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    Fabrication of Nanoscale BLM Biosensors

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    Presentation Contents

    Objectives

    Background

    Fabricated devices

    Signal Processing

    Current Goals

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    Objectives

    Fabrication of a stable platform for

    transducing signals through artificial BLMs Allow for the most stable BLM possible

    Analysis of BLM impedance characteristics

    Including signals produced with proteins

    Packaging of a sensor with analytic

    capabilities on-chip

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    BLMs

    Composed of a hydrophilic polar head andhydrophobic non polar tail

    5nm thickness with .5nm2 area / lipid molecule

    BLMs have high resistances and high capacitances

    An Artist's conception of ion channels in a lipid bilayer membrane

    (taken from Hille, B., 1992.Ionic Channels of Excitable Membranes.

    Sinauer, Sunderland, Massachusetts.)

    Bilayer Lipid Membranes

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    Why use a BLM/protein system?

    Biosensors based on natural receptors

    (proteins) with BLMs provide a sensitive andselective method of sensing chemical species(ions or molecules)

    Upon binding with analytes, transport proteins

    change their transport behavior across BLMs These types of sensors are unique in that

    they have molecular recognition as well assignal tranduction properties.

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    Electrochemical ImpedanceSpectroscopy (EIS)

    A small amplitude sinusoidal voltage is

    applied across the device The frequency dependant impedance is

    measured as a magnitude and phase angle

    device

    electrodes

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    Electrochemical ImpedanceSpectroscopy (EIS)

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    Electrochemical ImpedanceSpectroscopy (EIS)

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    Electrochemical ImpedanceSpectroscopy (EIS)

    Every circuit element has a transfer function

    Transfer functions are used to derive the resistance andcapacitance of the system

    Component Current Vs.Voltage Impedance

    resistor E= IR Z = R

    inductor E = L di/dt Z = jwL

    capacitor I = C dE/dt Z = 1/jwC

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    Electrochemical ImpedanceSpectroscopy (EIS)

    The most basic circuit

    model utilized is

    Zel

    This circuit has a function of

    ZelZmZt

    RjwC

    RZm

    jwCRZm

    1

    11

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    Electrochemical ImpedanceSpectroscopy (EIS)

    Assuming some knowledge of the circuit

    structure, a transfer function can be derivedand the circuit parameters can be extracted.

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    Electrochemical ImpedanceSpectroscopy (EIS)

    Unfortunately, these systems can be far more

    complicated due to a variety of other parasiticinteractions

    A primary source of these complications is the Si

    substrate itself which is highly conductive. This

    presents a low conductance, high capacitancepathway when combined with the membrane.

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    Electrochemical ImpedanceSpectroscopy (EIS)

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    Fabrication Requirements

    Hold a stable membrane

    Smooth and clean surface Preferably oxide surface

    Porous surface

    Allow for signals to be passed through

    membrane/proteins Pore size should be small to increase the stability of

    suspended region and prevent lipids from forming

    conformally to the surface

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    Fabrication Requirements

    Measure signals with a high S/N ratio

    Need a high resistance, low capacitance substrate Prevents capacitive coupling, capacitive signal

    leakage

    High resistance allows for signals to be measured

    only through the membrane area Good electrode placement

    i.e. Ag/AgCl electrodes for Cl- measurement

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    Porous alumina substrates

    Designed by Xinquin Jiang (Spencer group)

    Utilizes porous alumina formed

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    Porous Alumina Substrate Fabrication

    Use LPCVD (Low Pressure Chemical Vapor

    Deposition) to coat a 4 DSP (Double sided polish)wafer with Silicon Nitride

    Si3N4

    Si

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    Porous Alumina Substrate Fabrication

    Etch a 180 micron x 180 micron square

    window on the backside of the substrate

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    Porous Alumina Substrate Fabrication

    Use KOH as a wet etchant to etch through the Si substrate

    KOH preferentially etches crystal plane, resulting in a V-

    groove

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    Porous Alumina Substrate Fabrication

    Evaporate a thin layer of Al onto the front side

    of the substrateAl

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    Porous Alumina Substrate Fabrication

    Anodize the aluminum

    Al(metal) Al2O3

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    Porous Alumina Substrate Fabrication

    Etch the backside to remove the Si2N3

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    Porous Alumina Substrate Fabrication

    Alumina film characteristics can be adjusted by use of phosphoricacid and anodization conditions

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    Porous Alumina Substrate Fabrication

    BLM can then be deposited

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    Signals obtained from this system

    Our results are comparable to state of the art

    systems The results do require some amount of

    interpretation

    This is because the systems on which the BLMs

    reside are not identical.

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    Si substrates have a much lower resistance

    and higher capacitance than quartz substrates

    Sample AREA Impedance

    0.1 Hz 1 Hz 10 Hz

    Quartz plus oxide 88 mm2 46.25 G 14.02 G 1.67 G

    Silicon, N-type

    0.005-0.02 -cm

    88 mm2 1.51 M 173 k 21.32 k

    Silicon plus oxide 88 mm2 559.6 M 53.58 M 5.66 M

    Silicon/Nitride/Alumina (no H2PO4

    etching)

    88 mm2 25.21 M 4.197 M 494 k

    Silicon/Nitride/Alumina (no H2PO4

    etching)

    12.6 mm2 18.91 M 3.85 M 503 k

    Silicon/Nitride/Alumina (H2PO4 etch

    20 min)

    88 mm2 1.63 M 133 k 25.02 k

    Silicon/Nitride/Alumina (H2PO4 etch

    20 min)

    12.6 mm2 3.26 M 488.5 k 72.32 k

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    Proposed Structure

    Change of Silicon substrate for SiO2

    Difficulty in etching through the wafer HF wet etch is isotropic

    Dry etching of SiO2 has a maximum rate of

    100nm/minute which is 5000 minutes for a 500um

    wafer.

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    Proposed Structure

    Cut 100um diameter holes in a quartz

    substrate with a micromachining laser

    Quartz

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    Proposed Structure

    Cut 100um diameter holes in a quartz

    substrate with a micromachining laser

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    Proposed Structure

    Anodize the aluminum

    Al(metal) Al2O3

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    Proposed Structure

    Coat the surface with a polymer (polyimide or

    adhesive wax)

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    Proposed Structure

    Adhere the Si and quartz surfaces (hot press)

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    Proposed Structure

    Dry etch the Si wafer (Bosch etch process) at

    a rate of 1um/minute. Dry etch polymer (RIE)

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    Proposed Structure

    BLM can then be deposited

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    The Next Step

    Addition of proteins

    The proteins are the mechanism by which theenvironment is actually measured

    Measurements will be made at a single frequency

    that is chosen to maximize sampling while

    remaining in the resistive regime Optimally this frequency will be in the kHz range

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    Hirano from Nihon University used a patchclamp to measure current openings from a

    single gramicidin protein in response to

    different concentrations of ferritin avidin

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    Opening percentage vs. FA concentration

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    Conclusion

    We have developed a system to hold

    membranes at a high resistance over apatterned substrate

    Current readings are feasible and should

    generate readable results due to the larger

    number of measurement proteins

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    Wadsworth Center

    (State of NY)

    http://www.cnf.cornell.edu/index.html