ADVANCED (PROCESS) TECHNOLOGIES AND EQUIPMENT DESIG N FOR VOLUME PRODUCTION IN MEMS

Margarete Zoberbier, Business Development Manager

26. September 2013

OVERVIEW

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Overview MEMS Equipment & Trends

SUSS Lithography Solutions

SUSS Bonding Solutions

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� SUSS MicroTec: A global leader in semiconductor equipment

� Our equipment and process solutions create the micro structures that build and connect micro electronic devices

� We are focused on high growth market segments: Semiconductors, MEMS, LEDs

� Key Data:

� Stock Exchange Symbol: SMHN

� Share price*: 8.69 €

� Market Cap*: 165 € million

� Net Cash, March 31, 2013: 25.1 € million

SUSS MICROTEC AT A GLANCE

* May 31, 2013

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Sternenfels� Development/production :

� Bonder� Coater and Developer� Photomask Equipment

� Core competencies:

� Wet processing� Wafer bonding

Garching� SUSS MicroTec HQ

� Development/production:

� Mask Aligner� Bond Aligner

� Core competencies:

� Exposure (proximity exposure)

� Alignment

Corona� Development/production:

� Stepper/Scanner� Laser Processing

� Core competencies:

� Exposure(UV projection lithography)

� Laser Ablation

MAIN PRODUCTION SITES

Germany USA

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SUSS MICROTEC – A GLOBAL PLAYER

Sales & Service

Sunnyvale, USCorona, US

Shanghai, CNSingapore, SG

Hwaseong City, KR

Hsin Chu, TW

NORTH AMERICA EUROPE ASIA

Yokohama, JP

Garching, DESternenfels, DE

Neuchâtel, CHLyon, FRCoventry, UK

Production

Headquarters

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Total Sales & Service locations: 13(incl. Representatives)

Total Sales & Service location: 1 Total Sales & Service locations: 12(incl. Representatives)

3 Development & Production sites * 26 Sales & Service locations

MEMS FABRICATION - FROM WAFER TO SENSOR

Wafer Bonder

Mask Aligner

CoaterMask Aligner

Lift-off System

Alignment Verification System

Spin/Spray CoaterDeveloper

Grafiken: Silizium Airbagsensor (von Robert Bosch G mbH)

Cleaning TopographyCoating

AlignmentVerification

Wafer Bonding

Metal Lift-Off

Mounting/ Dicing

Wafer Level Packaging

Inspection/ Testing

Exposure

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MEMS Technology Trend & Requirements

� Smaller Form Factors� Device scaling requires better hermeticity levels within the packages

� Metal Seals provide a pathway to achieve higher hermeticity with smaller seal ring geometries = smaller chip size

� Integration with active devices

� Requires metal interconnects compatible with CMOS process/materials

� Must eliminate Na containing glass products

� Migration to 200 mm

� Superior performance

� Better sensitivity, higher resolution, higher-temperature robustness, …

� precise bond layer thickness control, less post-bond residual stress,

� High Yield and Short Process Cycle Time� Precise temperature / force control

� Capability of fast heating and cooling

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MEMS PROCESS CHALLENGESRESULTING FROM TRENDS

Lithography

� High Aspect Ratio Lithography

� Resolution / Pattern Fidelity

Bonding

� Metal/Eutectic & Low Temp. Bonding

� Precise & fast process parameter control for High Yield

Overall

� Warped & Thin Wafer Handling

� Smaller form factors� Device scaling requires higher resolution and better pattern fidelity of the lithography structures

� Improved alignment accuracy and efficient alignment verification

� Integration with active devices� Requires 3D lithography over topography including high-topography spray coat & develop

� Combines thin and thick resist lithography

� Thin and warped wafer handling

� High yield and short process cycle time� High performance exposure optics with greatest light uniformity

� High throughput and full wafer exposure

MEMS LITHOGRAPHY: TECHNOLOGY TREND & REQUIREMENTS

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PROCESS SOLUTIONS

MaskTrack Pro Wafer Bonder

Process Steps

Markets

Coater/Developer

CoatingDeveloping

Bond AlignmentPermanent BondingTemporary Bonding

Photomask Cleaning

Frontend Backend

Products

Exposure Tools

Alignment ExposureNano Imprinting

Mask Making

Advanced Packaging

3D Integration

MEMS

LED

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SUSS MEMS TOOLS

Product Lines

Automated≤ 200 mm

ProductionEquipment

ACS 200 Gen III

Wafer Bonders

CBC 200

Mask Aligners

MA 200 compact

Coaters/Developers

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EXPOSURE AND LASER STRUCTURING

Industrial Research / Universities

LED MEMS3D/ADPS

US

S

Mic

roTe

c Mask Aligner Mask AlignerMask Aligner

Tam

arac

k Projection /Laser Ablation

Projection /Laser Ablation

ElectronicsFlexible

Electronics Medical

Laser AblationLaser Ablation

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MA200COMPACT – ANGLE EXPOSURE SYSTEM

� Angular illumination system:

45° Exposure

60° Exposure

90° Exposure

Applications:� Photolithography in vertical trenches or in/on micro mechanical structures

MA200Compact with Angle Exposure System

d

g

gggg – exposure gap

vd

g

gggg – exposure gap

v

SUSS 3D – SPRAY COATING

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Main Advantages

• no striations or comet tail

• excellent coating uniformity within wafer

• perfect conformal coatings over various topography shapes

excellent coating uniformity within wafer and from wafer to wafer

>200µm

� Conformal resist on trench structures.50 µm and 150 µm features resolved across a 200 µm deep trench.

� 10 µm holes resolved at the bottom of 80 µm deep vias

EXAMPLES – TOPOGRAPHY LITHOGRAPHY

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EXAMPLES – PROJECTION LITHOGRAPHY THICK RESIST

30 µm vias in 100 µm WBR2100

Honey comb in 860 µm SU-8

40 µm vias in 80 µm AZ125nXT 5 µm vias in 10 µm AZ10XT

6 and 7 µm L/S in 15 µm AZ4620 6 µm vias in 10 µm HD8820 PBO

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EXAMPLES – THICK RESIST

Copper coil, 20 µm high200 µm SU-8 Resist

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� Special Substrate Handling� Simultaneous handling of two consecutive

wafer sizes� Edge handling from 2“ to 200 mm wafer� Thin wafer handling

� Thin / Thick Resist Coating� Resist dispense systems for material

viscosities from below 1cps up to 55.000cps

� Process Flexibility� Handling of wafers with different processes

at the same time in the same machine

� Technologies� Spray coating� Edge coating� Spray develop

ACS200 Gen3 – FOR MEMS MARKET

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Courtesy: micro resist technology

PROCESS SOLUTIONS

MaskTrack Pro Wafer Bonder

Process Steps

Markets

Coater/Developer

CoatingDeveloping

Bond AlignmentPermanent BondingTemporary Bonding

Photomask Cleaning

Frontend Backend

Products

Exposure Tools

Alignment ExposureNano Imprinting

Mask Making

Advanced Packaging

3D Integration

MEMS

LED

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WAFER BONDER PRODUCT PORTFOLIO

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Manual Equipment(Small pieces to 200mm)

SB6L / SB8L SB6e / SB8e

Automated Equipment (200mm and 300mm)

XBC300

Semi-Automated andAutomated Equipment

(up to 200mm)

CB200M ABC/CBC200 XBS300XBC300 Gen2

� Smaller form factors� Device scaling requires better hermeticity levels within the packages

� Metal Seals provide a pathway to achieve higher hermeticity with smaller seal ring geometries = smaller chip size

� Integration with active devices� Requires metal interconnects compatible with CMOS processes and materials

� Low temperature bonding

� Must eliminate sodium containing glass products

� High yield and short process cycle time� Precise temperature and force control

� Improved temperature and pressure uniformity

� Capability of fast heating and cooling

MEMS WAFER BONDING: TECHNOLOGY TREND & REQUIREMENTS

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BONDING PROCESSES WITH TYPICAL BOND TEMPERATURES

w/o Intermediate Layer

w/ Intermediate Layer

Fusion EutecticMetal

DiffusionAnodic

Plasma Activation

Wet Chemical

Adhesive

AuSn/290℃℃℃℃AuSi/390℃℃℃℃AlGe/430℃℃℃℃CuSn/240℃℃℃℃

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Au-Au/300 ℃℃℃℃Al-Al/400 ℃℃℃℃

Cu-Cu/350℃℃℃℃

BCB/250℃℃℃℃Polyimide/300 ℃℃℃℃

Epoxy/160 ℃℃℃℃Silicone/200 ℃℃℃℃

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GlassFrit

Pb-free/450℃℃℃℃

Si/SiO 2/1000℃℃℃℃

Pyrex/370℃℃℃℃,400V

Hydrophilic/200 ℃℃℃℃

UHV/RT

Permanent Bonding

Temporary Bonding and De-Bonding

Thermal Slide

Traditional

CuSn/270℃℃℃℃AuIn/180℃℃℃℃

TLP/SLID

Laser Lift-Off

Future Trend

Room Temperature Peel-Off

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� CBC200 designed for 200mm Advanced MEMS, LED & 3D Applications

� CBC200 platform developed to deliver the upmost process and production flexibility

� Temperature & pressure uniformity that meet and exceed the demanding requirements for metal and eutectic bonds used in MEMS for hermetic sealing and 3D stacking with TSV’s

PRODUCTION WAFER BONDER

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� Modular Cluster Design

� Total Process Flexibility

� Enabling Technology for Advanced

MEMS & 3D Integration

� Intuitive Software for EasyProgramming of Process Recipes

� Performance Data� Uptime: 92%

� MTBF: 200 hours

� MTTR: 4 hours

CBC200 WAFER BONDER FOR MEMS & 3D

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� “Pressure Column” Design � Ensures excellent pressure uniformity across

entire wafer surface� Selectable wafer sized column of high-pressure

instead of a single point piston pressure� Symmetric top & bottom pressure columns

� Rigid “Superstructure” � Load support structure separated from process chamber� Chamber designed to control atmospheric conditions

without impact from load

� Symmetric Top & Bottom Heater Design � Mechanical heater assembly matched to substrate

materials� Parasitic heat loss eliminated through vacuum isolation � Multi-zone heating eliminates conductive heat losses

CB200 BOND CHAMBER: PATENT FEATURES

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� To meet the new digital generation requirement of “anytime, anywhere and anyplace”, a new type of product development strategy structure for MEMS is necessary.

� From previous perpective as a component, the MEMS industry has matured towards a more systems perspective which can propel its own growth.

� MEMS based applications� Home gateways

� Home automation

� New Human Machine Interface (HMI)

� Reltime on-line human health detection

� Preventive biochip medicines

� Fabric embedded MEMS devices for clothing

� Devices enabling heterogeneous network connections

� Sensors embedded within heterogeneous network for IoT strategy

� etc.

OUTLOOK

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� To capture new market growth opportunities, it is essential to effectively integrate and leverage various resources from design, fabrication, and packaging, and more towards consumer testing in order to develop cost-effective and viable products which can contribute to the advancement of society.

SÜSS MicroTec Lithography GmbH

Schleissheimer Str. 90

85748 Garching

www.suss.com

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