5G: And Its Impact on Electronics

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    5G:And Its Impact on Electronics

    Gerhard P. Fettweis Vodafone Chair Professor

    coordinator

    serial entrepreneur

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    Via Della Conciliazione

    Gerhard Fettweis Slide 2

    Source: http://www.spiegel.de/panorama/bild-889031-473266.html Source: http://www.spiegel.de/panoram

    2005/4/4 2013/3/

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    Wireless >2020 Outlook

    100Tb/s

    10 Tb/s

    1 Tb/s

    100Gb/s

    10Gb/s

    1Gb/s

    100Mb/s

    10Mb/s

    1Mb/s

    100Kb/s

    10Kb/s

    1995 2000 2005 2010 2015 2020 202

    ?802.11ac/ad

    802.11n

    802.11ag

    802.11

    802.11b

    GSM GPRS

    HSPA

    HSDPALTE

    3G R99 / EDGE

    LTE Advanced

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    DFG SFB 912

    (German Science Foundation Collaborative Research Center)

    In operations since July-1, 2011

    Gerhard P. Fettweis (coordinator)

    Wolfgang Lehner (vice coordinator)

    Wolfgang Nagel (vice coordinator)

    HIGHLY ADAPTIVE ENERGY-EFFICIENT COMPUT

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    Collaborative Research Center 912: HAEC Highly Adaptive Energy-Efficient Computing

    The Communication Bottleneck of ParallelComputing

    Parallelism =2Comm. links =1

    P=4

    C=6

    P=8

    C=28

    P=16C=120

    P=32

    C=496

    P=64

    C=201

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    Collaborative Research Center 912: HAEC Highly Adaptive Energy-Efficient Computing

    Highly Adaptive Energy-Efficient ComputingInter-Chip Communications

    Slide 6

    Radio Interconnect on-chip/on-package

    analog/digital beam

    interference minimiz

    100Gb/s

    220GHz carrier / 25

    3D routing & flow m

    Optical Interconnect adaptive analog/dig

    transceiver

    embedded polymer

    packaging technolog

    (e.g. 3D stacking of

    90coupling of lase

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    Collaborative Research Center 912: HAEC Highly Adaptive Energy-Efficient Computing

    Some 3D Details of the HAEC

    Box7

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    Collaborative Research Center 912: HAEC Highly Adaptive Energy-Efficient Computing

    The Outlook: The Box in 2030+

    Slide 8

    Assume 64K processors per chip 2x 4x4 chip-stacks on board

    128x chips stacked in 3D 4x boards in a box

    in 10x10x10 cm3(1 liter) 108processors!

    1636 proc.+ 14746 memory chips 104x performance of today!

    HAEC Box

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    Center for Advancing Electronics Dresden

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    Comprehensive Approach

    Materials &

    Functions

    Devices &

    Circuits

    Information

    Processing

    More-Shots-on-Goal

    CMOS

    (industryfocus)

    A

    SiliconNanowires

    B

    Carbon

    C

    Organic

    D

    BiomolecularAsse

    mbly

    E

    Chemical

    F Orchestration

    G Resilience

    H

    HAEC:

    Highly Adaptive

    Computing

    Energy-EfficientBio

    Sy

    Reconfigcircuits

    Nanosen

    CNT transradio frequamplifiers

    Orgafor iproc

    Using DNA scaffoldsto build advancedelectronic devices

    Enabling the integratedprocessing of chemicalinformation

    Managingheterogeneitlarge-scale sReliable c

    with unrecompone

    Reconfigurablefrom software tohardwareinterconnects Learning

    informatio

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    Wireless >2020 Outlook

    100Tb/s

    10 Tb/s

    1 Tb/s

    100Gb/s

    10Gb/s

    1Gb/s

    100Mb/s

    10Mb/s

    1Mb/s

    100Kb/s

    10Kb/s

    1995 2000 2005 2010 2015 2020 202

    ?802.11ac/ad

    802.11n802.11ag

    802.11

    802.11b

    GSM GPRS

    HSPA

    HSDPALTE

    3G R99 / EDGE

    LTE Advanced

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    Via Della Conciliazione

    Gerhard Fettweis

    Source: http://www.spiegel.de/panorama/bild-889031-473266.html Source: http://www.spiegel.de/panoram

    4.4.2005 12.3.20

    Quelle: japantimes.co.jp/news/2014/09/30/asia-pacific/hong-kong-democracy-p

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    Via Della Conciliazione

    Gerhard Fettweis

    Source: http://www.spiegel.de/panorama/bild-889031-473266.html Source: http://www.spiegel.de/panoram

    4.4.2005 12.3.20

    Quelle: japantimes.co.jp/news/2014/09/30/asia-pacific/hong-kong-democracy-p

    7Billion Devices

    2014

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    Via Della Conciliazione

    Gerhard Fettweis

    Source: http://www.spiegel.de/panorama/bild-889031-473266.html Source: http://www.spiegel.de/panoram

    4.4.2005 12.3.20

    Quelle: japantimes.co.jp/news/2014/09/30/asia-pacific/hong-kong-democracy-p

    50Billion

    20

    7Billion Devices

    2014

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    Via Della Conciliazione

    Gerhard Fettweis

    Source: http://www.spiegel.de/panorama/bild-889031-473266.html Source: http://www.spiegel.de/panoram

    4.4.2005 12.3.20

    Quelle: japantimes.co.jp/news/2014/09/30/asia-pacific/hong-kong-democracy-p

    50Billion

    20

    7Billion Devices

    2014

    Throughput

    but there is more ....

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    The Tactile Internet

    And Its Millisecond

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    The Tactile Internet

    Gerhard Fettweishttp://ostsee-spezial.de/?p=148

    Moving from 25ms RTT 1ms tomorrow

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    Gaming

    Gerhard Fettweis

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    Free-Viewpoint Video

    Ad-Hoc MobileFree-Viewpoin

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    Tactile Internet Killer App: Free Viewpoint Video

    Gerhard Fettweishtt : baum artnerfl.lima-cit .de stadion.html

    10 cameras @ 100Hz frame rate 1Latency @

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    Reinventing Latin Classes

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    The Tactile Internet: Remote Controlled Humano

    Gerhard Fettweishttp://images.gizmag.com/hero/8456_51207105642.jpg

    http://www.dvice.com/archives/2011/05/kinect_con

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    Human Touch

    Gerhard Fettweis

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    The Tactile InternetThe Manufacturing Revolution Ahead

    Gerhard Fettweis

    http://jerryrushing.net/wp-

    content/uploads/2012/04/robotic_assembly_line1.jpg http://www.witchdoctor.co.nz/wp-content/uploads/2013/01/robot-fabric

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    Design Service: A Job Machine

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    5G CHALLENGES

    Gerhard Fettweis

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    5GLABGERMANY

    5G Research on four Tracks

    Mobile Silicon systems

    Tactile Interne

    Wireless

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    Members on Tracks

    Wirelesstrack

    Silicon systemstrack

    Mobile edge cloudtrack

    Tactile applicat

    Gerhard Fettweis

    EduardJorswieck

    Frank Ellinger

    Christel Baier

    ReneSchffny

    Frank Fitzek

    Leo

    Christof FetzerA

    Wolfgang Lehner

    EAlThorsten Strufe

    Ja

    Dirk Plettemeier

    Wolfgang Nagel

    Hermann HrtigMichaelSchrter Silvia Santini

    Team of 500+ Researchers !!!

    S G

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    Relevant Startups Generated by Team

    Wirelesstrack

    Silicon systems trackMobile edge cloud

    trackTactile

    applicat

    freedelity

    C d i d

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    Connected industry partners

    t t t & i

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    Inhaltast ctuatorssensors&transceivers

    fast

    value chain

    sales &

    service

    systems,

    networks,software

    circuits

    components

    semi-

    conductors

    net

    s

    Bran

    Mec

    VorpSaxo

    S

    Th

    Bad

    Lowe

    B

    Coordinators: Frank Ellinger, GerhardFettweis),TUDresden

    Starting2014,appox. 75M project size, 60+ partners

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    THE MILLISECOND

    Gerhard Fettweis

    1 I t

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    1ms Impact

    HostedComputing(decider)

    Terminal

    Air Interface

    Base Station & Compute

    = 0.3 ms

    = 0.2 ms

    = 0.5 msLatency Goals:

    SoftwareEcosystem

    1ms

    SensorEmbeddedComputing

    Receiver100 s

    Actuator EmbeddedComputing

    Receiver Transmitter100 s

    Transmitter

    Tomahawk2

    T h k2 ( SSCC )

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    Tommahawk2 (ISSCC 2014)

    Gerhard Fettweis Slide 44

    Atlasserial on-chip link (72GBit/s) local ADPLL clock generator

    TSMC 65nm LP

    6mm x 6mm

    Pads: 465

    Gates: 10,2 MSRAM: 750 kB

    Cores: 20 pro

    Power 150mW

    Tapeout: 04/20

    Dresden: 06/20

    Successor of Tom

    WinDes

    Block Tomaha k2 core

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    BlockDiagram

    hs-serial

    hs-serial

    hs-serial

    hs-serial

    hs-serial

    pRouter

    (1,0)

    FPGA-

    Interface

    Router

    (1,1)

    Router

    (0,1)

    Router

    (0,0)

    Duo-PE0

    Duo-PE1

    FEC

    Duo-PE2

    SDDuo-PE6

    Duo-PE7

    Duo

    Duo-PE3 CM

    ADPLL,

    PMGT

    ADPLL,

    PMGT

    ADP

    LL,

    PMG

    T

    AVS

    Contr.

    UA

    GP

    ADPLL,

    PMGT

    ADPLL,

    PMGT

    ADP

    LL,

    PMG

    T

    ADPLL,

    PMGT

    ADPLL,

    PMGT

    ADPM

    ADPLL,PMGT

    ADPLL,PMGT

    ADPLL

    Tomahawk2_core

    APP

    Duo

    ADPM

    VDSP

    RISC

    VDSP

    RISC

    VDSP

    RISC

    VDSPRISC

    VDSP

    RISCVD

    RI

    VD

    RI

    ADPLL,PMGT

    VDSP

    RISC

    Tomahawk Architecture Framework

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    Tomahawk Architecture Framework

    T1 T2 T3 T4 T2 T3 T4 T5...

    Cache

    CM

    App. Proc

    Global

    Memory

    Control-Plane Data-P

    ControlFlow

    DataFlow

    Dynamic out-of-order task dispatc

    T1 T2

    T3

    if

    Start

    T1

    T2

    T3

    T4

    T5

    End

    SW Application

    task specification chronology

    Fast DVFS Measurement Result

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    Fast DVFS Measurement Result

    Ultra fast DVFS level change of Duo-PE in

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    SDR Architectures for MIMO 3GPP-LTE/WiMAXTomahawk2 Magali [6]

    Clocking and PowerManagement

    GALS, local DVFS and

    AVS, power-gatingGALS, local DFS

    Scheduling

    Dynamic (flexible, energyadaptable)

    Static

    Peak Performance 105 GOPS (3.6 GFLOPS) 37 GOPS

    Application for powermeasurements

    4x4 MIMO 3GPP-LTE Rx

    baseband, 60 Mbit/s

    4x2 MIMO, 2x2 MIMO Tx,

    MAC, 10.8 Mbit/s

    Power consumption

    480 mW @ 1.15V

    477 mW @ 1.2V

    NoC Throughput (per link)

    80 Gbit/s

    17 Gbit/s

    Die size 36mm 29.6 mmTechnology 65nm 65nm

    [6] Clermidy, et al., A 477mW NoC-based digital baseband for MIMO 4G SDR, ISSCC Dig.

    Papers, pp. 278-279, 2010

    150mW

    typical

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    RESILIENCE

    Gerhard Fettweis

    Carrier Grade Wireless: Use cases

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    Carrier Grade Wireless: Use cases

    Planning & Optimization Overview Slide 51

    Traffic safety &efficiency

    Availability

    (time)

    Coverage/

    Availability

    (space)Latency

    > 99.999% < 1ms 100%

    Industrial automation

    (Motion control)

    Telesurgery

    > 99.999999% < 1ms 100%

    > 99.999% < 1ms n/a

    > 99.999% n/a 100%Emergency

    Communication

    Others: Power Networks / Smart Grid, Real-Time Remote Computing, Platooning, ESP, Exoskeleton [1]

    [1] Fettweis, G., "The Tactile Internet: Applications and Challenges," Vehicular Technology Magazine, IEEE, vol.9, no.1, pp.64,70, March 2014.

    Serious Carrier Grade: 10-x via Diversity

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    Serious Carrier Grade: 10 via Diversity

    # indep.channels

    1 2 3 4 5

    outage 3% 10-3 310-5 10-6 210-

    Gerhard Fettweis Slide 52

    2007-2013: Worlds Largest Operational

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    2007 2013: World s Largest OperationalLTE-Advanced CoMP Algorithm Testbed

    Gerhard Fettweis 53

    Google Earth

    Hbf-Sd

    Karstadt

    Lennplatz

    Mitte

    Kongresszentrum

    Fritz-Frster-Pl.

    Strassburger Pl.

    WTC

    Hbf

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    54

    Combining multiple Rayleigh-fading links

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    Combining multiple Rayleigh fading links

    David hmann & Gerhard Fettweis Slide 55

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    HANDOFF REVISITED

    Gerhard Fettweis

    Mobile Edge Cloud / Micro Cloud / Cloud

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    router

    Mobile Edge Cloud / Micro Cloud / Cloud

    Gerhard Fettweis Slide 57

    Distributed ComputeWithin

    Distributed Cloud

    Steering & Control

    Mobile Edge Cloud / Micro Cloud / Cloud

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    g

    Gerhard Fettweis

    Networking The Connnection

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    g

    node

    Single Path

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    g

    node

    Revolution Compute & Forward

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    p(Disintergration of packet)

    node

    Revolution Distributed Everything

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    y gStorage/Computing/Networking/

    node

    Cloud Evolution

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    Gerhard Fettweis

    Single/Static Distributed/Static Distr

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    CONCLUSIONS

    Gerhard Fettweis

    Telco Markets: A First Glimpse At Germany

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    care German ambulatory care ~35BTAM10B/a

    manufacturing German industrial interconnect revenue ~2B

    TAM10B/a

    events German event/concert/sport/stadium/congressTAM10B/a

    edutainement German TechniSat.5B (home entertainment11B)TAM10B/a

    mobility German Tollcollect5B,TAM10B/a

    smart grid EU smart grid ICT market27B, $47B by 2020TAM10B/a

    emerging e.g. drones, agriculture, and new gadgetsTAM10B/a

    Cellular Roadmap of USPs

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    2G1992VoiceMessages

    3G2002+ Data+ Positioning

    4G2012+ Video everything+ 3D Graphics

    5G2022+ Tactile Interne

    Gerhard Fettweis

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    Thank you

    5GLGERM

    Coordinator: Gerhard Fettweis dresden5GLab.org contact@D

    Related publications

    http://www.dresden5glab.org/http://www.dresden5glab.org/
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    [1] Fettweis, Gerhard, and Siavash Alamouti. 5G: Personal Mobile Internet beyond What Cellula

    Communications Magazine, IEEE 52.2 (2014): 140-145.

    [2] Fettweis, G. "The Tactile Internet: Applications and Challenges."

    Vehicular Technology Magazine, IEEE 9.1 (2014): 64-70.

    [3] Fettweis et al. Positionspapier Das Taktile Internet, VDE ITG

    [4] Fettweis et al. Tactile Internet, ITU Tech Watch report, 2014,

    http://www.itu.int/en/ITU-T/techwatch/Pages/tactile-internet.aspx

    [4] HUAWEI. 5G: A Technology Vision

    https://mns.ifn.et.tu-dresden.de/Lists/nPublications/Attachments/930/5G%20ComMag%20Fettweis%20Alamouti%20FINAL%20February%202014.pdfhttps://mns.ifn.et.tu-dresden.de/Lists/nPublications/Attachments/929/Gerhard%20Fettweis%20VTMag%20Tactile%20Internet%20FINAL%20March%202014.pdfhttp://www.itu.int/en/ITU-T/techwatch/Pages/tactile-internet.aspxhttp://www.huawei.com/ilink/en/download/HW_314849&sa=U&ei=ZhheU4DGBOyX0QXZyIDwCQ&ved=0CB4QFjAA&usg=AFQjCNHzjT9FavWQXHVbtKaQzBr0GpKAjQhttp://www.huawei.com/ilink/en/download/HW_314849&sa=U&ei=ZhheU4DGBOyX0QXZyIDwCQ&ved=0CB4QFjAA&usg=AFQjCNHzjT9FavWQXHVbtKaQzBr0GpKAjQhttp://www.itu.int/en/ITU-T/techwatch/Pages/tactile-internet.aspxhttp://www.itu.int/en/ITU-T/techwatch/Pages/tactile-internet.aspxhttp://www.itu.int/en/ITU-T/techwatch/Pages/tactile-internet.aspxhttp://www.itu.int/en/ITU-T/techwatch/Pages/tactile-internet.aspxhttp://www.itu.int/en/ITU-T/techwatch/Pages/tactile-internet.aspxhttps://mns.ifn.et.tu-dresden.de/Lists/nPublications/Attachments/929/Gerhard%20Fettweis%20VTMag%20Tactile%20Internet%20FINAL%20March%202014.pdfhttps://mns.ifn.et.tu-dresden.de/Lists/nPublications/Attachments/930/5G%20ComMag%20Fettweis%20Alamouti%20FINAL%20February%202014.pdf