18-Jan-021W. Karpinski System Test 2002 1.Design verification of petals and interconnect boards and control links without detectors a)mechanics b)electrical

18-Jan-02 1 W. Karpinski

System Test 2002

1. Design verification of petals and interconnect boards and control links without detectors a) mechanicsb) electrical performancec) thermal behavior

2. Test of the IInd detector group (rings #3, #4, #6)- ring #6 full equipped with Si-Modules ,and optical hybrids- ring #3 and #4 ‚ equipped with detector frames, frontend hybrids

and optical hybrids only

3. Test of the IIIrd detector group (rings #5, #7)

- equipped with detector frames , frontend hybrids and optical hybrids

only

4. Test of the Ist detector group (rings #1, #2)- equipped with detector frames , frontend hybrids and optical hybrids

only


Mechanics

o mechanical compatibility of the InterConnect Boards (ICB) with the mechanical structure of petals

- fixation points, inserts and holes for alignment system

- position of the FE hybrid connectors vs. position of the detector

modules, mech. stress of the Detector Module

- fixation of the optical hybrids and routing of the fibers

o mechanical stress of the ICB, cable connectors, ends of multiservice

cables- due to the plugging and unplugging of multiservice cables- due to current flow in magnetic field, if the petals are tilted a little

bit- dynamic stress on the non twisted cable ends due to switching on

and off of groups of FE Hybrids, - due to the large thermal expansion coefficient of pcb material and

large difference in two operating conditions –30 °C and room temperature




Equipment:

o Magnetic field, B 1Tesla (Bonn or CERN)

o Switchable dummy load of Frontend Hybrid

o dummy load of Optical Hybrid

o Thermo – Vacuum chamber


Electrical performance

Quality of production

o continuity of connections,

o insulation test of HV-distribution

o test system for mass production of assembled ICB

Power distribution

o voltage drops; verification of x-section of power lines

o verification of points of attachment of sense wires and ground reference

o measurement of the over-voltage (due to switching off/on of the FE hybrids and inductance of the long cables) as a function of capacitive load, protection against over-voltage?

o location of the capacitors on the ICB, total capacitance on the ICB


Electrical performance (cont.)

Signal Integrity of the distribution of the fast control signals: clock, reset and back plane pulses


Technical data

Test points: 64 - 4096

Low voltage: 0,1 - 40VDC

Insulation test: 50 - 1500 VDC

Test current: 50 mA - 2 A

Selective component test

Resistors

Capacitors

Diodes / Zener diodes

Costs:

Frame : 12 000 €

64 test points module: 500 €

Connection Test System

total for 2048 test points: 28 000 €


Connection Test System based on CCUM

o Dummy of FE - Hybrid eqipped with I2C controlled 16 BIT I/O port and a little logic to test the voltage level on each pin of connectoro Dummy of OH with a little logic to test the voltage level on each pin of connector


Little Logic to test the voltage level of power pins


Tools for the test of power distribution and Signal Integrity

o „Emulator“ of the CCUM with the basic functions


Tools for the test of power distribution (cont.)

o Switch-able dummy load of Front-end Hybrid

o dummy load of Optical Hybrid both with the proper dynamic resistivity of the power ports

Schematics of the dummy


Control link and control optoelectronics on the level of petals

o mechanical verification of the control ring

- fixation of the digital optical hybrids (DOH), fixation of the CCUMs

- cable routing - Cooling of the DOH module

o verification of the electrical performance of control ring- impedance matching, termination, reflections

- shielding of cables, shielding of DOHs

- voltage margin, cross section of power lines and GND lines

verification of grounding concept, bit error rate

- verification of redundancy of control link


Tools for Tests of Control link1 stage - CCUM 2 pc/petal, - FEC 1 pc- Front-end hybrids or few- dummies with I2C I/O Port 4-11 pc

2 stage- 1 control link 6 CCUMs (3)- ICB for IInd group 3pc- Inter-petal cables 3 pc- FEC 1 pc- dummies with I2C I/O Port 12-33 pc

3 stage- Optical link 1 pc- Digital Optical Hybrid 2 pc/control link- ICB for IInd group 3pc- Inter-petal cables 3 pc- dummies with I2C I/O Port 12-33 pc


o Pick up from digital signals

o Ground loops, grounding of frames

o Noise from cooling system if any?

o Studies of shielding requirements of petals

o Influence of ripples on the supply voltage to the quality of APV readout

o Common mode effects at the level of power groups ; can noise from crazy chips feed through the power lines to other chips.

Noise studies with Si-Detectors of II detector group


Required readout electronics

Detector FED CCUM FEC Dategroup 4 APV 6 APV 4 APV 6 APV channels of test

II 11 11 22 2 1 May 02III 5 4 5 4 22 1 1 Sep. 02I 8 8 24 1 1 Nov. 02

Total 16 12 16 12 68 2 1

frontend hybrids optical hybrids

Services

LV – Power Supplies : HP E3633A + HP E3614AHV – Biasing: EHQ 8006F, 8 isolated channels, 600V,

noise =2 mVpp, I resolution =100pATemp Control: Keithley 2700 DAQ


start end start end

PCB 2 avail.

LVDS radhard buff ers 13 avail.

FE -Hyb. dummies 11 Feb. 02

OH -Hyb. dummies 11 Feb. 02

CCUM Dummies 2 Feb. 02

PCB 2 Mar. 02




PCB 2 Apr. 02




Mar. 02 Mar. 02 Apr. 02

Apr. 02 Apr. 02 Apr. 02 May. 02

I CB 57

I CB 346 Feb. 02

Mar. 02

I CB 12

Feb. 02 Feb. 02 Mar. 02

Mech. Test Elec. Test

I tem Accessories Quantity Delivery

Test of Interconnect - Boards


start end start end

CCUM 2 J an. 02

FEC 1 J an. 02

I CB 346 1 avail.

dummies with I 2C 16

Bit I / O Port 4-11 Feb. 02

CCUM 6

I CB 346 3 Mai. 02

I nter Petals cables 3 Apr. 02

dummies with I 2C 16

Bit I / O Port 12-33 Mar. 02

Dig. Optical Link 1

DOH 2

DOHM 1 Apr 02

stage 1

stage 2

stage 3

May. 02 May. 02

May. 02 J un. 02

May. 02 J un. 02

Mar. 02 Mar. 02 Mar. 02 Mar. 02

Mech. Test Elec. Test

I tem Accessories Quantity Delivery

Test of the Control - Link

Documents

18-Jan-021W. Karpinski System Test 2002 1.Design verification of petals and interconnect boards and control links without detectors a)mechanics b)electrical