F. Anghinolfi/K. Swientek 1

ABCN Pad ring

V8.0

30/04/13

Final ABC130 pads distribution

y

x

7602.18 um

3146.16 um

4 off fiducials added

Fiducials are 95µm x 95µm (Ball bond pad)

1 2

34

6.8mm x 7.9mm (x,y)

ABC130 – Pad ring and Fiducials

3

3387.82

ABC130 “BOTTOM SIDE”

30/04/13F. Anghinolfi/K. Swientek

PIO

_REC

160

PIO

_REC

160

200

PIO

_REC

160

PIO

_REC

160

SIO

GND

200

20025

0

BC_p

adN

CLK_

PadN

COM

_LZE

RO_P

adN

LON

ERTH

REE_

padN

200

200

PIO

_IN

P_RA

W_P

ULL

DO

WN

PIO

_IN

P_RA

W_P

ULL

DO

WN

DGN

FETP

rot

padD

isabl

e_Re

gA

padD

isabl

e_Re

gD

padS

hunt

Ctrl

SIO

GND

250

250

SIO

GND

250

250

SIO

GND

250

250

200

200

To FE To BE

Chip edge

3150 um 530.82 um

BC_p

adP

CLK_

PadP

COM

_LZE

RO_P

adP

LON

ERTH

REE_

padP

423.03

40x40 um MA

GNDD

GNDD

GNDD

GNDD

4

ABC130 “RIGHT SIDE” (but represented horizontal to match the paper or.)

30/04/13 F. Anghinolfi/K. Swientek

Follow up on next slide --

PIO

_TRC

VR16

0

PIO

_TRC

VR16

0

200

200

111

PIO

_IN

P

PIO

_IN

P

PIO

_IN

P

PIO

_IN

P

PIO

_IN

P

padID (5)

XoffL

B

Data

LB

111

PIO

_IN

P_PD

111

111

SIO

DVSS

PIO

_REC

160

200

SIO

GND

111

111

111

111

Fast

CLK_

PadP

padT

erm

To “Bottom” side

Chip edge

111

111

1710 um

Abut left pad of next slide

14+377 = 391 um

0 1 2 3 4

XoffL

Data

L

Fast

CLK_

PadN

DVSS

GNDD

5

ABC130 “RIGHT SIDE” (but represented horizontal to match the paper or.)

30/04/13 F. Anghinolfi/K. Swientek

Follow up on next slide --

Digital Power/Ground (6 pads) Left GroupSI

OGN

D

SIO

VDD

SIO

DVDD

SIO

GND

SIO

VDD

SIO

DVDD

7*111 = 777 um

SIO

DVSS

DVSS

BR

GNDD

VDDD

DVDD

GNDD

VDDD

DVDD

DVSS

Special Unit

Abut left pad of next slide

All Power ri

ngs

cut (B

FMOAT)

DVSSBR is NOT treated as a regular pad.

Distance from last supply here, DVSS to DVSSA in the next slide is 162 um

111

111

111

6

ABC130 “RIGHT SIDE” (but represented horizontal to match the paper or.)

30/04/13 F. Anghinolfi/K. Swientek

Follow up on next slide --

Analog Power/Ground (16 pads)

SIO

GND

SIO

GND

SIO

VDD

SIO

DVDD

17*111+162 = 2049

GNDI

T

GNDA

VDDA

AVDD

SIO

DVSS

DVSS

A

Abut left pad of next slide

All Power ri

ngs cut (B

FMOAT)

SIO

DVSS

DVSS

A

GNDI

T

SIO

GND

SIO

GND

SIO

VDD

SIO

DVDD

GNDI

T

GNDA

VDDA

AVDD

SIO

GND

SIO

GND

SIO

VDD

SIO

DVDD

GNDI

T

GNDA

VDDA

AVDD

SIO

GND

SIO

GND

SIO

VDD

SIO

DVDD

GNDA

VDDA

AVDD

162

111

111

7

ABC130 “RIGHT SIDE” (but represented horizontal to match the paper or.)

30/04/13 F. Anghinolfi/K. Swientek

SIO

GND

SIO

VDD

SIO

DVDD

Digital Power/Ground (9 pads) Right groupSI

OGN

D

SIO

VDD

SIO

DVDD

SIO

GND

SIO

VDD

SIO

DVDD

8*111+126= 1014 um

GNDD

VDDD

DVDD

GNDD

VDDD

DVDD

GNDD

VDDD

DVDD

PIO

_DRV

160

PIO

_DRV

160

200

200

111

PIO

_TRC

VR16

0

PIO

_TRC

VR16

0

200

200

111

SIO

GND

111

111

SIO

DVSS

111

Data

outF

C1_P

adN

DATR

XOFF

R

Chip edge

To “Top” side

1577 um 368+14=382 um

Data

outF

C1_P

adP

DATR

B

XOFF

RB

Data

outF

C2_P

adN

Data

outF

C2_P

adP

SIO

DVSS

111

111

126

111

111

DVSS

DVSS

GNDD

8

ABC130 “TOP SIDE”

30/04/13 F. Anghinolfi/K. Swientek

SIO

GND

SIO

VDD

SIO

GND

PIO

_IN

P_PD

SIO

DVDD

SIO

GND

GNDD

VDDD

GNDD

abcu

p_pa

d

VDDD

GNDD

Chip edge

1233.82

PIO

_IN

PRS

TB_p

ad

PIO

_IN

P_PD

PIO

_IN

P_PD

SIO

BPU

08_B

_out

put

PIO

_IN

P_PD

SIO

BPU

08_B

_out

put

PIO

_AN

A

Scan

Enab

le

Scan

_in_

CLK

Scan

_in_

BC

Scan

_out

_CLK

Scan

_out

_BC

SIO

GND

SIO

VDD

VDDD

GNDD

TEST

COM

SIO

GND

GNDD

SIO

GND

GNDD

SIO

GND

GNDD

Analogue PadsAttached to the Analogue FE blockPower rails break

423.03 111

111

111

111

111

111

111

111

111

111

111

111

111

111

306

111

319

3387.82

2290

40x40 um MA

ANA

ANA

AMUX

OU

T

TEST

RES

228.

14 111

6.8mm x 7.9mm (x,y)

ABC130 – Placement on reticle

12.0320

.4<=21

<=20

6.8

7.9

6.8

7.9

6.6652.8

20.4

0.2 (arbitrary)0.

2 (a

rbitr

ary)

1.8

19.03

TDCpix

ABC130

TDCpix_demo

ABC130

20130412

2 ABC130 per reticle, 60 “good” reticles per wafer

6.8mm x 7.9mm (x,y)

ABC130 – Pads list

F. Anghinolfi/K. Swientek 11

Ashley’s Old

4 slides

30/04/13

rather old

y

x

6mm x 7.9mm (x,y)

200µm

250µm

250µm

200µm

200µm250µmLVDS Rx placed on

200µm pitch

Gnd pad, placed 250µm from LVDS pads (between centres)

450µm250µm

3650µm

BC RLCK L0_COM R3_L1FE_GND

GND Pad

700µm

Pads placed on 125µm pitch

A B C

A: REG_AB: REG_DC: ShuntCtrl

ABC130 Bottom Edge – Left Side

Unless indicated ALL bond pads are 95µm x 190µm

VSS (spare) pad omitted - but assume this GND serves the function?

y

x

200µm

300µm

125µm

125µm

200µm

125µm

125µm

200µm

150µm

125µm

XoffL

DataL

FC_CLK

TERM

Chip IDx

Chip IDx

Remaining Pad assignment as prescribed by Francis

125µm

Pads step and repeat at 125µm pitch

Fiducial 3

6mm x 7.9mm (x,y)

ABC130 Bottom Edge – Bottom left corner

y

x

200µm

125µm125µm

200µm

125µm125µm

200µm

FC1

FC2

DataR

XoffR

G

Remaining PAD assignment as prescribed by Francis

PG

P

275µm

125µm

125µm

200µm

150µm

125µm125µm

125µm

Pads step and repeat at 125µm pitch

Fiducial 2

6mm x 7.9mm (x,y)

ABC130 Bottom Edge – Top right corner

y

x

7660µm

3875µm 120µm

120µm

4 off fiducials added

Fiducials are 95µm x 95µm (Ball bond pad)

1 2

34

6mm x 7.9mm (x,y)

ABC130 – Fiducial Detail