Test

92.7%

57.2%

TM-HP(Y) Ref.

φ0.20mmWetting rate

2×3mmDe-wet Test

Board ： test board（120×120×0.8）

Stencil ：SUS laser cut 120μm

Board & StencilPH：190℃ 120secPeak ：236℃Over 220℃36sec

Reflow PF

Paste powder, materials (Components & Board) is oxidized under high heat.

Also Flux activation property goes down then Non melting & De-wet tend to coming up.

TM-HP(Y) keep good wetting property even under high pre-heat. It minimizes components de-wetting.

BGA/CSP De-wetting

Recently SMD process area has BGA/CSP De-wetting problem

It is still big issue, because difficult to detect by inspection or AOI.

Main reasons are BGA’s bump oxidation, BGA warping, Board bending, and Flux activation goes down under High pre-heat.

TM-HP(Y) keeps good heat resistance & Flux activity, which solve

De-wetting on these packages.

De-wetting example

BGA bump wetting TestTM-HP(Y) Ref.

PH：190℃ 120secPeak ：237℃Over 220℃45sec

Reflow PFBump (Ball) SAC305 φ0.50mm

40℃/90%RH 24hrs Aging

Pattern （φ0.45mm）Print paste 100% φ0.45mm areaRelow

Method

BGA package Test（BGA Warping, Board bending, bump oxidation can be De-wetting reason)

Bump (ball) Test （Wetting test against Oxidized balls）

Wetting situation is up toPaste’s Flux property (Activity)

Board ： test board（120×120×0.8）Cu OSP (water solution) Stencil ：SUS laser cut 120μm

Board & Stencil

Viscosity Chart

Viscosity Ti Index

Printer：SP-60PSolder paste：500gMeasurement Frequency：Each16hrsStencil：SUS laser cut (200μm )

Squeeze blade ：Urethane Hardness :90°Squeeze speed ：25mm/secPressure ：15×10-2N（close stencil apertures)

0ｈｒ 16ｈｒ 32ｈｒ 48ｈｒ

TM-HP(Y) 201 194 210 260

Ref. 232 293 387 585

0ｈｒ 16ｈｒ 32ｈｒ 48ｈｒ

TM-HP(Y) 0.58 0.59 0.61 0.58

Ref. 0.59 0.49 0.42 0.48

Viscosity ・Ti Index changes (Stencil Rolling)

粘度

0

100

200

300

400

500

600

700

0 16 32 48

（hr）

（Pa･

s）

TM-HP(Y)

他社品

TI

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0 16 32 48

（hr）

TI

TM-HP(Y)

他社品

Viscosity Chart

Viscosity (Malcom viscometer)0hr 16hr 32hr 48hr

Stencil Rolling

201 194 210 260

Malcom 201 134 142 150

Machine：PCU-2Solder paste：500gMeasurement Frequency：1回/60secTest condition：25℃60~70%RH

Viscosity value is depends how paste is rolled. (Stencil rolling & Malcom

ﾛｰﾘﾝｸﾞvsmalcom

0

50

100

150

200

250

300

0 16 32 48

（hr）

（Pa･

s）

ﾛｰﾘﾝｸﾞ

malcom

Printing property （Dots Φ）

3rd print

φ0.22mm φ0.24mm φ0.22mm φ0.24mm

11th print

21st print

TM-HP(Y) Ref.

Machine：SP10PBoard： Test board 100×100×1.6mm）Stencil：SUS laser cut 120μm

Squeeze speed：30mm/secPrint pressure ：1.0kgf/cm2Snap off speed ：5.0mm/sec Uniform

Printer setting

Printing property （Slit ）

3rd print

0.15mm 0.20mm

11th print

21st print

TM-HP(Y) Ref.

0.15mm 0.20mm

Machine：SP10PBoard： Test board 100×100×1.6mm）Stencil：SUS laser cut 120μm

Squeeze speed：30mm/secPrint pressure ：1.0kgf/cm2Snap off speed ：5.0mm/sec Uniform

Printer setting

Tackiness Test

Test method： JIS Z 3284

ﾀｯｷﾝｸﾞ力

0

20

40

60

80

100

120

140

160

180

200

0 8 16 24 32 40 48

放置時間

ﾀｯｷ

ﾝｸﾞ力

(gf)

TM-HP（Y)

他社品

Recommended Heat Profile

230～245℃230～245℃

Rump up speedRump up speed Pre-heat temp.Pre-heat temp. Peak Peak

170～200℃/sec90±30sec170～200℃/sec90±30sec1.0～2.5℃/sec1.0～2.5℃/sec

★TM-HP(Y) Recommended process window （Between Blue line ⇔ Black line ）

50 100 150 200 250

50

100

150

200

250

220

170

130

温度（℃）

時間（sec）

プリヒート時間90±30sec

溶融域220℃以上25～50sec

ピーク230～245℃

昇温速度ＴＭ－ＨＰ：青⇔黒　1.0～2.5℃ＴＭ－ＴＳ：緑⇔黒　1.0～2.0℃

50 100 150 200 250

50

100

150

200

250

220

170

130

温度（℃）

時間（sec）

プリヒート時間90±30sec

溶融域220℃以上25～50sec

ピーク230～245℃

50 100 150 200 250

50

100

150

200

250

220

170

130

温度（℃）

時間（sec）

プリヒート時間90±30sec

溶融域220℃以上25～50sec

ピーク230～245℃

昇温速度ＴＭ－ＨＰ：青⇔黒　1.0～2.5℃ＴＭ－ＴＳ：緑⇔黒　1.0～2.0℃

昇温速度1.0～2.5℃/sec