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Profile (Headquarters)
Name: Active Sales Associate Inc. LTD. Established: 1993 Address: 7441 114th Ave Suite 606, Largo, FL USA Employees: 30 Organization: Sales, Marketing, Administration, Quality and Engineering
President
V.P of sales
Technical
Sales
Inside Sales
Support Quality Engineering Administration
Profile (MN Sales Office)
MN Sales Office Location and Contacts: 11044 Industrial Circle NE, Suite N Elk River, MN 55330
Mike Dupont Jeff Scotting VP North America Sales / ITAR Technical Sales [email protected] [email protected] Tel: 763-229-2867 Tel: 763-441-7541 Fax: 763-445-2219 Fax: 763-445-2219 Shelly Bialka Inside Sales Mgr. [email protected] Tel: 763-441-1239 Fax: 763-445-2219
Profile (Century PCB)
Name: Century PCB Established: 1998 Address: Taoyuan, Taiwan Employees: 300 Sales Revenue: US $40 Million Organization: Research, Development & Manufacturing. Certification: ISO9001, TS16949, AS9100, ISO13485, ITAR & UL #E189010 Capability: 1-36 layer - Including metal back
Organization Chart
President
MFG V.P.
Engineering Quality Management Admin Manufacturing Sales &
Shipping
Technology Capability (1/7) Item Capability Note
1 Board thickness and Layers
1.1 Finished board thickness Min. 4 Layer: 12 Mil. Min. (0.3MM)
6 Layer: 18 Mil. Min. (0.45MM)
Max. 185 Mil. Max. (4.625MM)
1.2 Finished board thickness tolerance
Thickness (Mil.)
<30 >30
Thickness (Mil.)
±3 Mil. ±10 %
1.3 Max. layer count 36
2 Mechanical Drilling (Finished board thickness .062 Mil.)
2.1 Diameter 6 Mil. (0.15MM) Min. 250 Mil. (6.35MM) Max.
2.2 Hole Position Tolerance ±2 Mil.
2.3 Finished Dia. Tolerance
2.3.1 Plated Through Hole ±3 Mil.
2.3.2 Non-Plated Through hole ±2 Mil.
2.3.3 Press-Fit Hole ±2 Mil.
2.4 Thru-Via diameter 6 Mil. (0.15MM)
2.5 Thru-Via Aspect Ratio 10:1
2.6 Thru-Via Pad Dia. (min) 16 Mil. (0.4MM)
2.7 Min. Gap Hole to Hole 5 Mil. Min.
2.8 Min. Pad Size 16 Mil. Min.
Technology Capability (2/7) Item Capability Note
3 Laser Drilling
3.1 HDI Production Method Sequential Lamination
Build-up Method (CO₂ Laser)
3.2 Micro-Via Formation Method
Direct Laser Drill, Conformal Windows, Enlarge Windows.
3.3 Build-Up Dielectric FR4, RCC
3.4 Hole Diameter by Laser 4-6 Mil
3.5 Via. Aspect Ratio 1:0.8
(Dia. 5 Mil. ; PP Thickness, 4 Mil. Max.)
3.6 Blind Hole Position Tolerance
3.6.1 Blind Hole Bottom Position
2 Mil.
3.6.2 Capture Pad A/R(Y) 2 Mil.
3.7 Blind Hole Angle to Bottom (Z)
75° +15°/-10°
Technology Capability (3/7) Item Capability
4 Line Thickness (T)
4.1.1 Inner Layer
0.5 OZ : 0.45 Mil. (11.4µm) Min. Per: IPC-6012
1 OZ : 0.98 Mil. (24.9µm) Min.
2 OZ : 2.19 Mil. (55.7µm) Min.
3 OZ : 3.41 Mil. (86.6µm) Min.
4 oz : 4.63 Mil. (117.5µm) Min.
4.1.2 Outer Layer (Plated + Foil)
0.5 OZ : 1.3 Mil. (33.4µm) Min. Per. IPC-6012
1 OZ : 1.89 Mil. (47.9µm) Min.
2 OZ : 3.10 Mil. (78.7µm) Min.
3 OZ : 4.28 Mil. (108.6µm) Min.
4 OZ : 5.49 Mil. (139.5µm) Min.
4.2 Line Width (W1)
4.21 Inner Layer
0.5 OZ : 3 Mil. (76.2µm) Min. Per. IPC-6012
1 OZ : 4 Mil. (101.6µm) Min.
2 OZ : 5 Mil. (127.0µm) Min.
3 OZ : 7 Mil. (177.8µm) Min.33333
4 OZ : 8 Mil. (203.2µm) Min.
5 OZ : 9 Mil. (228.6µm) Min.
4.22 Outer layer 1/3 OZ : 3 Mil. (76.2µm) Min. /3 Mil. Per. IPC-6012
0.5 OZ : 4 Mil. (101.6µm) Min. /4 Mil.
1 OZ : 5 Mil. (127µm) Min. /5 Mil.
2 OZ : 8 Mil. ( 203.2µm) Min. /8 Mil.
3 OZ : 9 Mil. (228.6µm) Min. /9Mil.
4 OZ : 10 Mil (254µm) Min. /10 Mil.
5 OZ : 12 Mil. (279.4µm) Min. /12 Mil.
Technology Capability (4/7) Item Capability Note
4.3 Letter Screen Tolerance ±20% or ±0.001” (Trace Width ≥ 8 Mil.
4.4
Conductive Test Position
CSP, GF : Top (W1); PCB : Bottom (W2)
CSP, BGA, SMD, Wire Bonding
5.1 Layer to Layer Tolerance (X)
±3 Mil. (6 Mil.)
Hole Center to Hole Center
5.2 Annual Ring (outer Edge)
PTH R : 2 Mil. Min. (Class 3) Per. IPC-6012
NPTH
R : 6 Mil. Min. (Class 3)
Per. IPC-6012
5.3 7 % Special Impedance
6 Plating
6.1 Surface Thickness Average 0.984 Mil. (25µm) Class 3 Per. IPC-6012
Minimum 0.787 Mil. (20µm) Min. Class 3
R R
R
Technology Capability (5/7) Item Capability Note
6.2 Normal Hole Wall Thickness
6.21 Average 0.984 Mil. (25µm) Class 3 Per. IPC-6012
6.22 Min. .0787 Mil. (20µm) Min. Class 3 Per. IPC-6012
6.2.3 Wrap 0.472 Mil. (12µm) Class 3 Per. IPC-6012
6.3 Micro-Via Hole Thickness
6.3.1 Average 0.472 Mil. (12µm) Class 3 Per. IPC-6012
6.3.2 Min. 0.394 Mil. (10µm) Min. Class 3 Per. IPC-6012
6.3.3 Wrap Plating 0.236 Mil. (6µm) Class 3 Per. IPC-6012
6.4 Hole Copper Adhesiveness >35kg/cm Per. IPC-6012
6.5 Durability 288±5°C, 10 Sec. Per. IPC-TM-650
7 Solder Mask
7.1 Dielectric Strength 1000VDC/0.025mm Min. Per. IPC-SM-840
7.2 Position Tolerance ±2.0 Mil. Per. IPC-SM-840
7.3 Max Plugged Hole Diameter 0.0197 Mils. Per. IPC-SM-840
7.4 Adhesion (Tape Test) 2 Mil. Per. IPC-SM-840
Technology Capability (6/7) Item Capability Note
7.5 Thickness (1 Time Printing)
A: 0.4 Mil. Min. Solder mask brands:
0.6 Mil. Max. Green: Tamura, Taiyo Matte Green: Advance, Taiyo Blue: Onstatic Tech, Taiyo Matte Blue: Onstatic Red: Taiyo Matte Red: Onstatic Black: Onstatic, Taiyo White: Taiyo – PSR4000 WT02 & WT05
T: 0.5 Mil. Min.
1.0 Mil. Max.
S: 0.7 Mil. Min.
2.0 Mil. Max.
7.6 Solder Mask Dam (Green Solder mask)
7.6.1 Dam Width .003 Mil. Min. All other colors 5 Mil. Min.
7.6.2 Distance Dam to Pad .002 Mil. Min.
7.6.3 Distance Pad to Pad .007 Mil. Min.
8 Silkscreen
8.1 Width .005 Mil.
8.2 Character Height .032 Mils.
8.3 Position Tolerance ±.003 Mils.
8.4 Color White, Yellow, Black, Gray Other colors available upon request
8.5 Type Heat Curing, UV
Technology Capability (7/7) Item Capability Note
9 Surface Finish
9.1 Hot Air Leveling
9.1.1 Thickness
100µ”-1000µ”
X-Ray, 3MMx3MM Pad.
9.1.2 Content (Hot Air Leveling) 63%SN(±1%), 37%Pb, Impurity<0.4% ANSI/J-STD-003 3.2.1
9.1.3 Content (Lead Free Hot Air) 100% Sn (Sn-Ag-Cu)
9.2 ENIG Thickness
9.2.1 Gold Thickness 2-10µ” Max. X-Ray, 3MMx3MM Pad.
9.2.2 Nickel Thickness 200µ” Max.
9.2.3 Hardness 560HV
9.3 Gold Finger
9.3.1 Gold Thickness 50µ” Max. (30µ” Preferred)
9.3.2 Nickel Thickness 118µ” Min. - 200µ” Max.
9.3.3 Hardness (Hard Gold) 260-270HV
Current Certifications
Major Customers
Overview
Profile (Century PCB)
Established: 1993 New Facility Completed in 2016 Address: Kunshan City, China Building Area: 470,000 Square Feet. PCB Fabrication Size: 200,000 Square Feet. Employees: 380 (1st stage), 600 (2nd Stage) Organization: Research, Development & Manufacturing. Certification: ISO9001, TS16949, ISO14001 & UL #E189010 Capability: 1-12 layers Capacity: 40,000 square Meters (1st stage); 70,000 square Meters (2nd stage)
Organization Chart
Technology Capability (1/5) General Capability Y2016 Y2017 Y2018
Material
Material Type
Cem-3, FR4 140-170, Lead free & Halogen Free
Layer Count
2- 8
2-14
2-14
Maximum Board Size
24.49 x 21.50
24.49 x 21.50
24.49 x 21.50
Minimum Board Thickness
0.015 Mils.
0.012 Mils.
0.012 Mils.
Maximum Board Thickness
0.093 Mils.
0.125 Mils
0.156 Mils.
Minimum Core Thickness (I/L)
0.004 Mils.
0.003 Mils.
0.002 Mils.
Minimum Cu Thickness (Base)
0.047 Mils.
0.047 Mils.
0.047 Mil.s
Maximum Cu Thickness (Base)
0.0042 Mils (3 oz.)
0.0042 Mils (3 oz.)
0.0056 Mils. (4 oz.)
Technology Capability (2/5) General Capability Y2016 Y2017 Y2018
Finished Board Thickness Tolerance
Finished Board Thickness >0.039 Mils. ±10% ±10% ±10%
0.6mm <Finished Board Thickness ≤0.039 Mils. ±10% ±10% ±10%
Finished Board Thickness ≤0.02362 ±3% ±3% ±3%
Traces & Pads
Minimum Line Width & Space .004 Mils. / .004 Mils. .003 Mils. / .003 Mils. .003 Mils. / .003 Mils.
Trace Width Tolerance (≥0.00394) <.005 Mils. : ±.001 Mil. ≥.005 Mils. : ±20%
<.005 Mils. : ±.001 Mil. ≥.005 Mils. : ±20%
<.005 Mils. : ±.001 Mil. ≥.005 Mils. : ±20%
Impedance Control Tolerance ±10% ±8% ±8%
Minimum SMT Pad / Pitch .0098 Mils. (.25mm) Pad. .0157 Mils. (.40mm) Pitch
.0098 Mils. (.25mm) Pad. .0157 Mils. (.40mm) Pitch
.0079 Mils. (.20mm) Pad. .0157 Mils. (.40mm) Pitch
Minimum BGA Pad / Pitch .0118 Mils. (.30mm) Pad. .0256 Mils. (.65mm) Pitch
.0118 Mils. (.30mm) Pad. .0256 Mils. (.65mm) Pitch
.0098 Mils. (.25mm) Pad. .0236 Mils. (.60mm) Pitch
Pattern to Outline Tolerance ±5% ±5% ±5%
Technology Capability (3/5)
General Capability Y2016 Y2017 Y2018
Drilling And Routing
Min. Mechanical Drill Size 0.0098 0.0078 0.0078
Drilling Hole to Hole Accuracy ±0.003 Mils. ±0.003 Mils. ±0.003 Mils.
Routing Edge to Edge Accuracy ±0.004 Mils. ±0.004 Mils. ±0.004 Mils.
Stamping Edge to Edge Accuracy ±0.003 Mils. ±0.003 Mils. ±0.003 Mils.
Score V-Cut Edge to Edge Accuracy ±0.004 Mils. ±0.004 Mils. ±0.004 Mils.
Aspect Ratio (Drill Thru Via) 6.5:1 8:1 8:1
NPTH Diameter Tolerance ±0.002 Mils. ±0.002 Mils. ±0.002 Mils.
PTH Diameter Tolerance ±0.003 Mils. ±0.003 Mils. ±0.003 Mils.
Hole to Hole Accuracy ±0.003 Mils. ±0.003 Mils. ±0.003 Mils.
Technology Capability (4/5)
General Capability Y2016 Y2017 Y2018
Solder Mask and Electrical Testing
Min. Solder Mask Dam Width (Green Mask) ±0.003 Mils. ±0.003 Mils. ±0.003 Mils.
Min. Solder Mask Dam Width (All other Colors) ±0.005 Mils. ±0.005 Mils. ±0.004 Mils.
Solder Mask Plugged Hole Diameter (Max.) ≤0.0197 Mils. ≤0.0197 Mils. ≤0.0197 Mils.
Solder Mask Registration Tolerance ±0.0025 Mils. ±0.0025 Mils. ±0.0025 Mils.
Maximum Test Points – Bare Board 16,000 20,000 20,000
Electrical Test Conditions 250 V 0:20Ω/S:30Ω
250 V 0:20Ω/S:30Ω
250 V 0:20Ω/S:30Ω
Maximum Board Array Size – Electrical Testing 15.75 x 21.65 15.75 x 21.65 15.75 x 21.65
Technology Capability (5/5)
General Capability Y2016 Y2017 Notes
Surface Finishes
OSP Yes Yes 7.87 -15.75µ”
ENIG Yes Yes Nickel Thickness: 118 -150µ” Gold Thickness: .98 -3µ”
Selective ENIG Yes Yes Nickel Thickness: 118 -150µ” Gold Thickness: .98 -3µ”
Hard Gold Yes Yes Nickel Thickness: 118 -150µ” Gold: 7.87 – 39.37µ”
Lead Free Hot Air Leveling Yes Yes 100 -1000µ”
Order Process
Order Process
Production Process (1 of 17)
Etching+
Brown OxidePressing
Lab
Sidewalk
Sidewalk
Sidewalk
Vacuum
Etching
Dry Film+
ExposureLay-up
Sidewalk
Sidewalk
Dry Film+
Exposure
Pattern
Plating
Negative Film
House
Developing
Marerial
Warehouse
Cuttting
CNC Drilling
DMSE double Side
Multila
yer
Material Cutting Machine
Auto-edge Grinding Machine
Production Process (2 of 17)
Inner Layer Etching Line
Brown Oxide Line
Etching+
Brown OxidePressing
Lab
Sidewalk
Sidewalk
Sidewalk
Vacuum
Etching
Dry Film+
ExposureLay-up
Sidewalk
Sidewalk
Dry Film+
Exposure
Pattern
Plating
Negative Film
House
Developing
Marerial
Warehouse
Cuttting
CNC Drilling
DMSE double Side
Multila
yer
Production Process (3 of 17)
CEDAL Laminate Machine
Etching+
Brown OxidePressing
Lab
Sidewalk
Sidewalk
Sidewalk
Vacuum
Etching
Dry Film+
ExposureLay-up
Sidewalk
Sidewalk
Dry Film+
Exposure
Pattern
Plating
Negative Film
House
Developing
Marerial
Warehouse
Cuttting
CNC Drilling
DMSE double Side
Multila
yer
Production Process (4 of 17)
Drill Machines
Hitachi Drills
Etching+
Brown OxidePressing
Lab
Sidewalk
Sidewalk
Sidewalk
Vacuum
Etching
Dry Film+
ExposureLay-up
Sidewalk
Sidewalk
Dry Film+
Exposure
Pattern
Plating
Negative Film
House
Developing
Marerial
Warehouse
Cuttting
CNC Drilling
DMSE double Side
Multila
yer
Production Process (5 of 17)
PTH Line
Sidewalk
Sidewalk
Dry Film+
Exposure
Pattern
Plating
Negative Film
House
Developing
Marerial
Warehouse
Cuttting
CNC Drilling
DMSE
Etching+
Brown OxidePressing
Lab
Sidewalk
Sidewalk
Sidewalk
Vacuum
Etching
Dry Film+
ExposureLay-up
double Side
Multila
yer
Production Process (6 of 17)
Auto-Press Film Machine
CCD-exposure Machine *Class 10000 level clean Room.
Etching+
Brown OxidePressing
Lab
Sidewalk
Sidewalk
Sidewalk
Vacuum
Etching
Dry Film+
ExposureLay-up
Sidewalk
Sidewalk
Dry Film+
Exposure
Pattern
Plating
Negative Film
House
Developing
Marerial
Warehouse
Cuttting
CNC Drilling
DMSE double Side
Multila
yer
Production Process (7 of 17)
Developing Line Etching+
Brown OxidePressing
Lab
Sidewalk
Sidewalk
Sidewalk
Vacuum
Etching
Dry Film+
ExposureLay-up
Sidewalk
Sidewalk
Dry Film+
Exposure
Pattern
Plating
Negative Film
House
Developing
Marerial
Warehouse
Cuttting
CNC Drilling
DMSE double Side
Multila
yer
Production Process (8 of 17)
Pattern Plating Line
Automatic larger pattern plating, Auto-add and control chemical, current, density, current time & fail warning.
Sidewalk
Sidewalk
Dry Film+
Exposure
Pattern
Plating
Negative Film
House
Developing
Marerial
Warehouse
Cuttting
CNC Drilling
DMSE
Etching+
Brown OxidePressing
Lab
Sidewalk
Sidewalk
Sidewalk
Vacuum
Etching
Dry Film+
ExposureLay-up
double Side
Multila
yer
Production Process (9 of 17)
Vacuum Etching Line
Sidewalk
Sidewalk
Dry Film+
Exposure
Pattern
Plating
Negative Film
House
Developing
Marerial
Warehouse
Cuttting
CNC Drilling
DMSE
Etching+
Brown OxidePressing
Lab
Sidewalk
Sidewalk
Sidewalk
Vacuum
Etching
Dry Film+
ExposureLay-up
double Side
Multila
yer
Production Process (10 of 17)
Solder Mask Pre-Treatment
Solder Mask Pre-Treatment Sidewalk
OSP
Sidewalk
E/T+FQC
Sidewalk
Screen Room
S/M printing+S/M Exposure
Legend Print
Warehouse
Tooling Room
Packing
Sidewalk
pre-treatmentDeveloping
ENIG
CNC+Cleaning
Production Process (11 of 17)
Solder Mask Printing Line
Automatic Spray Coating Line
Sidewalk
pre-treatmentDeveloping
ENIG
CNC+Cleaning
Sidewalk
OSP
Sidewalk
E/T+FQC
Sidewalk
Screen Room
S/M printing+S/M Exposure
Legend Print
Warehouse
Tooling Room
Packing
Production Process (12 of 17)
Solder Mask Developing Line
Solder Mask Baking Ovens
Sidewalk
pre-treatmentDeveloping
ENIG
CNC+Cleaning
Sidewalk
OSP
Sidewalk
E/T+FQC
Sidewalk
Screen Room
S/M printing+S/M Exposure
Legend Print
Warehouse
Tooling Room
Packing
Production Process (13 of 17)
Letter Screen Printing
Letter Screen Inkjet Printer
Sidewalk
pre-treatmentDeveloping
ENIG
CNC+Cleaning
Sidewalk
OSP
Sidewalk
E/T+FQC
Sidewalk
Screen Room
S/M printing+S/M Exposure
Legend Print
Warehouse
Tooling Room
Packing
Production Process (14 of 17)
Immersion Gold Line
Sidewalk
pre-treatmentDeveloping
ENIG
CNC+Cleaning
Sidewalk
OSP
Sidewalk
E/T+FQC
Sidewalk
Screen Room
S/M printing+S/M Exposure
Legend Print
Warehouse
Tooling Room
Packing
Production Process (15 of 17)
Routing
V-Scoring
Sidewalk
pre-treatmentDeveloping
ENIG
CNC+Cleaning
Sidewalk
OSP
Sidewalk
E/T+FQC
Sidewalk
Screen Room
S/M printing+S/M Exposure
Legend Print
Warehouse
Tooling Room
Packing
Production Process (16 of 17)
Flying Probe Tester
Automatic E/T Machine
Sidewalk
pre-treatmentDeveloping
ENIG
CNC+Cleaning
Sidewalk
OSP
Sidewalk
E/T+FQC
Sidewalk
Screen Room
S/M printing+S/M Exposure
Legend Print
Warehouse
Tooling Room
Packing
Production Process (17 of 17)
OSP Line, Packaging & warehouse
Sidewalk
pre-treatmentDeveloping
ENIG
CNC+Cleaning
Sidewalk
OSP
Sidewalk
E/T+FQC
Sidewalk
Screen Room
S/M printing+S/M Exposure
Legend Print
Warehouse
Tooling Room
Packing