2015. Q4. Company CEOJD Park EstablishmentJun.2004Y Business Category Address

2015. Q4

2004 ㈜ 한트론 설립

㈜피델릭스 Agent contract

2005 Core logic ISP - Mobile SDRAM design Win

엠텍비젼 ISP - Mobile SDRAM design Win

2006 Telechips Multimedia chip - Mobile SDRAM design Win

2008 Nexus chips 3D Chip - Mobile SDRAM design win

현대모비스 차량용 Bluetooth module - mobile sdram design win

2010 ㈜ Nexell Agent contract

2011 R&D 전문회사 ㈜뉴트론 설립

2013 파트론 대리점 계약

2014 삼성전자 테스트 무선 모듈 S/W 개발 외주

㈜한트론 & ㈜ 뉴트론 합병

2015 바른 전자 대리점 계약

용접마스크 전문업체 OTOS – Auto Glass 구동기 개발 계약

㈜코맥스 – BLE module 개발 공급

Wi-Fi module

Wi-Fi to Serial module

Bluetooth module

BLE module

GPS module

Antenna

Bluetooth Firmware

Embedded Solution

RTOS

BLE Solution

WiFi M2M solution

H/W Debugging

S/W Debugging, Guide

SD CARD

eMMC

SDRAM / DDR SDRAM

NAND Flash

Serial Flash

Serial NAND Flash

SRAM

Memory

▶ SD CARD

▶ eMMC

▶ SDRAM

▶ DDR SDRAM

▶ NAND Flash

▶ Serial Flash

▶ SRAM

▶ Serial NAND Flash

RF Parts

▶ Wi-Fi module

▶ Wi-Fi to Serial module

▶ Bluetooth module

▶ BLE module

▶ GPS module

▶ Antenna

▶ DTV Tuner

▶ Customizing module

SD CARD

eMMC

SDRAM ( KGD, Package )

DDR SDRAM ( KGD, Package )

NAND Flash ( KGD, Package )

Serial Flash ( KGD, Package )

SRAM

Serial NAND Flash

SD Card & UFD

Products

Capacity (GB) Package Size

NAND Controller Class 4 8 16 32 64 SD Micro SD

SDHC 　 O 　　　 O O Micron MLC SMI 6

SDHC O O 　　　 O O Samsung TLC Asolid 6

SDHC 　　 O O 　 O O Samsung TLC SMI 10

SDHC 　 O O O 　 O O Hynix MLC SMI 10

SDHC O O O O 　 O O Micron MLC SMI 10

SDXC 　　　　 O O O Hynix MLC SMI UHS-1

SDXC 　　　　 O O O Samsung TLC SMI UHS-1

SDXC 　　　　 O O O Micron MLC SMI UHS-1

Products Capacity Size NAND Controller

UFD 4GB,8GB, 16GB,32GB,64GB UFD, micro UFD Samsung TLC SMI

eMMC

Note Ver. Capacity Controller Part number Package Size

MLC V4.51

4GB

SM2724BA

BEM04M5B50XA-A3CT FBGA153 11.5 x13.0x1.0

8GB BEM08M3B50XA-B9CT FBGA169 12.0 x16.0 x1.0



TLC V4.51

8GB

SA3601

BEM08S3B60XA-A3CT FBGA153 11.5 x13.0x1.0

16GB BEM16S3B60XA-A3CT FBGA153 11.5 x13.0x1.0

32GB BEM32S3B60XA-A3CT FBGA153 11.5 x13.0x1.0

* Operating Voltage Range• VCC = 2.7V~3.6V (typical 3.3V)• VCCQ =1.7V~1.95V (typical 1.8V) or 2.7V~3.6V (typical 3.3V)

* Operating temperature range Operating Temperature : -25℃ ~ 85℃ Storage Temperature : -40℃ ~ 85℃

* Key Features• Support JEDEC/ e•MMC 4.51 Compliant• Support 10 wire bus and hardware reset• Support Host clock frequencies 0 ~ 200MHz• Support Single Data Rate(SDR) and Dual Data Rate(DDR)• Support different Bus width : 1bit, 4bit, 8bit• Support Original Boot and Alternative Boot modes• Support Data Removal (Erase, Trim and Sanitize)• Support Replay Protected Memory Block(RPMB)• Support Multiple Partitions with enhanced attribute• Support Lock/Unlock and Write Protection• Support Enhanced Reliable Write• Support Data Protection for Power Failure• Support Power Saving Sleep Mode• Support High Priority Interrupt(HPI)• Support Background Operation• Support Packed Commands• Support Dynamic Power Manager : standby and sleep modes

Category Vcc 16Mb 32Mb 64Mb 128Mb 256Mb 512Mb 1Gb 2Gb 4Gb 8Gb 16Gb

LP DRAM

1.8 O O O O O O

3.0 O O O O O

LP DDR

1.8 O O O O O O O

3.0 O O O O

LP DDR2 1.8 O O O O O O O

SDRAM 3.0 O O O O

DDR 2.5 O O O

DDR2 1.8 O O O O

DDR3

1.35 O O O O

1.5 O O O O

DDR4 1.2 O O O

Category Vcc256K

b512k

b1Mb 2Mb 4Mb 8Mb 16Mb 32Mb 64Mb

128Mb

256Mb

SPI NOR

1.8V O O O O O O O O

3.0V O O O O O O O O O O O

Category Vcc 1Gb 2 4 8 16 32 64 128 256 512 1TB

SPI NAND

1.8V O O O

3.0V O O O

SLC NAND

1.8V O O O

3.0V O O O O

MLC NAND

3.0V O O O O O O O

TLC NAND

3.0V O O O O

Async SRAM

　 Org. Vdd 　

Density x8 x16 1.65~3.6 3.3 5 Package

1M O O O O O 44TSOP2, 48FBGA, 32sTSOP1

2M O O O O O 44TSOP2,36FBGA, 48FBGA

4M O O O O O 44TSOP2,36FBGA, 48FBGA

8M O O O 　 O 44TSOP2, 48FBGA

16M O O O O O 48TSOP1, 48FBGA, 44TSOP2

32Mbit O O O 　　 48FBGA

Sync SRAM

Operating Mode

Density OrgOperati

ng mode

VddAccess time

Package

4M 9M 18M 36M 72M x18 x36

Pipeline Burst O O O O O O O SPB 2.3~3.5 2.6 100TQFP

Flow Through O O O O O O O FT 2.3~3.5 6.5100TQFP, 100LQFP

NT Pipeline Burst O O O O O O O NT SPB 2.3~3.5 2.6100TQFP , 165FBGA

NT Flow Through O O O O O O O NT FT 2.3~3.5 6.5 100TQFP

DDR SRAM

　 Org Operating Mode 　　

Density x18 x36 DDRII DDR II + ODT SIO VDD (V) Package

18Mbit O O O O O O 1.8 165FBGA



Quadruple SRAM

　 Org Operating Mode 　　

Density x9 x18 x36 QDRI QDR II QDR II + ODT VDD (V) Package

18Mbit O O O O O O O 1.8 ~ 2.5 165FBGA

36Mbit O O O O O O O 1.8 165FBGA



Wi-Fi module

Wi-Fi to Serial module

Bluetooth module

BLE module

GPS module

Antenna

DTV Tuner

Customizing module

Part Number Chipset Specification Dimension Sample Remark

W8188RHPS REALTEK - RTL8188EUS IEEE802.11b/g/n, USB, 1T1R 12.2 x 13.0 x 2.0T Available

W8189RHPA REALTEK - RTL8189ES IEEE802.11b/g/n, SDIO, 1T1R 14.1 x 12.5 x 1.8T Available Telec

W8192RHPA REALTEK - RTL8192EU IEEE802.11b/g/n, USB, 2T2R 14.0 x 12.5 x 2.0T Available

W8812RHPU REALTEK - RTL8812AU IEEE802.11a/b/g/n/ac, USB, 2T2R 23.0 x 23.0 x 2.2T Available

PWD-100 REALTEK - RTL8188EUS IEEE802.11b/g/n, USB Dongle, 1T1R 30.7 x 15.45 x 9.75T Available WiFi allience , KCC, Telec

C8821RHPA REALTEK - RTL8821AU IEEE802.11a/b/g/n/ac + BT4.0, USB, 1T1R 19.0 x 17.0 x 2.2T Available

C8723RHPS REALTEK - RTL8723BS IEEE802.11b/g/n + BT4.0, SDIO, 1T1R 14.0 x 14.0 x 2.5T Available

C8131THPA TI - WL1831 IEEE802.11b/g/n + BT4.0, SDIO, 1T1R 13.0 x 11.0 x 2.1T Available

C8133THPA TI - WL1833 IEEE802.11a/b/g/n + BT4.0, SDIO, 1T1R 13.0 x 11.0 x 2.1T Available

CZ3130A TI - WL1831 + CC2530IEEE802.11b/g/n + BT4.0 + ZigBee

SDIO/UART, 1T1R22.0 x 21.0 x 2.2T 2015.4Q

CZ3730A TI - WL1837 + CC2530IEEE802.11a/b/g/n + BT4.0 + ZigBee

SDIO / UART, 2T2R22.0 x 21.0 x 2.2T 2015.4Q

PWD-100 W8188 USB W8189RHPA-SDIO C1833 THPA W1803THPA

RAK415

•IEEE 802.11b/g/n wireless standards•Integrated TCP / IP protocol stack•OPEN, WEP, WPA/WPA2-PSK Encryptions•SoftAP, Station modes•TCP, UDP protocols•DHCP SERVER / DHCPCLIENT•AT commands and transparent transmission mode•UART communication with a data flow control, maximum rate of 921600bps•multiple configuration tools for one-step configuration•wireless upgrade firmware•On-board ceramic antenna or U.FL antenna connector•Operating voltage: 3.3V•Support 4 kinds of power operating mode, with the lowest power consumption of 1-2uA•Small package size: 23.14mm × 28.75mm•FCC, RoHS and CE compliant

CC3200

802.11b/g/n 2.4GHzStation, AP with one station, Wi-Fi Direct P2PWPA2 Personal, WPA2 EnterpriseConfiguration WPS2, Access Point with HTML page, SmartConfig™ TechnologyIPv4, TCP, UDP, RAW, ARP, DHCP, DNS, ICMP, mDNS, mDNS-SD, SSL 3.0, TLS 1.2 HTTP ServerNumber of Sockets 8 TCP, UDP or RAW, 2 TLS/SSLMax Throughput 16 Mbps UDP, 12Mbps TCPHost Interface UART, 3 Mbps(baud rate)Power modes Active, Sleep, HibernatePower consumption @ 3.6V Transmit 229mA @ 54 OFDM, max power (MCU Active)Temperature range -20C to +70CMCU Core Cortex-M4, 80MHZ (TI CC3200)2x UART up to 5Mbps1x I2C (master or slave)2x SPI (master or slave)1x McASP with I2S or PCM4-channel 12 bit

Part Number Chipset Specification Dimension Sample Remark

MBL0402E CSR BC04-Ext V2.1 + EDR, Class2, Flash(8M), UART/USB 12.9 x 10.4 x 2.2T

MBL0502 CSR BC05-MM V2.1 + EDR, Class2, Flash(8M), UART/USB 12.9 x 10.4 x 2.2T

MBL0502B CSR BC05-MM V2.1 + EDR, Class2, Flash(8M), UART/USB 12.9 x 10.4 x 2.2T

BTMC8645 CSR8645 V4.0 Class2 ROM, EEPROM, UART/ USB 12.9 x 10.4 x 2.2T

BTMD14581 Dialog DA14581v4.1 Low Energy 84 kB ROM, 32 kB OTP, 50 kB RAM 1M Flash (Option) TX Power -4 to +0 dBm

7.0 x 7.0 x 1.6T Available

BTMD14581S Dialog DA14581v4.1 Low Energy 84 kB ROM, 32 kB OTP, 50 kB RAM TX Power -4 to +0 dBm Internal Antenna

7.0 x 7.0 x 1.0T 2015.3Q SIP Type

BTMC1010 CSR CSR1010v4.0 Low Energy 64KB ROM, 64KB RAM TX Power -20 to +7.5 dBm RX/TX Active ~16mA


BTMT2541 TI CC2541v4.0 Low energy128 KB or 256KB. & 8KB RAM TX Power +5 dBm


BTMC8670 CSR CSR8670Classic + BLE Power level : Class 2 Kalimba DSP coprocessor, 80MIPS


BTMC8811 CSR CSR8811Classic + BLE Power level : Class 2 Support HFP v1.6 wide-band speech

6.5 X 5.4 X 1.7 T Available

BTMT2650 TI CC2650BLE + Zigbee 128kB Flash, 30kB RAM TX Power +5 dBm 5.9mA lowest Rx

20.9 x 21.7 x 0.8T Available BLE + Zigbee

TX-S2470B Radiopulse MG2470BTx Power : +8.5dBm (Max) 25mA @ Rx / 43mA @ Tx sleep : 50uA max Flash Memory : 64KB

7.0 x 7.0 x 1.4T Available Zigbee

Part No Chipset DimensionTTFF

Current consumption

Tracking Sensitivity RemarksCold Hot

G1613BB0E U-Blox7 16.0 x 13.0 x 2.3T 26sec 1sec 37mA typ. @ 3.3v-162dBm/-158dBm

<Module> Stand alone / LNA Included GPS/GLONASS Switching

G1613BB0F U-Blox8 16.0 x 13.0 x 2.3T 26sec 1sec 45mA typ. @ 3.3v -167dBm<Module> Stand alone / LNA Included GPS & GLONASS GPS & Beidou

G1613SB0C SiRF4 16.0 x 13.0 x 2.3T 30sec 1sec 35mA typ. @ 3.3v -163dBm <Module> Stand alone / LNA Included GPS

G1311SB0A SiRF4 13.0 x 11.0 x 2.1T 30sec 1sec 35mA typ. @ 3.3v -163dBm <Module> Stand alone GPS

G2825S(B)B2x SiRF4, U-Blox7/8 28.0 x 25.0 x 7.95T set condition 1sec 35mA typ. @ 3.3v -163dBm<Smart Module>25x25x3 ㎜ patch / Sirf4 or U-blox7(8) module /Backup battery / UART connector

G2019BB2x U-Blox7 20.0 x 20.0 x 6.4T set condition 1sec 37mA typ. @ 3.3v -162dBm<Smart Module>20x20x3.5 ㎜ patch / U-blox7 module /Backup battery / UART cable

GM4942S(B) SiRF4, U-Blox7 49.0 x 42.0 x 14.7T set condition 1sec 37mA typ. @ 3.3v -162dBm<G-Mouse>25x25x3 ㎜ patch / Sirf4 or U-blox7 module /Backup battery / UART connector

GM4942B U-Blox8 49.0 x 42.0 x 14.7T set condition 1sec 45mA typ. @ 3.3v -167dBm<G-Mouse>25x25x3 ㎜ patch / U-blox8 module /Backup battery / UART connector

Chip AntennaApplication Part No Frequency Average Gain VSWR Peak Gain Size

Bluetooth / WLAN / WiFi / ZigbeeSDBTPTR3015

2445±40Mhz Typical Value 0~1.0dBi 2.0~3.0 MAXTypical Value 3.0 x 1.5 x 1.2T

ODBTPTR7020 2.0~4.0dBi 7.0 x 2.0 x 1.2T

Chip Antenna For GPS

ODGPPTR3015

1575.42±5Mhz Typical Value 0~2.0dBi 2.0~3.0 MAX

Typical Value3.0 x 1.5 x 1.2T

ODGPPTR4018 4.0 x 1.8 x 1.2T

ACS1575HDXX2.0~3.0dBi

4.0 x 2.0 x 1.2T

ODGPPTR7020 7.0 x 2.0 x 1.2 T

For Wi-Fi 2.4Ghz & 5 Ghz ODBWPTR50202445 ± 40Mhz

Typical Value 0~2.0dBi 2.0~3.0 MAXTypical Value

5.0 x 2.0 x 1.2T5500 ± 500Mhz 2.0~4.0dBi

Dipole Antenna (Bluetooth / WLAN / WiFi / Zigbee)

Part NoFrequency

Range （ MHz ）

Bandwidth

（ MHz ）VSWR Gain

Max Inputpower（ W ）

Input

Impedance （ Ω ）

Polarization Type Antenna Size

（ mm ） Connector Type

XQZ-2400E-0 2400-2483 83 ≤1.5 0 （ dBi ） 50 50 Vertical 30+/-1 SMA male

XQZ-2400E-3 2400-2500 MHz 100MHZ ≤2 3dBi 50 50 Vertical 110±3mm SMA male

Thank You

E-mail : [email protected] : 031-719-6719Fax : 031-719-6716

www.nutron.co.kr

Documents

2015. Q4. Company CEOJD Park EstablishmentJun.2004Y Business Category Address