2011 International SoC Design Conference (ISOCC 2011)toc.proceedings.com/13892webtoc.pdf · Jeju, South Korea 17 – 18 November 2011 IEEE Catalog Number: ISBN: CFP1169E-PRT 978-1-4577-0709-4

IEEE Catalog Number: ISBN:

CFP1169E-PRT 978-1-4577-0709-4

2011 International SoC Design Conference (ISOCC 2011)

Jeju, South Korea 17 – 18 November 2011

2011 International SoC Design Conference

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with amplitude and phase imbalance less than 0.1dB and 0.34 degrees respectively over the 55-66GHz frequency band.

S1-1Kaixue Ma, Shouxian Mou, Yang Lu, Lim Kok Meng and Kiat Seng YeoNanyang Technological University, Singapore ································································ 1

S1-2Keping Wang, Kaixue Ma and Kiat Seng YeoNanyang Technological University, Singapore ································································ 5

S1-3Thangarasu Bharatha Kumar, Kaixue Ma, Kiat Seng Yeo, Shouxian Mou and Mahalingam NagarajanNanyang Technological University, Singapore ································································ 9

S1-4Renjing Pan, Jiangmin Gu, Kiat Seng Yeo, Wei Meng Lim and Kaixue MaNanyang Technological University, Singapore ································································ 13

S1-5Fanyi Meng, Kiat Seng Yeo, Shanshan Xu, Kaixue Ma and Chee Chong LimNanyang Technological University, Singapore ································································ 17

Session 2 High-Speed and Power-Aware Circuit Techniques for Future Integrated Systems

13:30-15:00 / Room A

Tetsuya Iizuka (University of Tokyo, Japan)

AbstractHigh-speed communication techniques continue to demand advances in CMOS technologies for

both wireless and wireline applications. At the same time, the power challenge is another concern especially for the mobile and medical applications and the energy-efficient systems must be optimized to maintain low-energy and high-throughput operations simultaneously. This special session presents several state-of-the-art circuit components and systems for high-speed communications and robust


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power-aware circuits. The first paper presents a 60-GHz direct-conversion transceiver which realizes IEEE802.15.3c compliant full-rate wireless communication, and the second paper proposes a low-phase-noise ring-VCO-based frequency multiplier with a new sub-harmonic direct injection locking technique. Then, a 16Gbps laser-diode driver based on a bandwidth enhancement technique with mutually-coupled inductor is presented in the third paper. The fourth paper introduces the ultra-low power reference circuit design techniques to realize energy-efficient robust low-voltage sub-threshold digital circuit, and the last paper proposes a novel charge pump circuit that can generate higher output voltage than the breakdown voltage to enable an integration of the MEMS and CMOS technologies.

S2-1Kenichi OkadaTokyo Institute of Technology, Japan ············································································ 20

S2-2

Tetsuya HiroseKobe University, Japan ···································································································· 24

S2-3

Atsushi Shirane, Hiroyuki Ito, Noboru Ishihara and Kazuya MasuTokyo Institute of Technology, Japan ············································································ 28

S2-4

Norifumi Kanemaru, Sho Ikeda, Tatsuya Kamimura, Sang-yeop Lee, Satoru Tanoi, Hiroyuki Ito, Noboru Ishihara and Kazuya MasuTokyo Institute of Technology, Japan ············································································ 32

S2-5

Akira Tsuchiya(1), Takeshi Kuboki(1), Yusuke Ohtomo(2), Keiji Kishine(3), Shigekazu Miyawaki(1),Makoto Nakamura(2) and Hidetoshi Onodera(1)

(1)Kyoto University, Japan (2)NTT Corporation, Japan (3)University of Shiga Prefecture, Japan ··········································································· 36


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Session 3 Implementation of Low-Density Parity-Check Code13:30-15:00 / Room B

Jin Sha (Nanjing University, China)

AbstractIn digital communication and information theory, forward error correction (FEC) is a system

of error control for data transmission, whereby the sender adds systematically generated redundant data to its messages, also known as an error-correcting code (ECC). Recently, there has been a great research activity in the field of FEC achitectures. Some near-optimal (near-Shannon limit) error correction codes, such as Low-Density Parity-Check (LDPC) codes, have become one of the most attractive topics of interest in both academia and industry. The study on efficient Very Large Scale Integration (VLSI) design for LDPC decoding is a hot research filed and is essential for practical applications. The Special Invited Session on ISOCC aims to present latest's advances in LDPC architectures.

S3-1Yeong-Luh Ueng, Chung-Jay Yang, Shu-Wei Chen and Wei-Xuan WuNational Tsing Hua University, Taiwan ········································································· 40

S3-2Kai He(1), Jin Sha(1) and Zhongfeng Wang(2)

(1)Nanjing University, China(2)Broadcom Corporation, USA ························································································ 44

S3-3Yun Chen, Changsheng Zhou, Yuebin Huang, Shuangqu Huang and Xiaoyang ZengFudan University, China ·································································································· 48

S3-4Yuebin Huang, Chen Chen, Changsheng Zhou, Yun Chen and Xiaoyang ZengFudan University, China ·································································································· 54

S3-5Chuan Zhang(1), Sang-Min Kim(1) and Jin Sha(2)

(1)University of Minnesota, USA(2)Nanjing University, China ···························································································· 58


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Session 4Data converter

13:30-15:00 / Room C

Kwang Hyun Baek (Chung-Ang Unviersity, Korea)Tae Wook Kim (Yonsei University, Korea)

S4-1

Dong-Hyun Hwang, Jung-Eun Song, Sang-Pil Nam, Hyo-Jin Kim, Tai-Ji An, Kwang-Soo Kim and Seung-Hoon LeeSogang University, Korea ································································································· 62

S4-2

Daisuke Kanemoto, Toru Ido and Kenji TaniguchiOsaka University, Japan ··································································································· 66

S4-3Jinwoo Kim(1), Shin-Il Lim(1), Kwang-Sub Yoon(2) and Sangmin Lee(2)

(1)Seokyeong University, Korea (2)Inha University, Korea ·································································································· 70

S4-4Jin-Seon Kim(1), Tae-In Kwon(1), Gil-Cho Ahn(1), Yi-Gyeong Kim(2) and Jong-Kee Kwon(2)

(1)Sogang University, Korea (2)ETRI, Korea ··················································································································· 73

S4-5Arshad Hussain, Sai-Weng Sin, Seng-Pan U and Rui P. MartinsUniversity of Macau, China ····························································································· 76


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Session 5 SoC Design Methodology13:30-15:00 / Room D

Sang Bock Cho (Ulsan Unviersity, Korea)Tae Hwan Kim (Seoul National Unviersity, Korea)

S5-1Kim Joohan and Taewhan KimSeoul National University, Korea ···················································································· 80

S5-2Sik Kim, Kwang-Hyun Cho and Byeong MinSamsung Electronics, Korea ······························································································ 84

S5-3Joohee Choung(1), Sangwoo Han(1), Byung-Su Kim(2) and Juho Kim(1)

(1)Sogang University, Korea (2)Samsung Electronics, Korea ··························································································· 88

S5-4Yuki Ando(1), Seiya Shibata(1,2), Shinya Honda(1), Hiroyuki Tomiyama(3) and Hiroaki Takada(1)

(1)Nagoya University, Japan (2)Japan Society for the Promotion of Science, Japan (3)Ritsumeikan University, Japan ······················································································ 92

S5-5Inhyuk Choi, Taewoo Han, Ilwoong Kim and Sungho KangYonsei University, Korea ································································································· 96

S5-6

Hi-Seok Kim(1), Sea-Ho Kim(1) and Ki-Soek Chung(2)

(1)Cheongju University, Korea (2)Hanyang University, Korea ··························································································· 100


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Session 6 RF Front-end Circuits for SOC and SIP15:30-17:00 / Room A

Shawn S. H. Hsu (National Tsing Hua University, Taiwan)

AbstractThe RF front-end circuits are of extreme importance to the overall system performance of wireless

communication ICs. Continuous innovation of technology makes it possible to realize a wireless communication transceiver with a small form factor, low cost, and under low power consumption. In this special session, the design techniques and considerations of several critical RF circuit blocks in typical RF transceivers are reported and discussed, including the low-noise amplifier (LNA), frequency multiplier, mixer, and voltage-controlled oscillator (VCO). These circuits are implemented in a wide variety of advanced technologies such as CMOS, III-V heterojunction bipolar transistors (HBT), and integrated passive device (IPD). With the general design goals for achieving low power operation within a compact chip area, the design concepts are suitable for both system-on-chip (SOC) and system-in-package (SIP) applications.

S6-1

Da-Chiang Chang(1), Yuan-Chia Hsu(1), Ta-Yeh Lin(1), Ying-Zong Juang(1) and Ibrahim Haroun(2)

(1)National Applied Research Laboratories, Taiwan (2)Communication Research Center, Canada ···································································· 104

S6-2Hung-Ju Wei, Chinchun Meng and Yi-Chen LinNational Chiao Tung University, Taiwan ······································································ 108

S6-3Shawn S. H. Hsu and Ming-Hsien TsaiNational Tsing Hua University, Taiwan ········································································· 112

S6-4Tzu-Chao Yan and Chien-Nan KuoNational Chiao-Tung University, Taiwan ······································································· 116


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S6-5

Chin-Fu Li, Chang-Ming Lai, Ping-Chuan Chiang and Po-Chiun HuangNational Tsing Hua University, Taiwan ········································································· 120

Session 7 Three-dimensional Stacking: Theories, Tools and Tapeouts15:30-17:00 / Room B

Yiyu Shi (Missouri University of Science and Technology, USA)Shih-Chieh Chang (National Tsing Hua University, Taiwan)

AbstractThree-dimensional integrated circuits have generally considered to be the most promising

technique beyond the limit of device scaling. They provide smaller footprint, higher integration density and compatibility with current CMOS technology, and they allow heterogeneous integration. Yet many design challenges need to be addressed to attain those benefits. The first talk in the session presents the early design planning and exploration for 3D ICs based on virtual 3D placement. The second and third talks present the TSV reliability in various physical design stages, and its enhancement through different techniques, The fourth talk discusses about the lower power design, an essential component to reduce thermal stress in 3D ICs. The session is concluded with a real 3D design presented by industry experts for 3D stacking study.

S7-1

Ding-Ming Kwai and Ka-Yi YehIndustrial Technology Research Institute, Taiwan ·························································· 124

S7-2Chiao-Ling Lung(1,2), Jui-Hung Chien(2), Yiyu Shi(3) and Shih-Chieh Chang(1)

(1)National Tsing Hua University, Taiwan (2)Industrial Technology Research Institute, Taiwan (3)Missouri University of Science and Technology, USA ··············································· 127

S7-3Jinn-Shyan Wang, Keng-Jui Chang, Shu-Yi Yang, Tsung-Han Hsieh and Chingwei YehChung-Cheng University, Taiwan ···················································································· 131


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S7-4Dae Hyun Kim(1), Rasit Onur Topaloglu(2) and Sung Kyu Lim(1)

(1)Georgia Institute of Technology, USA (2)GLOBALFOUNDRIES, USA ······················································································· 135

S7-5Guojie LuoPeking University, China ································································································· 139

Session 8 SoC Testing/Verification/Signal Integrity15:30-17:00 / Room C

Young Hwan Kim (Pohang University of Science and Technology, Korea)Byeong Min (Samsung Electronics)

S8-1Yonghwan Kim, Minseok Kang, Kyoung-Hwan Lim, Sangdo Park, Deokjin Joo and Taewhan KimSeoul National University, Korea ···················································································· 142

S8-2

Masato Sakurai, Kiichi Niitsu, Naohiro Harigai, Daiki Hirabayashi, Daiki Oki, Takahiro J. Yamaguchi and Haruo KobayashiGunma University, Japan ································································································· 146

S8-3Teruki Nakasato, Toru Nakura and Kunihiro Asada University of Tokyo, Japan ····························································································· 150

S8-4Christoph Kuznik and Wolfgang MüllerUniversity of Paderborn, Germany ················································································· 154

S8-5Young-Nam Yun, Jae-Beom Kim, Nam-Do Kim and Byeong MinSamsung Electronics, Korea ······························································································ 158


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Session 9 Low Power Design Techniques15:30-17:00 / Room D

Kyung Ki Kim (Daegu University, Korea)

S9-1

Tony T. Kim and Zhi Hui KongNanyang Technological University, Singapore ································································ 163

S9-2Tomoyuki Nakabayashi, Takahiro Sasaki, Kazuhiko Ohno and Toshio KondoMie University, Japan ······································································································· 167

S9-3

Benjamin P. Wilkerson, Tae-Ho Kim and Jin-Ku KangInha University, Korea ····································································································· 171

S9-4Jungil Ahn, Jinwook Kim and Young Hwan KimPOSTECH, Korea ············································································································ 175

S9-5Ali Valaee and Asim J. Al-KhaliliConcordia University, Canada ························································································· 179

S9-6

Shang-Hsien Yang and Chua-Chin WangNational Sun Yat-Sen University, Taiwan ·································································· 182-1


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Friday, November 18, 2011

Session 10 Architectural Reconfiguration and Customization for Embedded Systems

08:20-09:50 / Room A

Hiroyuki Tomiyama (Ritsumeikan University, Japan)

AbstractReconfigurable/customizable architectures are attracting great interesting the embedded systems

industry for their high energy/performance efficiency and flexibility. This special session focuses on reconfiguration/customization of processor architectures and accelerators for embedded systems. The session starts with a brief review of research trends in this field. The second talk presents a reconfigurable processor which enables easy optimization of the performance/cost trade-off. The third talk describes a vector co-processor architecture which was customized for embedded applications. The fourth talk presents a design exploration methodology for reconfigurable address generation units of embedded processors. Finally, hardware multitasking techniques are presented for dynamically partially reconfigurable devices.

S10-1

Krzysztof Jozwik(1), Hiroyuki Tomiyama(2), Masato Edahiro(1), Shinya Honda(1) and Hiroaki Takada(1)

(1)Nagoya University, Japan (2)Ritsumeikan University, Japan ······················································································ 183

S10-2Kazuya Tanigawa and Tetsuo HironakaHiroshima City University, Japan ··················································································· 187

S10-3Ittetsu Taniguchi(1), Murali Jayapala(2), Praveen Raghavan(2), Francky Catthoor(2),Keishi Sakanushi(3), Yoshinori Takeuchi(3) and Masaharu Imai(3)

(1)Ritsumeikan University, Japan (2)IMEC, Belgium


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(3)Osaka University, Japan ································································································ 191

S10-4Yi Ge, Yoshimasa Takebe, Masahiko Toichi, Makoto Mouri, Makiko Ito, Yoshio Hirose and Hiromasa TakahashiFujitsu Laboratories, Japan ······························································································· 195

S10-5Tomonori IzumiRitsumeikan University, Japan ························································································· 199

Session 11 Microprocessor and DSP Architectures08:20-09:50 / Room B

Hanho Lee (Inha University, Korea)

S11-1

Yitao Ma(1), Tetsuo Endoh(1) and Tadashi Shibata(2)

(1)Tohoku University, Japan(2)University of Tokyo, Japan ·························································································· 203

S11-2Mochamad Asri, Naoki Fujieda and Kenji KiseTokyo Institute of Technology, Japan ············································································ 207

S11-3

Ki-woong Eom, Won-young Chung and Yong-surk LeeYonsei University, Korea ································································································· 211

S11-4Jinook Song and In-Cheol ParkKAIST, Korea ··················································································································· 215


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S11-5Hsin-Chou Chi, Hsi-Che Tseng and Kun-Lin TsaiNational Dong Hwa University, Taiwan ········································································ 219

Session 12 RF Techniques08:20-09:50 / Room C

Yun Seong Eo (Kwangwoon University)

S12-1

Shigekazu Miyawaki(1), Makoto Nakamura(2), Akira Tsuchiya(1), Keiji Kishine(3) and Hidetoshi Onodera(1)

(1)Kyoto University, Japan (2)NTT Corporation, Japan (3)University of Shiga Prefecture, Japan ··········································································· 223

S12-2Nakyoon Kim and Yong MoonSoongsil University, Korea ······························································································· 227

S12-3

Jinsoo Rhim and Woo-Young ChoiYonsei University, Korea ································································································· 231

S12-4

Sunwoo Yoon, JuYoung Jung and Dong-hyun BaekChung-Ang University, Korea ·························································································· 235

S12-5

Jongsik Kim and Hyunchol ShinKwangwoon University, Korea ························································································ 238


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Session 13 mm Wave Circuits and Systems08:20-09:50 / Room D

Jinwook Burm (Sogang University)

S13-1

Kok Meng Lim(1), Hong Cheang Quek(1), Jangook Lee(1), Jiangmin Gu(2), Jinna Yan(3),Keping Wang(3), Wei Meng Lim(3) and Kiat Seng Yeo(3)

(1)Cadence Design Systems, Singapore (2)Avago Technologies, Singapore (3)Nanyang Technological University, Singapore ····························································· 242

S13-2Jinna Yan, Kok Meng Lim, Jiangmin Gu, Keping Wang, Wei Meng Lim, Kaixue Ma and Kiat Seng YeoNanyang Technological University, Singapore ································································ 246

S13-3Yuki Torigai and Minoru WatanabeShizuoka University, Japan ······························································································ 250

S13-4Kok Meng Lim(1), Jiangmin Gu(2), Jinna Yan(3), Wei Meng Lim(3), Yang Lu(3) and Kiat Seng Yeo(3)

(1)Cadence Design Systems, Singapore (2)Avago Technologies, Singapore (3)Nanyang Technological University, Singapore ····························································· 254

S13-5Zhenghao Lu(1), Xiaopeng Yu(2), Kiat Seng Yeo(3), Wei Meng Lim(3), Jinna Yan(3) and Renjing Pan(3)

(1)Soochow University, China (2)Zhejiang University, China (3)Nanyang Technological University, Singapore ····························································· 258


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Session 14 Display Drivers and Multimedia SoCs13:30-14:30 / Room A

Hi Seok Kim (Chongju University, Korea)

S14-1

Sangkyun Park(1), Seonyoung Lee(2), Soojin Kim(1) and Kyeongsoon Cho(1)

(1)Hankuk University of Foreign Studies, Korea (2)KETI, Korea ··················································································································· 262

S14-2Xuan Cheng, Huijie Zhao, Yonglong Dai and Xiaokang LiuBeihang University, China ······························································································· 266

S14-3Sung Dae Kim and Myung Hoon SunwooAjou University, Korea ···································································································· 270

S14-4Sung In Cho(1), Hi-Seok Kim(2) and Young Hwan Kim(1)

(1)POSTECH, Korea (2)Cheongju University, Korea ·························································································· 274

S14-5Seunghyun Cho, Seong Mo Park and Nak-Woong EumETRI, Korea ······················································································································ 278


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Session 15 Analog Techniques13:00-14:30 / Room B

Yong Moon (Soongsil University, Korea)

S15-1Ning Qiao, Jiantou Gao, Kai Zhao, Ning Li, Fang Yu and Zhongli LiuChinese Academy of Sciences, China ··············································································N/A

S15-2

Yun Yang(1,2)

(1)Tohoku University, Japan (2)Osaka University, Japan ································································································ 286

S15-3Jae-Hwan Kim(1), Ji-Yong Um(2), Jae-Yoon Sim(2) and Hong-June Park(1,2)

(1)WCU, Korea(2)POSTECH, Korea ·········································································································· 290

S15-4

Jinbo Wan and Hans G. KerkhoffUniversity of Twente, Netherlands ················································································· 294

S15-5

Priyanka Kabara(1), Sanket Thakur(2), Gururaj Saileshwar(1), Maryam Shojaei Baghini(1) and Dinesh.K.Sharma(1)

(1)Indian Institute of Technology-Bombay, India(2)Syracuse University, USA ······························································································ 298

S15-6

YoungJoo Lee, Jinook Song and In-Cheol ParkKAIST, Korea ··················································································································· 302


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Session 16 Design, Analysis and Tools for Integrated Circuits and System 13:00-14:30 / Room C

Ka Lok Man (Xi'an Jiaotong-Liverpool University, China)

AbstractDATICS Workshops were initially created by a network of researchers and engineers both from

academia and industry in the areas of Design, Analysis and Tools for Integrated Circuits and Systems. The proposed 11th DATICS workshop/special session, DATICS-ISOCC’11, will focus on emerging Circuits and Systems (CAS) topics that will strongly lead human life revolutions, especially in CMOS technologies, communication technologies and biomedical technologies. Human life revolutions come along with economic opportunities. The market for these emerging topics is also forecast to grow to a multi-billion dollar market in the coming decade.The workshop/special session will highlight the potential and current developments of these CAS topics, along with pressing challenges. The proposed workshop/special session is coherent and complementary to the conference theme ("SoC Design for Future Living") and areas of interest of ISOCC. The main target of DATICS-ISOCC’11 is to bring together engineering researchers and people from industry to exchange theories, ideas, techniques and experiences.

S16-1

Chun Zhao(1), W. Zhang(2), C. Z. Zhao(1,2), K. L. Man(2,3), T. T. Jeong(3), J. K. Seon(4) and Y. Lee(5)

(1)University of Liverpool, United Kingdom (2)Xi'an Jiaotong - Liverpool University, China (3)Myongji University, Korea (4)LS Industrial Systems, Korea (5)KETI, Korea ··················································································································· 306

S16-2

Eng Gee Lim(1), Zhao Wang(1), Tammam Tillo(1), Ka Lok Man(1,2), Tuck Seng Wong(3) and Khin Wee Lai(4)

(1)Xi'an Jiaotong - Liverpool University, China (2)Myongji University, Korea


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(3)University of Sheffield, United Kingdom, (4)Technische Universität Ilmenau, Germany ··································································· 310

S16-3

Chun Zhao(1), W. Pan(2), C. Z. Zhao(1,2), K. L. Man(2,3), J. Choi(4) and J. Chang(5)

(1)University of Liverpool, United Kingdom (2)Xi'an Jiaotong - Liverpool University, China (3)Myongji University, Korea (4)University of Seoul, Korea (5)Texas Instruments, USA ································································································ 313

S16-4

Mouna Karmani(1), Chiraz Khedhiri(1), Ka Lok Man(2,3) and Belgacem Hamdi(1,4)

(1)Electronics & Microelectronics Laboratory, Tunisia (2)Xi'an Jiaotong - Liverpool University, China (3)Myongji University, Korea (4)ISSAT, Tuinisia ·············································································································· 317

S16-5

Ka Lok Man(1,4), Chi-Un Lei(2), Jieming Ma(3), Yanyan Wu(1), Sheng-Uei Guan(1), T.T. Jeong(4), J.K. Seon(5) and Yunsik Lee(6)

(1)Xi'an Jiaotong - Liverpool University, China(2)University of Hong Kong, Hong Kong (3)University of Liverpool, United Kingdom (4)Myongji University, Korea (5)LS Industrial Systems, Korea (6)KETI, Korea ··················································································································· 321


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Session 17 Advances in CMOS Circuits and Carbon-Based Electronics13:00-14:30 / Room D

Volkan Kursun (Hong Kong University of Science and Technology, Hong Kong)

AbstractTransistor made with individual single walled carbon nanotubes (SWNTs) exhibit impressive

characteristics. However, although carbon nanotubes have been actively studied for electronics applications (particularly for CMOS replacement) during the past 2 decades, practical applications are still very limited because SWNT technologies are plagued by a number of problems, such as separation of semiconductor specimens from the metallicones, alignment and organization with high densities, contact reproducibility for transistors, etc. The field of carbon nanotubes is progressively evolving towards gas sensing and flexible electronics applications which are much less demanding than advanced integrated circuits (ICs) in terms of device characteristics and integration density. On the other hand, graphene which has been isolated only 7 years ago seems to be more promising, in particular for ICs, as well as for large area transparent conducting film applications. In this session, we shall briefly review some basic properties of these two emblematic materials and present some recent advances concerning their use. In particular, we will show how the two fields are entangled, i.e., how graphene can improve some of the properties of carbon nanotube devices, and how carbon nanotubes can be employed as precursors for the fabrication of graphene nanoribbons. Future carbon-based devices and circuits will probably make extensive use of combinations of these two exceptional materials.

S17-1

Neena A Gilda, Sandeep Surya, Sanjay Joshi, Viral Thaker, M.Shojaei Baghini, Dinesh K.Sharma and V.Ramgopal RaoIndian Institute of Technology-Bombay, India ······························································· 325

S17-2

Didier PribatSungkyunkwan University, Korea ···················································································· 329


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S17-3

Hong Zhu and Volkan KursunThe Hong Kong University of Science and Technology, Hong Kong ························ 333

S17-4Jaeha Kung and Youngsoo ShinKAIST, Korea ··················································································································· 337

S17-5Masahiro Fukui(1), Yoriaki Nagata(1) and Shuji Tsukiyama(2)

(1)Ritsumeikan University, Japan (2)Chuo University, Japan ································································································· 341

Session 18 Communication SoCs15:00-16:30 / Room C

Sang Hoon Hong (Kyung Hee University, Korea)Norbert When (University of Kaiserslautern, Germany)

S18-1Jae Won Park(1), Jin Ha Hwang(1), Won Young Chung(1), Seung Woo Lee(2) and Yong Surk Lee(1)

(1)Yonsei University, Korea(2)ETRI, Korea ··················································································································· 345

S18-2Christian Brehm, Thomas Ilnseher and Norbert WehnUniversity of Kaiserslautern, Germany ··········································································· 349

S18-3Jinho Lee(1), Mingyang Zhu(1), Kiyoung Choi(1), Jung Ho Ahn(1) and Rohit Sharma(2)

(1)Seoul National University, Korea(2)Georgia Institute of Technology, USA ········································································· 353


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S18-4

Sadayuki Yasuda, Takahiro Hatano, Hiroki Suto, Masami Urano, Mamoru Nakanishi and Tsugumichi ShibataNTT Corporation, Japan ································································································· 357

S18-5

Yangsu Kim, Kyuseung Han and Kiyoung ChoiSeoul National University, Korea ···················································································· 361

S18-6Eun-Gu Jung(1), Daewan Han(1) and Jeong-Gun Lee(2)

(1)ETRI, Korea (2)Hallym University, Korea ····························································································· 365

S18-7

Yihu Xu and Myong-Seob LimChonbuk National University, Korea ············································································· 368

Session 19 Power Management and Energy Harvesting15:00-16:30 / Room D

Hyunchol Shin (Kwangwoon University, Korea)

S19-1Jiemin Zhou, Mengshu Huang, Yimeng Zhang, Hao Zhang and Tsutomu YoshiharaWaseda University, Japan ································································································· 373

S19-2

Orlando Lazaro and Gabriel Alfonso Rincón-MoraGeorgia Institute of Technology, USA ··········································································· 377


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S19-3

SangDo Park and Taewhan KimSeoul National University, Korea ···················································································· 381

S19-4

Suhwan Kim and Gabriel A. Rincón-MoraGeorgia Institute of Technology, USA ··········································································· 385

S19-5Xuan-Dien Do, Chang-Jin Jeong, Huy-Hieu Nguyen, Seok-Kyun Han and Sang-Gug LeeKAIST, Korea ··················································································································· 389


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Poster Session

Nov. 18, 2011 / 13:00-16:30 / Lobby

Kee-Won Kwon (Sungkyunkwan University)

PS-1

Ning Zhu, Wang Ling Goh and Kiat Seng YeoNanyang Technological University, Singapore ································································ 393

PS-2

Omer Vikinski, Ram Ben-Ezra and Jimmy Huat Since HuangIntel, Israel ························································································································ 397

PS-3

Ho-Hsin Yeh(1), Ji-Chen Huang(1), Yu-Chen Kuo(2) and Klaus Y.-J. Hsu(1)

(1)National Tsing Hua University, Taiwan (2)Chunghwa Telecom Corporation, Taiwan ··································································· 401

PS-4Jae-Won Nam, Young-Deuk Jeon, Seok-Ju Yun, Tae Moon Roh and Jong-Kee KwonETRI, Korea ······················································································································ 405

PS-5Yuan Cao and Xiangyu ZhangNanyang Technological University, Singapore ································································ 408


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PS-6

Qi Li and Tony T.KimNanyang Technological University, Singapore ································································ 412

PS-7

Myeong-Hoon Oh, Sung-Nam Kim and Sungwoon KimETRI, Korea ······················································································································ 416

PS-8

Hun ho Ham, Jong hak Kim, Chan-oh Park, Yong han-Kim and Jun dong ChoSungkyunkwan University, Korea ···················································································· 420

PS-9Youngdon Jung(1), Jisu Kim(1) and Kyungho Ryu(1), Seong-Ook Jung(1), Jung Pill Kim(2) and Seung H. Kang(2)

(1)Yonsei University, Korea (2)Qualcomm, USA ············································································································ 424

PS-10

Ji-Hoon KimChungnam National University, Korea ··········································································· 428

PS-11Yong-Kyu Kim(1), Chang-Seok Choi(1), Hanho Lee(1) and Jin-Gyun Chung(2)

(1)Inha University, Korea (2)Chonbuk National University, Korea ··········································································· 432

PS-12Jae-Jin Lee and NakWoong EumETRI, Korea ······················································································································ 436

PS-13Ho Joon Lee(1) and Kyung Ki Kim(2)

(1)Illinois Institute of Technology, USA (2)Daegu University, Korea ······························································································· 440


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PS-14Joonhong Park, Hyuk Ryu and Donghyun BaekChung-Ang University, Korea ·························································································· 444

PS-15Edward Collins(1), In-Seok Jung(2), Yong-Bin Kim(2) and Kyung-Ki Kim(3)

(1)Analog Devices Inc, USA (2)Northeastern University, USA (3)Daegu University, Korea ······························································································· 446

PS-16Peiwen He(1), Wei Wang(1), Ken Choi(1), JongHyun Lee(2) and SooHyun Kim(2)

(1)Illinois Institute of Technology, USA (2)KAIST, Korea ················································································································· 450

PS-17Fanyi Meng, Kiat Seng Yeo, Shanshan Xu, Kaixue Ma and Chee Chong LimNanyang Technological University, Singapore ································································ 454

Documents

2011 International SoC Design Conference (ISOCC 2011)toc.proceedings.com/13892webtoc.pdf · Jeju, South Korea 17 – 18 November 2011 IEEE Catalog Number: ISBN: CFP1169E-PRT 978-1-4577-0709-4