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23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea
Presented by Naehyuck Chang
Kiyoung Choi2015 General Co-Chairs
On Behalf of VLSI-SoC 2015 Organizing Committee
June 9, 2015
VLSI-SoC 2015Report
23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea
● Program Chairs○ Youngsoo Shin, KAIST, Korea○ Chi-Ying Tsui, HKUST, Hong Kong
● Vice Program Chair○ Jae-Joon Kim, POSTECH, Korea
● Analog and mixed-signal IC design○ Jaeha Kim, Seoul National University, Korea○ Tai-Cheng Lee, National Taiwan University, Taiwan
● CAD: synthesis and analysis○ Minsik Cho, IBM Research, USA○ Masahiro Fujita, University of Tokyo, Japan
● Circuits and systems for signal processing and communications○ Per Larsson-Edefors, Chalmers University, Sweden○ Oscar Gustafsson, Linköping University, Sweden
● Embedded system: architecture, design, and software○ Vijaykrishnan Narayanan, Penn State University, USA○ Jason Xue, City University of Hong Kong, Hong Kong
TECHNICAL PROGRAM COMMITTEE
23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea
● Low-power and thermal-aware design○ Massimo Poncino, Politecnico di Torino, Italy○ Tadahiro Kuroda, Keio University, Japan
● Memory: technology, circuit, and system○ Yiran Chen, University of Pittsburg, USA○ Rahul Rao, IBM, India
● Prototyping, verification, modeling, and simulation○ Swarup Bhunia, Case Western Reserve University, USA○ Graziano Pravadelli, University of Verona, Italy
● System architectures: NoC, 3D, multi-core, and reconfigurable○ Yuan Xie, UC Santa Babara, USA○ Nam Sung Kim, University of Wisconsin-Madison, USA
● Design for variability, reliability, and test○ Chris Kim, University of Minnesota, USA○ Jing-Jia Liou, NTHU, Taiwan
● Security of SoC Systems○ Ozgur Sinanoglu, New York University Abu Dhabi, UAE○ Srinivas Katkoori, University of South Florida, USA
23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea
TECHNICAL PROGRAM COMMITTEE
● Total submissions Abstracts: 138, Full papers: 118
23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea
Submission Stats
Track Submissions
Analog and mixed-signal IC design 17
CAD: synthesis and analysis 5
Circuits and systems for signal processing and communications 17
Design for variability, reliability, and test 11
Embedded system: architecture, design, and software 8
Low-power and thermal-aware design 10
Memory: technology, circuit, and system 11
Prototyping, verification, modeling, and simulation 7
Security of SoC Systems 4
System architectures: NoC, 3D, multi-core, and reconfigurable 20
COI 8
Total 118
• No. of reviews/paper: 4
• Target acceptance rateRegular: 48/118 = 41%Regular + Poster: 66/118 = 56%
• Session schedule12 regular session
• (4 papers per session) +1 poster session
• Acceptance notificationJune 25th
23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea
Review Process
Track Regular Poster
Analog 7 2
CAD 2 1
Circuits & Systems 7 3
Variability 4 1
Embedded 3 1
Low-power 3 1
Memory 5 1
Prototyping 2 1
Security 1 1
System Architecture 8 4
COI 6 2
Total 48 18
• PhD Forum abstracts included in the proceedings?
• Copyright issue should be resolved between IFIP and IEEE
23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea
Issues
Look forward to seeing you in Daejeon, Korea!
Thank you!