EEP-Vol. 19-1

ADVANCES INELECTRONIC PACKAGING1997

PROCEEDINGS OF THE PACIFIC R IM/ASME INTERNATIONAL INTERSOCIETY ELECTRONIC & PHOTONIC PACKAGING CONFERENCE

INTERPACK '97

Volume 1presented at

The Pacific Rim/ASME International Intersociety Electronicand Photonic Packaging Conference

June 15-19, 1997Kohala Coast, Hawaii

sponsored byThe Electrical and Electronic Packaging Division, ASME

edited byE. Suhir

Lucent Technologies

M. ShiratoriYokohama National University

Y. C. LeeG. Subbarayan

University of Colorado

T H E A M E R I C A N S O C I E T Y O F M E C H A N I C A L E N G I N E E R S

UNITED ENGINEERING CENTER • 345 EAST 47TH STREET . NEW YORK N.Y. 10017UB/TIB Hannover 89116 246 316"

CONTENTS

VOLUME 1

KEYNOTE LECTURESDecreasing the Time-to-Market Through Virtual Risk Assessment and RiskMitigation

Michael G. Pecht 1Challenges in Optoelectronic Packaging

Robert J. Hannemann 7Packaging Technologies for Optoelectronic Devices

Fuminori Ishitsuka 13A Perspective on the Intrinsic and Practical Limits of Cooling Technology forFuture Computer Products: From Laptops to Superservers

Richard C. Chu 15Surface Mount Packaging and Assembly: Past, Present, and Future

Jennie S. Hwang 19A Paradigm Shift: The Emerging Role of Professional Societies in DevelopingMicroelectronics and Photonics Packaging Technology

Ralph W. Wyndrum, Jr. 25Next Generation of Packaging: Challenges and Recent Advances

Rao R. Tummala 29

PACKAGING TECHNOLOGYPackaging Technology in Japan: Now and Future

Yoichi Hiruta 37Plastic Packaging-Related Consortia Activities: An Update

L T. Nguyen and R. W. Johnson 41Evolution of Microelectronics Packaging in Taiwan: Getting Ready for BGAand MCM

Albert W. Lin 47A Low Cost Bumping Process for Flip Chip-Technology Using Electroless Ni/AuBumping and Solder Ball Placement

Gerald Motulla, Paul Kasulke, Katrin Heinricht, Andreas Ostmann, Elke Zakel,Herbert Reichl, Ghassem Aszdasht, andJoachim Kloser 57

A Study on the Electrical Conduction Mechanism of Anisotropically ConductiveFilm (ACF) for LCD Packaging Applications

Myung J. Yin, Kyung W. Paik, Yang K. Kim, andHee N. Hwang 65

Packaging Technology for the Parallel Supercomputer SX-4Eiji Hori, Shinji Mine, Yuji Kuramitsu, and Jun Inasaka 73

Flip Chip Plastic Ball Grid Array Moisture Performance Utilizing a SelectedMaterial Set

Mona A. Chopra, Bill Mace, and James R. Guajardo 81Development of Low Pressure Contact Method-in CSP (Fine Pitch BGA) Testing

Toshiyuki Motooka, Shigeyuki Maruyama, Makoto Haseyama, Naomi Miyaji,Satoru Zama, and Hitoshi Yuzawa 95

PC Card Packaging Technology With BGA and Build Up PWBToshiyasu Takei, Akio Yoshida, Tomoyuki Kubota, and

Shigeyuki Ogata 101Application of Low Cost MCMS to Mobile Personal Computers

Akihiro Dohya, Manabu Bonkohara, Masafumi Nakamura, andTuneaki Tajima 107

Analysis of Stress Condition for Organic Multi-Chip PackageShogo Mizumoto, Yutaka Tsukada, and Itsuroh Shishido 113

Low Cost Underbump Metallization by Electroless Ni/Au Plating for ChipScale Packages

Christina C. Tsui, T. B. Lim, Y. C. Teo, and C. Q. Cui. 119

MANUFACTURINGStrategies for Optimization of Electronic Package Designs and ManufacturingProcesses

Ganesh Subbarayan and Roop L Mahajan 125Process Modeling, Optimization and Control in Electronics Manufacturing

Roop L. Mahajan 127Impact of the Manufacturing Process on Component Package Design

Virginia M. Miller and Hanna Kanciak. 139Fuzzy Logic Based Regression Models for Electronics Manufacturing Applications

Brian Schaible and Y. C. Lee 147

POLYMERIC ELECTRONICS PACKAGING MATERIALS ANDFUNDAMENTAL CHARACTERIZATIONS

High Performance Underfills for Low-Cost Flip-Chip ApplicationsC. P. Wong, S. Shi, and G. Jefferson 157

Novel Anisotropic Conductive Films With Area-Arrayed Conducting ParticlesYasushi Gotoh and Itsuo Watanabe 161

Electrical Contact Reliability in Anisotropic Conducting Adhesives Connectionsfor Flip Chip Technology

Samjid H. Mannan, Adebayo O. Ogunjimi, David C. Whalley, andDavid J. Williams 167

High-Frequency Measurements and Modelling of Anisotropic ElectricallyConductive Adhesive Flip-Chip Joint

Markus Dernevik, Rolf Sihlbom, Zonghe Lai, Piotr Starski, andJohan Liu 177

Piezoresistive Measurement of Mechanical Stress in Epoxy UnderfilledFlip-Chip-on-Board (FCOB) Devices

Jon B. Nysaether, Pontus Lundstrom, and Johan Liu 185Conductive Adhesive Joint Reliability Under "Full Cure" Conditions

Johan Liu, Pontus Lundstrom, Katrin Gustafsson, andZonghe Lai 193

PLASTIC PACKAGE MATERIALSThe Preliminary Development of a Novel Corrosion Resistant Plastic Package

K. Jayaraj, L. Felton, B. Farrell, and T. Tiano 201Evaluation of Ramp Rate and Peak Temperature Effects on BGA, QFP, andSOIC Moisture Sensitivity Performance

Ju-A. Kim, Seung Won Park, and Eun Sook Sohn 209PBGA Reliability for Under-the-Hood Automotive Applications

John L. Evans, Robert Newberry, Larry Bosley, Steven G. McNeal,Andrew Mawer, R. Wayne Johnson, and Jeff Suhling 215

Detection of Internal Package Flaws of Semiconductor Components by ScanningAcoustic Tomograph (SAT)

Rex T. Gaviola and Rodrigo O. Amor 221Environmentally Sound Technologies for PWB Prepreg Manufacture

Claudius Feger, David Lewis, William Corso, Stanley Whitehair,Jeffrey C. Hedrick, and Alfred Viehbeck 227

Using Open/Short Analysis as a Process Improvement ToolJose N. dela Cruz, Jr. 237

VI

PLASTIC PACKAGE DESIGNA CAD-Based Flow Modeling Tool for Plastic IC Encapsulation

L. T. Nguyen, A. S. Chen, A. Krishnan, S. A. Bayyuk, S. A. Lowry,A. J. Przekwas, and S. A. Bidsirup-Allen 245

A Study on the Mechanical Behavior of EMC and Thermal Stress Analysis inPlastic Packaging

D. K. Shin and J. J. Lee 253Fracture Strength of Epoxy Molding Compounds

Tai-Ran Hsu, Khaled M. Fawzi, Luu T. Nguyen, and An-Yu Kuo 261Flow Analysis of IC Encapsulating Resin in the Molding Process

Matsuki Yamamoto and Yoshihiro Matsumura 269Study on Cavity Filling Behavior With the Pressurized Underfill Encapsulationof Flip Chips

Sejin Han, K. K. Wang, and C. H. Cheng 277

ADVANCED INTERCONNECT TECHNOLOGYBare Chip Packaging Technology

Yutaka Tsukada 285Alternative Curing Methods for FCOB Underfill

M. M. Merton, Roop L. Mahajan, and N. Nikmanesh 291Fast-Flow Underfill Encapsulant: Flow Rate and Coefficient of Thermal Expansion

C. P. Wong, M. B. Vincent, and S. Shi 301Reversible Interconnection: An Approach to Debonding Joined Materials atthe Bonded Interface

N. Hosoda, L Yang, and T. Suga 307DCA on Flex: A Low Cost/Stress Approach

Frank Juskey and Robert Carson 313Ultra Fine Pitch Vertical Interconnection Sheet: An Alternative to Fusible BumpFlip-Chip Technology in Dense Interconnection Application

Patrice Caillat, G. Nicolas, and C. Massit. 319

LOW COST FLIP CHIP PROCESSINGRoadmap of Packaging Interconnect Technology

Paul A. Totta 323The Critical Issues in DCA Assembly

Ronald C. Lasky, John Cronin, and Alden Johnson 329Wafer Bumping Technologies: A Comparative Analysis of Solder DepositionProcesses and Assembly Considerations

Deborah S. Patterson, Peter Elenius, andJames A. Leal 337

Solder Flip Chips Employing Electroless Nickel: An Evaluation of Reliabilityand Cost

Frank Stepniak. 353Advanced Encapsulation Processing for Low Cost Electronics Assembly:A Cost Analysis

Nathan W. Pascarella and Daniel F. Baldwin 359Advanced Flip Chip Materials: Reflowable Underfill Systems

Daniel R. Gamota and Cindy M. Melton 365

THERMAL ISSUES IN ASSEMBLY PROCESSESDie-Bonding in Micro-Electronic Packaging by Oscillatory Squeezing

K. J. Zwick, P. S. Ayyaswamy, and I. M. Cohen 373An Engineering Model to Simulate the Thermal Response of Electronic DevicesDuring Pulsed Nd:YAG Laser Welding

S. E. Gianoulakis, T. E. Voth, P. W. Fuerschbach, andJ. M. Prinzbach 383

Ball Size and HAZ as Functions of EFO Parameters for Gold Bonding WireWei (Ivy) Qin, Ira M. Cohen, and P. S. Ayyaswamy. 391

VII

Finite Element Simulation of Wire Looping During WirebondingA. A. O. Tay, B. C. Seah, and S. H. Ong 399

Radiative Heat Transfer in an RTP ChamberJ. C. Chai and P. Dutta 407

MICROMACHINING AND MEMSRecent Advances in the Use of Plasma Etching for Micro-Machining

David J. Johnson, Michael W. DeVre, andRussell J. Westerman 413

Characterization of Mechanical Properties of Thin Films Using MicromechanicalSilicon Device

Kazuo Sato, Tetsuo Yoshioka, Mitsuhiro Shikida, andMasanori Yamasaki 421

MEMS Technology in Data Storage SystemLijun Jong, Ralph Ahlgren, and Vijay Dhingra 427

A Dry Etch Fabrication Process for Microelectromechanical Devices Using SiliconNitride Sacrificial Layers

Mark J. Mescher, Michael L. Reed, and T. E. Schlesinger 435Transient and Impact Dynamics of a Micro-Accelerometer

G. X. Li, Z. L. Zhang, and F. A. Shemansky. 439

MEMS PACKAGINGMicromachined Optical I/O Couplers for Optoelectronic Multichip Modules(OE-MCM)

Chong H. Ahn, Kwang Wook Oh, andKenneth P. Roenker 447

Low-Cost, Water Compatible Piezoresistive Bulk Micromachined Pressure SensorSlobodan Petrovic, Clem Brown, Adan Ramirez, Brian King, Theresa Maudie,

Dennis Stanerson, Gordon Bitko, Jeanene Matkin, John Wertz, andDavid J. Monk 455

MEMS Packaging/Interconnects Challenges and OpportunitiesRobert Mehalso and Robert Warrington 463

Effect of Measured Stress-Strain Solder Data on Die/Substrate Interface BondStress for Large CTE Mismatch

B. Chandran, W. F. Schmidt, and M. H. Gordon 467Packaging of Neural Stimulation/Recording Systems: Review and NewMechanism for Interfacing Passive Electrodes and Signal Processing Circuitry

Balasubrahmanyan Ganesh, Douglas A. Chinn, Timothy A. Ameel, andA. Bruno Frazier 475

ELECTRICAL CHARACTERIZATION OF RF PACKAGESElectrical Characterization and Optimization of High Speed Connector for HighFrequency Applications

Anand Haridass, Christine Nguyen, andMadhavan Swaminathan 483

Measurement Based Modeling of RF PackagesV. K. Tripathi 489

Modeling and Simulation for Mixed-Signal Package DesignAndreas C. Cangellaris and John L. Prince 497

Radiation From Printed CircuitsTapan K. Sarkar. 505

Mechanical Design for the Personal Messenger™ Wireless ModemTateshi Yamada and P. C. Low 509

A Wideband Ceramic Package for DC-18 GHz Microwave ApplicationsM. P. R. Panicker, N. L. Greenman, M. S. Hyslop, and

D. Douriet 519

VIII

RF PACKAGING TECHNOLOGYFailure Mechanisms of Microwave (MMIC) Packaging

Nickolaos Strifas and Aris Christou 533Drop Impact Simulation of a Custom Pager Product

Ben Nagaraj 539MPMS: The "Super" Microwave Package of the Future

Edward J. Jones 549A Total Product Life Cycle Profile Approach to Reliability Analysis for Low CostCrystal Oscillators

K. X. Hu, T. Knecht, C. P. Yeh, G. Mui, and K. W. Wyatt 555RF Modeling of Flip-Chip Interconnects in Coplanar Waveguide Circuits

Zhiping Feng, Wenge Zhang, K. C. Gupta, and Y. C. Lee 561

DISK DRIVESEnvironmental Packaging Issues in Direct Access Storage Devices

Kenneth Altshuler. 567Application of MR Heads for Hard Disk Drives

Erich Sawatzky 575Enhanced Modeling Through Incorporating Accurate Flying Height Measurementsfor Sliders at Below 1 Microinch

Joe J. Wallace, J. Russell Pavlat, Peter de Groot, Tod Erickson,Ara Dergevorkian, Jim Soobitsky, and Les Deck 583

Testing of New Magnetic Storage Layers for Disk Drive ApplicationsJay R. Hoinville 589

Mechatronics in Storage Technology: A Case Study of Direct Storage DevicesRishi Kant 597

Spacing Modulation of Magnetic Head Due to Topographical Feature of DiskSurfaces

Shoji Suzuki 599

OPTOELECTRONIC PACKAGING — FIBER OPTICSThe State of the Art in Fiber Optics Reliability

G. M. Bubel 607Mechanical Reliability of Optical Fibres and Components for the Optical AccessNetwork

Roland Goarin, Michel Gadonna, Alain Gouronnec, andPascal Devoldere 615

Coupled Thermal/Structural Analyses of Laser Powered Glass Sealing Methodsfor Fiber Optic and Flat Panel Display Applications

Robert S. Chambers and Steven E. Gianoulakis 621Computational Modelling of Defects in Fibre Optic Cables

C. Bailey, S. Gebreamlak, and P. Norman 627Analysis of Fractal Dimension of AE Pulse of Optical Glass Fiber Produced bya Cutting Procedure: Relation Between AE Energy and Correlation Dimension

Mitsuyuki Nakayama, Hideto Suzuki, Masaru Ohyabu, andYouji Nozawa 633

Cable Connectors for Radiated EMI Protection in a High-DensityTelecommunication Packaging System

Toshinori Mori and Kei-ichi Yasuda 639

OPTOELECTRONIC PACKAGING — GUIDEDWAVEOptoelectronic Packaging Using Polymer Waveguides

Julian Bristow, Yue Liu, Mary Hibbs-Brenner, Allen Cox, Lynn Galarneau,David Greenlaw, Yung Liu, and Herb Cole 647

Three Dimensional Tapered Optical Polymeric Waveguides for OptoelectronicPackaging

Ray T. Chen, Linghui Wu, Feiming Li, and Suning Tang 653

IX

Optical Packaging of Organic Polymer Electro-Optic Guided Wave DevicesWilliam H. Steier, Antao Chen, Vadim Chuyanov, Felix I. Marti-Carrera,

Sean Garner, Mehrdad Ziari, and L. R. Dalton 671Polymeric Materials for Optoelectronic Devices

Jerome D. Swalen 679Multi-Tap Electro-Optic Waveguide Interconnects for Module-Level Packaging

Rick Lytel 681Evaluation of Aging Induced Gradual Changes in Diode Lasers

Jens W. Tomm, Artur Barwolff, Roland Puchert, Uwe Menzel, Arndt Jaeger,and Thomas Elsaesser 683

Packaging of Optical Integrated Circuits Used in WDM Optical CommunicationSystems

Chau-Han Lee, Haifeng Li, Stephen Didde, Wenhua Lin, Scott A. Merritt,Yung-Jui Chen, Mario Dagenais, and Dennis R. Stone 689

Sputtered c-Axis LiNbO3 Thin Film on Si for Waveguide ApplicationsS. Tan, H. Han, R. Boudreau, T. E. Schlesinger,

and M. Migliuolo 695Optical Coupling With Tapered Polymer Waveguides

R. Brian Hooker, Regis S. Fan, Dominic J. Goodwill, andBrian K. McComas 703

Polymers, Packaging, and Optical WaveguidesA. R. Mickelson 711

A Practical Electronic Package for Multi-Wavelength Optical AmplifiersJeffrey A. DeMeritt and Peter G. Wigley 713

Investigation of the Temperature Transients of High Power Laser ArraysWith Different Thermal Architecture

Roland Puchert, Artur Barwolff, Arndt Jaeger, Uwe Menzel, andJens W. Tomm 717

The Effect of Precompression on Energy Absorbing Elements Used for ShockIsolation of Fiber Optic Switches

Mitchel J. Keil 723

ELECTRICAL DESIGN ISSUES IN PACKAGINGElectrical Issues in Packaging RF Components for Portable Wireless Applications

Robert C. Frye 729Electrical Design Issues for Mixed-Signal Packaging

Andreas C. Cangellaris 733Electrical Measurement Issues in Electronic Packaging

Vijai K. Tripathi, Richard D. Lutz, and Alok Tripathi 739Electrical Design Issues in Digital Product Packaging

John L. Prince 745

OPTOELECTRONIC PACKAGING — PASSIVE ALIGNMENTPassive Alignment for Optoelectronic Components

Paul O. Haugsjaa 753Application of Silicon-Glass Technology to Microwave Photonic MultichipModules

Stavros lezekiel, Eric A. Soshea, Matthew F. O'Keefe, andChristopher M. Snowden 759

Refractive Plate Optical Switches Using Off-Axis V-Groove Array for FiberPositioning

Hongtao Han, Bernie Caron, Warren Lewis, Songsheng Tan, Jay Mathews,Chris Drabenstadt, Robert Boudreau, Terry Bowen, and

Dale Murray 765Hybrid Assembly and Bonding of Miniature Optical Components onMicromachined Substrates

Donald E. Jones and David L. Naylor. 773

Passively Aligned WDM Transmitter/Receiver Module Using Fiber-EmbeddedCircuit

Genji Tohmon, Tomoaki Uno, Tohru Nishikawa, Masahiro Kito,Takayuki Yoshida, and Yasushi Matsui 779

Electroless Metallization of Silica Optical Fiber for Hermetic PackagingR. W. Filas 1265

FREE-SPACE OPTOELECTRONIC AND PHOTONIC INTERCONNECTIONSThe Challenges of Packaging for Free-Space Interconnection

John A. Neff 785Some Fundamental Issues of Optical Interconnects

Yao Li 793Free-Space Optical Switches Fabricated by Using Electro-Photonic Multi-ChipModule Technologies

Shigeru Kawai 803Packaging Advantages of Macro-Optical Free-Space Interconnections OverMicro-Optical and Electrical Interconnections

Michael W. Haney, Marc P. Christensen, Kannan Raj, andPredrag Milojkovic 811

The Design of a Programmable Photonic FFT ProcessorRichard G. Rozier, Fouad E. Kiamilev, and

Ashok V. Krishnamoorthy 819Finite Element Simulation of Optical Interconnect (OIC) Module

Nickolaos Strifas and Aris Christou 827The JHU/APL Miniaturized Scientific Imager Design With Light Weight ReflectiveOptics and Chip-on-Board Packaging

Binh Q. Le, Paul D. Schwartz, Keith Peacock, Kim Strohbehn, andTheodore G. Sholar 835

SYSTEM DESIGN OPTIMIZATION FOR MCMSSynthesis of Optimal MCM-Based Systems

Dong-Hyun Heo, Alice C. Parker, and C. P. Ravikumar. 843System-Level Impact of Early Packaging Decisions

Chet A. Palesko and Peter A. Sandborn 851Improving Performance and Routability Estimation in MCM Placement

J. Y. Cho and J. D. Cho 857Impact of MCMs on High Performance Processors

Brian T. Davis, Claude Gauthier, Phiroze Parakh, Todd Basso,Charles Lefurgy, Richard Brown, and Trevor Mudge 863

Tradeoffs in Chip and Substrate Complexity and Cost for Field ProgrammableMultichip Modules: Part II —The Clique Architecture

Joel Darnauer and Wayne Wei-Ming Dai 869MCM Design Using Integrated Passive Components

James Patrick Parkerson, Leonard W. Schaper, Gabriel Morcan,Michael Glover, and Timothy G. Lenihan 875

INNOVATIONS IN CAD/CAE INTEGRATION IN ELECTRONIC PACKAGINGChallenges in ECAD Tool Integration for Digital and RF Packages

Madhavan Swaminathan 883Integrating Reliability Analysis Tools in CAD/CAE

Yizhak Bot. 885A Framework for Integration of Analysis Tools for Microelectronic Devices

Ian R. Grosse, Daniel H. Schaubert, T. Chio, Daniel D. Corkill, andMark Stoklosa 891

Models of Electronic Package EngineeringFred,L. Cox, III and Gintautas B. Jazbutis 901

X I

Integrated Durability Design Tool for Electronics PackagingMostafa Rassaian, Jung-Chuan Lee, and

David W. Twigg 911SOLIDIS: A TCAD Environment for Packaging Simulation

Jorg M. Funk, Lars H. Bomholt, Renzo P. Paganini, Hans-Petter Lien,and Wolfgang Fichtner 919

CAD/E Requirements and Usage for Reliability Assessment of Electronic ProductsMichael Osterman, Thomas Stadterman, and

Randy Wheeler. 927Optical Design of Land Grid Array Connectors

A Deshpande and G. Subbarayan 939An Integrated Software Tool for the Thermomechanical Analysis of ElectronicChips

Stefan Kjellberg, Damian McGuckin, Tom Kisielewicz, andKohei Ando 949

Thermomechanical CAD/CAE Integration in the Tiger PWA ToolsetRussell S. Peak, Robert E. Fulton, and

Suresh K. Sitaraman 957Employing Computer-Aided Design Tools for Reliable Die Attachment

Thomas J. Stadterman, Rhonda M. Anderson, William F. Braerman,and Michael W. Deckert 963

CAD-Based Analsysis Tools for Electronic Packaging Design:A New Modeling Methodology for a Virtual Development Environment

Wen X. Zhou, Chien H. Hsiung, Robert E. Fulton, Xun Fei Yin, Chao-pin Yeh,and Karl Wyatt 971

ENABLING TECHNOLOGIES AND SIMULATION FOR CONCURRENT DESIGNDevelopment of Optimized Component-Level Thermal Behavioral Models fora Plastic-Ball-Grid Array Interconnect Technology for Air Cooled Applications

Sarang Shidore, Gary Kromann, and Steve Addison 981A Methodology for Thermal Characterisation of IC Packages:Part I — Experimental Validation of Detailed Models

John D. Parry and Harvey I. Rosten 989A Methodology for Thermal Characterisation of IC Packages:Part II — Generation of Reliable Boundary Condition Independent CompactModels

John D. Parry and Harvey I. Rosten 999EDA and CFD Tool Interoperability: The Concurrent Design of a PowerPC™Microprocessor-Based Microcomputer

Gary Kromann, Vincent Pimont, and Steve Addison 1007Thermal Analysis and Optimization of the Series E PowerPC Computer System

David L. Lober. 1015Thermal and Airflow Analysis of Sequent's New Generation Pentium Pro®Based Enterprise Server

Henry C. Bosak 1023

PROCESS CHARACTERIZATIONInstability Analysis for Ultra Thin Quad Flat Pack

Xinyu Dou, Chao-pin Yeh, Dawei Zheng, Keith Boardman, andGreg Ridsdale 1033

Modulus Measurements and Creep Effects on CTE Measurements of ThinPolymer Films

Claudius Feger 1041Wind-Induced Noise Simulation for Portable Electronics

Xiaohua Wu, Xinyu Dou, Chao-pin Yeh, andKarl Wyatt. 1047

XII

Bonding at Room Temperature and Fluxless Reflow of Copper and Lead-FreeSolder

Ken-ichiro Tango, Junji Shibata, Naoe Hosada, andTadatomo Suga 1053

Analysis of Polymer Flow Due to Capillary Forces for Flip-Chip Package DesignsTakayuki Masunaga, Tetsuro Nishimura, and

Takahito Nakazawa 1059Thermal Stress Reduction Effect in SMD by Resin Insulation Layer onMetal Base PWB

Toshihiko Sayama and Takeshi Takayanagi. 1065

INNOVATIONS IN MODELING TECHNIQUESStructural Optimization of Electronic Components by Using StatisticalOptimization Method

Takayoshi Kashiwamura, Masaki Shiratori, and Qiang Yu 1071Optimization of High Pin Count Cavity-Up Enhanced Plastic Ball Grid ArrayEPBGA) Packages for Robust Design

Atila Mertol 1079Failure Analysis of Brittle Components in Electronic Packaging

Terry Baughn and Shea Chen 1089Miscellaneous Modeling Issues in Thermomechanical Stress Analysis ofSurface-Mount Interconnects

Abhijit Dasgupta, Krishna Darbha, Prateek Dujari, Peter Haswell,Sharon Ling, C. Scott Sealing, Pradeep Sharma, and

Kumar Upadhyayula 1095Analysis and Design of At-Cut Quartz Resonators by Three DimensionalFinite Element Method

Masahiko Kadokura, Tei Hirashima, and Yukinori Sasaki 1101Thermomechanical Stress Analysis of BGA Interconnects Using the MDRRTechnique

S. Ling and A. Dasgupta 1109

MATERIAL CHARACTERIZATIONPolarimetry of the Raman Spectrum for Stressed Silicon Crystal

Yasushi Niitsu, Eiichi Suzuki, Tomo Ikebe, Teruki Ikeda, andYusei Ookubo 1115

Study of Delaminated Plastic Packages by High Temperature Moire andFEA Method

Jiansen Zhu, Daqing Zou, Sheng Liu, and Jim Benson 1121Photoelastic Property of Gallium Arsenide Crystal

Kenji Gomi and Yasushi Niitsu 1129Investigation of Deformation Characteristics of Electronic Solders Using aNovel Stress Strain-Microprobe (SSM): Application to Solder Aging andLife Prediction

K. Linga Murty and Fahmy M. Haggag 1133The Evaluation of Photosensitive Polyimide for High Performance StressBuffer Applications

Edward Prack, Ziep Tran, Craig Franklin, Steve Tanner, andDan O. Murray 1141

MEASUREMENT TECHNIQUESUnified Multi-Axial Sub-Micron Fatigue Tester for Miniaturized Specimens

Minfu Lu, Zhengfang Qian, and Sheng Liu 1145Characterization of Flip Chip Bump Failure Modes Using High FrequencyAcoustic Micro Imaging

Janet E. Semmens and Lawrence W. Kessler. 1151Errors in Strain Gage Testing Theory for Thermal Expansion Measurement

WilhedE. Desaulnier, Jr. 1161

XIII

Effect of Roundness Given to Corner of Angled Metal Line on ElectromigrationFailure

Kazuhiko Sasagawa, Naoaki Nakamura, Masumi Saka, andHiroyuki Abe 1177

Development of High-Resolution Probe for Scanning Acoustic Tomographs ofElectronic Parts

Ken Takeuchi and Shoji Yamaguchi 1183Thermo-Mechanical Behaviors of Electronic Packaging Materials and Structuresby High Temperature Moire Interferometry

Daqing Zou, Minfu Lu, and Sheng Liu 1191

MATERIAL, INTERFACIAL CHARACTERIZATION, ANDEXPERIMENTAL MECHANICS

Packaging Characteristics of Preplated Palladium LeadframeMitsuo Mori, Toshio Tani, Masaaki Kurihara, Takeo Uno, and

Takafumi Morikawa 1197Fracture of Filled Epoxy Molding Compound Compact Tension Specimens

Vernal H. Kenner, Kenneth K. C. Lau, andSuresh K. Chengalva 1201

Effects of Temperature and Moisture Upon the Mechanical Behavior of anEpoxy Molding Compound

Brian D. Harper, Li Lu, and Vernal H. Kenner 1207Residual Sintering Stress Measurement Method for Glass-Ceramic Substrates

Hiroaki Doi and Akio Yasukawa 1213Deformation Mechanisms in Sn-Based Solder Materials

K. Linga Murty, Hong Yang, Philip Deane, andPaul Magill 1221

Probing Stresses in Metal Trenches Using Raman PiezospectroscopyQing Ma, Jin Lee, and Harry Fujimoto 1233

EFFECTIVE USE OF MECHANICAL/THERMAL CAD DESIGN TOOLSIN SYSTEM LEVEL MODELING OF ELECTRONIC PACKAGES

CAD Tools for Thermal Testing of Electronic SystemsVladimir Szekely, Marta Rencz, and

Bernard Courtois 2209Characterization of Thermal and Hydraulic Performance of Longitudinal FinHeat Sinks for System Level Modeling Using CFD Methods

Izundu F. Obinelo 1239Finite-Element Simulation of Thin-Film Adhesion Strength Testing

R. Djakarta, M. H. Gordon, and W. F. Schmidt 1251Viscoelastic Analysis of Thermal Stresses in a PQFP

J. H. Park, J. K. Kim, M. M. F. Yuen, S. W. R. Lee, P. Tong, andP.C.H. Chan 1257

VOLUME 2

RELIABILITY OF PCB/MULTILAYERED STRUCTURESResearch Challenges and Directions in the Next-Generation PackagingFrom the Telecommunications Perspective

John M. Robertson 1283A Constitutive Model of Polyimide Films and Its Integration With FiniteElement Analysis for Residual Stress Prediction in Thin Film Interconnects

Sean X. Wu, Chao-Pin Yeh, and Karl Wyatt. 1285Constitutive Modeling of Polymer Films Based on a Molecule ChainNetwork Theory

Zhengfang Qian, Minfu Lu, and Sheng Liu 1291

X I V