5-V Low Drop Voltage Regulator

TLE 4263

^

P-DSO-14-3, -8, -9, -11, 14

P-DSO-20-1, -6, -7, -9, -14, -15, -17, -

P/PG-DSO-8-3, -6, -7, -8, -9,

Features

• Output voltage tolerance ≤ ±2%• 200 mA output current capability• Low-drop voltage• Very low standby current consumption• Overtemperature protection• Reverse polarity protection• Short-circuit proof• Adjustable reset threshold• Watchdog• Wide temperature range• Suitable for use in automotive electronics• Green Product (RoHS compliant)• AEC Qualified

Functional Description

TLE 4263 is a 5-V low drop voltage regulator in a SMDpackage PG-DSO-14-30, PG-DSO-20-35, orPG-DSO-8-16. The maximum input voltage is 45 V. Themaximum output current is more than 200 mA. The IC isshort-circuit proof and incorporates temperatureprotection which turns off the IC at overtemperature.

The IC regulates an input voltage VI in the range of 6 V <VI < 45 V to VQ,nom = 5.0 V. A reset signal is generated foran output voltage of VQ,rt < 4.5 V. This voltage thresholdcan be decreased to 3.5 V by external connection of avoltage divider. The reset delay can be set externally by a capacitor. The integratedwatchdog logic supervises the connected microcontroller. The IC can be switched off viathe inhibit input, which causes the current consumption to drop from 900 µA to typical 0 µA.

Type Package Type Package

TLE 4263 GS PG-DSO-8-16 TLE 4263 GM PG-DSO-14-30

TLE 4263 G PG-DSO-20-35

Data Sheet 1 Rev. 2.8, 2007-03-20

TLE 4263

Choosing External Components

The input capacitor CI is necessary for compensation of line influences. Using a resistorof approx. 1 Ω in series with CI, the oscillating circuit consisting of input inductivity andinput capacitance can be damped. The output capacitor is necessary for the stability ofthe regulating circuit. Stability is guaranteed at values ≥ 22 µF and an ESR of ≤ 3 Ωwithin the operating temperature range. For small tolerances of the reset delay thespread of the capacitance of the delay capacitor and its temperature coefficient shouldbe noted.

Figure 1 Pin Configuration (top view)

109

I1234567

14131211

AEP03067

8

GNDGNDGND

W

N.C.GNDGNDGND

DRADJ

RO

Q

INH

TLE 4263 GM TLE 4263 GSTLE 4263 G

DRADJW

GND 567

RO

8

4321

AEP01668_4263

QINH

I

1

432

56789

10

20

171819

161514131211

INH

GNDVI

N.C.

GNDGNDGNDN.C.VQ

W

N.C.

GNDRO

N.C.

GNDGNDGNDN.C.

DRADJ

AEP01099_4263

Data Sheet 2 Rev. 2.8, 2007-03-20

TLE 4263

Table 1 Pin Definitions and Functions

PinPG-DSO-14-30

PinPG-DSO-20-35

PinPG-DSO-8-16

Symbol Function

1 3 3 RO Reset output; open-collector output connected to the output via a resistor of 30 kΩ.

2 1, 2, 19, 13 – N.C. Not connected

3 - 5, 10 - 12 4-7, 14-17 4 GND Ground

6 9 5 D Reset delay; connected to ground with a capacitor.

7 10 6 RADJ Reset threshold; to adjust the switching threshold connect a voltage divider (output to GND) to the pin. If this input is connected to GND, reset is triggered at an output voltage of 4.5 V.

8 11 7 W Watchdog; rising edge triggered input for monitoring a microcontroller.

9 12 8 Q 5-V output voltage; block to ground with a capacitor, C ≥ 22 µF, ESR ≤ 3 Ω at 10 kHz

13 18 1 I Input voltage; block to ground directly at the IC with a ceramic capacitor.

14 20 2 INH Inhibit; TTL-compatible, low-active input.

Data Sheet 3 Rev. 2.8, 2007-03-20

TLE 4263

Circuit Description

The control amplifier compares a reference voltage, which is kept highly accurate byresistance adjustment, to a voltage that is proportional to the output voltage and drivesthe base of the series transistor via a buffer. Saturation control as a function of the loadcurrent prevents any over-saturation of the power element. If the externally scaled downoutput voltage at the reset threshold input drops below 1.35 V, the external reset delaycapacitor is discharged by the reset generator. When the voltage of the capacitorreaches the lower threshold VDRL, a reset signal occurs at the reset output and is helduntil the upper threshold VDU is exceeded. If the reset threshold input is connected toGND, reset is triggered at an output voltage of typ. 4.65 V. A connected microcontrollerwill be monitored through the watchdog logic. In case of missing pulses at pin W, thereset output is set to low. The pulse sequence time can be set in a wide range with thereset delay capacitor. The IC can be switched at the TTL-compatible, low-active inhibitinput. The IC also incorporates a number of internal circuits for protection against:

• Overload• Overtemperature• Reverse polarity

Figure 2 Block Diagram

Input

AEB03068

INH

GND

Output

D

RO

RADJ

ResetDelay

ResetOutput

ResetThreshold

Watchdog

W

TemperatureSensor

GeneratorReset

ReferenceBandgap

Adjustment

Buffer

ControlAmplifier

SaturationControl andProtection

Circuit

Inhibit

Ι Q

GND

Data Sheet 4 Rev. 2.8, 2007-03-20

TLE 4263

Table 2 Absolute Maximum Ratings

Parameter Symbol Limit Values Unit Remarks

Min. Max.

Input I

Input voltageInput current

VIII

-42–

45–

V–

–internally limited

Reset Output RO

VoltageCurrent

VRIR

-0.3–

42–

V–

–internally limited

Reset Threshold RADJ

Voltage VRADJ -0.3 6 V –

Reset Delay D

VoltageCurrent

VDID

-0.3–

42–

V–

–internally limited

Output Q

VoltageCurrent

VQIQ

-0.3–

7–

V–

–internally limited

Inhibit INH

Voltage VINH -42 45 V –

Watchdog W

Voltage VW -0.3 6 V –

Ground GND

Current IGND -0.5 – A –

Temperature

Junction temperatureStorage temperature

TjTstg

–-50

150150

°C°C

––

Operating Range

Input voltage VI – 45 V –

Junction temperature Tj -40 150 °C –

Data Sheet 5 Rev. 2.8, 2007-03-20

TLE 4263

Thermal Resistance

Junction-ambient Rthj-a –

–

–

–

112

92

185

164

K/W

K/W

K/W

K/W

PG-DSO-14-301);Footprint onlyPG-DSO-14-301);300 mm2 Heat sinkPG-DSO-8-161);Footprint onlyPG-DSO-8-161);300 mm2 Heat sink

Junction-pin Rthj-p – 32 K/W PG-DSO-14-302)

1) Worst case; package mounted on PCB 80 × 80 × 1.5 mm3; 35µ Cu; 5µ Sn; zero airflow.

2) Measured to pin 4.

Table 2 Absolute Maximum Ratings (cont’d)

Parameter Symbol Limit Values Unit Remarks

Min. Max.

Data Sheet 6 Rev. 2.8, 2007-03-20

TLE 4263

Table 3 Characteristics

VI = 13.5 V; -40 °C < Tj < 125 °C; VINH > 3.5 V; (unless specified otherwise)

Parameter Symbol Limit Values Unit Test Condition

Min. Typ. Max.

Normal Operation

Output voltage VQ 4.90 5.00 5.10 V 5 mA ≤ IQ ≤ 150 mA;6 V ≤ VI ≤ 28 V

Output voltage VQ 4.90 5.00 5.10 V 6 V ≤ VI ≤ 32 V;IQ = 100 mA;Tj = 100 °C

Output current IQ 200 250 400 mA 1)

Current consumption;Iq = II - IQ

Iq

IqIqIq

–

–––

0

9001015

50

13001823

µA

µAmAmA

VINH = 0

IQ = 0 mAIQ = 150 mAIQ = 150 mA; VI = 4.5 V

Drop voltage Vdr – 0.35 0.50 V IQ = 150 mA1)

Load regulation ∆VQ,lo – – 25 mV IQ = 5 mA to 150 mA

Line regulation ∆VQ.li – 3 25 mV VI = 6 V to 28 V;IQ = 150 mA

Power Supply Ripple Rejection

PSRR – 54 – dB fr = 100 Hz;Vr = 0.5 Vpp

Reset Generator

Switching threshold VQ,rt 4.5 4.65 4.8 V VRADJ = 0 V

Reset adjust threshold

VRADJ,th 1.26 1.35 1.44 V VQ > 3.5 V

Reset low voltage VRO,l – 0.10 0.40 V IRO = 1 mA

Saturation voltage VD,sat – 50 100 mV VQ < VR,th

Upper timing threshold

VDU 1.45 1.70 2.05 V –

Lower reset timing threshold

VDRL 0.20 0.35 0.55 V –

Charge current ID,ch 40 60 85 µA –

Reset delay time trd 1.3 2.8 4.1 ms CD = 100 nF

Reset reaction time trr 0.5 1.2 4 µs CD = 100 nF

Data Sheet 7 Rev. 2.8, 2007-03-20

TLE 4263

Note: The reset output is low within the range VQ = 1 V to VQ,rt.

Watchdog

Discharge current ID,wd 4.40 6.25 9.10 µA VD = 1.0 V

Upper timing threshold

VDU 1.45 1.70 2.05 V –

Lower timing threshold

VDWL 0.20 0.35 0.55 V –

Watchdog trigger time TWI,tr 16 22.5 27 ms CD = 100 nF

Inhibit

Switching voltage VINH,ON 3.6 – – V IC turned on

Turn-OFF voltage VINH,OFF – – 0.8 V IC turned off

Input current IINH 5 10 25 µA VINH = 5 V1) Drop voltage = Vi - VQ (measured when the output voltage has dropped 100 mV from the nominal value

obtained at 6 V input).

Table 3 Characteristics (cont’d)

VI = 13.5 V; -40 °C < Tj < 125 °C; VINH > 3.5 V; (unless specified otherwise)

Parameter Symbol Limit Values Unit Test Condition

Min. Typ. Max.

Data Sheet 8 Rev. 2.8, 2007-03-20

TLE 4263

Figure 3 Application Circuit

Figure 4 Test Circuit

AES03069

22 Fµ

GND

D

RO

470 nFINH

100 nF

Output

KL 15

To MC

Input

Reset

TLE 4263G

W

Watchdogfrom MC

Ι Q

RADJ

6 V...45 V 100 kΩ

56 kΩ

AES03070_4263

22 F

ΙQ

ΙRD

VRADJ

Ω5.6 k

D

ROINHEΙ

1000 F 470 nF

Ι Ι

VE DCVC

GNDΙD, chΙVRO

QVVΙ

TLE 4263Gµ µ

GND

WV

W RADJ

100 nF

Ι Q

Vr+

PSRR = 20 logVr

Q, rV∆

Data Sheet 9 Rev. 2.8, 2007-03-20

TLE 4263

Reset Timing

The power-on reset delay time is defined by the charging time of an external capacitorCD which can be calculated as follows:

CD = (trd × ID,ch)/∆V (1)

Definitions:

• CD = delay capacitor• trd = reset delay time• ID,ch = charge current, typical 60 µA• ∆V = VDU, typical 1.70 V• VDU = upper delay switching threshold at CD for reset delay time

Figure 5 Time Response, Watchdog with High-Frequency Clock

AET03066

IV

VQ

Q, rtV

VD

DUVVDRL

ROV

rdt trr

< rrt

Vdtd

= D, chI

DC

Power-ONReset

Over-temperature at Input

Voltage Drop Under-voltage Spike

SecondaryBounce

Load

t

t

t

t

Data Sheet 10 Rev. 2.8, 2007-03-20

TLE 4263

Reset Switching Threshold

The present default value is typ. 4.65 V. When using the TLE 4263 the reset thresholdcan be set to 3.5 V < VQ,rt < 4.6 V by connecting an external voltage divider to pin RADJ.The calculation can be easily done since the reset adjust input current can be neglected.If this feature is not needed, the pin has to be connected to GND.

VQ,rt = (1 + R1/R2) × VRADJ,th (2)

Definitions:

• VQ,rt = reset threshold• VRADJ,th = comparator reference voltage, typical 1.35 V

Watchdog Timing

The frequency of the watchdog pulses has to be higher than the minimum pulsesequence which is set by the external reset delay capacitor CD. Calculation can be doneaccording to the formula given in Figure 6.

Figure 6 Timing of the Watchdog Function Reset

AED03099_4263

WV

V

VQ

DV

VRO WD, Lt

WD, pT

WI, trT

T =VV( DU - DWL )

Ι D, wd

DUV

VDWL

Ι

WI, tr DC

t

t

t

t

t

Data Sheet 11 Rev. 2.8, 2007-03-20

TLE 4263

Reset Switching Threshold versus Output Voltage

Reset Switching Threshold versus Temperature

Timing Threshold Voltage VDU and VDRL versus Temperature

Current Consumption of Inhibit versus Temperature

0.8

0.4

0.6

0.2

10 20

1.6

1.2

1.4

1.0

RADJV V

V43 5

V Q

AED01098_4263

ΙV = 13.5 V

AED01088

-40 0 40 80 120 ˚C 1600

jT

RADJV

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6V

AED03062

-400

IV = 13.5 V

0.4

0.8

1.2

1.6

2.0

2.4

2.8

3.2V

0 40 80 120 160˚C

V

T j

VDRL

DUV

AED03063

VINH = 5 V

µAINHI

80-40

4

2

0

6

8

400

10

12

14

16

160˚C120T j

Data Sheet 12 Rev. 2.8, 2007-03-20

TLE 4263

Drop Voltage versusOutput Current

Current Consumption versusInput Voltage

Current Consumption versusOutput Current

Output Voltage versusInput Voltage

AED03060_4263

00

QI50 100 150 200 300mA

100

200

300

400

500

600

700

800mVVdr

jT = 125 ˚C25 ˚C

15

10

5

200 100

20

mA

30

25qΙ

= 25R L

50V30 40

V Ι

AED01096

Ω

AED03061

00

QI

qI

50 100 150 200 300

IV = 13.5 V

mA

4

8

12

16

20

24

28

32mA

R6

4

2

040 2

8

12

10QV V

10V6 8

V Ι

AED01097

= 25L Ω

Data Sheet 13 Rev. 2.8, 2007-03-20

TLE 4263

Charge Current and DischargeCurrent versus Temperature

Pulse Time versusTemperature

Output Voltage versusTemperature

Output Current versusInput Voltage

40

20

30

10

0-40 400

80

60

70

50

ΙA

C12080 160

T j

AED03064

µ

= 13.5 V= 1.5 V

ΙVV D

Ι D, ch

D, disΙ

20

10

15

5

0-40 400

40

30

35

25

WI,trT

C12080 160

T j

AED03065_4263

ms

V Ι = 13.5 V= 100 nFCD

AED01090

-40 0 40 80 120 ˚C 1604.6

jT

QV

VI = 13.5 V

4.7

4.8

4.9

5.0

5.1

V5.2

T

1000

50

100

20

250

300

QΙmA

200

150

V

4030 V

Ι

50

= 25 Cj

AED01091

Data Sheet 14 Rev. 2.8, 2007-03-20

TLE 4263

Package Outlines

Figure 7 PG-DSO-14-30 (Plastic Dual Small Outline)

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly productsand to be compliant with government regulations the device is available as a greenproduct. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitablefor Pb-free soldering according to IPC/JEDEC J-STD-020).

1) Does not include plastic or metal protrusion of 0.15 max. per side2) Lead width can be 0.61 max. in dambar area

-0.28.75 1)

0.64

0.19

+0.0

6Index Marking

1.27

+0.100.410.1

1

14

2)

7

14x

8

0.17

5

(1.4

7)

±0.0

7

±0.26

0.35 x 45˚

-0.2

1.75

MA

X.

41)

±0.25

8˚M

AX

.

-0.06 0.2 M A BM0.2 C

C

B

A

GPS01230

You can find all of our packages, sorts of packing and others in ourInfineon Internet Page “Products”: http://www.infineon.com/products.

Dimensions in mmSMD = Surface Mounted Device

Data Sheet 15 Rev. 2.8, 2007-03-20

TLE 4263

Figure 8 PG-DSO-20-35 (Plastic Dual Small Outline)

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly productsand to be compliant with government regulations the device is available as a greenproduct. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitablefor Pb-free soldering according to IPC/JEDEC J-STD-020).

-0.2

Index Marking

1 10

+0.150.350.

20.2

20

2)

11

20x

2.45

2.65

MA

X.

0.110.3

-0.1 -0

.2

7.6

±0.3

1)

Does not include plastic or metal protrusion of 0.15 max. per side2)

1)

Does not include dambar protrusion of 0.05 max. per side

1.27

0.23

+0.0

9

MA

X.

8˚

0.35 x 45˚

+0.80.4

12.8 -0.21)

GPS05094

You can find all of our packages, sorts of packing and others in ourInfineon Internet Page “Products”: http://www.infineon.com/products.

Dimensions in mmSMD = Surface Mounted Device

Data Sheet 16 Rev. 2.8, 2007-03-20

TLE 4263

Figure 9 PG-DSO-8-16 (Plastic Dual Small Outline)

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly productsand to be compliant with government regulations the device is available as a greenproduct. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitablefor Pb-free soldering according to IPC/JEDEC J-STD-020).

1) Does not include plastic or metal protrusion of 0.15 max. per side

-0.06

-0.2

+0.1

5

0.418x

1

1)

4

8

1.27

5

A

0.1

0.2 M A

(1.4

5)

0.

175

1.75

MA

X.

B

B 6±0.2

0.64

4 -0.2

0.19

+0.0

6

0.35 x 45°1)

±0.25

MA

X.

8°

IndexMarking

±0.0

7

2) Lead width can be 0.61 max. in dambar area

GPS01229

You can find all of our packages, sorts of packing and others in ourInfineon Internet Page “Products”: http://www.infineon.com/products.

Dimensions in mmSMD = Surface Mounted Device

Data Sheet 17 Rev. 2.8, 2007-03-20

TLE 4263

Revision History

Version Date Changes

Rev. 2.8 2007-03-20 Initial version of RoHS-compliant derivate of TLE 4263Page 1: AEC certified statement addedPage 1 and Page 15 ff:RoHS compliance statement and Green product feature addedPage 1 and Page 15 ff: Package changed to RoHS compliant versionLegal Disclaimer updated

Data Sheet 18 Rev. 2.8, 2007-03-20

Edition 2007-03-20Published byInfineon Technologies AG81726 Munich, Germany© 2007 Infineon Technologies AGAll Rights Reserved.

Legal DisclaimerThe information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.

InformationFor further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com).

WarningsDue to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office.Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.