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AES67 FOR AUDIO PRODUCTION: BACKGROUND, APPLICATIONS AND CHALLENGES SMPTE Evening, Montreal, March 2016 Nestor Amaya

AES67 for Audio Production-Background Applications and Challenges

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Page 1: AES67 for Audio Production-Background Applications and Challenges

AES67 FOR AUDIO PRODUCTION:BACKGROUND, APPLICATIONS AND CHALLENGESSMPTE Evening, Montreal, March 2016

Nestor Amaya

Page 2: AES67 for Audio Production-Background Applications and Challenges

AGENDA

• Background

• Aspects of network and connection control

• COVELOZ’ Media Networking Solutions

• 15 minutes Q&A

Page 3: AES67 for Audio Production-Background Applications and Challenges

AES67 – BACKGROUND

The following 5 slides were borrowed from a presentation by the Media Networking Allianceto the 139th AES 215 Convention in New York

Page 4: AES67 for Audio Production-Background Applications and Challenges

Technology PurveyorDate

introduced Synchronization Transport

Livewire Telos/Axia 2003 Proprietary RTP

Wheatnet-IP Wheatstone 2005 Proprietary RTP

Dante Audinate 2006 IEEE1588-2002 UDP

N/ACIP EBU 2007 Adaptive(perstream) RTP

Q-LAN QSCAudioProducts 2009 IEEE1588-2002 UDP

RAVENNA ALCNetworX 2010 IEEE1588-2008 RTP

AVB IEEE,AVnu 2011 IEEE802.1AS Ethernet,RTP

Recent Networked-Audio Initiatives

Page 5: AES67 for Audio Production-Background Applications and Challenges

AES67 – KEY BENEFITS

• Interoperability• Based on proven IETF and IEEE standards• Operates using standard IT equipment

• Network time distribution & media synchronization

• Low latency

• Uncompressed, professional audio

Page 6: AES67 for Audio Production-Background Applications and Challenges

IP

RAVEN

NA

Livewire

Q-LA

N

WheatN

et

Dante

AES67

AES67 – THE COMMON DENOMINATOR

Page 7: AES67 for Audio Production-Background Applications and Challenges

AES67 – APPLICATIONS• Commercial audio applications:

- Installed sound: theaters, stadiums, theme parks, cruise ships

- Live sound (fixed and touring)

• Professional broadcast- In-house distribution- Inter-facility links on corporate networks

- OB vans

• Music production

• Post-production

Page 8: AES67 for Audio Production-Background Applications and Challenges

AES67 – COMPONENTS• Synchronization: IEEE 1588-2008 default profile

• Media clock is synchronous to PTP clock

• Transport: RTP / UDP / IPv4• Unicast• Multicast & IGMPv2

• Encoding• 16 / 24 bit linear• 48 (44.1 / 96) kHz• channel count: 1..8 required, more possible as a function of Packet Time &

Encoding

• Packet Time: 48 samples (6 / 12 / 16 / 192)• max. payload size: 1440 bytes

Page 9: AES67 for Audio Production-Background Applications and Challenges

AES67 – KEY OBSERVATIONS

AES67 provides interoperability at the transport layer, but the following are out-of-scope:

1. Discovery and connection management

2. Network management & QoS• Bandwidth reservation• Time-aware switches are not strictly required (but without

them, performance cannot be guaranteed)

Page 10: AES67 for Audio Production-Background Applications and Challenges

AES67 – DISCO & CONNECTION MGMT

• Connection management• SDP (Session Description Protocol)• SIP (Session Initiation Protocol, for unicast)

• Discovery: excluded, but several recommendations given • ZeroConf• SAP

• How to signal SDP?• RAVENNA uses ZeroConf and RTSP/http• DANTE uses SAP

• Controller API?• Ember+ is a possible candidate, as well as AMWA NMOS

Page 11: AES67 for Audio Production-Background Applications and Challenges

AES67 – NETWORK MANAGEMENT• Quality of service

• DiffServ w/ 3 suggested traffic classes (DSCP)• Problem: Diffserv is not automatically

configured, nor universally or consistently implemented by switches

• Network & Media Synchronization• Problem: Time-aware switches are not required,

but if not used, then performance cannot be guaranteed

Page 12: AES67 for Audio Production-Background Applications and Challenges

How to get the networkout of the way!

to act like a simple wire

Page 13: AES67 for Audio Production-Background Applications and Challenges

AES67 over an AVB/TSN FOUNDATION

Ethernet AVB/TSN offers effective network management• Keep AES67/RTP transport• As defined in AES67-2015 standard

Network management is about synchronization and punctual forwarding

• Stream Reservation Protocol & FQTSS –IEEE 802.1Q

• Timing and Synchronization for LAN and Metro –IEEE 802.1AS

Page 14: AES67 for Audio Production-Background Applications and Challenges

AES67-2015

- 2 -

2015-09-21 printing

Contents

0 Introduction ....................................................................................................................................... 5!0.1 General ........................................................................................................................................ 5!0.2 Patents ......................................................................................................................................... 5!

1 Scope ................................................................................................................................................. 6!2 Normative references ...................................................................................................................... 6!3 Definitions and abbreviations ......................................................................................................... 7!4 Synchronization .............................................................................................................................. 12!

4.0 General ...................................................................................................................................... 12!4.1 IP network synchronization ........................................................................................................ 12!4.2 IEEE 1588 network synchronization .......................................................................................... 13!4.3 AVB network synchronization .................................................................................................... 13!

5 Media clocks ................................................................................................................................... 13!6 Transport ......................................................................................................................................... 13!

6.0 General ...................................................................................................................................... 13!6.1 Network layer ............................................................................................................................. 14!6.2 Quality of service ....................................................................................................................... 15!6.3 Transport layer ........................................................................................................................... 16!

7 Encoding and streaming ............................................................................................................... 16!7.0 Introduction ................................................................................................................................ 16!7.1 Payload format and sampling rate ............................................................................................. 16!7.2 Packet time ................................................................................................................................ 17!

7.2.0 General ................................................................................................................................ 17!7.2.1 Required packet time .......................................................................................................... 17!7.2.2 Recommended packet times ............................................................................................... 18!

7.3 Stream channel count ................................................................................................................ 18!7.4 Link offset ................................................................................................................................... 19!7.5 Sender timing and receiver buffering ......................................................................................... 20!7.6 Multicasting ................................................................................................................................ 20!

8 Session description ....................................................................................................................... 21!8.0 General ...................................................................................................................................... 21!8.1 Packet time ................................................................................................................................ 21!8.2 Clock source .............................................................................................................................. 22!8.3 RTP and media clock ................................................................................................................. 22!8.4 Payload types ............................................................................................................................ 23!8.5 Example descriptions ................................................................................................................. 23!

8.5.1 Multicast session description example ................................................................................ 23!8.5.2 Unicast session description example .................................................................................. 23!

9 Discovery ........................................................................................................................................ 24!10 Connection management ............................................................................................................ 24!

10.0 General .................................................................................................................................... 24!10.1 Unicast connections ................................................................................................................. 24!

10.1.1 SIP URI ............................................................................................................................. 24!10.1.2 Server and serverless modes ............................................................................................ 24!10.1.3 User-Agent ........................................................................................................................ 25!

AVB is referenced in AES67-2015

Page 15: AES67 for Audio Production-Background Applications and Challenges

I’m not making this up! AES67-2015

- 33 -

2015-09-21 printing

Annex C (Informative) – AVB network transport

C.0 General This standard defines how to use an IP transport to carry media data. Ethernet is a common network used to support IP transport. AVB can be viewed as an improved Ethernet. The AVB network is described in a suite of IEEE standards. The standards relevant to network transport are:

• IEEE 802.1AB - Audio Video Bridging (AVB) Systems • IEEE 802.1Q Clause 34 - Forwarding and queuing for time-sensitive streams • IEEE 802.1Q Clause 35 - Stream Registration Protocol (SRP)

The AVB improvements can be used to improve performance of media transport. AVB improvements can also be used to improve clock distribution, a topic which is discussed separately in annex D.

C.1 AVB network transport Two basic methods for transmission of interoperable media streams across an AVB network are available. Transporting interoperable media as an AVB time-sensitive stream makes use of AVB improvements with the restriction that this method of transport must be confined to an AVB network domain and cannot exit to legacy portions of a network that do not support the AVB improvements and thus cannot connect to non-AVB devices. Transporting interoperable media as “other traffic” allows the flexibility to connect to and through AVB and non-AVB portions of the network and to non-AVB devices. This mode of transport does not make use of AVB’s QoS and registration services and is confined to the proportion of network bandwidth not allocated to time-sensitive streams, typically 25%.

C.1.1 Interoperable media as AVB time-sensitive streams Devices in compliance with this standard that also have AVB capabilities may choose to use AVB bandwidth reservation and QoS provisions for transport of media streams. The advantages of this approach include:

• Reserved bandwidth assures successful media transmission across the network • Potential compatibility with other AVB devices using IP transport • Premium bandwidth and latency performance

Devices using this method must be directly connected to an Ethernet switch supporting the AVB standards and protocols. Under AVB, there are two classes of media streams. Class A streams are highest priority and achieve a 2-ms latency guarantee on IEEE 802.1BA compliant networks. Class B streams are lower priority but still higher priority than any other non-stream data on the network. Class B streams achieve a 50-ms latency guarantee on IEEE 802.1BA compliant networks. Either class may be used for interoperable media transport. Before a device can transmit interoperable media as AVB media traffic, bandwidth must be reserved for the traffic. This is accomplished using the Stream Reservation Protocol described in clause 35 of IEEE 802.1Q. In the reservation, the sender specifies the class of traffic (A or B) and the maximum amount of traffic generated in the measurement interval for that class. The measurement interval is 125 microseconds for class A and 250 microseconds for class B. Because the AVB network identifies streams by their Ethernet destination addresses, multicast destination addressing is generally used for AVB streams. Interoperable media transmitted should use multicast IP addressing as described in 7.6. Furthermore since, as per RFC 1112, multiple IP multicast addresses are mapped

Page 16: AES67 for Audio Production-Background Applications and Challenges

Protocols and Layers of proposed solution• RTP-based Transport

• Common discovery & connection management protocols

• Connections are steered via IGMP

• Bandwidth is managed using SRP

• Network synchronization distributed via generalized PTP (IEEE 802.1AS), and use PTP for bridging domains

16

gPTP802.1AS 2011

FQTSS802.1Q 2011

clause 34

SRP802.1Q 2011

clause 35

MSRPclause 35.1

MMRPclause 10.9

MVRPclause 11.2

AES67

MRPclause 10

RFC 4175 SMPTEST 2022-6

ZeroconfmDNS/SD

SDPRTSP/SIP

Ember+

JSON

TRANSPORT

NETWORKSYNCHRONIZATION

DISCOVERY &SESSION CTRL

IGMPRFC 2236

NETWORKFlow Control &Steering

PTP1588 2008

Page 17: AES67 for Audio Production-Background Applications and Challenges

SRP/802.1AS Capable Switches

Extreme NetworksSummitSeries

DellNetworkingN4000 Series

CiscoNexus7000Series

Page 18: AES67 for Audio Production-Background Applications and Challenges

IEEE 802.1AS/gPTP – Precise SynchronizationConstrained subset of IEEE 1588

Extensions to support WiFi - IEEE 802.11

Benefits: • Resilience: Weather traffic storms & maintain

synchronization confidence• Economies of scale: high-precision and low-cost

switches• Certification program: UNH-IOL & AVnu Alliance

Page 19: AES67 for Audio Production-Background Applications and Challenges

PTP versus gPTPPerformance• +/- 500ns end-to-end

independent of traffic

Resilience & Fast Settling• gPTP is immune to flooding,

since event messages are not queued & forwarded

• Fast recovery & switch-over time because switches do not use PLLs

Cost

Hirschmann MACH1000 • 24-port GE with PTP• + $4,000 USD

Netgear ProSAFE Smart• 24-port GE with SRP/gPTP• $240 USD

Multiple vendors• Arista, Cisco, Dell, Extreme, …

Page 20: AES67 for Audio Production-Background Applications and Challenges

Stream Reservation Protocol• Stream Reservation Protocol (SRP) is an enhancement to Ethernet that

implements admission control.

• Standardized as IEEE 802.1Qat in September 2010• Mature standard!• Incorporated into IEEE 802.1Q-2011

• SRP defines the concept of streams at layer 2 of the OSI model• SRP Class A, SRP Class B and Best-Effort• This is just Ethernet: RTP Streams running over UDP/IP/Ethernet can be SRP

streams

• Provides an established mechanism for end-to-end management of the streams' resources, to guarantee Quality of Service (QoS)

• SRP implements a peer-to-peer (distributed) flow control model

Page 21: AES67 for Audio Production-Background Applications and Challenges

Summary of Stream Reservation ProtocolMSRP packets signal registrations

1. Talker advertises stream

2. Listener subscribessend “Listener Ready”

3. Switches are configured in the interim

bandwidth reservation as necessary

4. System handles exceptions…e.g. bandwidth exceeds capacity

Sender1

802.1Q/AS Switch

802.1Q/AS Switch

802.1Q/AS Switch

Receiver2

Receiver1

802.1Q/AS Switch

1. Talker Advertise

Talker Fail?

2. Listener Ready

4. Listener Fail?

3. Bandwidth Reservation

Domain Registration

Page 22: AES67 for Audio Production-Background Applications and Challenges

MSRP – Key Parameters and Examples

22

Bandwidth is reserved using

• StreamID: unique ID• U/C SMAC + a number

• VLAN

• TSPEC• Priority/Rank• MaxFrameSize• MaxIntervalFrames

• Accumulated latency

IEEE StdMAC BRIDGES AND VIRTUAL BRIDGED LOCAL AREA NETWORKS 8021Q-2011

Copyright © 2011 IEEE. All rights reserved. 1121

35.2.2.8.5 PriorityAndRank

a) Data Frame Priority: The 3-bit Data Frame Priority component specifies the priority value used togenerate the Priority Code Point (PCP) the referenced data streams will be tagged with. It indicatesthe priority EISS or ISS parameter that will be used in all frames belonging to the data stream forwhich this MAD is reserving resources. This parameter determines which queue the frame is placedinto on an output Bridge Port. In accordance with 10.8.1.1 these three bits are in the most significantpositions (8, 7 and 6). The priority specified here is associated with the SR Classes as described in34.5.

b) Rank: The single-bit Rank component is used by systems to decide which streams can and cannotbe served, when the MSRP registrations exceed the capacity of a Port to carry the correspondingdata streams. If a Bridge becomes oversubscribed (e.g., network reconfiguration, IEEE 802.11bandwidth reduction) the Rank will also be used to help determine which Stream or Streams can bedropped. A lower numeric value is more important than a higher numeric value. In accordance with10.8.1.1 this bit is in position 5.

For streams that carry emergency data such as North America 911 emergency services telephonecalls, or fire safety announcements, the Rank shall be 0. Nonemergency traffic shall set this bit to a1.

Table 35-5—TSpec Components Examples

Source Raw Bit RateMedia Specific

FramingOverhead

TSpecMaxFrameSize

TSpecMaxIntervalFrames

48kHz stereoaudio stream

(32-bit samples)Class A [B11]

~3 Mbit/sec ~4.7 Mbit/sec 80 1(8,000 frames/sec)

96kHz stereoaudio stream

(32-bit samples)Class A [B11]

~6 Mbit/sec ~4.7 Mbit/sec 128 1(8,000 frames/sec)

MPEG2-TS video

Class B [B11]~24 MBit/sec ~2.5 Mbit/sec 786 1

(4,000 frames/sec)1

SD SDI(Level C)

uncompressed Class A [B46]

270 Mbit/sec ~15 Mbit/sec 1442 3(24,000 frames/sec)

SD SDI(Level D)

uncompressedClass A [B46]

360 Mbit/sec ~20 Mbit/sec 1442 4(32,000 frames/sec)

HD SDI 1080iuncompressedClass A [B47]

1.485 Gbit/sec ~80 Mbit/sec 1486 16

(128,000 frames/sec)

HD SDI 1080p uncompressedClass A [B48]

2.97 Gbit/sec ~160 Mbit/sec 1486 32(256,000 frames/sec)

1The MPEG-2 TS entry in this table (third row) is shown as Class B traffic which runs at a defaultframe rate of 250 µs/frame, or 4000 frames/sec. Class A traffic runs at a default rate of8000 frames/sec.

Page 23: AES67 for Audio Production-Background Applications and Challenges

FQTSS - Forwarding and Queueing of TSS• Per port & SR Class

• Credit-based shapers

• Maximum (reserved) bandwidth vs. actual bandwidth used within SR class interval

• Work-conserving for best-effort class

Page 24: AES67 for Audio Production-Background Applications and Challenges

AVnu Alliance Certification What is AVnu?• AVnu is to 802.1Q/802.1AS what WiFi is to 802.11

Certification testing run by UNH-IOL• Thorough and reputable test facility

Test suites targets specific areas of functionality• IEEE 802.1AS (gPTP)• FQTSS• SRP (MRP/MVRP/MSRP)

Certification is based on profile, such as Wireless, Industrial and Automotive. • Broadcast could also define its own profile

Page 25: AES67 for Audio Production-Background Applications and Challenges

PRODUCTION MEDIA NETWORKING AND PROCESSING SOLUTIONS

Page 26: AES67 for Audio Production-Background Applications and Challenges

COVELOZ Mission

26

Bring to market technology solutions to address the needs

of

Pro A/V and Broadcast OEMs

To unwind the Internet of Things to the simplicity of a wire

To clear-cut a differentiated product path for our customers by offering

a virtual system-on-chip

Page 27: AES67 for Audio Production-Background Applications and Challenges

COVELOZ = Co-Creation + Velocity

27

Sales,Marketing&CustomerSupport

OperationsandManufacturing

+

=fasterTTMandlowercostofentry=winningproduct

Standards-basedtechnologyshouldnotbeakeyproductdifferentiator

R&DCoreCompetency

ProductionMediaNetworkingTechnology

Page 28: AES67 for Audio Production-Background Applications and Challenges

BACH™ Product Family – Ethernet AVB & AES67

28

1. BACH module, offered in two configurationsa. BACH-canon – full-featured with audio DSPb. BACH-allegro– cost-optimized

2. BACH-minuet• lowest-cost, 64-channel ASSP endpoint

3. BACH development kit• Custom application development• Example reference design

4. BACH platform reference design• Application license• “build-your-own” hardware IP

Page 29: AES67 for Audio Production-Background Applications and Challenges

SWIFT™ Production Media Networking Platform

29

1. SWIFT™ SDI to IP Gateway• QSFP (40GE) network interface• 8+8 SDI HD-BNC

2. SWIFT™ development kit• Custom application development• Example reference design on A10 SoC

3. SWIFT™ platform reference design• Intellectual property license• “build-your-own” hardware• RFC 4175, AES67, SMPTE ST 2022

IP

DESIGNED & DIMENSIONEDIN MILLIMETERS[INCHES]

DO NOTSCALE FROM

THIS PRINT

HDBNC-J-P-XX-RA-BHXGENDER

TYPE ORIENTATION

TERMINATION

PLATING SPECIFICATION-RA: RIGHT ANGLE

-HF: 30µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-HN: 30µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY-GF: 10µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-GN: 10µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY(SEE TABLE 1)

-BH1: BULKHEAD THROUGH HOLE .062 BOARD-BH2: BULKHEAD THROUGH HOLE .093 BOARD-BH3: BULKHEAD THROUGH HOLE, ROUND LEGS .062 BOARD

-P: PCB

-J: JACK

"B"REF

0.50 .020REF

7.50 .295REF

"A"REF

7.52 .296REF

4.25 .167REF

5.08 .200(4 PLCS)

REF

7.50 .295(4 PLCS)

REF

1.67 REF (8 PLCS).066

20.30 REF.799

0.92 .036(4 PLCS)

REF

7.00 REF.276

12.00 REF.472

16.55 .652 REF

1/4-36 UNS-2AREF

C

6.50 .256

5.90 .232

RECOMMENDED MOUNTING HOLE2.95 [.116] MAX PANEL THICKNESS

5.08 (4 PLCS).200

0.76 .030PTH

1.70 PTH.067(4 PLCS)

2.54 .100(4 PLCS)

RECOMMENDED PCB LAYOUT

2.55 .100REF

0.50 .020REF

1(SEE NOTE 4)2

FIG 1-BH1 AND BH2

HDBNC-J-P-XX-RA-BH1 SHOWN

C

SHEET OF

UNLESS OTHERWISE SPECIFIED,DIMENSIONS ARE IN MILLIMETERS.TOLERANCES ARE:DECIMALS ANGLESX.X: 0.3 [.01] 5X.XX: 0.13 [.005]X.XXX: 0.051 [.0020]MATERIAL:

HD BNC 75 OHM, RA JACK BULKHEAD

BY:HDBNC-J-P-XX-RA-BHX

DWG. NO.

DESCRIPTION:

PROPRIETARY NOTETHIS DOCUMENT CONTAINS INFORMATIONCONFIDENTIAL AND PROPRIETARY TOSAMTEC, INC. AND SHALL NOT BE REPRODUCEDOR TRANSFERRED TO OTHER DOCUMENTS ORDISCLOSED TO OTHERS OR USED FOR ANYPURPOSE OTHER THAN THAT WHICH IT WASOBTAINED WITHOUT THE EXPRESSED WRITTENCONSENT OF SAMTEC, INC.

DO NOT SCALE DRAWING

ALVIN W 02/17/2011 21

SHEET SCALE: 3:1

F:\DWG\MISC\MKTG\HDBNC-J-P-XX-RA-BHX-MKT.SLDDRW

NOTES:

1. C REPRESENTS A CRITICAL DIMENSION.2. NOTE DELETED.3. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M. TRAY: TY-SMA-001-1 COVER: TY-SMA-001-24. NUT TO BE PACKAGED SEPARATELY.

520 PARK EAST BLVD, NEW ALBANY, IN 47150PHONE: 812-944-6733 FAX: 812-948-5047e-Mail [email protected] code 55322

SOCKET: BeCuSHELL, BODY, NUT: BRASSINSULATOR: PTFE

REVISION C

DESIGNED & DIMENSIONEDIN MILLIMETERS[INCHES]

DO NOTSCALE FROM

THIS PRINT

HDBNC-J-P-XX-RA-BHXGENDER

TYPE ORIENTATION

TERMINATION

PLATING SPECIFICATION-RA: RIGHT ANGLE

-HF: 30µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-HN: 30µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY-GF: 10µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-GN: 10µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY(SEE TABLE 1)

-BH1: BULKHEAD THROUGH HOLE .062 BOARD-BH2: BULKHEAD THROUGH HOLE .093 BOARD-BH3: BULKHEAD THROUGH HOLE, ROUND LEGS .062 BOARD

-P: PCB

-J: JACK

"B"REF

0.50 .020REF

7.50 .295REF

"A"REF

7.52 .296REF

4.25 .167REF

5.08 .200(4 PLCS)

REF

7.50 .295(4 PLCS)

REF

1.67 REF (8 PLCS).066

20.30 REF.799

0.92 .036(4 PLCS)

REF

7.00 REF.276

12.00 REF.472

16.55 .652 REF

1/4-36 UNS-2AREF

C

6.50 .256

5.90 .232

RECOMMENDED MOUNTING HOLE2.95 [.116] MAX PANEL THICKNESS

5.08 (4 PLCS).200

0.76 .030PTH

1.70 PTH.067(4 PLCS)

2.54 .100(4 PLCS)

RECOMMENDED PCB LAYOUT

2.55 .100REF

0.50 .020REF

1(SEE NOTE 4)2

FIG 1-BH1 AND BH2

HDBNC-J-P-XX-RA-BH1 SHOWN

C

SHEET OF

UNLESS OTHERWISE SPECIFIED,DIMENSIONS ARE IN MILLIMETERS.TOLERANCES ARE:DECIMALS ANGLESX.X: 0.3 [.01] 5X.XX: 0.13 [.005]X.XXX: 0.051 [.0020]MATERIAL:

HD BNC 75 OHM, RA JACK BULKHEAD

BY:HDBNC-J-P-XX-RA-BHX

DWG. NO.

DESCRIPTION:

PROPRIETARY NOTETHIS DOCUMENT CONTAINS INFORMATIONCONFIDENTIAL AND PROPRIETARY TOSAMTEC, INC. AND SHALL NOT BE REPRODUCEDOR TRANSFERRED TO OTHER DOCUMENTS ORDISCLOSED TO OTHERS OR USED FOR ANYPURPOSE OTHER THAN THAT WHICH IT WASOBTAINED WITHOUT THE EXPRESSED WRITTENCONSENT OF SAMTEC, INC.

DO NOT SCALE DRAWING

ALVIN W 02/17/2011 21

SHEET SCALE: 3:1

F:\DWG\MISC\MKTG\HDBNC-J-P-XX-RA-BHX-MKT.SLDDRW

NOTES:

1. C REPRESENTS A CRITICAL DIMENSION.2. NOTE DELETED.3. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M. TRAY: TY-SMA-001-1 COVER: TY-SMA-001-24. NUT TO BE PACKAGED SEPARATELY.

520 PARK EAST BLVD, NEW ALBANY, IN 47150PHONE: 812-944-6733 FAX: 812-948-5047e-Mail [email protected] code 55322

SOCKET: BeCuSHELL, BODY, NUT: BRASSINSULATOR: PTFE

REVISION C

DESIGNED & DIMENSIONEDIN MILLIMETERS[INCHES]

DO NOTSCALE FROM

THIS PRINT

HDBNC-J-P-XX-RA-BHXGENDER

TYPE ORIENTATION

TERMINATION

PLATING SPECIFICATION-RA: RIGHT ANGLE

-HF: 30µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-HN: 30µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY-GF: 10µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-GN: 10µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY(SEE TABLE 1)

-BH1: BULKHEAD THROUGH HOLE .062 BOARD-BH2: BULKHEAD THROUGH HOLE .093 BOARD-BH3: BULKHEAD THROUGH HOLE, ROUND LEGS .062 BOARD

-P: PCB

-J: JACK

"B"REF

0.50 .020REF

7.50 .295REF

"A"REF

7.52 .296REF

4.25 .167REF

5.08 .200(4 PLCS)

REF

7.50 .295(4 PLCS)

REF

1.67 REF (8 PLCS).066

20.30 REF.799

0.92 .036(4 PLCS)

REF

7.00 REF.276

12.00 REF.472

16.55 .652 REF

1/4-36 UNS-2AREF

C

6.50 .256

5.90 .232

RECOMMENDED MOUNTING HOLE2.95 [.116] MAX PANEL THICKNESS

5.08 (4 PLCS).200

0.76 .030PTH

1.70 PTH.067(4 PLCS)

2.54 .100(4 PLCS)

RECOMMENDED PCB LAYOUT

2.55 .100REF

0.50 .020REF

1(SEE NOTE 4)2

FIG 1-BH1 AND BH2

HDBNC-J-P-XX-RA-BH1 SHOWN

C

SHEET OF

UNLESS OTHERWISE SPECIFIED,DIMENSIONS ARE IN MILLIMETERS.TOLERANCES ARE:DECIMALS ANGLESX.X: 0.3 [.01] 5X.XX: 0.13 [.005]X.XXX: 0.051 [.0020]MATERIAL:

HD BNC 75 OHM, RA JACK BULKHEAD

BY:HDBNC-J-P-XX-RA-BHX

DWG. NO.

DESCRIPTION:

PROPRIETARY NOTETHIS DOCUMENT CONTAINS INFORMATIONCONFIDENTIAL AND PROPRIETARY TOSAMTEC, INC. AND SHALL NOT BE REPRODUCEDOR TRANSFERRED TO OTHER DOCUMENTS ORDISCLOSED TO OTHERS OR USED FOR ANYPURPOSE OTHER THAN THAT WHICH IT WASOBTAINED WITHOUT THE EXPRESSED WRITTENCONSENT OF SAMTEC, INC.

DO NOT SCALE DRAWING

ALVIN W 02/17/2011 21

SHEET SCALE: 3:1

F:\DWG\MISC\MKTG\HDBNC-J-P-XX-RA-BHX-MKT.SLDDRW

NOTES:

1. C REPRESENTS A CRITICAL DIMENSION.2. NOTE DELETED.3. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M. TRAY: TY-SMA-001-1 COVER: TY-SMA-001-24. NUT TO BE PACKAGED SEPARATELY.

520 PARK EAST BLVD, NEW ALBANY, IN 47150PHONE: 812-944-6733 FAX: 812-948-5047e-Mail [email protected] code 55322

SOCKET: BeCuSHELL, BODY, NUT: BRASSINSULATOR: PTFE

REVISION C

DESIGNED & DIMENSIONEDIN MILLIMETERS[INCHES]

DO NOTSCALE FROM

THIS PRINT

HDBNC-J-P-XX-RA-BHXGENDER

TYPE ORIENTATION

TERMINATION

PLATING SPECIFICATION-RA: RIGHT ANGLE

-HF: 30µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-HN: 30µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY-GF: 10µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-GN: 10µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY(SEE TABLE 1)

-BH1: BULKHEAD THROUGH HOLE .062 BOARD-BH2: BULKHEAD THROUGH HOLE .093 BOARD-BH3: BULKHEAD THROUGH HOLE, ROUND LEGS .062 BOARD

-P: PCB

-J: JACK

"B"REF

0.50 .020REF

7.50 .295REF

"A"REF

7.52 .296REF

4.25 .167REF

5.08 .200(4 PLCS)

REF

7.50 .295(4 PLCS)

REF

1.67 REF (8 PLCS).066

20.30 REF.799

0.92 .036(4 PLCS)

REF

7.00 REF.276

12.00 REF.472

16.55 .652 REF

1/4-36 UNS-2AREF

C

6.50 .256

5.90 .232

RECOMMENDED MOUNTING HOLE2.95 [.116] MAX PANEL THICKNESS

5.08 (4 PLCS).200

0.76 .030PTH

1.70 PTH.067(4 PLCS)

2.54 .100(4 PLCS)

RECOMMENDED PCB LAYOUT

2.55 .100REF

0.50 .020REF

1(SEE NOTE 4)2

FIG 1-BH1 AND BH2

HDBNC-J-P-XX-RA-BH1 SHOWN

C

SHEET OF

UNLESS OTHERWISE SPECIFIED,DIMENSIONS ARE IN MILLIMETERS.TOLERANCES ARE:DECIMALS ANGLESX.X: 0.3 [.01] 5X.XX: 0.13 [.005]X.XXX: 0.051 [.0020]MATERIAL:

HD BNC 75 OHM, RA JACK BULKHEAD

BY:HDBNC-J-P-XX-RA-BHX

DWG. NO.

DESCRIPTION:

PROPRIETARY NOTETHIS DOCUMENT CONTAINS INFORMATIONCONFIDENTIAL AND PROPRIETARY TOSAMTEC, INC. AND SHALL NOT BE REPRODUCEDOR TRANSFERRED TO OTHER DOCUMENTS ORDISCLOSED TO OTHERS OR USED FOR ANYPURPOSE OTHER THAN THAT WHICH IT WASOBTAINED WITHOUT THE EXPRESSED WRITTENCONSENT OF SAMTEC, INC.

DO NOT SCALE DRAWING

ALVIN W 02/17/2011 21

SHEET SCALE: 3:1

F:\DWG\MISC\MKTG\HDBNC-J-P-XX-RA-BHX-MKT.SLDDRW

NOTES:

1. C REPRESENTS A CRITICAL DIMENSION.2. NOTE DELETED.3. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M. TRAY: TY-SMA-001-1 COVER: TY-SMA-001-24. NUT TO BE PACKAGED SEPARATELY.

520 PARK EAST BLVD, NEW ALBANY, IN 47150PHONE: 812-944-6733 FAX: 812-948-5047e-Mail [email protected] code 55322

SOCKET: BeCuSHELL, BODY, NUT: BRASSINSULATOR: PTFE

REVISION C

DETAIL A NOTE #7

DETAIL A

1

1

2

2

3

3

4

4

5

5

6

6

7

7

8

8

A A

B B

C C

D D

E E

F F

THIS DOCUMENT AND THE INFORMATION CONTAINED IN IT ARE PROPRIETARY AND CONFIDENTIAL TO MELLANOX TECHNOLOGIES LTD.LIMITED. NO PERSON IS ALLOWED TO COPY, REPRINT, REPRODUCE OR PUBLISH ANY PART OF THIS DOCUMENT, NOR DISCLOSE ITS CONTENTSTO OTHERS, NOR MAKE ANY USE OF IT, NOR ALLOW OR ASSIST OTHERS TO MAKE ANY USE OF IT - UNLESS BY THE PRIOR WRITTEN EXPRESSAUTORIZATION OF MELLANOX TECHNOLOGIES LTD. AND THEN ONLY TO THE EXTENT AUTHORIZED. (C) COPYRIGHT - MELLANOX TECHNOLOGIES LTD. .

DRAWING / P.N. :SIZE

QSFP

NIMER K.

RAFI L.

NIMER KH.USE DIMENSIONS ONLY DO NOT SCALE

CHKD

APPVD NATAN K.

PROJECT:

1/8/2014

DSGN

DWG

1/8/2014

A2

1/8/2014

1/8/2014

Mellanox Technologies Ltd.P.O.B. 586 Yokneam Zip : 20692 - IsraelTel : 972-4-9097200

1 5

QSFP port cage, 1x1, Press fit PCI type heat-sink

MTMQ11PPN A1

TITLE

SHEET OF

REV

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN MM

1st ANGEL PROJ SCALE

2:1

GENERAL TOLERANCE:

LINEAR: B0.2

RADIAL: B0.1

ANGLES: B0.5`

BTWN HOLE CENTERS: B0.1

TECHNOLOGIESMellanox

21.9 MAX

13.6

NO

TE #

8

2.2 MAX

(53.5)

(13.

2)

(14.

4)

3.0 MAX TYP

NOTES: 1. CAGE MATERIAL: NICKEL SILVER, 0.25 THICK HEAT SINK MATERIAL: ALUMINUM HEAT SINK CLIP MATERIAL: STAINLESS STEEL EMI SPRING MATERIAL: STAINLESS STEEL FRONT FLANGE MATERIAL: ZINC ALLOY2. MATES WITH QSFP MSA COMPATIBLE TRANSCEIVER.3. REFER TO APPLICATION SPEC FOR RECOMMENDED DRILL HOLE DIAMETER AND PLATING THICKNESS.4. BOARD THICKNESS : SINGLE SIDED PC BOARD MINIMUM THICKNESS = 1.45 mm DOUBLE SIDED PC BOARD MINIMUM THICKNESS = 2.2 mm PER QSFP4. DIMENSION F IS THE NOMINAL THICKNESS OF CUSTOMER SUPPLIED PC BOARD,5. DATUMS AND BASIC DIMENTIONS ESTABLESHED BY CUSTOMER.6. DATUM -A- IS TOP SURFACE OF HOST BOARD.7. SURFACE TRACES PERMITTED WITHIN THIS AREA EXCEPT WHERE CAGE STANDOFFS (SHOWN IN DETAIL A) CONTACT PC BOARD.8. DIMENSION APPLIES WITH MODULE INSTALLED IN THE CAGE.9. DATE CODE (WWYRR) MARKED ON CAGE SIDE . WW- WEEK NO. IN YEAR. Y - YEAR RR - REVISION

REV DESCRIPTION DATEA1 RELEASED PER ECO-016320 1/19/2014

DESIGNED & DIMENSIONEDIN MILLIMETERS[INCHES]

DO NOTSCALE FROM

THIS PRINT

HDBNC-J-P-XX-RA-BHXGENDER

TYPE ORIENTATION

TERMINATION

PLATING SPECIFICATION-RA: RIGHT ANGLE

-HF: 30µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-HN: 30µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY-GF: 10µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-GN: 10µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY(SEE TABLE 1)

-BH1: BULKHEAD THROUGH HOLE .062 BOARD-BH2: BULKHEAD THROUGH HOLE .093 BOARD-BH3: BULKHEAD THROUGH HOLE, ROUND LEGS .062 BOARD

-P: PCB

-J: JACK

"B"REF

0.50 .020REF

7.50 .295REF

"A"REF

7.52 .296REF

4.25 .167REF

5.08 .200(4 PLCS)

REF

7.50 .295(4 PLCS)

REF

1.67 REF (8 PLCS).066

20.30 REF.799

0.92 .036(4 PLCS)

REF

7.00 REF.276

12.00 REF.472

16.55 .652 REF

1/4-36 UNS-2AREF

C

6.50 .256

5.90 .232

RECOMMENDED MOUNTING HOLE2.95 [.116] MAX PANEL THICKNESS

5.08 (4 PLCS).200

0.76 .030PTH

1.70 PTH.067(4 PLCS)

2.54 .100(4 PLCS)

RECOMMENDED PCB LAYOUT

2.55 .100REF

0.50 .020REF

1(SEE NOTE 4)2

FIG 1-BH1 AND BH2

HDBNC-J-P-XX-RA-BH1 SHOWN

C

SHEET OF

UNLESS OTHERWISE SPECIFIED,DIMENSIONS ARE IN MILLIMETERS.TOLERANCES ARE:DECIMALS ANGLESX.X: 0.3 [.01] 5X.XX: 0.13 [.005]X.XXX: 0.051 [.0020]MATERIAL:

HD BNC 75 OHM, RA JACK BULKHEAD

BY:HDBNC-J-P-XX-RA-BHX

DWG. NO.

DESCRIPTION:

PROPRIETARY NOTETHIS DOCUMENT CONTAINS INFORMATIONCONFIDENTIAL AND PROPRIETARY TOSAMTEC, INC. AND SHALL NOT BE REPRODUCEDOR TRANSFERRED TO OTHER DOCUMENTS ORDISCLOSED TO OTHERS OR USED FOR ANYPURPOSE OTHER THAN THAT WHICH IT WASOBTAINED WITHOUT THE EXPRESSED WRITTENCONSENT OF SAMTEC, INC.

DO NOT SCALE DRAWING

ALVIN W 02/17/2011 21

SHEET SCALE: 3:1

F:\DWG\MISC\MKTG\HDBNC-J-P-XX-RA-BHX-MKT.SLDDRW

NOTES:

1. C REPRESENTS A CRITICAL DIMENSION.2. NOTE DELETED.3. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M. TRAY: TY-SMA-001-1 COVER: TY-SMA-001-24. NUT TO BE PACKAGED SEPARATELY.

520 PARK EAST BLVD, NEW ALBANY, IN 47150PHONE: 812-944-6733 FAX: 812-948-5047e-Mail [email protected] code 55322

SOCKET: BeCuSHELL, BODY, NUT: BRASSINSULATOR: PTFE

REVISION C

DESIGNED & DIMENSIONEDIN MILLIMETERS[INCHES]

DO NOTSCALE FROM

THIS PRINT

HDBNC-J-P-XX-RA-BHXGENDER

TYPE ORIENTATION

TERMINATION

PLATING SPECIFICATION-RA: RIGHT ANGLE

-HF: 30µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-HN: 30µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY-GF: 10µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-GN: 10µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY(SEE TABLE 1)

-BH1: BULKHEAD THROUGH HOLE .062 BOARD-BH2: BULKHEAD THROUGH HOLE .093 BOARD-BH3: BULKHEAD THROUGH HOLE, ROUND LEGS .062 BOARD

-P: PCB

-J: JACK

"B"REF

0.50 .020REF

7.50 .295REF

"A"REF

7.52 .296REF

4.25 .167REF

5.08 .200(4 PLCS)

REF

7.50 .295(4 PLCS)

REF

1.67 REF (8 PLCS).066

20.30 REF.799

0.92 .036(4 PLCS)

REF

7.00 REF.276

12.00 REF.472

16.55 .652 REF

1/4-36 UNS-2AREF

C

6.50 .256

5.90 .232

RECOMMENDED MOUNTING HOLE2.95 [.116] MAX PANEL THICKNESS

5.08 (4 PLCS).200

0.76 .030PTH

1.70 PTH.067(4 PLCS)

2.54 .100(4 PLCS)

RECOMMENDED PCB LAYOUT

2.55 .100REF

0.50 .020REF

1(SEE NOTE 4)2

FIG 1-BH1 AND BH2

HDBNC-J-P-XX-RA-BH1 SHOWN

C

SHEET OF

UNLESS OTHERWISE SPECIFIED,DIMENSIONS ARE IN MILLIMETERS.TOLERANCES ARE:DECIMALS ANGLESX.X: 0.3 [.01] 5X.XX: 0.13 [.005]X.XXX: 0.051 [.0020]MATERIAL:

HD BNC 75 OHM, RA JACK BULKHEAD

BY:HDBNC-J-P-XX-RA-BHX

DWG. NO.

DESCRIPTION:

PROPRIETARY NOTETHIS DOCUMENT CONTAINS INFORMATIONCONFIDENTIAL AND PROPRIETARY TOSAMTEC, INC. AND SHALL NOT BE REPRODUCEDOR TRANSFERRED TO OTHER DOCUMENTS ORDISCLOSED TO OTHERS OR USED FOR ANYPURPOSE OTHER THAN THAT WHICH IT WASOBTAINED WITHOUT THE EXPRESSED WRITTENCONSENT OF SAMTEC, INC.

DO NOT SCALE DRAWING

ALVIN W 02/17/2011 21

SHEET SCALE: 3:1

F:\DWG\MISC\MKTG\HDBNC-J-P-XX-RA-BHX-MKT.SLDDRW

NOTES:

1. C REPRESENTS A CRITICAL DIMENSION.2. NOTE DELETED.3. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M. TRAY: TY-SMA-001-1 COVER: TY-SMA-001-24. NUT TO BE PACKAGED SEPARATELY.

520 PARK EAST BLVD, NEW ALBANY, IN 47150PHONE: 812-944-6733 FAX: 812-948-5047e-Mail [email protected] code 55322

SOCKET: BeCuSHELL, BODY, NUT: BRASSINSULATOR: PTFE

REVISION C

DESIGNED & DIMENSIONEDIN MILLIMETERS[INCHES]

DO NOTSCALE FROM

THIS PRINT

HDBNC-J-P-XX-RA-BHXGENDER

TYPE ORIENTATION

TERMINATION

PLATING SPECIFICATION-RA: RIGHT ANGLE

-HF: 30µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-HN: 30µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY-GF: 10µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-GN: 10µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY(SEE TABLE 1)

-BH1: BULKHEAD THROUGH HOLE .062 BOARD-BH2: BULKHEAD THROUGH HOLE .093 BOARD-BH3: BULKHEAD THROUGH HOLE, ROUND LEGS .062 BOARD

-P: PCB

-J: JACK

"B"REF

0.50 .020REF

7.50 .295REF

"A"REF

7.52 .296REF

4.25 .167REF

5.08 .200(4 PLCS)

REF

7.50 .295(4 PLCS)

REF

1.67 REF (8 PLCS).066

20.30 REF.799

0.92 .036(4 PLCS)

REF

7.00 REF.276

12.00 REF.472

16.55 .652 REF

1/4-36 UNS-2AREF

C

6.50 .256

5.90 .232

RECOMMENDED MOUNTING HOLE2.95 [.116] MAX PANEL THICKNESS

5.08 (4 PLCS).200

0.76 .030PTH

1.70 PTH.067(4 PLCS)

2.54 .100(4 PLCS)

RECOMMENDED PCB LAYOUT

2.55 .100REF

0.50 .020REF

1(SEE NOTE 4)2

FIG 1-BH1 AND BH2

HDBNC-J-P-XX-RA-BH1 SHOWN

C

SHEET OF

UNLESS OTHERWISE SPECIFIED,DIMENSIONS ARE IN MILLIMETERS.TOLERANCES ARE:DECIMALS ANGLESX.X: 0.3 [.01] 5X.XX: 0.13 [.005]X.XXX: 0.051 [.0020]MATERIAL:

HD BNC 75 OHM, RA JACK BULKHEAD

BY:HDBNC-J-P-XX-RA-BHX

DWG. NO.

DESCRIPTION:

PROPRIETARY NOTETHIS DOCUMENT CONTAINS INFORMATIONCONFIDENTIAL AND PROPRIETARY TOSAMTEC, INC. AND SHALL NOT BE REPRODUCEDOR TRANSFERRED TO OTHER DOCUMENTS ORDISCLOSED TO OTHERS OR USED FOR ANYPURPOSE OTHER THAN THAT WHICH IT WASOBTAINED WITHOUT THE EXPRESSED WRITTENCONSENT OF SAMTEC, INC.

DO NOT SCALE DRAWING

ALVIN W 02/17/2011 21

SHEET SCALE: 3:1

F:\DWG\MISC\MKTG\HDBNC-J-P-XX-RA-BHX-MKT.SLDDRW

NOTES:

1. C REPRESENTS A CRITICAL DIMENSION.2. NOTE DELETED.3. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M. TRAY: TY-SMA-001-1 COVER: TY-SMA-001-24. NUT TO BE PACKAGED SEPARATELY.

520 PARK EAST BLVD, NEW ALBANY, IN 47150PHONE: 812-944-6733 FAX: 812-948-5047e-Mail [email protected] code 55322

SOCKET: BeCuSHELL, BODY, NUT: BRASSINSULATOR: PTFE

REVISION C

DESIGNED & DIMENSIONEDIN MILLIMETERS[INCHES]

DO NOTSCALE FROM

THIS PRINT

HDBNC-J-P-XX-RA-BHXGENDER

TYPE ORIENTATION

TERMINATION

PLATING SPECIFICATION-RA: RIGHT ANGLE

-HF: 30µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-HN: 30µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY-GF: 10µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT 100µ" NICKEL ON BODY-GN: 10µ" GOLD CENTER CONTACT, 100µ" NICKEL OUTER CONTACT 100µ" NICKEL ON BODY(SEE TABLE 1)

-BH1: BULKHEAD THROUGH HOLE .062 BOARD-BH2: BULKHEAD THROUGH HOLE .093 BOARD-BH3: BULKHEAD THROUGH HOLE, ROUND LEGS .062 BOARD

-P: PCB

-J: JACK

"B"REF

0.50 .020REF

7.50 .295REF

"A"REF

7.52 .296REF

4.25 .167REF

5.08 .200(4 PLCS)

REF

7.50 .295(4 PLCS)

REF

1.67 REF (8 PLCS).066

20.30 REF.799

0.92 .036(4 PLCS)

REF

7.00 REF.276

12.00 REF.472

16.55 .652 REF

1/4-36 UNS-2AREF

C

6.50 .256

5.90 .232

RECOMMENDED MOUNTING HOLE2.95 [.116] MAX PANEL THICKNESS

5.08 (4 PLCS).200

0.76 .030PTH

1.70 PTH.067(4 PLCS)

2.54 .100(4 PLCS)

RECOMMENDED PCB LAYOUT

2.55 .100REF

0.50 .020REF

1(SEE NOTE 4)2

FIG 1-BH1 AND BH2

HDBNC-J-P-XX-RA-BH1 SHOWN

C

SHEET OF

UNLESS OTHERWISE SPECIFIED,DIMENSIONS ARE IN MILLIMETERS.TOLERANCES ARE:DECIMALS ANGLESX.X: 0.3 [.01] 5X.XX: 0.13 [.005]X.XXX: 0.051 [.0020]MATERIAL:

HD BNC 75 OHM, RA JACK BULKHEAD

BY:HDBNC-J-P-XX-RA-BHX

DWG. NO.

DESCRIPTION:

PROPRIETARY NOTETHIS DOCUMENT CONTAINS INFORMATIONCONFIDENTIAL AND PROPRIETARY TOSAMTEC, INC. AND SHALL NOT BE REPRODUCEDOR TRANSFERRED TO OTHER DOCUMENTS ORDISCLOSED TO OTHERS OR USED FOR ANYPURPOSE OTHER THAN THAT WHICH IT WASOBTAINED WITHOUT THE EXPRESSED WRITTENCONSENT OF SAMTEC, INC.

DO NOT SCALE DRAWING

ALVIN W 02/17/2011 21

SHEET SCALE: 3:1

F:\DWG\MISC\MKTG\HDBNC-J-P-XX-RA-BHX-MKT.SLDDRW

NOTES:

1. C REPRESENTS A CRITICAL DIMENSION.2. NOTE DELETED.3. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M. TRAY: TY-SMA-001-1 COVER: TY-SMA-001-24. NUT TO BE PACKAGED SEPARATELY.

520 PARK EAST BLVD, NEW ALBANY, IN 47150PHONE: 812-944-6733 FAX: 812-948-5047e-Mail [email protected] code 55322

SOCKET: BeCuSHELL, BODY, NUT: BRASSINSULATOR: PTFE

REVISION C

Page 30: AES67 for Audio Production-Background Applications and Challenges

THANK YOU!

Any questions?