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3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

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Page 1: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

3-D Nano-scratching in silicon and silicon carbide

Dr John A PattenJerry Jacob

Western Michigan University, Kalamazoo, MIManufacturing Research Center

Page 2: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Overview of presentation

• Introduction to HPPT in ceramics• Examples of HPPT in ceramics• Scratching experiments on silicon • Scratching experiments on silicon carbide• Simulations of scratching experiments

– Silicon– Silicon Carbide

• Results and Discussion• Conclusions

Page 3: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Basics of HPPT and importance in Ceramics

• Definition of HPPT and relation to hardness of the material.

• D-B-T depth in ceramics.• Importance of HPPT in ceramic manufacturing.

Page 4: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Examples of HPPT in ceramics

Page 5: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Scratching experiments in silicon

Page 6: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Simulation setup for silicon scratching

Process parameters Value Unit Schematic

(Actual) Depth of Cut, doc 115* nm

Length of Cut, loc 10.0 µm

Cutting Speed, v 0.305 mm/s

Friction factor 0.1 -

Custom tool file for simulations

* Programmed depth of cut was 125 nm

Page 7: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Silicon Simulation result

Pressures at the tool-workpiece interface are at least 12GPa or higher. 12 GPa is the hardness of this silicon material.

Page 8: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Silicon Simulation result – cont’d

• Thrust force value from simulation at 115 nm is lower than experimental value at 75 nm.

Page 9: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Scratching experiments in silicon carbide

Scratching parameters

Tool: Diamond Stylus with 5 µm radius

Speed: 0.005 mm/sec

Scratch length: 5 mm

Load Range: 10 to 25 grams for Poco Graphite sample and

1 to 10 grams for CoorsTek

Polished Samples used

Poco Graphite CVD coated SiC surface roughness of <100 nm (Ra) and Coors Tek CVD coated SiC surface roughness of <10 nm

Page 10: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Determination of D-B-T depth

Optical image of a typical D-B-T in a scratch

Page 11: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Wyko RST image of Ductile scratch on CVD coated SiC

Page 12: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Simulation setup for silicon carbide

Parameters Value Unit Geometry

Programmed Depth (feed) 125 nm

Actual depth, doc 103 nm

Length of Cut, loc 10.0 µm

Cutting Speed, v 0.305 mm/s

Friction factor, µ 0.1, 0.26, 0.6 -

Page 13: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Result from simulations of silicon carbide

• Cutting force values are lower because simulation depth (105 nm) is smaller than experimental depth (120 nm).

• Thrust force values show good agreement.

Page 14: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Summary of simulations and conclusion• Summary of 3-D scratching simulations

– Si simulations show simulation thrust force is lower than experimental value.

• Material model needs to be validated

– SiC simulations show thrust forces in good agreement with the experiment.

– SiC simulations show cutting forces that are not in very good agreement with the experiment.

• depths are different

• 3-D scratching work shows encouraging results– initial attempts at simulations of ductile behavior of ceramic

materials • nanometer depths,• below the DBT depth of these nominally brittle materials.

Page 15: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Acknowledgements• National Science Foundation for the research grant (DMR).• Andy Grevstad and Third Wave Systems for software and funding

support.• Dr Guichelaar (WMU) for equipment at the Tribology lab.• Lei Dong at University of North Carolina at Charlotte Si work)• Biswarup Bhattacharya (WMU) for CVD coated SiC work.

Page 16: 3-D Nano-scratching in silicon and silicon carbide Dr John A Patten Jerry Jacob Western Michigan University, Kalamazoo, MI Manufacturing Research Center

Questions and comments

Contact: [email protected]