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8 th progress meeting: EC-ASIC and TEST-EC-ASIC S. Ahmad, P. Barrillon, S.Blin , D. Cuisy, S. Dagoret-Campagne, P. Dinaucourt, R. Sliwa, JL. Socha October 12 th 2012 - LAL

8 th progress meeting: EC-ASIC and TEST-EC-ASIC

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8 th progress meeting: EC-ASIC and TEST-EC-ASIC. S. Ahmad, P. Barrillon , S.Blin , D. Cuisy , S. Dagoret - Campagne , P. Dinaucourt , R. Sliwa , JL. Socha October 12 th 2012 - LAL. EC_ASIC history. Week 22: Schematic Week 23-Week 27: Routing - PowerPoint PPT Presentation

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Page 1: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

8th progress meeting: EC-ASIC and TEST-EC-ASIC

S. Ahmad, P. Barrillon, S.Blin, D. Cuisy, S. Dagoret-Campagne, P. Dinaucourt, R. Sliwa, JL. Socha

October 12th 2012 - LAL

Page 2: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

EC_ASIC history• Week 22: Schematic• Week 23-Week 27: Routing• Gerber files have been available since 9th July • 1st prototype:– PCB manufacturer: supervised by KIT– Cabling: KIT with ASICs CQFP160 from MATRA– Delivery: 3rd of October

• SPACIROC asic tests: July 2012

Page 3: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

The ASIC: SPACIROC1

3

• Package: CQFP 160pins by MATRA• Received in May: 105 chips

• Dedicated test board:– 5 test boards: ok– Firmware and software ok

Bonding

• 3 programs:• Automatic tests• Read out and plot results for

one asic• Scan and plot the mean

results for all asics

Page 4: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

List of the tests:• Asic consumption: Avdd, Dvdd

• DC measurements:

– Bandgap voltage: 2.5V

– Pedestals : PA (2.5V), FSU (1V), VFS (1V),KI

(1.5V) per channels

– DAC linearity: DAC PA, DAC FS, DAC KI

• Slow control readout: check srout output

• Photon counting tests: Qinj=1/3pe

– Scurve versus threshold: trig_pa, trig_fsu

• Gain test: scurve versus threshold at different gains

• KI tests:

– Qinj=2pC/channels, data_ki versus threshold

– Threshold defined, data_ki versus input

charge for 3 different slow control

configurations

Labview: Automatic test program

• 105 asics

• Test duration: 6 min

• ASICs have to be handled with precaution

Page 5: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

Labview: Test result example

• Results:– 105 asics were

tested– Yield: 80% (88%

with some a bit noisy)

• Enough ASICs for prototypes (2 EC_ASICs), Flight Model (6) and spares (at least 2)

Page 6: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

EC_asic boardTOP VIEW

A C E

F D B

BOTTOM VIEW

1 connector: HIROSE FX2-120P-1.27DS• 120 pins• Header• Right angle type• Through hole

6 connectors: HIROSE FX2CA-68S-1.27DSA• 68 pins (64 analog signals + 4 gnd)

• Receptacle

• Straight type

• Through hole

6 asics SPACIROC1• Packaging: CQFP 160 pins

• 3 on each side

115 mm

159 mm

Page 7: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

EC_ASIC issues

7

• No power consumption:– Probably all bonding wires were broken in the 6 asics

• Diodes on the pad weren’t seen• No connection between two pins connected inside the asic (example vdd! pin 120 and pin79)

30s

1min30s

2min30s

3min30s

4min30s

5min30s

6min30s25

50

75

100

125

150

175

200

225

Tem

pera

ture

on

the

asic

(°C)

• Soldering temperature cycle at LAL Steaming (80°C, more than 10 hours) Oven: 4 temperature steps

With lead: 180,200,221,250°C

• ASIC n°174: steaming + two soldering cyclesÞ Asic OK

• ASIC n°138: no steaming + one soldering cycleÞ Asic HS: no bonding

Þ It looks like steaming is mandatory (MATRA agrees) and we probably should go to soldering paste with lead

Page 8: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

TEST-EC-ASIC status• Week 27: Schematic

• Week 28 – Week 31: Routing

• Gerber files have been available since September 5th

• 5 test boards have been produced

– Company: SOS electronic (France)

– Order: 10th September

– Delivery: 20th September

– Cabling: LAL, week 39

• Firmware is modified by Eric Plaige (LAL)

• Software is modified

Page 9: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

Connection EC_ASIC and TEST_EC_ASIC

9

TEST_EC-ASICEC-ASIC

Pow

er

supp

ly

conn

ecto

r

regulators

FPGA programmer connectors

40Mhz oscillator

Lemo connectors

120

pin

conn

ecto

r

USB

Page 10: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

Development plan• EC_ASIC:

– The next week, we will test the EC_ASIC equipped with plastic asics packaged by Riken and

cabled at KIT.

– MATRA will help us (for free)

• They will perform X ray-scan to check the asic bonding on the dead ones

• They will remove the 6 asics of 1 EC_ASIC and replace them manually

• They will test few (rejected) asics with their standard soldering temperature cycles (lead and lead-free)

• TEST_EC_ASIC:

– 2 boards have been cabled

– Firmware and software have been already modified – debug to be done as soon as we have a

working EC_ASIC

Page 11: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

BACKUP

Page 12: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

The ASIC: SPACIROC (1/3)

12

• Specifications: Readout MAPMT signals Consumption: 1mW/channel Photon counting: 100% trigger efficiency@50fC (1/3pe, 106 Gain) Charge/time converter input range : 2pc – 200pc (10pe - 1000pe) Radiation hardness

Spatial Photomultiplier Array Counting and Integrating

ReadOut Chip

• 1st version received in October 2010• Technology: AMS 0.35µm SiGe • Dimensions : 4.6mm x 4.1mm (19 mm²)• Power supply: 0-3V• Packaging : P(C)QFP240(160)

Page 13: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

The ASIC: SPACIROC (2/3)

13

• 64 channels• Preamplifier with individual 8-bit gain adjustment• Photo-electron counting (10-bit DACs)

– 3 discriminator outputs : Trig_PA, Trig_FSU & Trig_VFS– Multiplexed discriminator outputs to Digital part– Many parameters available

• Charge to time converters (called KIs)– Designed in collaboration with JAXA/RIKEN– 9 outputs : 8 channels (8-pixel-Sum) + Last Dynode– Many parameters available

• Continuous Data acquisition & Readout every 2.5 ms (GTU)– 8 identical digital module for PC– 1 digital module for KI

• First version of SPACIROC showed good behavior (intensive lab tests with and without MAPMT)

Page 14: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

The ASIC: SPACIROC (3/3)

14

• Package: CQFP 160pins by MATRA• Quantity: 100• Cost: 105€/asic• Delay: – Package material : 2 weeks– 3 prototypes: 2 weeks– 100 asics: 2 weeks

• One test board has been produced to sort chips– Cabling ok– Firmware is the same as the previous spaciroc test board– Software should be modified to perform automatic tests

Page 15: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

EC_ASIC routing constraints

15

• Asic inputs:– Group by 8 consecutive anodes according to the pattern 4 by 2– No crossing between wires for consecutive layers

• Outputs:– Only two routing wires between two connector pins in order to keep a good

isolation • More than one layer for the outputs routing

– No crossing between inputs and data outputs

• LVDS signals– Pay attention to the 40MHz clock

• Be careful to power supply planes to minimize the noise spread– Choice to have two layers for gnd and avdd

• Maximum isolation on critical signals

Page 16: 8 th  progress meeting:  EC-ASIC and TEST-EC-ASIC

Configuration of the EC_ASICEach ASIC is configured via 898 bits of slow control and 265 bits for the probe set-up. The 6 ASICs of the EC_ASIC are configured in a daisy chain mode, meaning that respectively 5388 and 1590 bits are sent for the slow control and the probes. This daisy chain is done through the signals sr_in and sr_out, the sr_out of one ASIC being the sr_in of the following ones like described in the figure bellow.