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University of Wollongong University of Wollongong Research Online Research Online Faculty of Engineering and Information Sciences - Papers: Part B Faculty of Engineering and Information Sciences 2019 A crystal plasticity FEM investigation of a Cu single crystal A crystal plasticity FEM investigation of a Cu single crystal processed by accumulative roll-bonding processed by accumulative roll-bonding Hui Wang University of Wollongong, [email protected] Cheng Lu University of Wollongong, [email protected] Anh Kiet Tieu University of Wollongong, [email protected] Follow this and additional works at: https://ro.uow.edu.au/eispapers1 Part of the Engineering Commons, and the Science and Technology Studies Commons Recommended Citation Recommended Citation Wang, Hui; Lu, Cheng; and Tieu, Anh Kiet, "A crystal plasticity FEM investigation of a Cu single crystal processed by accumulative roll-bonding" (2019). Faculty of Engineering and Information Sciences - Papers: Part B. 3377. https://ro.uow.edu.au/eispapers1/3377 Research Online is the open access institutional repository for the University of Wollongong. For further information contact the UOW Library: [email protected]

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Page 1: A crystal plasticity FEM investigation of a Cu single

University of Wollongong University of Wollongong

Research Online Research Online

Faculty of Engineering and Information Sciences - Papers: Part B

Faculty of Engineering and Information Sciences

2019

A crystal plasticity FEM investigation of a Cu single crystal A crystal plasticity FEM investigation of a Cu single crystal

processed by accumulative roll-bonding processed by accumulative roll-bonding

Hui Wang University of Wollongong, [email protected]

Cheng Lu University of Wollongong, [email protected]

Anh Kiet Tieu University of Wollongong, [email protected]

Follow this and additional works at: https://ro.uow.edu.au/eispapers1

Part of the Engineering Commons, and the Science and Technology Studies Commons

Recommended Citation Recommended Citation Wang, Hui; Lu, Cheng; and Tieu, Anh Kiet, "A crystal plasticity FEM investigation of a Cu single crystal processed by accumulative roll-bonding" (2019). Faculty of Engineering and Information Sciences - Papers: Part B. 3377. https://ro.uow.edu.au/eispapers1/3377

Research Online is the open access institutional repository for the University of Wollongong. For further information contact the UOW Library: [email protected]

Page 2: A crystal plasticity FEM investigation of a Cu single

A crystal plasticity FEM investigation of a Cu single crystal processed by A crystal plasticity FEM investigation of a Cu single crystal processed by accumulative roll-bonding accumulative roll-bonding

Abstract Abstract In this study, texture modelling of a copper single crystal processed by accumulative roll-bonding (ARB) was conducted for the first time. A crystal plasticity finite element method (CPFEM) model was developed, and the predicated textures were validated by the experimental observations conducted by another research group. A heterogeneous through-thickness deformation was revealed. Two types of matrix bands formed through the thickness after the first ARB cycle, and different crystal rotation, slip system activation, and shear strain evolved in matrix bands. Due to the cutting, stacking and roll-bonding involved in ARB, transition of deformation behaviours has been found after a position being moved to a new position in the next cycle, and this transition was investigated based on the CPFEM model.

Disciplines Disciplines Engineering | Science and Technology Studies

Publication Details Publication Details Wang, H., Lu, C. & Tieu, K. (2019). A crystal plasticity FEM investigation of a Cu single crystal processed by accumulative roll-bonding. Journal of Materials Research and Technology, 8 (6), 5057-5065.

This journal article is available at Research Online: https://ro.uow.edu.au/eispapers1/3377

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Please cite this article in press as: Wang H, et al. A crystal plasticity FEM investigation of a Cu single crystal processed by accumulativeroll-bonding. J Mater Res Technol. 2019. https://doi.org/10.1016/j.jmrt.2019.05.019

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Available online at www.sciencedirect.com

Original Article

A crystal plasticity FEM investigation of a Cu singlecrystal processed by accumulative roll-bonding

Hui Wang ∗, Cheng Lu, Kiet Tieu

School of Mechanical, Materials, Mechatronics and Biomedical Engineering, University of Wollongong, New South Wales 2522, Australia

a r t i c l e i n f o

Article history:

Received 28 December 2018

Accepted 17 May 2019

Available online xxx

Keywords:

Accumulative roll bonding

Crystal plasticity FEM

Texture

Single crystal

a b s t r a c t

In this study, texture modelling of a copper single crystal processed by accumulative roll-

bonding (ARB) was conducted for the first time. A crystal plasticity finite element method

(CPFEM) model was developed, and the predicated textures were validated by the experimen-

tal observations conducted by another research group. A heterogeneous through-thickness

deformation was revealed. Two types of matrix bands formed through the thickness after

the first ARB cycle, and different crystal rotation, slip system activation, and shear strain

evolved in matrix bands. Due to the cutting, stacking and roll-bonding involved in ARB,

transition of deformation behaviours has been found after a position being moved to a new

position in the next cycle, and this transition was investigated based on the CPFEM model.

© 2019 The Authors. Published by Elsevier B.V. This is an open access article under the

CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

1. Introduction

Severe plastic deformation (SPD) has been widely used to fab-ricate ultra-fine grained (UFG) materials by introducing a largestrain [1,2]. Among various SPD techniques, accumulative rollbonding (ARB) attracts extensive research interests due to itseffectiveness in manufacturing UFG materials [1–4] and com-posites [5,6] by repeating roll-bonding, cutting, and stacking.Copper polycrystals have been extensively used to study thedeformation in ARB, and a heterogeneous through-thicknessdistribution of texture and microstructure in ARB-processedcopper has been revealed [1,3,4]. Unlike polycrystals, singlecrystals have no pre-existed grain boundaries and thus nograin interaction, and possess an identical initial orientation.

∗ Corresponding author.E-mail: [email protected] (H. Wang).

Single crystals are thus the ideal material for tracing textureevolution, microstructure refinement, and deformation of ARBprocess. Only one experimental study on an ARB-processedcopper single crystal (15 12 5)[9 10 3] has been reported [7].Crystal orientations split during ARB, which is noticeably dif-ferent from that in copper polycrystals, since single crystalsare strongly anisotropic in texture. The texture evolution inthis copper single crystal is also different from ARB-processedaluminium single crystals [8,9] due to the difference in initialorientations. How the material deformed and crystal orien-tation rotated during ARB in this copper single crystal needfurther study, especially the effect of cutting-stacking to tran-sition of deformation.

Deformation history is critically important to study thetransition of deformation. Texture modelling, unlike experi-mental techniques, can access the whole deformation historyand provide more details on the deformation. Texture mod-elling has become a powerful method to study textureevolution, and various crystal plasticity models have been

https://doi.org/10.1016/j.jmrt.2019.05.0192238-7854/© 2019 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license(http://creativecommons.org/licenses/by-nc-nd/4.0/).

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Fig. 1 – A schematic of ARB FEM model.

proposed. The Taylor model [10], ALAMEL model [2,11], andthe viscoplastic self-consistent (VPSC) model [12] have beenapplied to investigate the texture evolution in ARB-processedaluminium. An iso-strain is assumed in the Taylor modeland the stress equilibrium at grain boundaries is disregarded,while in the ALAMEL model strain compatibility and stressequilibrium are only met for paired grains. In the VPSC model,a grain is regarded as an inclusion in the homogenized matrixand thus grain interaction cannot be fairly accessed. Differentfrom the above crystal plasticity models, no homogenizationis assumed in the so-called ‘full-field’ crystal plasticity finiteelement method (CPFEM) model, and the stress equilibriumand strain compatibility are reached in each time increment[13]. The texture evolution is coupled with deformation inthe CPFEM model. As suggested by Knezevic et al. [14], theCPFEM model is applicable for ARB because of its advantage onsolving mechanical problems under complicated internal andexternal boundary conditions [15], where the roll-bonding,cutting and stacking in ARB result in complex deformation.The CPFEM model has been applied to ARB-processed alu-minium single crystals [16]. However, texture modelling ofARB-processed copper has never been attempted.

In the current report, a CPFEM model was developedto investigate the deformation of an ARB-processed cop-per single crystal. The predicted textures was validated bycomparison with experimental observations performed byYoshida et al. [7]. The deformation in this single crystal wasinvestigated, in terms of texture, slip activities, and shearstrain.

2. Texture modelling

The ARB experiment in Ref. [7] was followed, in which acopper single crystal with an initial orientation of (15 125)[9 10 3] was deformed up to 4 cycles. The finite elementmethod (FEM) model in Fig. 1 is two-dimensional under theplane strain conditions. The simulation was performed bycommercial FEM code ABAQUS/Standard ver.6.9. After com-parison of different methods, mapping solution, a built-inremeshing technique of ABAQUS [16], was used betweencycles. After applying mapping solution, the deformed meshwas completely replaced by a new mesh, while the defor-mation solution was automatically transferred from thedeformed mesh into the new mesh by interpolation. Thedeformation solution at nodes of the deformed mesh was

firstly obtained by extrapolating the values of integrationpoints and then the solution at nodes was averaged overall elements around the nodes in the new mesh. Whenperforming mapping solution, it is necessary to ensure theequivalence of the deformation solution, i.e., solution con-tinuity. The continuity of the deformation solution in thisstudy was improved to an acceptable level, as examinedlater.

In the corresponding experiment, the initial sheet thick-ness was 2 mm and was rolled to 1 mm by 50% reduction inthe first ARB cycle, i.e., using rolling to replace roll-bonding inthis cycle. ARB (including cutting, stacking, and roll-bonding)was used from the second cycle onwards. In the simula-tion, the deformation solution of this deformed sheet afterthe first cycle was mapped into two separate undeformedones (‘Cutting’ in Fig. 1), and then rigid translation alongthe rolling direction (RD) and normal direction (ND) wasperformed to realize the stacking of the two sheets (‘Stack-ing’ in Fig. 1). Mapping solution was performed again inthe preparation of the next cycle. The two stacked sheetswere treated as a single-layered one by omitting the inter-face. This treatment is reasonable based on the followingconsiderations. In the experiment, the two stacked sheetswere joined together at the four corners, and the fric-tion between the two sheets is expected to be very highbecause the bonded surfaces were wire-brushed before-hand, which resulted in a negligible relative displacementbetween the two sheets [16]. Conventional rolling at 18%reduction was also conducted in the experiment, and thiswas also simulated. Plane strain four-node elements withreduced integration (element ID: CPE4R) were used, and aftermesh calibration the number of elements was kept at 80through the thickness. To match the dry rolling conditions[7], a coefficient of friction of 0.25 was chosen after test-ing various coefficients, since it provided the best matchof textures. The sheet was deformed by the rotating rolls,which were considered as rigid bodies with a diameter of310 mm.

A well-recognized crystal plasticity model was adopted,which was developed by Peirce [17,18], and Asaro and Needle-man [19]. The crystal plasticity model was implementedinto ABAQUS/Standard via User-defined MATerial subroutine(UMAT). The slip plane and direction in FCC structured copperare {1 1 1} and <1 1 0>, respectively, and their combinationsgenerate 12 potentially activated slip systems, as listed inTable 1.

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Table 1 – Notation of 12 slip systems.

Slip plane (1 1 1) (1 1 1) (1 11) (1 1 1)

Slip direction [0 11] [1 0 1] [1 1 0] [101] [110] [0 1 1] [0 1 1] [110] [1 0 1] [0 1 1] [101] [1 1 0]

Slip system a1 a2 a3 b1 b2 b3 c1 c2 c3 d1 d2 d3

Table 2 – Material parameters used in the Bassani–Wu hardening model.

n �0(s−1) h0 (MPa) hs (MPa) �1 (MPa) �0 (MPa) C11 (MPa) C12 (MPa) C44 (MPa)

20 0.0001 90 1.5 1.3 1 168,400 21,400 75,400

The used Bassani-Wu hardening model [20,21] is regardedas the best texture predictor after comparison of fivedifferent hardening models [22]. In this hardening model,the shear strain rate ( � (˛)) of slip system is determined by

resolved shear stress (�(˛)) relative to its strength (�(˛)c ), as

expressed by Eq.1, where �(˛)0 is the reference value of the shear

strain rate and n is the rate-sensitive exponent.

� (˛) = �(˛)0 sgn(�(˛))

∣∣∣∣ �(˛)

�(˛)c

∣∣∣∣n

for �(˛) ≥ �(˛)c (1a)

� (˛) = 0 for �(˛) < �(˛)c (1b)

The sgn(x) ={

1 for x ≥ 0

−1 for x < 0(1c)

The �(˛)c is calculated by:

�(˛)c =

∑N

ˇ=1h˛ˇ

∣∣� (ˇ)∣∣ (2)

where h˛ˇ is the hardening modulus. It is self-hardening when˛ = ˇ(h˛˛), while it is latent hardening h˛ˇ when /= ˇ. The h˛˛

and h˛ˇ are expressed by:

h˛˛ =[

(h0 − hs) sec h2

((h0 − hs)� (˛)

�1 − �0

)+ hs

]

⎡⎢⎣1 +

∑N

= 1

/= ˛

f˛ˇ tanh(� (ˇ)

�0)

⎤⎥⎦ for = (3a)

h˛ˇ = qh˛˛ for /= (3b)

where h0 is the hardening modulus after initial yield, hs isthe hardening modulus of easy slip, �1 is the critical stresswhen plastic flow begins, �0 is the initial critical resolved shearstress, q is the ratio between latent hardening modulus andself-hardening modulus, and f˛ˇ represents the interactionbetween two slip systems and ˇ. The material parametersin Eqs. (1) and (3) are listed in Table 2, which were obtained byfitting the simulated stress-strain curve with the experimental

Fig. 2 – {1 1 1} pole figures in the simulation andexperiment [7] after (a) 18% rolling reduction, and (b) 2-ARB(upper panel: simulation, lower panel: experiment), wherethe initial and final orientations in the simulation areshown in red and black, respectively.

results [23]. Three elastic moduli are C11 = 112, 000 MPa, C12 =66, 000 MPaand C44 = 28, 000 MPa, as also listed in Table 2.

3. Results and discussion

The thickness location X is defined in terms of the total sheetthickness t, where X = 0t and X = 1t correspond to the upperand lower surfaces, respectively.

3.1. Prediction validation

The predicted textures after conventional rolling (18% reduc-tion) and 2-ARB are shown by {1 1 1} pole figures in Fig. 2,and the textures obtained by electron backscattered diffrac-tion (EBSD) in the corresponding experiment [7] are also shownfor comparison. The simulated pole figures were constructed

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Fig. 3 – Distribution of crystal rotation angles and deformed FEM meshes (a) after 1-ARB, (b) before 2-ARB, (c) after 2-ARB,and (d) after 3-ARB. Red solid and dashed lines indicate the bonded interfaces formed in the current cycle and previouscycles, respectively.

Fig. 4 – Distribution of through-thickness crystal rotation (a) after 1-ARB and before 2-ARB, (b) before and after 2-ARB, (c)before and after 3-ARB. The angles in (a) are those along the line marked in Fig. 3a and b, while they are the average values(of all elements along the RD) in (b and c).

from all elements in the same areas (central region) as thosein the experiment. The predictions in Fig. 2 agree well withthe experimental results at different strains. It should benoted that the element size in the simulation is much largerthan the step size of EBSD maps, and thus compared to theexperimental observation, the scatter of the predicted tex-tures was obviously low. It can be seen that crystal orientationsslightly rotated away from the initial orientation after 18%reduction (Fig. 2a), while they rotated evidently after 2-ARB(Fig. 2b).

3.2. Texture evolution

The crystal rotation angle, i.e., misorientation between theinitial and final orientations, in each element was calcu-lated according to the Angle/Axis method. The distributionof crystal rotation angles is shown in Fig. 3 and the through-thickness crystal rotation is also plotted in Fig. 4. Fig. 5 showsthe {1 1 1} pole figures after all four cycles, which wereconstructed from all elements in steady state deformationregion.

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Fig. 5 – {1 1 1} pole figures after (a) 1-, (b) 2-, (c) 3-, (d) 4-ARB, where the red and black poles show the initial and finalorientations, respectively.

After 1-ARB, the variation of crystal rotation along theRD is very low (Fig. 3a). In contrast, the through-thicknesscrystal rotation is non-uniform (Figs. 3a and 4a), and macro-subdivision occurred by forming four matrix bands, marked asM1a-M1b-M1c-M1d (‘M’ for matrix band, ‘1’ for 1-ARB), wherethe thickness centre is located in M1a. The four matrix bandscan be categorized into two groups, where M1a and M1c arein the first group, and M1b and M1d in the second group. Thecrystal rotation angles are very high in M1b and M1d, even upto 33◦, while they are relatively low in M1a and M1c, at about20◦. The misorientation angles change sharply between adja-cent matrix bands (Figs. 3a and 4a). The splitting of the singlecrystal was also observed in the corresponding experimentalresearch [7]. No shear band was observed in the simulation.The pole figure after 1-ARB (Fig. 5a) shows that the crystal ori-entations rotated away from the initial orientation mainly intwo paths and the final textures are highly concentrated attwo positions. One position corresponds to the crystal orien-tations in M1a and M1c, while the other position correspondsto those in M1b and M1d.

Mapping solution was applied at the beginning of 2-ARB. Two 1-ARB processed sheets (two layers) were stacked(Fig. 3b), and the number of matrix bands was doubled(M2a1-M2b1-M2c1-M2d1-M2a2-M2b2-M2c2-M2d2), where thesubscripts indicate the layer of sheets. The stacking patternis clearly reflected by the distribution of matrix bands (Fig. 3b)and crystal rotation (Fig. 4a) before 2-ARB. The accuracy ofmapping solution is very high (Fig. 3a) after comparing thecrystal rotation angles along the line (marked in Fig. 2a and b)after 1-ARB and before 2-ARB. The stacking at the beginningof 2-ARB resulted in a bonded interface, as marked by the redsolid line in Fig. 3b and c. The change of crystal rotation is alsohigh at the interface that connects M2a2 and M2d1, like thoseat the boundaries of matrix bands. The maximum increase ofcrystal rotation in 2-ARB is only about 10◦, not as large as thatin 1-ARB (Fig. 4b), since the crystal orientations rotated slowlyas approached relatively stable positions. The crystal rotationincreased slightly in M2a1 near the upper surface (X = 0t to0.3t), but it increased obviously in M2a2 (X = 0.5t to 0.78t),and the increase is even higher in M2c2 (X = 0.9t to 0.96t). Incontrast, the increase of crystal rotation in M2b (M2b1 andM2b2) and M2d (M2d1 and M2d2) is slightly higher than thatin M2a and M2c. Textures became more scattered after 2-ARB

Fig. 6 – Distribution of through-thickness shear strain �12

after 1-, 2-, and 3-ARB, where the shear strain is thatevolved in a cycle, but not cumulated with previous cycles.

(Fig. 5b), and one texture component rotated toward (2 11)[1 1 1], similar to that observed in the experiment [7]. Thenumber of matrix bands was doubled again in 3-ARB due tothe cutting–stacking (Fig. 3d), while the thickness of matrixbands was halved. The increase of crystal rotation in 3-ARBis very low by comparing with that before this cycle (Fig. 4c),which means the crystal orientations have almost reachedstable positions. Texture scattered more after 3- and 4-ARB,as shown in Fig. 5c and d, and the definition of the two texturecomponents became unclear with increasing cycles.

3.3. Shear strain

The distorted FEM meshes in Fig. 3 also indicate the strain,and the through-thickness shear strain �12 is plotted in Fig. 6.The distortion of FEM meshes in Fig. 3 and shear strain in Fig. 6are those developed in a cycle, not cumulated with previouscycles, since the distorted FEM mesh in a cycle was replacedby an undeformed one in the next cycle during mapping solu-tion. After 1-ARB, the direction of shear deformation in thefirst group of matrix bands (M1a and M1c) is opposite to thatin the second group (M1b and M1d), where the shear strain ispositive in the former and negative in the latter (Fig. 6). The

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Fig. 7 – Shear strain on slip systems in the matrix band of (a) M1a, (b) M1b, (c) M2a1, (d) M2a2, (e) M3a2, (f) M3a4.

through-thickness shear strain in Fig. 6 is quite different fromthat observed in ARB deformed polycrystals, where the shearstrain in polycrystals increases from the centre to surface[11,24], as measured by the embedded-pin method. However,this kind of through-thickness shear strain (Fig.6) is charac-teristic in rolled single crystals due to their strong anisotropy[16,25]. Furthermore, the shear strain in single crystals isdifferent from orientation to orientation [16]. Similar to thecrystal rotation in Fig. 3a, the shear strain is almost uniformalong the RD. The alternation of shear deformation betweenmatrix bands was also observed after 2- and 3-ARB (Fig. 6). It isinteresting that the net shear strain after 3-ARB is extremelylow in the region from 0.76t to 0.9t, where it is close to thelower surface that is supposed to experience high surfacefriction.

The crystal rotation and shear strain are quite differentfrom matrix band to matrix band, while they are almost uni-form within a matrix band. In this study, slip activity was usedto represent microstructural evolution, since slip system acti-vation plays a key role in microstructure [26]. Fig. 7 shows theshear strain on slip systems within representatively selectedmatrix bands. Slip systems, a2-d1-a3, were mainly activatedin M1a after 1-ARB (Fig.7a), while they are c2-b1-a1 in M1b(Fig.7b). The M1a was moved to M2a1 and M2a2 in 2-ARB. The

activated slip systems in M2a1 (Fig. 7c) are a3-a2-d1, similarto those in M1a, since they both are near the upper surface.However, the activated slip systems in M2a2 are d1-a3-b1-a2(Fig. 7d), different from those in M1a, due to the differencein thickness position. In 3-ARB, the M2a2 was moved to M3a2

and M3a4. The slip system activation in M3a2 (a3-a2-d1-b1 inFig. 7e) is different from that in M2a2, but similar to that inM2a1, since both M2a1 and M3a2 are near the upper surface.The slip system activation in M3a4 (Fig. 7f) is similar to thatin M2a2. It is obvious that multi-slip is the feature of 1-ARB(Fig. 7a and b), while only four slip systems are mainly acti-vated in the following cycles. It has been observed that onlyfour slip systems were generally activated in single crystalsthat have slip systems being symmetrical about the RD-NDplane, such as Cube {0 0 1} <1 0 0> [25,27], rotated-Cube {00 1} <1 1 0> [28], while more slip systems were activated insingle crystals that have an asymmetrical distribution of slipsystems, such as S {1 2 3} <6 3 4> [8,16]. During deforma-tion, the crystal orientation rotated into a relatively stableposition and it is also the direction lowering the resolvedshear stress on slip systems, and thus the number of activatedslip systems reduced. The transition of slip system activa-tion is important to the textural and microstructural evolution[16,26,29].

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Fig. 8 – (I) Evolution of shear strain �12 (or material spin ˝TD), (II) shear strain rates on four highly activated slip systems (orplastic spin ˝P), and (III) crystal rotation (or lattice spin ˝∗) at points (a) A–C, and (b) B–D marked in Fig. 3. The insertedfigures in (II) show the distribution of slip systems on the RD-ND plane.

3.4. Deformation mechanism in CPFEM

In the adopted CPFEM model, the material spin consists oflattice rotation ˝∗ and plastic spin ˝P, namely

= ˝∗ + ˝P. (4)

The material spin can be represented by shear strain [11].The crystal orientation changes as lattice rotates, and this isthe reason for texture evolution. Crystal slip causes plasticspin, during which crystal orientation keeps unchanged. Theplastic spin ˝P can be calculated according to

˝P =∑12

a=1

12

(s(a) · m(a) − m(a) · s(a)

)� (a) (5)

are the slip direction and slip plane normal, respectively. Thesimulation model is two-dimensional, and thus material spin

about the RD (˝RD) and ND (˝ND) is zero. However, the slipsystems are oriented in all three dimensions, and their acti-vation would result in ˝P

RD and ˝PND. To retain zero material

spin about the RD and ND, the lattice spin has to develop inthe opposite direction to compensate the plastic spin. This iswhy crystal rotation about all three directions can be predictedby the two-dimensional model, as shown in Fig. 5.

The deformation history (shear strain �12, shear strain rateson slip systems, and crystal rotation) at two positions wastraced and is shown in Fig. 8. The first point A in M1a of 1-ARB was moved to C in 2-ARB (Fig. 3), while the second pointis B in 1-ARB and was moved to D in 2-ARB. The deformationhistory of point A can be divided into three periods (Fig. 8a).It is multi-slip from 0.0 s to 0.4 s (II), two slip systems (a2-c1)with relatively high shear strain rates were mainly activatedfrom 0.4 s to 0.8 s, and three slip systems (a2-a3-c1) were stillhighly activated in the last period (0.8–1.0 s). Multi-slip in thefirst period produced low plastic spin (˝P

TD) according to Eq.

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8 j m a t e r r e s t e c h n o l . 2 0 1 9;x x x(x x):xxx–xxx

Table 3 – Shear strain on slip systems, shear strain �12, and crystal rotation at four points, where the values are thoseevolved in a cycle, not the cumulative ones.

�a1 �a2 �a3 �b1 �b2 �b3 �c1 �c2 �c3 �d1 �d2 �d3 �12 Crystal rotation

A,1st 0.022 0.81 0.31 0.092 0.004 0.029 0.82 0.028 0.041 0.24 0.16 0.0002 0.19 19.1◦

C,2nd 0 0.47 0.46 0 0 0 0.82 0.003 0.0003 0.58 0.0005 0.001 0.095 6.8◦

B,1st 0.24 0.045 0.59 0.65 0.31 0.0045 0.073 0.14 0.13 0.43 0.022 0.054 −0.4 30.0◦

D,2nd 0.021 0 0.91 0.19 0.46 0.0006 0 0.077 0.03 0 0.0006 0.025 −0.23 10.9◦

Fig. 9 – Crystal rotation paths of point A, B, C and D fromthe initial orientation.

(5), since the activated slip systems are not co-directional andwould counteract the plastic spin caused by each other, wherethe distribution of activated slip systems on the RD-ND planeis shown in (II) of Fig. 8. The material spin (˝TD), representedby the shear strain in (I) Fig. 8, is also very low in this period(0.0–0.4 s), so low lattice spin (˝∗) is required according to Eq.(4). In the second period (0.4–0.8 s), the shear strain rates ona2 and c1 are obviously higher than the other slip systems,and low plastic spin evolved, since a2 and c1 are in differentdirections. The low plastic spin is not enough to meetthe greatly increased material spin, so large lattice spin isrequired. In the last period, i.e., from 0.8 s to 1.0 s, the shearstrain rates are not very high and produced low plastic spin.Lattice spin remained almost unchanged due to the low mate-rial spin. The deformation at A, B, C, and D is also summarisedin Table 3. The shear strain and slip system activation at A andC are different, and a small increase of crystal rotation devel-oped at point C. Similarly, the deformation behaviour can alsobe deduced at point B and D, though the shear strain, slip sys-tem activation and lattice spin are different from those at pointA and C.

The crystal rotation paths of A-C and B-D are shown by apole figure in Fig. 9. Point A and B rotated away from the initialorientation in different directions, and point A rotated toward(2 1 1)[1 1 1]. The rotation paths are not straight and crystalrotation about all three directions (RD, ND, and TD) developed.Basically speaking, the crystal orientation of point C continuedto rotate following the rotation path of A, and it is the samefor point B-D.

3.5. Texture evolution and slip activities in ARB

This transition of crystal rotation and slip activities in ARBis probably due to two reasons. The first reason is that thethrough-thickens deformation is non-uniform. According tothe hardening model (Eq. (1)), the slip system activation isonly determined by the resolved shear stress on slip systemsrelative to their strengths. The slip system activation at Aand B is different though they have the same initial orienta-tion, which means the imposed through-thickness stress isinhomogeneous. The through-thickness shear strain �12 atA and B is different too, which suggests that the introducedthrough-thickness strain is non-uniform. The variation ofstress and strain through the thickness is due to the surfacefriction and rolling bite geometry [30]. The imposed loadingdetermines the slip system activation and shear strain, andalso crystal rotation according to Eq. (4). The second reasonis that the previously introduced deformation definitelyinfluences the following deformation. For instance, thecrystal rotation and slip system activation at A are differentfrom those at D (Table 3) though they both are located atthe same thickness position (centre), which indicates thatthe previously evolved crystal rotation at B influences thedeformation at D. According to the Schmid’s law, the previ-ously developed crystal rotation would influence the resolvedshear stress on slip systems and thus affects slip systemactivation. The deformation history that the material hadpreviously experienced was brought into the new positionby the FEM model (Fig. 1), and accordingly the deformationcontinuity was preserved. The coupled effect of these tworeasons is responsible for the change of deformation inARB.

4. Conclusions

1. For the first time, the CPFEM was used to study the defor-mation behaviours of an ARB-processed copper singlecrystal. The simulation successfully captured the textureexperimentally observed by another research group.

2. The through-thickness deformation is inhomogeneous, interms of crystal rotation, shear strain and slip activities.Matrix bands formed after 1-ARB, and the number of matrixbands was doubled after each cycle.

3. By tracing the deformation history at two points, the tran-sition of crystal rotation and slip system activation wassuccessfully revealed. It was found that the coupled effectof previously experienced deformation and thickness posi-tion change is the reason for this transition.

Page 11: A crystal plasticity FEM investigation of a Cu single

Please cite this article in press as: Wang H, et al. A crystal plasticity FEM investigation of a Cu single crystal processed by accumulativeroll-bonding. J Mater Res Technol. 2019. https://doi.org/10.1016/j.jmrt.2019.05.019

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Conflicts of interest

The authors declare no conflicts of interest.

Acknowledgements

This work was supported by Australian Research Council Dis-covery Project (DP170103092).

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