The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications. FC300 covers a large range of bonding forces, from 1 to 4000 N. That makes it perfectly suitable for reflow and thermocompression processes.

The leveling between both components is adjusted before each bonding within 1 µradian. The parallelism adjustment, the high resolution alignment and the perfect control of all bonding parameters allow to achieve submicronic post-bond accuracy.

Applications• Infrared and X-Ray image sensors

• MicroLEDs displays

• Quantum computing

• 3D-integration, Memory stacking

• Optoelectronics and Silicon Photonics

• Flip-chip bonding, Die bonding

• Chip-to-Chip

• Chip-to-Wafer

• Nanoimprinting

Advanced R&D and Pilot line oriented,High accuracy and high force flip-chip bonder 0.5 µm

Highlights• Accuracy* ± 0.5 µm

• Low/High bonding forces• Perfect parallelism control• Confining gas including formic acid• Unique vision system• From R&D to pilot line

*depending on configuration and application.

SET Corporation S.A.Smart Equipment Technology

131 impasse Barteudet 74490 Saint-Jeoire - France • Ph: +33 (0)450 35 83 92 • Fax: +33 (0)450 35 88 01 • Email: info@set-sas.fr

www.set-sas.fr

Represented by:

MachineFootprint 1850 x 1850 mmHeight 2215 mmWeight 3500 kg

Component size

Chip (upper die) 0.2 x 0.2 – 100 x 100 mm Thickness up to 6 mm

Substrate (lower die)0.5 x 0.5 – 200 x 200 mm Thickness up to 6 mm Wafer up to ø 300 mm

Bonding arm

Accuracy* Placement: ± 0.3 µm Post-bond: ± 0.5 µm

Leveling Travel: ±1 degree Resolution: ± 4.2 µrad

Z resolution 0.06 µmForce 1 up to 4000 N

Alignment stageXY stage 395 x 395 mmTheta travel ± 5 degrees

Bonding headsRoom temperature sq. 50 or 100 mmHeating sq. 22, 50 or 100 mm, 450°CUltrasonic 90 kHzUV 120 mW/cm² @ 365 nm

Substrate chucksRoom temperature sq. 50, 100, 150, 200 or ø 300 mm

Heating sq. 50, 100, 150, 200 or ø 300 mm, 400°C

Optics

Digital camera resolution 0.37 µm/pixel Dark/Bright field illumination

Field of view 890 x 680 µmLeveling measurement resolution 8 µrad/pixel Automatic alignment Yes

OptionsAdvanced laser leveling system Ionizer barOptical leveling system Dispenser/Dipping stationSurface imaging system Formic acid for oxide removalLarge field of view camera Face up station High magnification microscope (0.15 µm/pixel)

Nanoimprinting lithography by Hot embossing and UV-NIL

Automatic calibration

Data, design and specifications depend on individual process conditions and can vary according to equipment configurations. Not all specifications may be valid simultaneously. Illustrations, photos and specifications in this datasheet are not legally binding. Specifications are subject to change without prior notice.

*depending on configuration and application.

User benefits• Control of parallelism to guarantee

very high accuracy even under high forces• Hand free/full automated calibration• Automatic cycle and operator independent • High yield thanks to a stiff design• Process recording for development,

log files to track production

10-2

017

Main bonding process• Flip-chip/Die bonding• Thermocompression• Reflow• Gold, Gold/Tin, Indium, Copper

• Direct bonding: Copper to Copper…• UV/Thermal curing adhesives, polymers…• Thermosonic

FC300 Specifications