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ADVANCED CMOS TECHNOLOGY 2020(The 10/7/5 nm Nodes)May 27, 28, 29, 2020; An ONLINE Course
1. Detailed step-by-step 10/7 nm FinFET fabrication process (front-end & back-end)
2. FinFET manufacturing issues and solutions
3. 5 nm Horizontal Nanowire fabrication process flow
4. DRAM Memory Fabrication and Yield Issues
5. Detailed 3D Flash fabrication process flow and manufacturing issues
6. Future memory technologies
7. Extensive SEM/TEM Survey of Leading-edge devices
8. EUV Applications, Power Solutions and Status Update
9. 3D Packaging Versus 3D Monolithic packaging status update
10. CMOS Technology Forecast: 5 nm, 3 nm, 2 nm nodes
COURSE CONTENT IS UPDATED & TECHNICALLY CURRENT THROUGH MAY 2020
© 2020 Threshold Systems Inc. All rights reserved.
www.ThresholdSystems.com
COVERED ARE 10/7NM FINFET, 3D FLASH AND 5NM NANOWIRE
FABRICATION DETAILS
THE 10/7/5 NM NODES
This is the best and the most important course that you
can attend this year to learn about the key technical break-
throughs in Logic and Memory that have enabled 10/7 nm
node technology, and the manufacturing challenges of 3D
Flash, 7 nm FinFETs and 5 nm Nanowires.
Course Contents
Online Learning
© 2020 Threshold Systems Inc. All rights reserved.
1. Process integration. The 10/7 nm technology nodes represent landmarks in semiconductor manufacturing.
•Theenduringmythofatechnologynode •Marketforces:theshifttomobileapplications •TheIdsatequation •Ion/Ioffcurves,scalingmethodology 2. Detailed 10/7 nm FinFET Fabrication Sequence. The FinFet
represents a radical departure in transistor architecture. • Adetailedstep-by-step10/7nmFinFETfabricationprocess• FinFETHigh-k/MetalGateintegration• CobaltcontactsandCobaltmetallines•DetailsofBack-Endmetallizationmethodologiesandair-gapdielectrics
3. Nanowires at the 5 nm Node •ThedrivetoGate-All-Around(GAA)devices •NanowireSCEcontrolandscaling •Adetailed5nmNanowirefabricationprocess •Keyfabricationdetailsandmanufacturingproblems •VerticalversushorizontalNanowires:advantagesand disadvantages
4. Planar Flash & DRAM Memory. •DRAMmemoryfunctionandnomenclature •DRAMscalinglimits •Thecapacitor-lessDRAMmemorycell •PlanarFlashoperationandfunction •PlanarFlashscalingtechniques
5. 3D Flash Memory •Adetailedstep-by-stepSamsung3DNAND Flashfabricationprocess •Staircasefabricationmethodology •TheroleofALDin3DFlashfabrication •TheIntel-Micron3DNANDprocess
6. Advanced Lithography. •PhysicalLimitsofLithographyTools •ImmersionLithography–principlesandpractice •Double,TripleandQuadruplepatterning •EUVLithography:status,problemsandsolutions •ResolutionEnhancementTechnologies •Photoresist:chemicallyamplifiedresistissues •EmergingLithographyTechnologies(DSA)
7. Emerging Memory Technologies. •Cross-pointmemory •PhaseChangeMemory(PCRAM) •ResistiveRAM(ReRAM) •SpinTorqueTransferRAM(STT-RAM)–thebrightest prospect?
8. Survey of leading edge devices. This part of the course presents a visual feast of TEMs and SEMs of real-world, leading edge devices for Logic, DRAM, and Flash memory. It is presented by Dick James, the Fellow Emeritus of TechInsights.
9. 3D Packaging versus Monolithic 3D - which way to go? •TSVtechnology:design,processingandproduction •Interposers:theshortcutto3Dpackaging •Monolithic3Dfabricationprocesses •Annealing3DMonolithicstructures •TheInternetofThings(IoT).
10. The Way forward: a CMOS technology forecast. •Thetransitionto3Ddevices(Logic&FlashMemory) •TheFutureofMemoryandLogic •NewnanoscaleeffectsandtheirimpactonfutureCMOS device architecture and materials •Futuredevices:Quantumwelldevices,TunnelFETsandQuantumWires •IsMoore’slawfinallycomingtoanend?
Advanced CMOS Technology - An Online Course
TheCovid-19pandemicandthetravelrestrictionsithasimposedhavechangedthelandscapeoftechnicalinstructionfromtraditionalinstructor-leadclassroomlearningtowardadistributedlearningexperiencethatenablestheinstructorandthestudentstobeinsociallydistantlocations.Thislearningsolutioneliminateshighcostandinconvenienceassociatedwithhavingstudentstraveltoonelocationforinstruction.Itoffersasafe,flexibile,convenientandlessexpensivelearningexperiencethattraditionalclassroominstructiondoesnothave.Itisalsoidealforcompanieswithaglobalbusinessmodelandwhoseemployeesarescatteredaroundtheworld.
• EquipmentSuppliers&MetrologyEngineers• FablessDesignEngineersandManagers• FoundryInterfaceEngineersandManagers• DeviceandProcessEngineers• Design Engineers
• ProductEngineers• ProcessDevelopment&ProcessIntegrationEngineers• ProcessEquipment&MarketingManagers• MaterialsSuppliers&ApplicationsEngineers• PatentAttorneys
Dr. Moshe Preil isaworld-classlithographerwithover30yearsofexperienceinthefield.HehasworkedatAMD,Luminescent,ASMLandmostrecentlyhewastheManagerofEmergingLithographyTechnologyatGlobalFoundries.CurrentlyheistheSeniorMarketingManagerinthePatterningDivisionatKLA-Tencor.Hehasleadteamstaskedwithinvestigatingstate-of-the-artLithographytoolsandprocessessuchasDirectedSelfAssembly(DSA)ande-BeamDi-rectWrite(EBDW)aswellasmanagedanEUVlithographytool.Adramaticandengagingpublicspeaker,Dr.Preilhastaughtnumerouscoursesonthesubjectofopticallithography,haspublishedextensivelyinthisfield,andiswidelyregardedasagiftedandinspiringinstructor.
Dick James is theFellowEmeritus forTechInsights, anOttawa,Canada-based reverseengineeringcompany thatspecializesinsemiconductorsandelectronicsystems.
DickjoinedTechInsightspredicessor,Chipworks,in1995andactsasaconsultanttoTechInsights’staffandcustom-ers,dealingwith themicrostructural characterizationofdevices,bothprocess andpackaging.He is alsoamuchsought-afterspeakerat technicalconferencesandapopularbloggeratTechInsights.comandElectroIQ.com,andotherpublications.
Dickgraduatedin1971withaM.Sc.inMicroelectronicsandSemiconductorDevicesfromtheUniversityofSouthamp-toninEngland,andaB.Sc.inAppliedChemistryfromtheUniversityofSalford.Hehasover40years’experienceinprocessdevelopment,design,manufacturing,packagingandreverseengineeringofsemiconductordevicesandisaworldauthorityontheinterpretationandanalysisofScanningandTransmissinElectronMicrographs.
Jerry Healeyhasbeenatechnicalprofessionalinthesemiconductorindustryfor30years,8yearsofwhichwerespentasaDeviceEngineeratMotorolaSemiconductor.HewasformerlyaninstructorforUCBerkeleyExtension(College of Engineering), andwas also employed as a Process Integration Engineer at both Sematech and theAdvancedTechnologyDevelopmentFacility(ATDF),whereheworkedonadvancedtechnologynodedevelopment.
Heisarenownedlecturerinthefieldofsiliconprocessing,andhisareasofexpertiseincludeprocessintegration,technologytransferofnewprocessesfromR&Dintomanufacturing,NanowireandFinFETfabrication.Hisaudienc-esrememberhimforthebreadthofhisknowledgeregardingsemiconductormanufacturing,hisengaginglecturestyle,andtheinsightfulcolorgraphicsheusestoillustratehislectures.
Thebestinstructorsinthebusinessteachthiscourse.Alloftheinstructorsareworld-classexpertsintheirfields,withdecadesofin-dustryexperience.However,thesepresentershavebeenselectednotjustfortheirdeeptechnicalexpertise,butalsofortheirabilitytopresentcomplextechnicalinformationinaclearandengagingmanner.Eachoftheseinstructorsisanexperiencedandskilledpublicspeaker,andtheaccompanyingcoursenotesforthisseminarareprofuselyillustratedwithhigh-quality3DcolorgraphicsandrelevantSEMsandTEMs.Wewantyoutoleavethiscoursewithaclearunderstandingofthekeyenablingtechnologiesthathavemadethe10/7nmnodetechnologiesareality,aswellasanunderstandingofwhatthecentraltechnicalchallengesareforthe5nmnode.Afteryouhavecompletedthiscourseyouwillneveragainleaveameetingwonderingwhatpeopleweretalkingabout.
How Online Learning Works:
Threshold Systems, Inc.,
527QueenAnneCourt,
San Antonio, TX 78229
512-576-6404www.ThresholdSystems.com
ADVANCED CMOS TECHNOLOGY - AN ONLINE COURSE MAY 27, 28, 29, 2020
$1,695
© 2020 Threshold Systems Inc. All rights reserved.
Who Should Attend:
Shortlyafterregisterationyouwillbeemailedalinkthatwilltakeyoutotheonlineclassroomthedayofthecourse.TheweekbeforetheclassbeginsabinderofcolorcoursenoteswillbeshippedtoyouviaFedexorUPS.
TheclassisthreedayslongandwillbeginonMay27,2020at8:30PDT.Onthatdayyousimplyclickonthelinkthathasbeenprovidedandyouwillbeseamlesslytakentotheonlineclassroomwhereyouwillbeabletosee,hearandinteractwiththeinstructor.
Tuition:
Course Instructors: