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8/14/2019 2N3553 el seor transistor 2N3553 (500Mhz 7W)
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DATA SHEET
Product specification
Supersedes data of October 1981
File under Discrete Semiconductors, SC08a
1995 Oct 27
DISCRETE SEMICONDUCTORS
2N3553Silicon planar epitaxialoverlay transistor
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Philips Semiconductors Product specification
Silicon planar epitaxial
overlay transistor 2N3553
APPLICATIONS
The 2N3553 is intended for use in VHF and UHF
transmitting applications.
DESCRIPTION
The device is a silicon NPN overlay transistor in a TO-39
metal package with the collector connected to the case.
PINNING - TO-39/3
PIN DESCRIPTION
1 emitter
2 base
3 collector
Fig.1 Simplified outline.
handbook, halfpage
MBB199
1
2
3
QUICK REFERENCE DATA
RF performance
SYMBOL PARAMETER CONDITIONS MAX. UNIT
VCEX collector-emitter voltage IC 200 mA; VBE =1.5 V 65 V
VCEO collector-emitter voltage open base; IC 200 mA 40 V
ICM peak collector current 1.0 A
Ptot total power dissipation up to Tmb = 25C 7.0 W
Tj junction temperature 200 C
fT transition frequency IC = 125 mA; VCE = 28 V 500
f
(MHz)
VCE(V)
Po(W)
Gp(dB)
(%)
175 28 2.5 >10 >50
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
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Philips Semiconductors Product specification
Silicon planar epitaxial
overlay transistor2N3553
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter 65 V
VCEX collector-emitter voltage IC 200 mA; VBE =1.5 V 65 V
VCEO collector-emitter voltage open base; IC 200 mA 40 V
VEBO emitter-base voltage open collector 4 V
IC collector current (DC) 0.35 A
ICM peak collector current 1 A
Ptot total power dissipation up to Tmb = 25C 7 W
Tstg storage temperature 65 +200 CTj junction temperature 200 C
THERMAL CHARACTERISTICS
SYMBOL PARAMETER VALUE UNIT
Rth j-mb thermal resistance from junction to mounting base 25 K/W
Fig.2 DC SOAR.
(1) All frequencies, including DC.
(2) f 1 MHz.
(3) Allowed during switching off, provided the transistor is cut-offwith VBB 1.5 V; RBE 33; IC 200 mA and the transientenergy 0.5 mW.
handbook, halfpage
MGC928
10
1
10
102110-2
10-1
VCE(V)
IC(A)
(1)
(2)
(3)
Fig.3 Power derating curve.
handbook, halfpage
0
10
Ptot(W)
5
0100 200
Tmb(oC)
MGC927
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Philips Semiconductors Product specification
Silicon planar epitaxial
overlay transistor2N3553
CHARACTERISTICS
Tj = 25C unless otherwise specified.
Note
1. Pulsed through an inductor of 25 mH; = 0.5; f = 50 Hz.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V(BR)CBO collector-base breakdown voltage open emitter; IC = 0.25 mA 65 V
V(BR)CEO collector-emitter breakdown voltage open base; ICup to 200 mA;
note 1
40 V
V(BR)CEX collector-emitter breakdown voltage ICup to 200 mA; VBE =1.5 V;
RB = 33; note 1
65 V
V(BR)EBO emitter-base breakdown voltage open collector; IE = 0.25 mA 4 V
VBE base-emitter voltage IC = 250 mA; VCE = 5 V 1.5 V
VCEsat collector-emitter saturation voltage IC = 250 mA; IB = 50 mA 1.0 V
ICEO collector leakage current open base; VCE = 3 0 V 0.1 mA
hFE DC current gain VCE = 5 V; IC = 125 mA 15 200
VCE = 5 V; IC = 250 mA 10 100
fT transition frequency IC = 125 mA; VCE = 28 V 500 MHz
Rhoie) real part of input impedance IC = 125 mA; VCE = 28 V;
f = 200 MHz
20
Cc collector capacitance VCB = 28 V; IE = ie = 0;
f = 1 M H z
10 pF
Fig.4 DC current gain as a function of collector
current; typical values.
handbook, halfpage
0 100 200 300 400
hFE
60
20
0
40
MGC935
500IC(mA)
Fig.5 Collector capacitance as a function of
collector-base voltage; typical values.
handbook, halfpage
0
5
20
15
10
0 20 40 60
(pF)
Cc
VCB(V)
MGC930
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Philips Semiconductors Product specification
Silicon planar epitaxial
overlay transistor2N3553
APPLICATION INFORMATION
RF performance at Tmb = 25C.
Ruggedness
The transistor is capable of withstanding a load mismatch corresponding to VSWR = 3 : 1 varied through all phases,
under the conditions: VCE = 28 V; f = 175 MHz; Tmb = 25C; Po = 2.5 W.
f
(MHz)
VCE(V)
Po(W)
Gp(dB)
(%)
175 28 2.5 >10 >50
(1) The length of the external emitter wire is 1.6 mm.
Fig.6 Test circuit at 175 MHz.
handbook, full pagewidth
C1input
50
output50
L1
C2
C5
C3C4
MGC926L2
L4
L3
DUT
+VCC
(1)
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Philips Semiconductors Product specification
Silicon planar epitaxial
overlay transistor2N3553
List of components (see Fig.6)
COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE No.
C1, C2, C3, C4 air trimmer capacitor 4 to 29 pF
C5 polyester capacitor 10 nF
L1 1 turn 1.0 mm copper wire int. diameter 10 mm;
leads 2 10 mm
L2 Ferroxcube choke coil Z = 550 20%;
f = 175 MHz
4312 020 36640
L3 15 turns enamelled 0.7 mm
copper wire
int. diameter 4 mm;
closely wound
L4 3 turns enamelled 1.5 mm
copper wire
int. diameter 12 mm;
leads 2 20 mm;closely wound
Fig.7 Transition frequency as a function of
collector current; typical values.
Tj = 25C.
(1) VCE = 28 V.
(2) VCE = 14 V.
(3) VCE = 7 V .
handbook, halfpage
0
600
fT(MHz)
400
(2)(3)
200100 200 300 400
IC(mA)
MGC937
(1)
Fig.8 Output power as a function of frequency;
typical values.
VCE = 28 V; Tmb = 25C.
(1) Pi = 0.5 W.
(2) Pi = 0.375 W.
(3) Pi = 0.25 W.
(4) Pi = 0.1 W.
(5) Pi = 0.05 W.
handbook, halfpage
0
10
Po(W)
5
(1)
(2)
(3)
(4)
(5)
0200100 400300
f(MHz)
MGC929
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Philips Semiconductors Product specification
Silicon planar epitaxial
overlay transistor2N3553
PACKAGE OUTLINE
handbook, full pagewidth
45o
0.86max
1.0max
5.08
9.4 max
1
2
3
8.5max
6.6max
12.7 min
0.51max
MSA241
Fig.9 TO-39.
Dimensions in mm.
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Philips Semiconductors Product specification
Silicon planar epitaxial
overlay transistor2N3553
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application informationWhere application information is given, it is advisory and does not form part of the specification.
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