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1060nm VCSEL1060nm VCSEL--based 10Gbpsbased 10Gbps1060nm VCSEL1060nm VCSEL--based 10Gbpsbased 10Gbpsoptical interconnectsoptical interconnects
Hideyuki Nasu
Technical seminar at CERN, Sept. 23 2011H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
FITEL Photonics LaboratoryFurukawa Electric Co., Ltd.
Outline
� Background� Why we need optical interconnects?� Trends in optical interconnects
� Advantage of 1-µm optical interconnect� InGaAs VCSEL and PD
�Low power consumption�Higher modulation capability
� Link budget
� 10-Gbps x 12-ch1060-nm parallel-optical module
Technical seminar at CERN, Sept. 23 2011 2H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
� Performance data
� Future prospect
Performance trend (Super computer & Computer)(F
LOP
S)
100Peta
Next next next plan
250T
(bps
/mac
hine
)
There is correlation between computer performance and bandwidth.
Fujitsu “Kei” is No. 1 now, but no optical link
1Peta
10Tera
Computer for company
Earth simulator plan
Next generation plan
Next next plan
2.5T
25G
360TFLOPS
10PFLOPS
Technical seminar at CERN, Sept. 23 2011
1995 2000 2005 2010 2015 2020 2025
100Giga
Computer for research
Personal computer
SupercomputerRenewal of
conventional computer
250M
PSI symposium 2005 : Ministry of Education, Culture, Sports, Science and Technology
3H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Bandwidth trend of Backplane (Edge Router)
There will be high possibility of accelerating time plan in consideration for power consumption.consumption.
High speed interface (commercial base)
Electrical backplane
Optical backplane
Rou
ter b
ackp
lane
ban
d w
idth
Technical seminar at CERN, Sept. 23 2011
Rou
ter b
ackp
lane
ban
d w
idth
100GbE standardizedNEDO’s project : Next generation High performance Network Device
New standard boost traffic and NW equipment bandwidth.
4H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Data rate trend in server systems
Technical seminar at CERN, Sept. 23 2011 5
Forecast for server connection speed, supplied by Intel and Broadcom, indicates the migration from 1 to 10, then to 40 and 100 Gbit/s transmission is at hand
H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Power consumption in IT equipment� Power consumption trends
� Japan: 5 times, from 2006 to 2025� Worldwide: 9 times, from 2006 to 2025
⇒ CO2 emission-increase
Environmental issuePower consumption estimation
Green IT Project (Japan)•Power reduction target•Data center: ≥ 30%• NW router: ≥ 30%
International project
(日本)
Environmental issuePower consumption estimation(Japan)
TV
Server
NW Equipment
5X
12X
Technical seminar at CERN, Sept. 23 2011
� Driving forward activities for power saving
Ministry of Economics, Trade and Industry, Green IT Project
International project•WSC / GAMS•Climate Savers•The Green Grid
6
NW Equipment
H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
I/O power trend
� Power trend on optical and electrical inter face)
△ Commercial× Sample○ Research
Pow
er c
onsu
mpt
ion
(W/G
bps)
Power saving in optical transmission(Photonic integration)
Power saving in electrical transmission(Low voltage driving)
Electrical ElectricalElectrical
○ Research
Technical seminar at CERN, Sept. 23 2011 7
Expectation and future perspective on optical interconnect (Technical roadmap of optical circuit packaging technology), p. 7 2010
7mW/Gbps(10Gbps x 12ch)
Pow
er c
onsu
mpt
ion
(W/
Furukawa Electric
year
H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Trend of Optical interconnection
2020
Optical printed board
Opt connector
LSI
Optical circuit board
Optical Module
Opt connector
Optical waveguide
Optical Fiber
LSI
board
Optical Fiber
Opt connector
Back plane
2012
Technical seminar at CERN, Sept. 23 2011
Optical TransceiverLSI
Conventional optical interconnection
Optical module will be expected more small and high speed.Connector will be more high density.
Now
8H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
How dose electrical transmission distance affect to optical signal performance?
MSL=0mm MSL=400mm
RX output: Eye opening
no PE PE3
Optical engine
400mm
Input Input
200
250
Eye
ope
ning
(mV
)
50
60
70
Pow
er c
onsu
mpt
ion
grow
th r
ate
(%)
PE1 PE2 PE3
Eye opening at BER10-12
no PE PE3
•10Gbps, NRZ•12ch simultaneous operation
Eye opening and Power increase rate
Pow
er in
crea
se ra
te (
%)
Technical seminar at CERN, Sept. 23 2011 9
0
50
100
150
0 100 200 300 400 500
MSL length(mm)
Eye
ope
ning
(mV
)
0
10
20
30
40
50
Pow
er c
onsu
mpt
ion
grow
th r
ate
(%)
no PEPower
Minimizing electrical connection between optical engine and LSI
Power saving
Pow
er in
crea
se ra
te (
%)
H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Requirements on optical interconnect
� Low power consumption� xx mW/Gbps
� High capacity� High speed, 10Gbps, 14Gbps, 25Gbps� High speed, 10Gbps, 14Gbps, 25Gbps� Number of multiplexed signals
� Longer transmission link� Covering the length of <300m� Very long distance in Enterprise: ~1km
� Low cost� $xx/Gbps
Technical seminar at CERN, Sept. 23 2011 10H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
� $xx/m^2
� Higher reliability� Huge number of modules
Advantages of 1µm optical devices� InGaAs QW VCSEL
High differential gain
Wide bandwidth Low power
High power
High speed
Low band gap energy Low driving
voltage
Low power
Al free
Slow DLD
High reliability
Low current density
SPIE Proceedings, vol. 4649, pp.19-24, 2002.
Inhibiting Al oxidization
EBIC image after aging test
Technical seminar at CERN, Sept. 23 2011
High sensitivity Low power drive of VCSEL
� InGaAs PIN-PD
25% increase compared with 850nm GaAs PD
Inhibiting DLD by IndiumInGaAs SQWGaAs SQW
PTL, vol. 2, no. 8, 1990
11H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Power saving ability in TX� Low power operation of 1060-nm InGaAs QW VCSEL
� Clear eye openings� Error free transmission
Vpp I = 1.8 mAVpp
(mV)
150
230
I = 1.8 mA
Technical seminar at CERN, Sept. 23 2011 12H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
A bias current of 1.8mA is sufficient for 10Gbps operation
J. B. Herou et. al, CLEO/QELS 2010, CWP3.
230
Low power operation by 1060nm VCSEL
� 1060nm VCSEL
Technical seminar at CERN, Sept. 23 2011
S. Nakagawa, FOE-12, Photonix2011, Apr. 2011
13H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Reliability of 1060nm VCSEL
Technical seminar at CERN, Sept. 23 2011
S. Nakagawa, FOE-12, Fiber Optics Expo, Apr. 2011K. Takaki et.al, Photonic West. Jan. 2011
14H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Power saving ability in TX
� TX power vs. VCSEL bias current
TXモジュールの消費電力8.0
25˚C 850nm VCSEL
Power consumption in TX
2.0
3.0
4.0
5.0
6.0
7.0
Pow
er c
onsu
mpt
ion
(mW
/Gbp
s)25˚C
80˚C
1060-nm VCSEL
850nm VCSEL
Technical seminar at CERN, Sept. 23 2011 15H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
0.0
1.0
2.0
0 2 4 6 8 10
Pow
er c
onsu
mpt
ion
(mW
/Gbp
s)
VCSEL bias current (mA)
Higher modulation capability� 40Gbit/s direct modulation
NEC group
� 20Gbit/s parallel-optical module•12ch Transceiver
NEC group
T. Anan et. al. International Symposium on VCSELs and Integrated Photonics, E-3, 2007
Technical seminar at CERN, Sept. 23 2011 16H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
K. Kurata, OFC2010, OThS3. K. Yashilki et. al., ICSJ2010, 19-3
•12ch Transceiver•20Gbit/s, PRBS 27-1•50m of GI50 MMF•Error free transmission•Minimum sensitivity: <-8.6dB at 10-12
•Crosstalk penalty: 4dB
1µm VCSEL (TU Berlin)� 980nm VCSEL
Technical seminar at CERN, Sept. 23 2011
A. Mutig, OIDA Workshop, Apr. 2011
17H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Advantages of 1µm optical link�Parameters
Items Parameters 1060nm 850nm
RX:PD Sensitivity
0.75A/WInGaAs
0.6A/WGaAs
Transmission loss 0.95dB/km 2.09dB/km
*1. IEC60925-1 2001, eye-safety class1.
4
pena
lty(d
B)
5Measured (1060nm)
Calculation (1060nm)
Calculation (850nm)4
5 Bit rate: 10Gbps OM3
OM22000MHz·km
Condition:Fiberbandwidth=5000MHz.km
Fiber optics
Transmission loss 0.95dB/km 2.09dB/km
Chromatic dispersion -34.2ps/nm/km -90.42ps/nm/km
TX:Eye safety
Maximum output power
+1.5dBmClass 1
-2.2dBmClass 1
Technical seminar at CERN, Sept. 23 2011 18
0
1
2
3
0300 600 900
Transmission distance (m)
Incr
ease
ofpo
wer
pena
lty
3
2
1
01200
850nm 1060nm 1300nm
500MHz·km
Conventional OM2 applicable Low cost
Longer distance
H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Fiber transmission� Conventional OM-2 and OM-3 MMFs
� 1060-nm optimized MMF
Technical seminar at CERN, Sept. 23 2011 19H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
OM2:Penalty <2dB up to 300mMax. 300m recommendation
OM3:Penalty ~4dB at 300mMax. 150m recommendation
1060-nm MMFPenalty ~3dB at 1000mPotential 300m or beyond
Received power (dBm) Received power (dBm) Received power (dBm)
Modal bandwidth� Power penalty as a function of transmission distance
� Bit rate: 10Gbps� Calculated by IEEE 802.3z link model spread sheet� Limited laser modes (1060-nm VCSEL)� Modal bandwidth is measured with frequency sweeping method� Modal bandwidth is measured with frequency sweeping method
2
3
4
5
6
Pow
er p
ena
lty (
dB
)
OM2OM31060nm MMFOM-2 simulationOM-3 simulation1060nm MMF simulation 850 nm (1) 1060 nm (2) 1300 nm (1)
2262 (OFL)2612 (LLM)1094 (OFL)1741 (LLM)4318 (OFL)
MMF typeModal bandwidth (MHz×km)
OM-2 790 1602
OM-3 4509 708
1060-nm MMF - -
Modal bandwidth
Technical seminar at CERN, Sept. 23 2011 20H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
0
1
2
0 200 400 600 800 1000
Transmission distance (m)
Pow
er p
ena
lty (
dB
)
4318 (OFL)5433 (LLM)
1060-nm MMF - -
Note 1: Fiber bandwidth is calculated from DMD dataNote 2: Measured by frequency sweeping method
JIS C 6824, Aug. 1997.
OFL: Overfilled launchLLM: Limited laser modes
25Gbps optical link� Power penalty as a function of transmission distance
� Bit rate: 25Gbps� Receiver bandwidth: 18.75GHz� MMF bandwidth: 4700MHz.km (OM4 level)� Tr/Tf(20%-80%)=16ps� Tr/Tf(20%-80%)=16ps� Spectral linewidth: 0.45nm, 0.65nm
3
4
5
6
Pow
er p
enal
ty (d
B)
850nm
1060nm
100m 300m
Calculated by IEEE 802.3z link model spread sheet
Technical seminar at CERN, Sept. 23 2011 21H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
0
1
2
0 0.1 0.2 0.3 0.4
Transmission distance (km)
Pow
er p
enal
ty (d
B)
0.45nm 850nm
0.45nm 1060nm
0.65nm 850nm
0.65nm 1060nm
Scalability to the future� Coarse wavelength division multiplexing (CWDM)
� Capability of selecting lasing wavelength� Wide range of wavelength sensitivity
MAUI project: parallel multiwavelength optical subassemblies (PMOSAs)
Cost reduction?
MAUI project: parallel multiwavelength optical subassemblies (PMOSAs)
Technical seminar at CERN, Sept. 23 2011 22H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
LEOS2005, TuW1, Mar. 2005, JLT vol. 22, no. 9, p.2043 2004, ECTC, p.1027 2005.6.6mW/Gbit/s: 10.42Gbit/s x 48ch
Scalability to the future� Attenuation in polymer waveguides
� Poly (methyl methacrylate) (PMMA)� Not available
� Perdeuterated (PD) polymer� Available 2500
3000
3500
4000
4500
5000
PMMA base
PD polymer base
PF polymer base
1060nm
� Available
� Perfluorinated (PF) polymer� Available
� Applied to silicon photonics� 1060nm is in the transmittance window of Silicon
0
500
1000
1500
2000
2500
0.5 0.6 0.7 0.8 0.9 1.1 1.2 1.3 1.4Wavelength (µm)
1.0
T. Ishigure et. al, Science and Technology of Polymer and Advanced Materials, Plenum Press, New York, 1998
PCB
Polymer waveguide
VCSEL
Lens
Technical seminar at CERN, Sept. 23 2011
� 1060nm is in the transmittance window of Silicon
23H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
10Gbit/s x 12ch optical engine� Optical pluggable and pigtailed engines
Heat sinkPigtailed90º-angled connector
Optical pluggable
21mm 21.7mm
Pluggable socketBW > 10GHz
Module 13X13Xt3.4mm
Module
Pluggable socket-1
0
-10
0
Technical seminar at CERN, Sept. 23 2011
18mm18mm
-5
-4
-3
-2
0 2 4 6 8 10
Frequecncy (GHz)
S21 (dB
)
-50
-40
-30
-20
S11 (dB
)
S21S11
24H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
12.5Gbit/s x 12ch x 4� High-density optical pluggable solution
� 600Gbps mezzanine card
Technical seminar at CERN, Sept. 23 2011 25H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Parallel-optical engines
� 10Gbps × 12ch parallel-optical engine� 1060-nm VCSEL array,InGaAs PD array� BiCMOS LDD/TIA
� Electrical interface: pluggable socket
Heat sink
� Electrical interface: pluggable socket� Capability of replacing optical modules� Wide band width >10GHz
� Mechanical size:� Module: 13 × 13 × 3.4 mm(not to include pigtailed fiber)
� Socket: 21.7 × 21 × 13.7 mm
� Performance
21mm 21.7mm
Module
Technical seminar at CERN, Sept. 23 2011 26H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
� Performance� Power consumption:::: <10mW/Gbps� Operating case temperature 0~70°C
� Transmission: 120Gbps error free
Pluggable socket:BW > 10GHz
Module structure�Schematic view
Metal coverVD/TIAMicrolens
12-ch fiber ribbon
Thermal dissipation
-6
-3
0
SD
D21
(dB
)
-20
-15
-10
-5
0
SD
D11
(dB
)
RF pathDifferential transmission lines
12ch VCSEL/PD array
MT ferrule
Multi-layer ceramic substrate
S-parameter (EM simulation)
92 LGA
Technical seminar at CERN, Sept. 23 2011 27H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
-15
-12
-9
0 5 10 15 20
Frequency(GHz)
SD
D21
(dB
)
-50
-45
-40
-35
-30
-25
SD
D11
(dB
)
DB(|S(2,1)|) : Spara_ESA
DB(|S(1,1)|) : Spara_ESA
SDD21: >-3dB at 0-10GHz>-5dB at 0-20GHz
SDD11: <-15dB at 0-20GHz
Electrical-pluggable interface
S-parameters
� Capability of module replacement� System maintenance� Repeatability of module installation
� Wide bandwidth: >10GHz
Cross sectional drawing
-3
-2
-1
0
S21
(dB
)
-30
-20
-10
0
S11
(dB
)
S-parameters� Wide bandwidth: >10GHz
Parallel-optical module
Technical seminar at CERN, Sept. 23 2011 28H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
-5
-4
0 2 4 6 8 10
Frequecncy (GHz)
-50
-40S21S11
Electrical pluggable socket
Spring pin
Eye diagrams
� TX output and RX output
15°C 25°C 50°C 80°CTX TX output
RX output
Technical seminar at CERN, Sept. 23 2011 29H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Monitor channel: Ch 7Case temperature: 25~80°CBias current: 4mA, Optical power: -4.0dBm, Extinction ratio : 4.5dBTr/Tf: (TX output) 31.6ps/47.2ps,
(RX output) 36.0ps/37.6ps
BER performance� BER measurement
� 10Gbps × 12ch simultaneous transmissionOver operating case temperature
(Back to back) Transmission in MMF of 300m
BE
R
80℃
50℃
25℃
15℃
10-4
10-6
10-8
BE
R
Back to back
300m10-4
10-6
10-8
Technical seminar at CERN, Sept. 23 2011 30H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
-18 -16 -14 -12 -10 -8 -6 -4 -2 0 Received optical power(dBm)
10-8
10-10
10-12
-18 -16 -14 -12 -10 -8 -6
Received optical power (dBm)
10-8
10-10
10-12
Minimum sensitivity at 25°C: -10.2dBm Power penalty: 0.6dB
Optical link power� 1060nm 12ch x 10.315Gbit/s optical link
� Tc=25°C: 5.9mW/Gbit/s� Tc=70°C: 6.4 mW/Gbit/s
6.4mW/Gbit/s
Minimum sensitivity: <-12dBm BER=1012
2
3
4
5
6
7
8
-16
-15
-14
-13
-12
-11
-10
Pow
er c
onsu
mpt
ion(
mW
/Gbp
s)
Sen
sitiv
ity(d
Bm
)
ch1
ch2
ch3
ch4
ch5
ch6
ch7
ch8
ch9
5.9mW/Gbit/s
6.4mW/Gbit/s
Technical seminar at CERN, Sept. 23 2011 31
0
1
2
-18
-17
-16
0 20 40 60 80 Pow
er c
onsu
mpt
ion(
mW
/Gbp
s)
Sen
sitiv
ity(d
Bm
)
Case temprature(deg.C)
ch9
ch10
ch11
ch12
average
PC
H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Summary� Technical trends in data centers and optical interconnects are
described.� Advantages of 1-µm optical inter connects
� Low power consumptionHigher modulation capability � Higher modulation capability
� Longer transmission distance� Low cost solution with conventional OM-2 fibers� High reliability with InGaAs devices
� Expansivity of 1-µm optical inter connects� Usage of polymer waveguide� Silicon photonics� Coarse wavelength division multiplexing (CWDM)
Technical seminar at CERN, Sept. 23 2011 32H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
� Coarse wavelength division multiplexing (CWDM)� 10-Gbps x 12-channel 1060-nm parallel-optical modules
� Size: 13mm x 13mm x 3.4 mm� Very Low power: <7mW/Gbps (Tc: 15°C to 80°C)� Electrical-pluggable socket interface� Very low power 7.0mW/Gbps over operating case temperature
Future perspective� Higher speed >25Gbps
� High speed devices VCSEL, PD, CMOS (Silicon) Photonics�Argument on wavelength: expectation on 1µm wavelength
� Electrical wiring: Wideband wiring, Crosstalk suppression� Bandwidth control: Equalization, Emphasis� Bandwidth control: Equalization, Emphasis
� Optical waveguide� Polymer waveguide
�Loss, Bandwidth�Optical coupling
� MMF�Bandwidth (Refractive index profile, Core diameter)
ECOC2010, Tu4G3, Sept. 2010.
Terabus Project
Technical seminar at CERN, Sept. 23 2011
� High-density� Small optical engine� 3D integration, CMOS Photonics
� Mounting technology� Electrical pluggable� Permanent mounting
33
ECOC2010, Tu4G3, Sept. 2010.
H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.
Thank you!
Technical seminar at CERN, Sept. 23 2011 34H. Nasu/FITEL Phonics Laboratory, Furukawa Electric Co, Ltd.