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APEC 2007 - System Design 28 February 2007 – Anaheim
Evolution of Hybrid Vehicle Electric System and its Support
Technologies
Kimimori Hamada TOYOTA MOTOR CORPORATION
APEC 2007 - System Design 28 February 2007 – Anaheim
Contents1. Toyota Hybrid System1. Toyota Hybrid System--II (THSII (THS--II)II)2. Electric Components in Hybrid system 2. Electric Components in Hybrid system 3. 3. HV Inverter SimulationHV Inverter Simulation4. IGBT development4. IGBT development5. Conclusion5. Conclusion
APEC 2007 - System Design 28 February 2007 – Anaheim
1. Toyota Hybrid System1. Toyota Hybrid System--IIII(THS(THS--II)II)
APEC 2007 - System Design 28 February 2007 – Anaheim
Toyota Hybrid System IIToyota Hybrid System II
Power split
GeneratorBattery
Motor
Mechanical power path
Electrical power path
Hybrid transmission
Engine
Power control unit
Inverter Boostconverter
device
APEC 2007 - System Design 28 February 2007 – Anaheim
Toyota Hybrid System IIToyota Hybrid System IIWith two-stage motor speed reduction device
Mechanical power path
Electrical power pathPower control unit
Power split device
Generator
Inverter
BatteryMotor
Hybrid transmission
Engine
Boost
Two-stage motor speed reduction device
Speed
Torq
ue
Output in high gear position
Output in low gear position
converter
APEC 2007 - System Design 28 February 2007 – Anaheim
Motor EfficiencyMotor Efficiency
Highefficiency area
Motor speed
Mot
or to
rque
Fixed motor speed reduction device
Motor speedM
otor
torq
ue
Two-stage motor speed reduction device
APEC 2007 - System Design 28 February 2007 – Anaheim
Fuel Efficiency & Fuel Efficiency & Acceleration PerformanceAcceleration Performance
20.0
22.5
25.0
27.5
30.0
32.5
35.0
2.5 3 3.5 4 4.5 530-50 mph (sec)
US
mod
e fu
el e
ffici
ency
(MP
G)
GS430
GS350
RX400hGToyota(2.4L)
E
B
DA
F(2.4L)
C
GoodGS450h(FR-HV)
APEC 2007 - System Design 28 February 2007 – Anaheim
2. Electric Components 2. Electric Components in Hybrid Systemin Hybrid System
APEC 2007 - System Design 28 February 2007 – Anaheim
Electric Circuits and Energy Flow in THSElectric Circuits and Energy Flow in THS--IIII
Filtercapacitor
Maincapacitor Inductor 288V
650V
PCU (power control unit)
Battery
Boost Converter
Inverterfor generator
Inverterfor motor
Generator
Motor
30kW
50kW
20kW
APEC 2007 - System Design 28 February 2007 – Anaheim
APEC 2007 - System Design 28 February 2007 – Anaheim
APEC 2007 - System Design 28 February 2007 – Anaheim
Reactor
Water-cooled heat sink
Smoothing capacitor
Boost power module
MG-ECUConverter
Inverter
& filter capacitor
Inverter power module
Internal Structure of PCU for GS450h
- Cooling units- Electric/electronic circuits- Power semiconductors- Simulation
APEC 2007 - System Design 28 February 2007 – Anaheim
3. HV Inverter Simulation3. HV Inverter Simulation
APEC 2007 - System Design 28 February 2007 – Anaheim
Inverter
Motor
ControllerTimeVe
hicl
e Sp
eed
TimeTem
pera
ture
Accelerator signal
Aims of Simulation TechnologyAims of Simulation Technology
Battery
INPUT
- Chip temperature- Current balance- Voltage surge- Power dissipationetc.
OUTPUT
APEC 2007 - System Design 28 February 2007 – Anaheim
Overall Structure of HV Inverter SimulationOverall Structure of HV Inverter Simulation
IGBT module
Electrical modelElectrical model
Heatsink
Controlsystem
Thermal modelThermal model
System modelSystem model
MotorTemp.
Smoothing capacitor
INVERTER
Accelerator signal
Current
Voltage
Voltage
Current
Loss
Vehicle specificationsCurrent
Frequency
Torque
(Weight, tire-diameter)
Diagram of electro-thermal-mechanical simulationfor HV inverter system
APEC 2007 - System Design 28 February 2007 – Anaheim
E2
VVP1GVVP1E
RuLu
RvLv
RwLw
VVN1E
VWP1GVWP1E
VWN1G
VUP1GVUP1E
VUN1G
VWN1E
VVN1G
IGBT_WP1
IGBT_WN1 IGBT_VN1
IGBT_VP1
IGBT_UN1
IGBT_UP1
DWP1
DWN1
DVP1
DVN1
DUP1
DUN1
L1
R1
C1
L2
R2
C2
Lu2
Lu3
IGBT_WP2
DWP2
IGBT_WN2
DWN2VWN2GVWN2E
VWP2GVWP2E
VUN1E
DUN2
DUP2
DVN2
DVP2
IGBT_UN2
IGBT_UP2
IGBT_VN2
IGBT_VP2
VUP2GVUP2E
VUN2GVUN2E
VVN2G
VVN2E
VVP2GVVP2E
Lu9 Lu4
Lu10 Lu5
Busbar parasitic inductance matrix
Motor
Capacitors
Diodes
IGBTs
Gate drive circuits
U V W
Electrical model in HV inverter system
(1) Electrical modelMajor Parts of Inverter SimulationMajor Parts of Inverter Simulation
APEC 2007 - System Design 28 February 2007 – Anaheim
IGBT power loss
Temperature of IGBT
Bottom of heatsink
Thermalinterference part
Silicon (IGBT)SolderCopper (DBC)AlN (DBC)Copper (DBC)SolderCopper (base plate)GreaseAluminum alloy(heatsink)
Heat transfer
Diode power lossTemperature of diode
(2) Thermal model
Compact thermal model (CTM) for IGBT moduleincluding water-cooling system
APEC 2007 - System Design 28 February 2007 – Anaheim
Prediction of IGBT temperature at full-throttle acceleration
0
25
50
75
100
0 1 2 3 4Time [s]
Tem
pera
ture
rise
[deg
ree
C]
SimulationMeasurement
Verification of HV Inverter SimulationVerification of HV Inverter Simulation
APEC 2007 - System Design 28 February 2007 – Anaheim
4. IGBT Development4. IGBT Development
APEC 2007 - System Design 28 February 2007 – Anaheim
Battery
Boostconverter
Inverter
Generator
Motor
HighHigh--Voltage Electrical SystemVoltage Electrical System
PriusPrius 500VDC 200VDC650VDCRX400hRX400h 288VDC
970V1200V
Bus line voltage Battery voltageIGBT VBD
APEC 2007 - System Design 28 February 2007 – Anaheim
Electric field (V/m)
Increase of resistivity
Improvement of IGBT Breakdown VoltageImprovement of IGBT Breakdown Voltage
N- drift layer
N+
P-
VB=area
Ecrit
600
800
1000
1200
1400
50 100 150 200Thickness of drift layer (um)
Bre
akdo
wn
volta
ge (V
)
50
150
250
350
450
On-
stat
e lo
sses
(W)
d
Increase of thicknessN+ buffer layer
(A)
(B)
P+ substrate
●
Increase of on-state losses accompanied with improvement in breakdown voltage
General ways to improve breakdown voltage of IGBT
APEC 2007 - System Design 28 February 2007 – Anaheim
Introduction of Introduction of EElectric lectric FField ield DDispersion (EFD) Layerispersion (EFD) LayerConventionalstructure(trench IGBT)
Conventionalstructure(trench IGBT)
Novelstructure(EFD IGBT)
N- drift layer
N+
P-
N+ buffer layerP+ substrate
N- drift layer
N+
P-
N+ buffer layerP+ substrate
N- drift layer
N+
P-
N+ buffer layerP+ substrate
EFD layer
Electricfield (V/m)
Electric fielddispersionprincipal
(Low BV)(High BV)(High BV)
APEC 2007 - System Design 28 February 2007 – Anaheim
Design and Effect of EFD LayerDesign and Effect of EFD Layer
1180
1190
1200
1210
Doping concentration of EFD layer (arb. unit)
Bre
akdo
wn
volta
ge (V
)
Thinner -10%
1000
1100
1200
1300
Without EFD layer
Bre
akdo
wn
volta
ge (V
)
230
250
270
290
On-
stat
e lo
sses
(W)
WithEFD layer
Thicker
Effect of EFD layerBreakdown voltage dependence on EFD layer conditions
APEC 2007 - System Design 28 February 2007 – Anaheim
Benchmark of Toyota InBenchmark of Toyota In--House IGBTsHouse IGBTs
180
220
260
300
340
500 750 1000 1250 1500Breakdown voltage (V)
On-
stat
e lo
sses
(W/c
m2 )
‘06 GS‘05 RX
Competitors
Good Toyota
APEC 2007 - System Design 28 February 2007 – Anaheim
Evolution of InEvolution of In--House IGBTsHouse IGBTs
Chip appearance
Chip size (mm2)
Chip thickness (um)
Breakdown voltage (V)
On-state losses(W/cm2)
Item ’03 Prius ’05 RX
13.7×9.7 12.75×9.39
380 375970 1200
265 242
’06 GS
300
232
12.75×9.39
1200
Device structure Planar IGBT EFD IGBT EFD IGBT
APEC 2007 - System Design 28 February 2007 – Anaheim
5. Conclusion5. Conclusion-
-
-
-
THS-II realizes dual requirements of fuel efficiency and acceleration performance by employing boost converter and two-stage motor speed reduction device.The electrical components of the THS-II are contributing to making the system more compact, and lightweight, and to increasing its power density.An HV inverter simulation has been developed as a powerful tool for HV system development.Low loss high-breakdown voltage novel IGBTs ,named EFD IGBTs, have been successfully developed for the THS-II.
APEC 2007 - System Design 28 February 2007 – Anaheim
Thank you!Thank you!