2N3553 el señor transistor 2N3553 (500Mhz 7W)

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    DATA SHEET

    Product specification

    Supersedes data of October 1981

    File under Discrete Semiconductors, SC08a

    1995 Oct 27

    DISCRETE SEMICONDUCTORS

    2N3553Silicon planar epitaxialoverlay transistor

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    Philips Semiconductors Product specification

    Silicon planar epitaxial

    overlay transistor 2N3553

    APPLICATIONS

    The 2N3553 is intended for use in VHF and UHF

    transmitting applications.

    DESCRIPTION

    The device is a silicon NPN overlay transistor in a TO-39

    metal package with the collector connected to the case.

    PINNING - TO-39/3

    PIN DESCRIPTION

    1 emitter

    2 base

    3 collector

    Fig.1 Simplified outline.

    handbook, halfpage

    MBB199

    1

    2

    3

    QUICK REFERENCE DATA

    RF performance

    SYMBOL PARAMETER CONDITIONS MAX. UNIT

    VCEX collector-emitter voltage IC 200 mA; VBE =1.5 V 65 V

    VCEO collector-emitter voltage open base; IC 200 mA 40 V

    ICM peak collector current 1.0 A

    Ptot total power dissipation up to Tmb = 25C 7.0 W

    Tj junction temperature 200 C

    fT transition frequency IC = 125 mA; VCE = 28 V 500

    f

    (MHz)

    VCE(V)

    Po(W)

    Gp(dB)

    (%)

    175 28 2.5 >10 >50

    WARNING

    Product and environmental safety - toxic materials

    This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged.

    All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety

    precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of

    the user. It must never be thrown out with the general or domestic waste.

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    Philips Semiconductors Product specification

    Silicon planar epitaxial

    overlay transistor2N3553

    LIMITING VALUES

    In accordance with the Absolute Maximum Rating System (IEC 134).

    SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

    VCBO collector-base voltage open emitter 65 V

    VCEX collector-emitter voltage IC 200 mA; VBE =1.5 V 65 V

    VCEO collector-emitter voltage open base; IC 200 mA 40 V

    VEBO emitter-base voltage open collector 4 V

    IC collector current (DC) 0.35 A

    ICM peak collector current 1 A

    Ptot total power dissipation up to Tmb = 25C 7 W

    Tstg storage temperature 65 +200 CTj junction temperature 200 C

    THERMAL CHARACTERISTICS

    SYMBOL PARAMETER VALUE UNIT

    Rth j-mb thermal resistance from junction to mounting base 25 K/W

    Fig.2 DC SOAR.

    (1) All frequencies, including DC.

    (2) f 1 MHz.

    (3) Allowed during switching off, provided the transistor is cut-offwith VBB 1.5 V; RBE 33; IC 200 mA and the transientenergy 0.5 mW.

    handbook, halfpage

    MGC928

    10

    1

    10

    102110-2

    10-1

    VCE(V)

    IC(A)

    (1)

    (2)

    (3)

    Fig.3 Power derating curve.

    handbook, halfpage

    0

    10

    Ptot(W)

    5

    0100 200

    Tmb(oC)

    MGC927

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    Philips Semiconductors Product specification

    Silicon planar epitaxial

    overlay transistor2N3553

    CHARACTERISTICS

    Tj = 25C unless otherwise specified.

    Note

    1. Pulsed through an inductor of 25 mH; = 0.5; f = 50 Hz.

    SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

    V(BR)CBO collector-base breakdown voltage open emitter; IC = 0.25 mA 65 V

    V(BR)CEO collector-emitter breakdown voltage open base; ICup to 200 mA;

    note 1

    40 V

    V(BR)CEX collector-emitter breakdown voltage ICup to 200 mA; VBE =1.5 V;

    RB = 33; note 1

    65 V

    V(BR)EBO emitter-base breakdown voltage open collector; IE = 0.25 mA 4 V

    VBE base-emitter voltage IC = 250 mA; VCE = 5 V 1.5 V

    VCEsat collector-emitter saturation voltage IC = 250 mA; IB = 50 mA 1.0 V

    ICEO collector leakage current open base; VCE = 3 0 V 0.1 mA

    hFE DC current gain VCE = 5 V; IC = 125 mA 15 200

    VCE = 5 V; IC = 250 mA 10 100

    fT transition frequency IC = 125 mA; VCE = 28 V 500 MHz

    Rhoie) real part of input impedance IC = 125 mA; VCE = 28 V;

    f = 200 MHz

    20

    Cc collector capacitance VCB = 28 V; IE = ie = 0;

    f = 1 M H z

    10 pF

    Fig.4 DC current gain as a function of collector

    current; typical values.

    handbook, halfpage

    0 100 200 300 400

    hFE

    60

    20

    0

    40

    MGC935

    500IC(mA)

    Fig.5 Collector capacitance as a function of

    collector-base voltage; typical values.

    handbook, halfpage

    0

    5

    20

    15

    10

    0 20 40 60

    (pF)

    Cc

    VCB(V)

    MGC930

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    Philips Semiconductors Product specification

    Silicon planar epitaxial

    overlay transistor2N3553

    APPLICATION INFORMATION

    RF performance at Tmb = 25C.

    Ruggedness

    The transistor is capable of withstanding a load mismatch corresponding to VSWR = 3 : 1 varied through all phases,

    under the conditions: VCE = 28 V; f = 175 MHz; Tmb = 25C; Po = 2.5 W.

    f

    (MHz)

    VCE(V)

    Po(W)

    Gp(dB)

    (%)

    175 28 2.5 >10 >50

    (1) The length of the external emitter wire is 1.6 mm.

    Fig.6 Test circuit at 175 MHz.

    handbook, full pagewidth

    C1input

    50

    output50

    L1

    C2

    C5

    C3C4

    MGC926L2

    L4

    L3

    DUT

    +VCC

    (1)

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    Philips Semiconductors Product specification

    Silicon planar epitaxial

    overlay transistor2N3553

    List of components (see Fig.6)

    COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE No.

    C1, C2, C3, C4 air trimmer capacitor 4 to 29 pF

    C5 polyester capacitor 10 nF

    L1 1 turn 1.0 mm copper wire int. diameter 10 mm;

    leads 2 10 mm

    L2 Ferroxcube choke coil Z = 550 20%;

    f = 175 MHz

    4312 020 36640

    L3 15 turns enamelled 0.7 mm

    copper wire

    int. diameter 4 mm;

    closely wound

    L4 3 turns enamelled 1.5 mm

    copper wire

    int. diameter 12 mm;

    leads 2 20 mm;closely wound

    Fig.7 Transition frequency as a function of

    collector current; typical values.

    Tj = 25C.

    (1) VCE = 28 V.

    (2) VCE = 14 V.

    (3) VCE = 7 V .

    handbook, halfpage

    0

    600

    fT(MHz)

    400

    (2)(3)

    200100 200 300 400

    IC(mA)

    MGC937

    (1)

    Fig.8 Output power as a function of frequency;

    typical values.

    VCE = 28 V; Tmb = 25C.

    (1) Pi = 0.5 W.

    (2) Pi = 0.375 W.

    (3) Pi = 0.25 W.

    (4) Pi = 0.1 W.

    (5) Pi = 0.05 W.

    handbook, halfpage

    0

    10

    Po(W)

    5

    (1)

    (2)

    (3)

    (4)

    (5)

    0200100 400300

    f(MHz)

    MGC929

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    Philips Semiconductors Product specification

    Silicon planar epitaxial

    overlay transistor2N3553

    PACKAGE OUTLINE

    handbook, full pagewidth

    45o

    0.86max

    1.0max

    5.08

    9.4 max

    1

    2

    3

    8.5max

    6.6max

    12.7 min

    0.51max

    MSA241

    Fig.9 TO-39.

    Dimensions in mm.

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    Philips Semiconductors Product specification

    Silicon planar epitaxial

    overlay transistor2N3553

    DEFINITIONS

    LIFE SUPPORT APPLICATIONS

    These products are not designed for use in life support appliances, devices, or systems where malfunction of these

    products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

    use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

    improper use or sale.

    Data Sheet Status

    Objective specification This data sheet contains target or goal specifications for product development.

    Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

    Product specification This data sheet contains final product specifications.

    Limiting values

    Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

    more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

    of the device at these or at any other conditions above those given in the Characteristics sections of the specification

    is not implied. Exposure to limiting values for extended periods may affect device reliability.

    Application informationWhere application information is given, it is advisory and does not form part of the specification.

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    www.datasheetcatalog.com

    Datasheets for electronics components.

    http://www.datasheetcatalog.com/http://www.datasheetcatalog.com/http://www.datasheetcatalog.com/http://www.datasheetcatalog.com/