© 2001 Amkor Technology, Inc.

Prepared by Elec. Pkg. Char. Group7/16/01 Page1

3D Bondwire Electrical Modeling Results

Bondwire Diameter = 1 mil

Die Pad Pitch = 75 um

Bond Pad Pitch = 160 um

Mold Compound Dielectric Constant = 3.9

Gold Bondwire Partial Self and Mutual Inductance (nH)1 mil Diameter

0.00.51.01.52.02.53.03.54.04.55.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Length (mm)

Indu

ctan

ce (n

H)

L11

L12

L13

© 2001 Amkor Technology, Inc.

Prepared by Elec. Pkg. Char. Group7/16/01 Page2

3D Bondwire Electrical Modeling Results

Bondwire Diameter = 1 mil

Die Pad Pitch = 75 um

Bond Pad Pitch = 160 um

Mold Compound Dielectric Constant = 3.9

Gold Bondwire Bulk and Mutual Capacitance (pF)1 mil Diameter

0.0

0.1

0.2

0.3

0.4

0.5

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Length (mm)

Cap

acita

nce

(pF)

C11

C12

C13

© 2001 Amkor Technology, Inc.

Prepared by Elec. Pkg. Char. Group7/16/01 Page3

3D Bondwire Electrical Modeling Results

Bondwire Diameter = 1 mil

Die Pad Pitch = 75 um

Bond Pad Pitch = 160 um

Mold Compound Dielectric Constant = 3.9

Gold Bondwire Partial Self Resistance (mΩ )1 mil Diameter

050

100150200250300350400450500550600650

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Length (mm)

Res

ista

nce

(mΩ

)R11 @ 1GHz

R11 @ 100MHz