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Advances in Die Extraction and Re-Packaging for Obsolete Semiconductors
Design/Sales/Support partner for EMEA: Research/Design Manu. Facilities
GCI/Force Provides High-
Reliability Electronic
Components for Oil/Gas
Drilling in Harsh
Environments
GCI/Force Engineers
Integrated Circuit
Obsolescence Solutions for
Military and Commercial
Applications
GCI/Force Manufactures and
Services Products On Site
Who is GCI/Force
2 of 23
Inadequate Overlap between Component Product Lifecycles and Required
Lifecycle of End Product/System
Common in Military Electronic System Platforms
(Thousands of Commercial ICs are Obsoleted Every Year)
Also seen in Commercial Systems (e.g, Medical)
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Why a Demand for our Obsolescence Solutions?
Solution for Obsolescence - DER™
If one Package Footprint or Type is Obsolete, but the Die can still be
Located in Another Package Footprint, the Die can be Extracted and
Re-Assembled As Needed (DERTM)
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- Or the DERTM
Process Can be
Used to
Inventory
Functional Die.
Solution For Obsolescence - DERTM
Die Extraction and Re-Packaging Considerations:
- What is the End Application?: (Bare Die, Hybrid, Monolithic.MCM)
- Original Package, Target Package Selection, Bond Map, etc.
- Plastic SOIC to Ceramic TSOP (Hermetic)
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Die Extraction & Re-Packaging (DERTM)
Remove Die from Original Low-Reliability, Low-Temp Plastic Casing
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Hermetic Packaging
Hybrids & Multi-Chip Modules
Re-Assembly into High-Reliability Ceramic Package of any Footprint using Proprietary Processes
OR
DERTM Technology
Extraction Technology Provides Very Clean Front-Side and Back-Side
Surfaces
Relies on Chemical and Mechanical Processes Which Are No More
Aggressive Than Those Used During Wafer Fabrication
- Extremely Clean
Bond Pads
- No Inadvertent
Etching
- Die Surface Free of
Contaminants
- Die Back-Side Surface Free
of Contaminants and Returned
to Original Mirror Finish
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Conventional Bonding During Re-Packaging
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Re-manufactured Part Process Flow
PRODUCT FLOW
PE
RF
OR
MA
NC
E/R
EL
IAB
ILIT
Y
Commercial CMOS ASYNCHRONOUS FIFO Military CMOS ASYNCHRONOUS FIFO
• IDT7201LA50XEB
• 28 Pin CERDIP
• IDT7201LA5OP
• 28 Pin PDIP
• Purchased from
Franchised
Distributor
• GCI7201LA50XEB
• 28 Pin CERDIP
• Qualified
OBSOLETE PART
DONOR
REMANUFACTURED PART
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DERTM Process Improvements – Pad Re-Plating , Now DEERTM
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Pad Re-Conditioning Using Gold Ball Removal Followed by ENEPIG
(Electroless Nickel, Electroless Palladium, Immersion Gold) Plating - DEERTM
Potential Original Poor Ball Bond Quality/Reliability is Removed
Subsequent Bonding is Non-Compound with More Consistent and
Reliable Bond Pull Strength
New Bond Pad Surface Eliminates Possibility of Kirkendall Voiding with
Gold Bond Wire at Operating Temperatures Above 150°C
General Appearance
of Kirkendall or
Horsting Voiding at
Bond Pad Location -
Specifically at Gold
Ball to Aluminum
Bond Pad Interface
the following
dielectrics can be
formed: Au5Al2,
Au4Al, Au2Al and
AuAl2
DERTM Process Improvements – Pad Re-Plating (DEERTM)
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Process Flow for Pad Re-Conditioning Following Extraction Targeted Thicknesses: 4 um Ni, 0.25 um Pd, 0.04 um Au
Gold Ball Removal, Pad Re-Plating with Electroless Ni/Pd/Au Process DEERTM
Aluminum Pad Reconditioning for an Extracted Die (Target Total Plate Up is 4 - 5 um)
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Packaging Option Key: 1 – Standard Plastic (25h) 2 – Extraction, Standard Ceramic Assembly (DERTM) (95h) 3 – Extraction, Hi-Temp Ceramic Assembly (DERTM ) (600h) 4 – Extraction, Ni/Pd/Au Process, Hi-Temp Ceramic Assembly (DEERTM) (+6000h) 5 – Extraction, Ni/Pd/Au Process, Standard Ceramic Assembly (DEERTM) (+2500h)
1
10
100
1000
10000
1 2 3 4 5
Hours
Packaging Options
Hours to Failure @ 250°C
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GCI’s Ni/Pd/Au Pad Re-Plating Performance at 250°C
Avg. Bond Std. Mean- Plastic Pull Strength Dev. 3 SD Mean Device as Received: 7.154g 1.03g 4.06g Control Device After Pad Re-Conditioning: T=0 13.302g 1.52g 8.74g 6.8g T=168 (250°C) 12.650g 1.26g 8.89g 3.2g T=1000 (250°C) 11.540g 0.90g 8.50g 1.0g T=2000 (250°C) 10.913g 0.76g 8.65g 0.0g Data Reflects 16 Data Points for Each Component
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Ni/Pd/Au Pad Performance at 250°C
Ni/Pd/Au Pad Re-Plating Performance at 250°C
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Bond Pull Strength vs. Time at 250°C for ENEPIG Pad Plating, DEERTM
U.S. Department of Defense DER Research (Air Force)
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F-16 P/N (GEN#)
Original
Package
New
Package
Counterfeit
Analysis
Variability
Analysis
Reliabilit
y
Study
DER
HERM
ASSY
SMD
Military
3-T
Electrical
100%
Screen/
Group A
QCI
Group B
QCI
Group C
1K Hour
Life
QCI
Group D
Ext.
2K Hour
Life
AT28C64B
Memory Device
28-pin
SOIC
Plastic
Ceramic-
28 Pin
SideBraze
Authorized
Distributor
- Franchised PASS PASS 100% 100% PASS PASS PASS PASS PASS PASS
XC4013XL
Field Programmable
Gate Array
160-pin
TQFP
Plastic
Ceramic-
144 CQFP
Authorized
Distributor
-
Franchised PASS PASS 100% 100% PASS PASS PASS PASS 7/10/17 PASS
• DER PROCESS PASSED “V” LEVEL TESTING PER MIL-PRF-38535 AND MIL-STD-883 / 5004 & 5005 QCI AND PERFORMS BEYOND 2000 HOUR LIFE TEST. • QCI LIFE TEST EXTENDED FROM 2,000 HOURS TO 4,000 HOURS TO MEET DLA’S NEW TECHNOLOGY INSERTION LIFE TEST REQUIREMENT. • TO DATE THE RESULTS SHOW GCI’S DER PROCESS IS HIGHLY RELIABLE AFTER SUCCESSFUL SCREENING AND QCI IN ACCORDANCE WITH MIL-PRF-38535, MIL-STD-
883/5004/5005. • 100% SCREENED PARTS ARE AVAILABLE FOR LRU AND SYSTEM LEVEL TESTING TO THE USG. • GCI HAS SUCCESSFULLY QUALIFIED A DER PART IN ACCORDANCE WITH MIL-PRF-38535, MIL-STD-883/5004/5005 AND THE NAVY IS PRESENTING A SUCCESS STORY AT
THE NOVEMBER 2016 DMSMS CONFERENCE.
• NET RESULT: GCI HAS BEEN AWARDED A $2.75M CONTRACT WITH THE AIR FORCE TO BUILD AND QUALIFY 20 – 25 OTHERWISE OBSOLETE IC DEVICES
CANDIDATE DEVICE TYPE SELECTED (NAVY)
NM24C04
8-lead Ceramic Side Braze Package
SCD 80202739004
• Process Die Removal
• Hermetic Packaging
• Donor Electrical Variability Analysis
• Reliability Temperature Stress Cycling
• MIL-PRF-38535 Appendix B (V Level)
• 100% Screening 883/5004
• QCI Per 883/5005, 1K Hour Life Test
Donor Device Target Device
Ceramic Package Drawing
17 of 23
NSWC 24C04DMB
Project Franchised
Distributor Only
Pass / Fail?
System and Piece Part Screening
100% “B” Level
Screening Per MIL-
STD-883/5004
QCI Per STD-
883/5005 Groups A,
B, C, D
Life Test 1,000 Hrs.
Candidate Parts Selection
YES 100% Visuals
Pre & Post Burn-in Delta
Measurements
Hermetically Sealed, meeting
SMD Requirements Marking is for
illustration only
Bond Pull Data: Identical Strength for Compound or Single Bonds
DER DEVICE SELECTION, SCREENING & QCI FLOW (NAVY)
NO
100% PIND, Read & Record Data
DER Assembly
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Die Thinning t0 75 um & Stacking
Additional GCI/Force Capabilities
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Additional GCI Capabilities
Vacuum Bake & Sealing
- Low-Pressure (10-5 Torr) Vacuum Bake and Sealing for MEMs Devices – Controlled Cavity/Sealing Atmosphere
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GCI’s Extraction Capability is Proven and Reliable
- Over 100K GCI DERTM Processed ICs Currently in the Field
Standard High-Temperature Packaging Increases Life Times
by More Than 250x for Applications > 150°C)
Ni/Pd/Au Pad Re-Plating Increases Life Times by More than
1000x (for Applications > 150°C)
Ni/Pd/Au Pad Reconditioning DEERTM Allows for Conventional
Assembly with Increased Quality While Maintaining Hi-Temp
Reliability!
Summary of GCI Capabilities/Services
21 of 23
Counterfeit Screening
In-house IC & Hybrid Assembly Facility
Turnkey High-Volume Production IC Solutions for Extreme
Environments (High Shock @ >150°C) as well as
Aerospace, Defense, and Industrial Applications
Quick-Turn Prototype Development
Failure Analysis
Summary of GCI/Force Capabilities/Services
Solutions for Obsolescence
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Die Thinning and Vacuum Sealing
Contact Information
Michael Salmon
Director of Engineering
Tel+44(0)1264 731200
www.forcetechnologies.co.uk (EMEA)
Erick Spory
President & CTO
www.GCI-Global.com (ROW)
ISO 9001:2008 Certified Company
EMEA Distributor/Partner for GCI
DER™ DEER™ are the Registered Trade Marks of Global Circuit Innovations. Presentation in part, shown by kind permission of GCI
AS9100D tba Dec’17 Certified Company