1. FOUNDATION COURSE - nptc.ac.in · 1. FOUNDATION COURSE Course Code Course Name Credits 0101 English – I 3 0102 Basics of Computer Science – I 4 0103 Mathematics – I 7

1

1. FOUNDATION COURSE

Course Code Course Name Credits

0101 English – I 3

0102 Basics of Computer Science – I 4

0103 Mathematics – I 7

0104 Applied Physics – I 3

0105 Applied Chemistry – I 3

0106 Technical Drawing – I 4

0107 Applied Physics Practical – I 1

0108 Applied Chemistry Practical – I 1

0109 Applied Chemistry Practical – I 1.5

0110 English Communication Practical – I 1

0201 English – II 3

0202 Basics of Computer Science – II 4

0203 Mathematics – II 7

0204 Applied Physics – II 3

0205 Applied Chemistry – II 3

0206 Technical Drawing – II 4

0207 Applied Physics Practical – II 1

0208 Applied Chemistry Practical – II 1

0209 Workshop practice – II 1

0210 English Communication Practical - II 1.5

Total Credits 57

2

4301 Measurements And Instruments 6.0

4302 Communication Engineering 7.04303 Measurements And Instruments Lab 1.5

4304 Communication Engineering Lab 3.0

4305 Communication Systems 6.04306 Television Engineering 7.0

4307 Communication Systems Lab 3.0

4308 Project Work, Entrepreneurship &Personal Skills 2.0

2. CORE COURSE


3. APPLIED COURSE


4201 Electrical Circuits And Machines 6.04202 Electronic Devices And Components 6.04203 C++ Programming 5.04204 Electrical Circuits And Machines Lab 3.04205 Electronic Devices And Components Lab 3.04206 C++ Programming Lab 3.04207 Electronic Circuits 7.04208 Digital Electronics 6.04209 Computer Installation And Servicing 7.04210 Electronic Circuits Lab 3.04211 Digital Electronics Lab 1.54212 Computer Installation And Servicing Lab 3.0

Total Credits 53.5

Total Credits 35.5

3

4401 Diversified Course - I 7.0A) Microcontroller And Advanced MicroprocessorB) Bio Medical InstrumentationC) Power ElectronicsD) Surface Mount Technology

4402 Diversified Course Lab – II 3.0A) Microcontroller And Advanced Microprocessor LabB) Bio Medical Instrumentation LabC) Power Electronics LabD) Surface Mount Technology Lab

4403 Diversified Course – III 6.0A) Industrial ElectronicsB) Computer NetworksC) Digital CommunicationD) Digital Signal Processing

4404 Diversified Course Lab – IV 3.0A) Industrial Electronics Lab

Total Credits 19.0

4. APPLIED COURSE


CREDIT ABSTRACT

S.No. Course Credits Percentage

1. Foundation Courses 57.0 34.52. Core Courses 53.5 32.53. Applied Courses 35.5 21.54. Diversified Courses 19.0 11.5

Total 165.0 100.0

4

Total

Code No Course Name Hrs /Week Internal External Total

Credit

Scheme of ExaminationAllocation marks

Dura-tion

ofexam

CURRICULUM AND SCHEME OF EXAMINATIONDIPLOMA IN ELECTRONICS AND COMMUNICATION ENGINEERING

III TERM

4201 ELECTRICAL CIRCUITS ANDMACHINES 6 6 25 75 100 3

4202 ELECTRONIC DEVICES ANDCOMPONENTS 6 6 25 75 100 3

4203 C++ PROGRAMMING 5 5 25 75 100 34204 ELECTRICAL CIRCUITS AND

MACHINES LAB 6 3 25 75 100 34205 ELECTRONIC DEVICES AND

COMPONENTS LAB 6 3 25 75 100 34206 C++ PROGRAMMING LAB 6 3 25 75 100 3

35 26 150 450 600 18

4207 ELECTRONIC CIRCUITS 7 7 25 75 100 3

4208 DIGITAL ELECTRONICS 6 6 25 75 100 3

4209 COMPUTER INSTALLATIONAND SERVICING 7 7 25 75 100 3

4210 ELECTRONIC CIRCUITS LAB 6 3 25 75 100 3

4211 DIGITAL ELECTRONICS LAB 3 1.5 25 75 100 34212 COMPUTER INSTALLATION

AND SERVICING LAB 6 3 25 75 100 3

35 27.5 150 450 600 18Total


Credit


Dura-tion

ofexam

IV TERM

5

4301 MEASUREMENTS ANDINSTRUMENTS 6 6 25 75 100 3

4302 COMMUNICATIONENGINEERING 7 7 25 75 100 3

4401 DIVERSIFIED COURSE -I 7 7 25 75 100 34303 MEASUREMENTS AND

INSTRUMENTS LAB 3 1.5 25 75 100 3

4304 COMMUNICATIONENGINEERING LAB 6 3 25 75 100 3

4402 DIVERSIFIED COURSE -II 6 3 25 75 100 3

35 27.5 150 450 600 18Total


Credit


Dura-tion

ofexam

V TERM

CURRICULUM AND SCHEME OF EXAMINATIONDIPLOMA IN ELECTRONICS AND COMMUNICATION ENGINEERING

Diversified course – I - 4401 ( Theory ) Diversified course – II - 4402 ( Practical )A) Microcontroller and advanced A) Microcontroller and advanced microprocessor Lab

microprocessor B) Bio medical instrumentation LabA) Bio medical instrumentation C) Power electronicsB) Power electronics D) Surface mount technologyC) Surface mount technology

Diversified course – III - 4403 ( Theory ) Diversified course – IV - 4404 ( Practical ) A) Industrial electronics A) Industrial electronics Lab B) Computer networks C) Digital communication D) Digital signal processing

Total


CreditScheme of Examination

Allocation marksDura-tion

ofexam

4305 COMMUNICATION SYSTEM 6 6 25 75 100 34306 TELEVISION ENGINEERING 7 7 25 75 100 3

4403 DIVERSIFIED COURSE -III 6 6 25 75 100 34307 COMMUNICATION SYSTEM LAB 6 3 25 75 100 3

4404 DIVERSIFIED COURSE -IV 6 3 25 75 100 34308 PROJECT WORK,

ENTREPRENEURSHIP ANDPERSONAL SKILLS 4 2 25 75 100 3

35 27 150 450 600 18

VI TERM

6

4201 - ELECTRICAL CIRCUITS AND MACHINES

III TERM ( CORE COURSE)

6 Hrs / Week Total Hrs : 72

MAJOR DIVISIONS

UNIT TOPIC

I DC CIRCUITS AND DC NETWORK THEOREMS

II ELECTROMAGNETIC INDUCTION, CAPACITANCE AND AC

FUNDAMENTALS

III AC CIRCUITS AND RESONANCE

IV DC MACHINES AND TRANSFORMERS

V AC MACHINES

UNIT – I ( 15 Hrs )

DC CIRCUITS AND DC NETWORK THEOREMS

Concept of electrical quantities – Voltage – Current – resistance – Ohm’s law –Kirchoff’s laws – Series – parallel and series parallel circuits – Mesh current and Nodal Voltagemethods – electrical power and energy (Simple problems)

Super position, Thevenin, Norton, Millmann and Maximum power transfer Theorem(Statements and explanation only – Proof not necessary) – Simple problems.

UNIT – II ( 13 Hrs )

ELECTROMAGNETIC INDUCTION, CAPACITANCE AND AC FUNDAMENTALS

Magnetic circuits – flux – flux density – permeability - mmf – field intensity – reluc-tance ohms’ law of magnetic circuit – Faraday’s laws of electromagnetic induction – Lenz’s law– dynamically induced emf – statically induced emf – self induced emf – mutually induced emf –self inductance – mutual inductance – Co-efficient of self inductance and mutual inductance –

Co-efficient of coupling – comparison of electric circuit and magnetic circuit – energy stored inan inductor.

Capacitance – permittivity of a dielectric medium – parallel plate capacitor – capacitorsin series and parallel – energy stored in a capacitor.

AC waveform – sinusoidal and non – sinusoidal – period – frequency – cycle –amplitude- phase – peak value – average value – RMS (effective) value – form factor – crestfactor- phasors – rectangular and polar forms.

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UNIT - III ( 15 Hrs )

AC CIRCUITS AND RESONANCE

Voltage and current relationship in resistance, inductance, and capacitance – Conceptof reactance – Susceptance – Conductance – impedance and admittance -RL, RC and RLC –Series and parallel circuits- power in ac circuits – power factor – Concept of three phase supply– line and phase voltage and current in star and delta connected circuits – simple problems.

Resonance - series and parallel resonance – Condition for resonance – resonance curve– effect of resistance on resonance curve – selectivity of resonant circuits – Q factor and bandwidth – applications of resonance.

UNIT - IV

DC MACHINES AND TRANSFORMERS ( 15 Hrs )

Transformer – ideal Transformer – principle of working – Constructional details – emfequation- turns ratio – Core Loss – Copper Loss – Efficiency – regulation – OC and SC tests ontransformer – Application.

DC Machines – Types – Constructional details of Yoke, pole ,core, pole shoe – Fieldwinding – armature Core – Commutators – armature winding (Types only)

DC Generator – Principle of working – Types – emf equation – Losses and efficiency– characteristics of shunt, series and compound Generators – Applications.

DC Motor – Motor action – Back emf – Torque speed – speed Regulation – Character-istics of shunt, series and compound motor – Starting of motors using 3 and 4 point starters –Speed control of dc motor – Applications.

UNIT – V ( 14 Hrs )

AC MACHINES

Alternator – principle of working of alternator – Constructional details – Speed andfrequency – emf equation (no derivation is required)- Induction Motor -Construction details –types – principle of operation – Rotating magnetic fields – Slip – Speed torque characteristics –Methods of starting 3 ph. Inductor motor (Qualitative treatment only). Single phase inductionmotor – Constructional details – principle of operation – Types – split phase, shaded poleCapacitor start and Repulsion Motors – Stepper Motor – uses (Qualitative treatment only)

REFERENCE BOOKS: -1. B.L. Theraja, A.K.Theraja, “A Text Book of Electrical Techology”, S.Chand &

Company Ltd, 23 Revised Edition.

2. S.K.Bhattachary, “Electrical Machines”, Tata MCGraw - Hill Publishing Company Ltd,2nd Edition.

3. Joseph Edminister & Mahmood Mahvi, “Electric Circuits Schaums Series”, TataMCGraw - Hill, 3rd Edition.

4. Umesh Sinha, “Circuit Theory”, Sathya Prakashan (Publisher), 4th Edition.

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4201 - ELECTRICAL CIRCUITS AND MACHINES

MODEL QUESTION PAPER

TIME : 3 Hrs MARKS : 75

Note : 1. Answer all questions

2. Answer any one from Part A(5 marks) and any one from Part B

(10 marks )

I. A. 1. State Kirchoff’s Laws

2. State Thevenin’s and Norton’s theorem.

B. 1. A resistor of 10 ohm is connected in series with two resistance’seach of 15 ohms connected in parallel. What resistance must beconnected across the whole combination so that the total currentshall be 1.5 amps with 20V applied.

2. Find the current in 20 ohms resistor using Norton’s theorem.

II A. 1. State Faraday’s Law’s of Electromagnetic induction.

2. Derive an expression for RMS value of an alternating current.

B. 1. Derive an expression for the energy stored in a capacitor.

2. A solenoid of 10 cm long and 10 cm in diameter is wound with 1500

turns . Find

a) The inductance

b) The energy stored in the magnetic field when a current of 4A

flows in the coil.

III A. 1. Define reactance, Susceptance, impedance, admittance and powerfactor.

2. Derive an expression for impedance of an RLC series circuit.

B 1. A series RLC circuit consists of R of 15 ohm inductance of 0.1H and capacitance c =100 f. Calculate inductance, reactance, capacitive reactance the impedance, the current,power factor, voltage across coil and condenser when 200v 50 Hz is applied.

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2. A circuit consists of a capacitor of 100 f connected in series with a coil of resistance50 ohms and inductance 200 H.

Calculate , a) resonant frequency b) Q factor c) Bandwidth

IV A.1. Derive the EMF equation of a transformer.

2. Brief about the significance of Back EMF.

B. 1. Explain the Principle of working of a D.C. generator.

2. Explain speed control of method of D.C. series motor.

V A. 1. Derive the frequency of a alternator.

2. Compare Slip ring and squirrel cage induction motor.

B. 1. Explain how a rotating magnetic field is produced in an induction motor.

2. Explain with diagram the principle of working of a capacitor typeinduction motor.

10

4202- ELECTRONIC DEVICES AND COMPONENTS

III TERM ( CORE COURSE )


MAJOR DIVISIONS

UNIT TOPIC

I COMPONENTS, SWITCHES, FUSES & DIODES

II TRANSISTORS

III THYRISTORS AND UNI. - JUNCTION TRANSISTOR

IV SPECIAL DIODES & OPTO ELECTRONIC DEVICES

V MICROWAVE DEVICES

UNIT 1 COMPONENTS, SWITCHES, FUSES & DIODES [15 Hrs]

Components

Electronic Components - passive and active components – Resistors - fixed and variable(types only)- wire wound – colour coding –comparison with respect to size, power rating,accuracy and temperature- uses of resistors - Thermistors Capacitors – fixed and variable (typesonly) - uses of capacitors.

Inductors - fixed – tapped and variable (types only) - factors affecting the inductance- applica-tions

Switches

Switch function - Types - on/off - push button - push to on - push to off - two wayswitch – SPST - SPDT (symbol only) – electromagnetic switches - principle of operation - relay-symbol – types - rating.

Fuses

Types of fuses - Rating of fuses - use

Diodes

Atomic theory - atomic structure of silicon, germanium – energy band diagram ofconductors – semiconductors – insulators - electron hole pair generation & recombination -intrinsic & extrinsic semiconductor – drift and diffusion current (qualitative treatment only) - PNjunction under open circuit, forward bias, and reverse bias conditions - characteristics of silicon,germanium diode – cut in and break - down voltages.

UNIT II –TRANSISTORS [15 Hrs]

BIPOLAR JUNCTION TRANSISTORS:

Transistor action: PNP and NPN transistor - CB, CE, CC configuration – characteristics- comparison between three configuration (qualitative treatment only) - typical values of cut off,cut -in, conduction and saturation voltages - reverse saturation current - transistor current gain -typical values

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FIELD EFFECT TRANSISTORS:

Construction, characteristics and operation of junction FET, MOSFET and dual gateMOSFET – IGFET, – pinch off voltage – parameters rd, gm and mu - types of packages –application - comparison of JFET, MOSFET

UNIT III- THYRISTORS AND UNI - JUNCTION TRANSISTOR [12 Hrs]

SCR:

Constructional details – principle of operation – terminal identification – characteristicsand ratings – turn on, turn off mechanism – silicon controlled switch – applications of S.C.R. –construction and working of DIAC and TRIAC – characteristics - applications.

UJT:

Construction- operation- characteristics and applications

UNIT IV – SPECIAL DIODES & OPTO ELECTRONIC DEVICES [15 Hrs]

Zener diode – construction & working principle – characteristic – Zener breakdown –Avalanche breakdown – applications – Tunnel diode – Varactor diode – construction – operation– characteristics – Symbol Opto electronic devices: Construction – principle of operation,characteristic, application and symbols of photodiode, phototransistor, solar Cell, LDR, LED,LCD, photo conductive cells – laser diode – principle - characteristic of laser –applications.

UNIT V – MICROWAVE DEVICES [15 Hrs]

UHF and microwave transistors – construction and application (qualitative treatmentonly) PIN, Schottky, step recovery diode. Klystron – reflex Klystron – operation and application.

Magnetron and travelling wave tube – construction of cavity magnetron – mechanismof oscillation in magnetron– Travelling wave tube – operation - applications.

REFERENCE BOOKS:1. Allen Mottershed, “Electronic Devices and Circuits”, Prenlice Hall, 2nd Edition.2. Jacob Miltman & Christors C.Hallcias, “Electronic Devicesand Circuits”, Tata MCGraw

- Hill, Edition 1991.3. Thomas L.Floal, “Electronic Devices”, Pearson Education (Publisher), 6th Edition.

12

4202 - ELECTRONIC DEVICES AND COMPONENTS


TIME : 3 Hrs MARKS : 75 Note : 1. Answer all questions

2.. Answer any one from Part A(5 marks) and any one from Part B(10 marks )

I A. 1. Explain the principle of operation of relay.

2. How electron hole pair is being generated and recombined in a semiconductor.explain.

B. 1. Differentiate between intrinsic and extrinsic semiconductors.

2. Explain the PN junction under forward bias and reverse bias conditions.

II A. 1. Explain the NPN transistor action.

2. a) Define Pinch off voltage. b)compare JFET and MOSFET.

B. 1. Explain the input and output characteristics of a transistor under common baseconfiguration

2. Explain the operation of MOSFET.

III A. 1. Explain any one method of Turn – on mechanism of SCR.

2. Derive the expression for the intrinsic stand off ratio of an UJT.

B. 1. Explain the operation of SCR.

2. Explain the operation of UJT.

IV A. 1. Define zener breakdown and avalanche breakdown.

2. List the names of varactor diode. Why it is called so.

B. 1. Explain the operation of varacter diode.

2. Explain the operation of photo diode.

V A. 1. Explain the operation of step recovery diode.

2. Draw and explain the construction of travelling wave tube.

B. 1. Explain the operation of reflex klystron.

2. Explain the mechanism of oscillation in a magnetron.

13

4203 - C++ PROGRAMMING

( III TERM CORE COURSE )


MAJOR DIVISIONS

UNIT TOPIC

I INTRODUCTION TO OBJECT ORIENTED PROGRAMMING AND C++

PROGRAMMING

II FUNCTIONS, CLASSES AND OBJECTS

III CONSTRUCTORS, DESTRUCTORS AND OPERATOR OVERLOADING

IV INHERITANCE, POINTERS AND VIRTUAL FUNCTIONS

V CONSOLE I/O AND FILE MANAGEMENT

UNIT: I INTRODUCTION TO OBJECT ORIENTED PROGRAMMING ANDC++ PROGRAMMING (12 Hrs )

Problems in software development - software evolution - procedure oriented programming -object oriented programming paradigm - basic concepts of object oriented programming -benefits of OOP - object oriented languages - applications of OOP.

Features and applications of C++ - structure of C++ programs – cin and cout objects –creating the source file – compiling and linking.

Keywords - identifiers - basic data types - user defined data types - derived

data types- symbolic constants - type compatibility - declaration of variables -

dynamic initialization of variables - reference variables - operators in C++ - scope resolutionoperator - member dereferencing operators - memory management operators – manipulators -type cast operator - expressions and

implicit conversions - operator overloading - operator precedence.

goto statement - if and if…else statement - while and do…while statements - switch state-ment - for statement.

UNIT: II FUNCTIONS, CLASSES AND OBJECTS (15 Hrs )

The main () function - functions prototype - call by reference, return by reference, inlinefunction; default arguments - const arguments - functions overloading.

Structures and classes; classes – specifying a class - defining member functions - nesting ofmember functions - private member functions - arrays within a class - memory allocation forobjects -static data member - static member functions.

Arrays of objects - objects as function arguments - friendly functions - returning objects -constant member functions - pointers to the members.

14

UNIT: III CONSTRUCTORS, DESTRUCTORS AND OPERATOR OVERLOADING(12 Hrs )

Constructors without parameters - constructors with parameters - multiple constructors - con-structors with default arguments - dynamic initialization of objects - copy constructors - dynamicconstructors - destructors.

Operator loading - overloading unary operators - overloading binary operators with friends -manipulation of strings using operators; rules for overload ing operators.

Conversion of basic data types to class and class to basic data types - conversion of one class toanother class.

UNIT: IV INHERITANCE, POINTERS AND VIRTUAL FUNCTIONS (12 Hrs )

Inheritance - Defining derived classes - single inheritance - making a private member inheritable- multi-level inheritance - multiple inheritance - hierarchy inheritance -hybrid inheritance - virtualbase classes - abstract classes - constructors in derived classes - member classes - nesting ofclasses – polymorphism.

Pointers to objects - pointers to derived classes -Virtual functions - Rules for virtual functions -pure virtual functions.

UNIT: V CONSOLE I/O AND FILE MANAGEMENT ( 9 Hrs )

I/O operations - streams - stream classes - unformatted I/O - formatted console I/O outputwith manipulators.

Classes for file stream operations - opening and closing a file - detecting end of files - file modes- file pointers and their manipulators - sequential input and output operations - updating a file -error handling.

Reference Books :1. John.R.Hubbard, Ph.D, “Schaum’s Outlines Programming withC++”, Tata McGraw - Hill,

2nd Edition, 2002.2. Herbert Schilde, “C++: The Comlete Reference”, Tata McGraw - Hill, 4th Edition.

3. E.Balagurusamy, “Object Oriented Programming with C++”, Tata McGraw - Hill, 2ndEdition,1998.

4. D.Ravichandran, “Programming with C++”, Tata McGraw - Hill, 1st Edition, 1999.5. Ashwant Kanetkar, “Let us C++”, BPB Publications, New Delhi, 1st Edition.

15

4203 - C++ PROGRAMMING


TIME 3 Hrs MARKS :75Note : 1. Answer all questions

2. Answer any one from Part A(5 marks) and any one from Part B(10 marks )

I A.. 1. State few characteristics of OOP.

2. What are the standard identifier used in C++

B. 1. Explain the basic data types available in C++.

2. Explain the basic concept of C++.

II A. 1. What do you mean by inline function.

2. List are the difference between array & structure.

B. 1. Briefly explain how a function is defined and declared.

2. Write a C++ program to display fibonacci sequence.

III A. 1. What is destructor.

2. State few rules for operator overloading.

B. 1. What is constructor. Explain the different types of constructor.

2. Explain the conversion of basic data types to class.

IV A. 1. Short note on Polymorphism.

2. Explain pointer to object.

B. 1. What is inheritance.? Explain different types of inheritance.

2. What is virtue function? List the rules for virtual functions.

V A. 1. What is stream?

2. Short notes on error handling.

B. 1. Explain with example unformatted I/O operation.

2. Explain how a file is open and close.

16

4204 - ELECTRICAL CIRCUITS AND MACHINES LAB.



1. Device an experiment to verify the ohm’s law (use standard resistance, ammeter andvoltmeter)

2. Device an experiment to verify Kirchoff’s laws (use standard resistance, ammeter andvoltmeter)

3. Device an experiment to find the reactance and impedance of the given passive element fordifferent frequencies (element inductor and capacitor)

4. Device an experiment to verify superposition Theorem (DC only)

5. Device an experiment to verify Norton’s and Thevenin’s Theorems (DC only)

6. Device an experiment to verify the maximum power transfer theorem (DC only)

7. Device an experiment to verify Millman’s theorem (DC only)

8. Construct a series and parallel resonant circuit and plot the resonance characteristics.Obtain the frequency resonance curve

9. Study the parameters of a sinusoidal signal

10. Obtain the magnetization Characteristics of a DC Shunt Generator

11. Obtain the Load Characteristics of a DC Shunt Generator

12. Find the power input to a DC Motor under no Load and at different loads.

13. Obtain Speed Control of DC Shunt Motor

14. Find the power input to a 3 phase induction Motor using two wattmeter method at no loadand any other load..

15. Find the iron Losses, Copper Losses, and efficiency of a single phase transformer byconducting OC and SC tests.

16. Find the efficiency of single phase transformer by conducting a Load test.

17. Study the Construction of Stepper Motor, Servomotor and tachogenerator.

18. Obtain the Load Characteristic of an alternator.

SCHEME OF EXAMINATION

1. Experiments 70

2. Viva – Voce 05

Total 75

S.No Topics Marks

17

4205 - ELECTRONIC DEVICES AND COMPONENTS LAB.

III TERM ( CORE COURSE )


1. ISI symbols, specifications and packages – diodes (all types) – Transistors

(PNP, NPN) - Op. Amp.- UJT, SCR, JFET, MOSFET, DIAC, TRIAC Resistors: fixedVariable Resistors, Potentiometers – Inductor– air core, Ion core – adjustable , Variable –Capacitor – air ganged – variable– Ammeter – Volt meter – Wattmeter – Neon lamp – Pilotlamp – Resistor, Capacitor, color coding. Switches – fuses

2. V-I characteristics of germanium and silicon signal diode under forward and reverse biasconditions . Determination of cut – in voltage, reverse saturation current and dynamicforward resistance.

3. V-I Characteristics of silicon power diode under forward and reverse bias conditions. Deter-mine the cut-in voltage, reverse saturation current and dynamic forward resistance.

4. Input ,output, mutual characteristics under Common Emitter configuration. Determinationof cut-in voltage, input resistance, current gain and output Admittance.

5. Construct a series connection for a lamp with ON/OFF switch use (fuse, indicator lamp)

6. Input, output, mutual characteristics under Common Base Configuration. Determination ofcut-in voltage, input resistance, current gain and output admittance.

7. Plotting of the drain characteristics of FET. Determination of pinch – off voltage (Enhance-ment mode).

8. Plotting of the drain characteristics of MOSFET. Determination of pinch – off voltage(Enhancement mode).

9. Plotting of the drain characteristics of MOSFET. Determination of pinch – off voltage.(Depletion mode)

10. Plotting the V.I. Characteristic of UJT. Determination of Vp, Vv & Iv. (forward & reverse).

11. Plotting the V.I characteristic of given Zener diode.Determination of the forward cut involtage and forward dynamic resistance. Determination of the reverse breakdown voltage,minimum Zener current and reverse dynamic resistance.

12. Plotting the V-I characteristics of given LED

13. Plotting the V-I characteristics of DIAC.

14. Plotting the V-I characteristic of TRIAC.

15. Plotting the V-I characteristics of SCR for different gate current .

18

16. Conducting the cold check using Multimeter on the following devices and checking for theirconditions such as (1) open or shorted junctions. (2) Identification of anode and cathode ofdiode. (3) Identification of base, collector and emitter of transistor. (4) Identification ofemitter, base 1 and base 2 of UJT and (5) Identification of gate, drain and source of aFET(6)Identification of Anode,Cathode and Gate of SCR.

17. Plotting the V–I characteristic of Photodiode.

18. Plotting the V–I characteristic of LDR

Scheme of Examination

1. Experiments 70

2. Viva – Voce 05

Total 75

S.No Topics Marks

19

.4206- C++ PROGRAMMING LAB



1. Program to calculate simple & compound interest .

2. Program to find the variance and standard deviation of n numbers

3. Program to generate fibonacci series

4. Program to calculate factorial of given number N.

5. Program to add two 2 * 2 matrices and display the resultant matrix

6. Program to find the largest value in an array.

7. Write a function called ‘add’ to add two integers. Write another function with the same name’add’ to add two floating point values .write a main( ) function to call both these function oneby one, giving suitable values for the arguments and print the values returned by the functions

8. Write a function max( ) to find the bigger of the two integers given and return the answer tomain() by reference. The max( ) function is to supply two integer values to the main( ) andcall it by reference.

9. Write a function power( ) to raise a number m to a power n. the function takes a double form and int value for n, and returns the result correctly. Use a default value of 2 for n to makethe function to calculate squares when this argument is omitted. Write a main that gets thevalues of m and n from the user to test the function.

10. create a class ‘item’ to contain two class data 1)item code (an integer) and 2) item price(anfloat) write two constructor functions, a no argument constructor to initialise class data withzero values and a constructor with two arguments. To assign values for class data. Write amember function get_data ( ) to read values for class data from the keyboard. Write anothermember function disp_data( ) to display class data.

11. Write a main( ) function to create two objects in a class. Create the first obiect with the noargument constructor and initialise the data items in it with zeros. Create and initialise thesecond object with the two arguments constructor. call get_data( ) to read values for object1.callshow_data( ) and display the data items in both the objects.

12. Create a class ‘string’ to contain a class data str(an array of characters). Write two constructorfunctions, one to initialise str with null string and another to assign str, the given string.Write also member functions concat( ) for concatenating two strings (overloading the +operator) and disp( ) for displaying a string.

13. Write a main( ) function that creates three string objects of the above class. Invoke themember function concat( ) passing two strlings and store the result in the third object.Display all the stings with disp( ) member function.

20

14. Create a class ‘distance’ to contain two class data 1) feet (an integer) and 2) inches(a float).Write two constructor functions, one to contain only one argument of type float andanother to contain two arguments of type int and float. The first construtor function is toconvert the given inches into feet and inches. The second constructor function is to assignvalues for feet and inches. Write also a member function float( ) to convert the given feet andinches into inches and another member function to display the converted value. Write amain( ) function to create two objects of the above class. Invoke the first constructor functionto convert the inches in object1 to feet and inches in object2. Convert the feet and inches inobject2 into inches using the conversion function float( ).

15. Create a class called ‘stack’. The class data are

1) number (an array of integers) and 2) top (an integer). Write a member functionpush( ) to store the given integer in the array ‘number’ using top as an index. Write anothermember function pop( ) to return the last integer in the array ‘number’ using top as an indexand 2) decrement top.

Create another class ‘stack2’ with two number functions push( ) and pop( ). The push( )function is to check whether the array is full (or) not. If it is not full, it should call the pop( ) function of the ‘stack’ class.

Write a main( ) function to create an object of class ‘stack2’ and push and pop the integers intothe array ‘number’.

16. Create a manipulator ‘form’ to

a. display floating point

b. replace blank spaces with * and

c. display two decimal digits.

17. Create a class ‘student’ to contain two class data 1)name and 2) rollnumber. Write a memberfunction to store and display the class data.

Write a main( ) function to create a class ‘student,dat’. Create objects of the above class andstore them in the file “student.dat” and close the file. Open the file again and read back thedata items in objects and display them

18. Create a class called ‘employees’ with class data name (an array of characters) and age (aninteger). Write member functions to store and display the class data. Write a main( ) functionto create an array of objects and display them using the member functions.


1. Programs 70

2. Viva – Voce 05

Total 75

S.No Topics Marks

21

4207 - ELECTRONIC CIRCUITS

IV TERM ( CORE COURSE )


MAJOR DIVISIONS

UNIT TOPIC

I BIAS AND BIAS STABILITY

II POWER AMPLIFIERS

III FEEDBACK AMPLIFIERS & OSCILLATORS

IV WAVE SHAPING AND SWEEP CIRCUITS:

V POWER SUPPLIES AND VOLTAGE REGULATORS

UNIT I - BIAS AND BIAS STABILITY ( 18 Hrs)

Selection of operating point – DC and AC load lines - Thermal stability – Thermal runaway- Stability factors – Biasing circuits - Fixed bias - Collector to base bias - Self bias – Compensa-tion techniques - Diode compensation for VBE and ICO – Thermistor compensation.

BJT Amplifiers (No derivation required) – Classification - RC coupled amplifier - Low,Medium, High frequency range gains – Frequency response characteristics - Gain bandwidthproduct - High input impedance transistor circuits – Emitter follower - Darlington configuration- Differential amplifier using transistors - Noise in Amplifier -Transistor as switch.

UNIT II - POWER AMPLIFIERS ( 17 Hrs)

Power transistors and their special characteristics - power amplifier characteristics - Heatsinks – Classification of power amplifiers - Class A series fed , Shunt fed amplifiers - Class Apush pull operation - Class B push pull operation – Cross over distortion - Class AB operation- complementary symmetry operations - Darlington pair - Complementary Symmetry operations- Class C amplifier.

FET Amplifiers - Biasing of FET’s – Self bias, Voltage divider bias, Source bias, Currentsource bias – Biasing of MOSFETS – Zero bias for DMOSFET, Drain feed back bias forEMOSFET - Common source, common drain and Common gate amplifiers (No derivations) -DC amplifier using FET chopper-Differential Amplifier.

UNIT III - FEEDBACK AMPLIFIERS & OSCILLATORS ( 17 Hrs)

Feedback concept, Types - Voltage series , current series, Voltage shunt and Current shuntfeedback, Comparison, - Effect of feedback on gain - Input and output impedance - bandwidthand distortion - Advantages of feedback .

Oscillators - Condition for Oscillation - Principle of tank circuit - LC Oscillators - Hartley,Colpitts, Clapp’s Oscillators – RC phase shift oscillator - Crystal Oscillator - Negative resistanceOscillator.

22

UNIT IV: WAVE SHAPING AND SWEEP CIRCUITS: ( 17 Hrs)

Clippers - Diode clipper - Transistor clipper - Clipping at two independent levels - Clampercircuits using diode - Schmitt trigger - Saw tooth generator - Miller integrator – 555 IC – Pindetails - basic concepts of multi vibrator- Astable and monostable, bistable operation ( transistorversion circuits ) – 741 IC – Pin details ( internal circuit not required) - Characteristics - open loopand closed loop concepts - virtual ground – Applications – Inverting amplifier - summingamplifier - Voltage follower – Differentiator - integrator and comparator – PLL 565 IC – Basicconcept – Pin details – Applications – Frequency multiplier – Frequency translator.

UNIT V: POWER SUPPLIES AND VOLTAGE REGULATORS ( 15 Hrs)

Rectifiers - Half wave, full wave and bridge rectifiers (No derivations required) - Filters- Capacitors, Inductors, L-section and Pi section and RC filters - Voltage multipliers - Half waveand Full wave doublers, tripler and quadrupler - Voltage regulators - Zener regulator - Emitterfollower regulators – Electronic feed back series regulator - Switched mode power supply(SMPS) and Uninterrupted power supply (block diagrams only) – IC regulators - 723, 78XXand 79XX ICs.

Reference Books:1. JacobMillman and C.Halkier, “Electronic Devices and Circuits”, Tata McGraw - Hill,

Edition 1991.2. G.K.Mithal, “Electronic Devices and Circuits”, Khanna Publishers, 22nd Edition 1999.3. Robert L.Boylestand & Louis Mashelsky“Electronic Devices and Circuit Theory”,

Pearson Education Publishers, 8th Edition 1999.4. Jacob Millman and Herbert Taub, “Pulse, Digital and Switching Waveforms”, Tata

McGraw Hill, Edition 1999.7. Power supplies - M.Sasi Kumar

8.. Electronic devices and circuits- Allen Mottershed

9. Pulse ,Digital and Switching Waveforms – Millman and Taub

23

4207 - ELECTRONIC CIRCUITS


TIME : 3 hrs MARKS : 75



I A 1. Short notes on thermal runway

2. Explain how a transistor act as a switch.

B. 1.. Explain with a neat circuit diagram the operation of self bias circuit.

2. Explain the operation of differential amplifier using transistor.

II A. 1. Short notes on heat sinks.

2. Short note on biasing techniques of FET.

B. 1. Explain with a neat diagram the operation of complementary symmetryamplifier.

2. Explain the operation of DC amplifier using FET amplifier.

III A. 1. State few advantages of negative feedback

2. State Piezo electric effect.

B. 1. Draw the block diagram of various types of feedback and list itscharacteristics

2. Explain the operation of LC phase shift oscillator with neat diagram.

IV A. 1. What is clipper?

2. List are the typical characteristics of 741 IC.

B. 1. Explain the operation of positive clamper circuit.

2. Draw and explain the mono stable operation using 555 IC

V A. 1. Define rectification efficiency and ripple factor.

2. What are the differences between full wave and bridge rectifiers.

B. 1. Explain the operation of bridge rectifier.

2. Explain the operation of SMPS

24

4208 - DIGITAL ELECTRONICS



MAJOR DIVISIONS

UNIT TOPIC

I SWITCHING ALGEBRA AND LOGIC GATES

II DIGITAL COUNTER & MEMORY DEVICES

III DIGITAL ARITHMETIC CIRCUITS AND DISPLAY CIRCUITS

IV PERIPHERALS

V MICROPROCESSOR & ARCHITECTURE

UNIT-I SWITCHING ALGEBRA AND LOGIC GATES: [15 Hrs]

Number systems- binary, BCD, octal, hexadecimal, conversions - Boolean algebra – Basiclaws & DeMorgan’s theorem – Logic gates – Positive logic – Negative logic – Symbolic repre-sentation & truth table for logic gates – OR, AND, NOT, NAND, NOR, EX-OR, EX-NORRealization of gates using universal gates – NAND & NOR combinational logic gates – Simpli-fication of logic functions using Karnaugh’s map (Simple problem upto four variables) –Synthesising simple logic gates circuits.

Digital Logic families – TTL, ECL, I2L, CMOS technologies –fan in – fan out- propagationdelay- comparison. Sequential logic circuits – Flip Flops – RS, D, T, JK Master Slave Flip Flops– Edge triggered Flip flops – Switching characteristics of Flip Flops.

UNIT – II - DIGITAL COUNTER & MEMORY DEVICES [15 Hrs]

COUNTERS: Asynchronous counter- up/down counter – Synchronous counter –up/downcounter–BCD counter – Counter applications – Decoders - Seven Segment Decoder – Encoder– Multiplexer & Demultiplexer – tristate buffer & bi-directional buffer - 4 bits shift registers –Serial In Serial Out, Serial In Parallel Out, Parallel In Parallel Out and Parallel In Serial Out – IC’sused for the above (Number only) – PLD.

MEMORY: Semiconductor memories –– classification and characteristics of memories –Read Only Memory - ROM organisation – PROM – programming mechanism – RandomAccess memory (RAM)- bipolar RAM cell – MOSRAM –Static MOSRAM cell – dynamicMOSRAM cell – EPROM – EEPROM - CCD – Programmable Logic Array.

UNIT- III DIGITAL ARITHMETIC CIRCUITS AND DISPLAY CIRCUITS: [14 Hrs]

1s Complement – 2s complement – addition – signed binary numbers – Arithmetic circuits –Half adder – Full adder – Half subtractor – Full subtractor – serial & parallel adders – paritygenerators & checkers –digital comparator-Arithmetic logic units.

25

Analog to Digital conversion– simultaneous, ramp, successive approximation – Dual slopeA/D converters. D/A converters – Basic concepts – summing amplifier type D/A converter –R/2R ladder network circuit – A/D &D/A converters specification.

UNIT –IV PERIPHERALS [14 Hrs]

BUS STANDARDS RS 232C - RS 422, RS 423 – RS 485 –IEEE 488 S100 – Centronics andUniversal standard Bus.

PERIPHERAL: Printers classification- dot matrix printer – inkjet printer – Laser printer-Principle of working – Scanners – light pen – touch screen – keyboards – mouse types –Auxiliary memory devices – floppy disk – Hard disk- CD ROM – principle of working.

UNIT-V MICROPROCESSOR & ARCHITECTURE [14Hrs]

Microprocessor – Evolution of microprocessor – general architecture of microprocessorsystem - Intel 8085 – Architecture - Pin Details -Instruction set - Simple programmes (Addition- subtraction – Multiplication - division-sorting of an array of 8 bit data in ascending anddescending order-finding the smallest and the largest number in array)

VLSI Design: Emergence of HDLS – Design methodologies- top–down design methodol-ogy- Bottom-up design methodology –types of modelling- Behavioural modeling- Data flowlevel – gate level – switch level - Verilog HDL- Design of gates, half adder, full adder-halfsubtractor, full subtractor- multiplexer, flip flop.

REFERENCE BOOKS:1. R.P.Jain, “Modern Digital Electronics”, Tata McGraw - Hill, New Delhi, Edition 2002.2. Samuel C.Lee, “Digital Circuits and Logic Design”, Prentice Hall of India , New Delhi,

Edition 2004.3. Aditya P.Mathur, “Introduction to Microprocessers”, Tata McGraw - Hill, New Delhi,

3rd Edition 1999.4. Albert Paul Malvino & Donald, “Digital Principles & Applications”, Tata McGraw -

Hill, 2nd Edition 1991.

26

4208 - DIGITAL ELECTRONICS





(10 marks )

I A. 1. Convert decimal 1993 into octal.

2. What are the difference between combinational logic gate and sequential logic circuits.

B. 1. Reduce the following expression using karnaugh map f( A,B,C,D) = Em( 0,3,4,6,9,10,12,13)

2. Explain the logic diagram of a JKMSFF.

II A. 1. Define and explian decoders

2. Write short notes on CCD.

B. 1. Explain the working of a 4 bit synchronous counter with a neat diagram.

2. Explain ROM organization.

III A. 1. Perform the following subtraction using 2’s complement.

a) 1011 b) 11011

- 0111 - 10010

2. Give the specification of A/ D converter.

B. 1. Explain the operation of Half adder anf Full adder with truth table withcircuit diagram.

2. Draw the block diagram of a ramp type A/D converter and explain itsworking

IV A. 1. Write short notes on centronics bus standard.

2. Explian the working of a scanner

B. 1. Explain about RS 232C bus standard.

2. Draw the block diagram of Laser printer and explain its working principle.

V A. 1. Explain briefly about the evalution of microprocessor.

2. Explain data flow level.

B. 1. Draw the architectural block diagram of 8085 microprocessorand describe the functions of each block.

2. Explain verilog HDL.

27

4209 - COMPUTER INSTALLATION & SERVICING

IV TERM (CORE COURSE )


MAJOR DIVISIONS

UNIT TOPIC

I BASICS OF MICRO COMPUTER SYSTEM

II SYSTEM UNIT

III FLOPPY DRIVE AND OTHER PERIPHERAL DEVICES

IV PERIPHERALS

V ROOM PREPARATION AND TROUBLE SHOOTING

Unit – I : BASICS OF MICRO COMPUTER SYSTEM ( 17 Hrs )

Introduction : Evolution of Computer – Summary of evolution Mother Board: Evolution –BIOS- CMOS RAM – Form Factor – Baby AT – LAP – ATX –NLX – MicroATX –FlexATX– Riser Architectures.

Chipsets: Introduction – 810 AGP Set – 820 chipset - 815 – 850 Chipset - 915 - 925 X - 955 X- 975 X Express chipset

Bus Standards: Introduction – ISA Bus – Local Bus – PCI Bus – PCMCI A AGP – USB.

Processors: Introduction – CISC – RISC – Basic Structure – Pentium – Pentium

Pro – MMX – Pentium II – Celeron – Pentium III – Pentium IV – Cyrix Series –

AMD Series, Comparison Table.

UNIT – II : SYSTEM UNIT ( 16 Hrs )

Memory: Introduction - Main memory – Evolution - DRAM – EDO RAM -

SD RAM – DDR DRAM – IT RAM – Direct RDRAM – Memory Chips ( SIMM, DIMM,RIMM)- Extended – Expanded – Cache - Virtual Memory.

Graphic Cards: Introduction – Layout of Components in Graphics card – Graphics Processor –Video memory – Memory Chart – RAMDAC – Driver Software – 3D – 3D Acceleration –DirectX – Direct 3D.

Sound Cards: Introduction – Components – Connectivity – Standards – A3D – EAX – MIDI– General MIDI – PCI Audio – USB Sound – MP3 – SDMI.

Displays: Introduction – CRT – Anatomy – Resolution – refresh rate – interlacing – DigitalCRT’s – Panel Displays – Introduction – LCD Principles – Plasma Displays – Thin CRTs.

KeyBoard & Mouse: Introduction – Types – Signals – Keyboard Functions; Mouse Operation– Signals – Installation.

28

UNIT – III FLOPPY DRIVE AND OTHER PERIPHERAL DEVICES ( 15 Hrs )

Hard Disk: Introduction – Construction – Operation – IDE, EIDE, Ultra ATA, Serial ATA,SCSI, RAID – Installation – Partition – Formatting

Floppy Disk Drive: Introduction – Boot Record, FAT, Diskette basics – Disk formatting – DiskRecording – Construction – Drive Operation.

CD-ROM: Introduction – Construction – Operation – various formats (Books) – CD-R, CD-RW, Photo CD, Audio CD.

DVD: Introduction – Formats – Technology – DVD-ROM, DVD Video , DVD Audio –Recordable formats – DVD-R, DVD-RW, DVD-RAM

I/O Ports: Serial – Parallel – USB – Game Port – Signal specification.

UNIT – IV : PERIPHERALS ( 18 Hrs )

Printers: Introduction – Types of printers – Dot Matrix – Inkjet – Laser - Operation –Construction – Features – Installation.

Modem: Introduction – Working Principle – Types – Installation.

Scanners: Introduction – operation – Scan Resolution- Color Scanners – Scan modes – Fileformats.

Digital Camera: Introduction – Operation – Features.

SMPS: Principles of Operation – Block Diagram – AT & ATX Power Supply connector speci-fications.

UNIT – V ROOM PREPARATION AND TROUBLE SHOOTING ( 18 Hrs )

Room Preparation: Location – Pollution – Air-conditioning – Power Supply – VoltageRegulators – Servo Stabilizers – UPS.

PC Installation: Configuring the Motherboard – All in one motherboards – jumper settings –Identifying connectors and cables – Adding Memory modules – BIOS Setup Program – Varioussetup options.

POST: Definition – IPL hardware – POST Test sequence – beep codes and error messages.

Troubleshooting the motherboard and keyboard: Troubleshooting the motherboard –problemdiagnosis, normal checks, power supply, clock signal check, keyboard check, speaker check;troubleshooting the keyboard -problem diagnosis, isolation of problem with keyboard/motherboard; verifying with diagnostic software, checking the connectors and cables.

Troubleshooting floppy disk drive, hard disk drive, printer: Troubleshooting floppy disk drivesand hard disk drives; problem diagnosis, typical problems and troubleshooting; checking theCMOS configuration; performing media tests, use of scandisk, fixing bad sectors; printer trouble-shooting: isolating the problem using self test, cables check, port problem, software problems,head pins problems and coils check.

Diagnostic Software and Viruses: Computer Viruses – Precautions – Anti-virus Software –identify the signature of viruses – Firewalls and latest diagnostic software – Norton.

29

Reference:1. M.Radhakrishnan & D.Balasubramaniam, “Computer Installation & Trouble Shooting”.2. Scolt Muller, “Upgrading and Repairing Pcs”, Tech Media Publications, 2nd Edition.3. Stephen Beglow, “Troubleshooting, Maintaing, repairing Pcs”, 5th Edition.

4. Servicing and Supporting Ibm Pcs & Compatibles.5. D.Balasubramaniam, “Computer Installation and Servicing”.

6. Servicing and Supporting IBM PC’s & Compatibles

30

4209 - COMPUTER INSTALLATION AND SERVICING





I A. 1. Explain the evolutions of PC’s.

2. Explain about the ISA and PCI Bus system.

B. 1. Explain the features of 450NX and 820 Chipsets.

2. Explain the pentium and AMD series processors.

II. A. 1. What is meant by cache memory. Explain its different types.

2. Give the mouse signals and explain its operations.

B. 1. Explain the following

a) DRAM b)EDO Ram c) SD Ram d) DDR Ram

e) Extended memory f) expanded memory

2. Explain the fuctios of digital CRT.

III. A. 1. Explain the data recording mechanism in Floppy disk.

2. Give the signal specification of parallel port.

B. 1. Explain the construction of hard disk. Compare IDE and SCSI harddisk.

2. Explain the following

a) Boot record b) FAT c) Photo cd d) DVD-ROM e) DVD-RAM

IV. A. 1. Explain the operation of the MODEM in detail.

2. Explain the operation of the digital camera.

B. 1. Explain the operation of the Laser printer with block diagram.

2. Draw the block diagram of SMPS and explain.

V. A. 1. What is IPL in POST? Mention any five IPL components.

2. Write short notes on computer virus and anti-virus software.

B. 1. Describe in detail about the audio and video error message given by

POST in detail.

2. Explain in detail about the troubleshooting procedure in floppy diskand hard disk.

31

4210 - ELECTRONIC CIRCUITS LAB

IV TERM ( CORE COURSE)


1. To determine the regulation characteristics of full wave rectifier withsemiconductor diodeswith and without filter.

2. To determine the regulation characteristics of bridge rectifier with and without filter.

3. To determine the regulation characteristics of a fullwave voltage doubler.

4. To determine the regulation characteristic of series regulator.

5. To construct and measure (a) voltage gain (b) input impedance (c) output impedance and (d)plot the frequency response of common emitter amplifier.

6. To construct and measure (a) voltage gain (b) input impedance (c) output impedance and d)Plot the frequency response of common source amplifier.

7. To construct and test RC phase shift Oscillator.

8. To construct and test UJT relaxation oscillator.

9. To construct and test astable multivibrator using transistor

10. To construct and test astable multivibrator using 555.

11. To construct and test monostable multivibrator using IC 555

12. To construct and test a schmitt trigger circuit using transistor.

13. Applications of operational amplifier 741 IC - sign changer, scale changer and adder.

14. Applications of operational amplifier 741 IC - Integrator, Differentiator and zero crossingdetector.

15. To construct and test the characteristics of 78XX and 79XX regulators.

16. To construct and test the regulator using 723 IC.

17. To construct and test clipper and clamper circuits using diodes.

18. EWB and PSPICE should be used to perform atleast two of the above experiments.


S.No Topics Marks

1 Exercise 70

2 Viva – Voice 5

Total 75

32

4211 - DIGITAL ELECTRONICS LAB



1. Verify the Truth Table of the following Logic gates AND,NAND,NOT, OR

NOR , EXOR, - using 74XX Ics and breadboard.

2. Realise the Universal property of NAND gate and NOR gate.

3. Realise the circuit using Karnaugh’s map for a given problem.

4. Construct a half adder & Fulladder using 7408,7486 &7432 ICs and verify its truth table.

5. Verify the truth table of RS,D and JK flip-flop.

6. Construct a Half Subtractor , Full Subtractor and Verify the truth table using 74xx Ics.

7. Familiarisation of BCD to 7 segment Decoder and Construct 1of 4 Decoder.

8. Construct and test Multiplexer and Demultiplexer.

9. Construct a 2 digit up /down counter using IC7448,74192 chip and 7 segment LED andcheck up its performance.

10. Construct a Binary counter and Decade counter and observe the output waveforms.

11. Verify the operation of bidirectional shift registers.

12. Verify the operation of DAC & ADC.

13. Construct a parity generator and test its performance.

14. Simple programs - Addition - subtraction – Multiplication - division-sorting of an array of8 bit data in ascending and descending order-finding the smallest and the largest number inarray using 8085 microprocessor kit.

15. Design of gates, half adder, full adder-half subtracter,full subtractor- multiplexer, flip flopusing Verilog HDL ( Demo )


S.No Topics Marks

1 Exercise 70

2 Viva – Voice 5

Total 75

33

4212 - COMPUTER INSTALLATION & SERVICING LAB

IV TERM ( CORE COURSE)


1. Installing and Configuring FDD in system

a. Using BIOS setup program to configure an FDD

b. Floppy drive Diagnostics / Servicing

2. Identification of front panel indicators , switches in a computer system for flip-flop andtower case computers and identification of rear side connectors.

3. Familiarizing the computer system layout : Marking positions of SMPS,Motherboard,FDD, HDD , CD and add on cards in both flip-flop and tower models.

4. Drawing the layout of a Pentium Motherboard marking the following items in it : CPUused, RAM, Cache, Xtal, Cooling fan, I/O slots, I/O ports available.

5. (a) Studying the important jumper settings for changing the CPU speed,Memory size, temperature etc., in a motherboard.

(b) Study of CMOS setup program

1. Changing Standard Settings

2. Changing advanced settings

6. HDD Installation:

(a) Installing Hard Disk.

(b) Configuring CMOS-Setup

(c) Partitioning using FDISK

(d) Formatting Hard Disk

7. OS Installation

8. Study of AGP Card (a) To draw the layout (b) Study various connections (c) jumpersettings

9. Familiarizing important dos commands (a) scandisk (b) MSD (c) Virus Detecting andRectifying Softwares.

10. Printer Installation :

(a) Installing a DOT Matrix Printer

(b) Installing a Laser / Inkjet printer

(c) Printer trouble shooting to cable fault

(d) Head Cleaning

34

11. CD Drive Installation

(a) Installing a CD-ROM Drive for Dos / Windows modes

(b) Configuring using device drivers

12. Installing a MODEM and Configuring it.

13. Installing and Configuring a TV Tuner Card

14. Installation of CD-Writer

(a) Installing and Configuring a CD-Writer

(b) Recording a Blank CD.

15. Installation of Scanner and DVD Drive

(a) Installing and Configuring a Scanner

(b) Installing and configuring a DVD Drive

16. Assembling of a Pentium (II / III / IV ) System with add on Cards

17. Checking the working condition of thee assembled Pentium ( II /III / IV ) system with addon cards.

18. Assembling of a Pentium system without add on cards. ( Built –in ) and check theworking condition of the system.


S.No Topics Marks

1 Exercise 7 0

2 Viva – Voice 5

Total 7 5

35

4301 - MEASUREMENTS AND INSTRUMENTS

V TERM ( APPLIED COURSE)


MAJOR DIVISIONS

UNIT TOPIC

I ELECTRICAL INDICATING INSTRUMENTS AND MEASUREMENTS

II SIGNAL GENERATORS

III CRO

IV RECORDERS TRANSDUCER & TEMPERATURE MEASUREMENT

V DIGITAL AND OTHER TEST INSTRUMENTS

UNIT I: ELECTRICAL INDICATING INSTRUMENTS AND MEASUREMENTS

( 15 Hrs )

Basic forces for indicating Instruments – Definition of measurement - definition of true value- accuracy - precision instrument efficiency - Constructional Features of Permanent magnetmoving coil Instrument – Shunts and Multipliers – DC Ammeter circuit – DC Voltmeter circuit– Multi range – Voltmeter sensitivity – Series and Shunt type Ohmmeter (No design) – SchematicDiagram of a Multi meter for DC current, DC voltage, AC current, AC voltage, Ohm meter –Moving iron instruments – Types – construction and Operating principle of Attraction & Repul-sion types – Comparison – Electro-Dynamometer – Operating principle & construction – (Noderivation) – Comparison of PMMC, MI, ED of instruments – Bridges – Wheat stone Bridge –Kelvin’s Double Bridge – Maxwell’s Bridge – Hay’s Bridge – Wein Bridge – Universal Imped-ance Bridge arrangements to measure R.L.C.

UNIT II: SIGNAL GENERATORS ( 14 Hrs )

Definitions – Classifications – Block diagram, Principles of Operation and applications ofHeterodyne type Audio Generator – Audio Signal Generator – RF Signal Generator – FunctionGenerator – Function Generator using IC 8038 – Pulse Generator – Double pulse Generator –Standard Signal Generator – RF Marker Generator – Pattern Generator – Direct & Indirectfrequency synthesizer – Sweep Frequency Generator.

UNIT III: CRO (14 Hrs )

Principle of operation and Block Diagram of CRO – CRT operation – Electrostatic focusing– positioning control - focus control - intensity control - Electrostatic deflection (No derivation)– Vertical Deflection system block diagram – CRO Probes requirements – Passive voltage probe– Active voltage probe – current robe – high voltage probe – Need for Time Base Voltage –Vertical Input and Sweep generator synchronization – Applications of CRO – Block diagram ofDual Trace – Dual Beam CRO – Comparison – Digital storage oscilloscope – Sampling CRO –Digital Read out CRO when measuring voltage – Spectrum Analyzer – Wobbuloscope.

36

UNIT IV: RECORDERS TRANSDUCER & TEMPERATURE MEASUREMENT

( 15 Hrs )

Classification of Recorders – X-Y Recorder – Strip Chart Recorder – Galvanometric typeStrip chart Recorder – Classification of Transducers – Strain Gauges – Types – Bonded typepotentiometric Strain Gauge – Bridge type Strain Gauge – Unbonded strain Gauge – Applica-tions – Construction, principles of operation and applications of Capacitive, inductive, Photoelectric – LVDT, Velocity, Displacement Transducers – vibratory sensor – Load cell – Blockdiagram of Micro processor based Electronic Balance – Construction and application of MetalResistance Thermometer – Thermocouple – See beck effect – basic circuit – Simple application –Thermistor – construction – types – application Thermistor – Radiation pyrometer.

UNIT V: DIGITAL AND OTHER TEST INSTRUMENTS ( 14 Hrs )

Basic DC voltmeter with DC Amplifier – Harmonic Distortion – Tuned circuit Harmonicanalyzer – Heterodyne Harmonic Analyzer – Digital Vs Analog Instruments – Types of DVM –Block diagrams of Integrated type DVM, Successive approximation type DVM – Automation inDigital Instruments – Auto Ranging – Auto Polarity – Auto Zeroing – Digital Frequency counter– Extending the range – Block diagram of digital Multimeter – Computer controlled Test systemfor an audio amplifier and a radio receiver – Digital Auto ranging optical power meter – Digitaloptical Time Domain Reflectometer – Block diagram of a PC Based Data Acquisition system.

REFERENCE BOOKS:1. Albert.D.Helfrick, William D.Cooper,“Modern Electronic Instrumentation and Measure-

ment Techniques”, Prentice Hall of India, Edition 1999.

2. Barry.E.Jones, “Instrumentation Measurement and Feedback”, Tata McGraw - Hill,New Delhi, Edition 1978.

3. Sawheney, “Electrical & Electronics - Measurements & Instrumentation”, Dhanpatrai &Sons, 11th Edition 2001.

37

4301 :MEASUREMENTS AND INSTRUMENTS





(10 marks )I A. 1. Explain any one basic forces for any indicating instruments.

2. Write short notes on universal impedance bridge.

B. 1. Explain the construction and working principle of a PMMC instrument with adiagram.

2. Explain a kelvin’s double bridge with a circuit diagram.

II A. 1. What are the features of a double pulse generator? Explain brief

2. What is meant by a frequency synthesizer? Explain.

B. 1. Explain a function generator using IC 8038.

2. Explain a pattern generator with block diagram.

III A. 1. Compare dual trace and dual beam CRO.

2. What is a spectrum analyzer? What is the use of it.

B. 1. Explain the block diagram of a CRO

2. Explain a wobbuloscope with a block diagram.

IV A. 1. Classify the Transducer.

2. What is load cell? What is the use of it.

B. 1. Explain the construction working principle and merits of LVDT.

2. Explain a radiation pyrometer with a diagram.

V A 1. Distinguish between analog and digital instruments

2. What is meant by harmonic distortion? Explain

B. 1. Explain a successive approximation type DVM with a schematicdiagrams.

2. Explain a digital auto – ranging power meter.

38

4302 - COMMUNICATION ENGINEERING

V TERM ( APPLIED COURSE)


MAJOR DIVISIONS

UNIT TOPIC I NETWORKS II ANTENNA AND PROPAGATION III AUDIO SYSTEMS

IV MODULATION THEORY V TRANSMITTER & RECEIVERUNIT –I NETWORKS [17 Hrs]

NETWORKS

Four terminal networks – Balanced & unbalanced networks – symmetrical and asymmetricalnetworks-characteristic impedance-propagation constant-T, II-Lattice, Bridged T -image anditerative impedance –‘T’ & ‘L’ networks – image transfer constant- Ladder network - Matchingnetwork.

EQUALIZERS & ATTENUATORS

Classification of equalizer- series & shunt equalizer – constant resistance equalizer – LatticeEqualizer - Attenuator – symmetrical T attenuator – symmetrical II attenuator – variable attenua-tor.

FILTERS

Low pass filter –High pass filter – Band pass filter – Band stop filter- calculation of cut-offfrequency - attenuation and phase characteristic-impedance matching half- section-compositefilter.

UNIT-II ANTENNA AND PROPAGATION 17 Hrs]

TRANSMISSION LINES

Transmission line equation – Elementary theory of long lines – Infinite line – Secondaryconstants of transmission line- Distortion less line– Sending end impedance – Reflected &incident wave – Travelling and standing waves – Reflection co-efficient & SWR - Wave guides–TE & TM waves - phase and group velocity.

ANTENNA

Basic principle of antenna working, terms and definition – Radiation resistance – Antennalosses – Efficiency – Directivity - Radiation pattern – Radiation intensity – Different types ofmedium wave, high frequency and VHF antennas – Directive antenna – Antenna array – Broad-side and end fire arrays – Radiation patterns – Advantages and disadvantages – applications –Principle of operation and uses of rhombic antenna – Loop antenna – Log periodic antenna –Parabolic reflectors.

39

PROPAGATION

Ground and sky waves – Propagation over ground at different frequencies – Ionosphere– Structure – Propagation through ionospheric layers – Critical and maximum usable frequencies– Absorption – Skip distance and fading – VHF propagation.

UNIT-III AUDIO SYSTEMS [16 Hrs]

AUDIO SYSTEMS

Acoustic principles – Microphones – Constructional details and performance of the follow-ing microphones (qualitative treatment only) Carbon, Condenser, Piezo electric, moving coil,Electro dynamic, Pressure gradient and velocity microphones - constructional details. Loud-speaker types – Dynamic cone type loudspeaker, Horn type loudspeaker, Electrostatic loud-speaker- Woofer, Midrange and Tweeter - Specification and frequency range - Cross overnetwork - Stereo phonic working - Magnetic recording and reproduction - Noise reductionsystem - Dynamic reduction, Dolby NR A & B, Digital track sound (DTs)- Compact discrecording and reproduction.

UNIT -IV MODULATION THEORY [17 Hrs]

MODULATION

Need for modulation-Types of modulation-Amplitude modulation-expression and wave-form of AM wave-AM spectrum and side-band- modulated power output-square wave modula-tion - Balanced modulator – AM – DSB/SC system - Single side-band generation advantage &disadvantage of SSB - AM vestigial side band system Frequency modulation- FM using reac-tance, FET and Varactor diode. Phase modulation.

DEMODULATION

AM detection - Square law diode detector - linear diode detector FM Detector –Balancedslope detector - Phase Discriminator – Ratio Detector

PULSE MODULATION

Pulse modulation-types-PAM-PTM -generation of PAM, PWM and PPM –pulse codemodulation-sampling-quantizing noise- application of PCM.

UNIT- V TRANSMITTER AND RECEIVERS [17 Hrs]

TRANSMITTER

Classification of Transmitter based on types of modulation used, types of service involvedand according to range of frequency – Block diagram of AM Transmitter – High Level modula-tion – low Level modulation- Requirements of carrier frequency in Radio Transmitter –Radiotelephone Transmitter- Peak Clipper - Volume Compressor -Pre-emphasis and Privacy Devices– Block diagram of SSB Transmitter- Block diagram of SSB radio telegraphic transmitters -Modulation Methods In Radio Telegraphic Transmitter-Interrupt Carrier wave and ModulatedCarrier wave – Method of keying – Block diagram of FSK Transmitter - Direct FM Transmitter– indirect FM Transmitter

40

RECEIVERS

Types – TRF Receiver – Super - Heterodyne Receiver – RF Section And Characteristics –Frequency changing and Tracking – IF Amplifier – Detection and AGC –Delayed AGC- Doubleconversion receivers- FM Receiver- AFC - Single Side Band Receiver.

REFERENCE BOOKS:1. Dennis Roddy & John Coolen, “Electric Communication”, Prentice - Hall of India.2. Kennedy Davis, “Electronic Communication Engineering”, Tata McGraw - Hill Publish-

ing, 4th Edition.3. Umesh Sinha, “Principles Of Communication Engineering”, Satya Prakashan Publication,

3rd Edition.4. John D.Ryder, “Networks, Lines and Fields”, Prentice - Hall of India Private Limited,

New Delhi, 2nd Edition.

41

4302: COMMUNICATION ENGINEERING





I A. 1. Compare attenuator and equalizer.

2. What is Ladder Network?

B 1. Obtain the characteristic Impedance and propagation constant for Bridged network.

2. Draw a high pass filter and obtain its cut-off frequency, attenuation and phaseconstant

II A. 1. Define i. reflection coefficient ii. SWR

2. Explain bandwidth of an antenna

B 1. Explain about the structure of ionosphere and its propagation.

2. Explain Broad side array and End fire array

III A. 1. With neat diagram, Explain the operation of piezo electric Microphones

2. Write about Horn type Loudspeaker

B 1. With neat sketches describe the working of pressure gradient micro phones

2. Explain about compact disc recording and reproduction

IV A. 1. What is the need for modulation

2. Drive the expression and waveform of AM wave

B 1. With neat diagram, describe the operation of balanced modulator

2. Explain the generation of PCM

V A. 1. Draw the block diagram of AM transmitter

2. Write briefly about AGC

B. 1. Describe the Armstrong FM transmitter with block diagram

2. Describe the operation of Super heterodyne AM receiver with neat block diagram

42

4401- A - MICRO CONTROLLER AND ADVANCED MICROPROCESSOR

V TERM ( Diversified Course - I )


MAJOR DIVISIONS

UNIT TOPIC

I INTRODUCTION TO MICRO CONTROLLER II PROGRAMMING MICRO CONTROLLER III PERIPHERAL DEVICES AND INTERFACING IV 8086 MICROPROCESSOR

V 8086 PROGRAMMING

UNIT-1 INTRODUCTION TO MICRO CONTROLLER [16 Hrs]

Introduction to Micro Controller – features of Micro Controller over microprocessor –architecture of Micro Controller 8051 – description of individual blocks – pin configuration of8051 (MCS 51). Pin description of 8051 – Power supply – power on reset.

UNIT-II PROGRAMMING MICRO CONTROLLER [18 Hrs]

Memory organization of 8051 – Program memory – data memory –special function registers(SFR)- instruction set – addressing – stack and subroutines – modes – writing programs for 8-bit addition, 8-bit subtraction, 16-bit addition, 16-bit subtraction, 8-bit multiplication, 8-bit divi-sion, sum of arrays of 8-bit data, sorting of an array of 8-bit data, ascending and descendingorder, finding smallest and largest number in an array – code conversion – delay programs usingtimer.

UNIT-III PERIPHERAL DEVICES AND INTERFACING [17 Hrs]

Block and signal diagrams and control word format of the following peripheral devices 8255,8254, 8259, 8279. Interfacing 8051 with 8255, RS 232C serial interface, 8259 interface, ADC/DAC interfacing.

UNIT-IV 8086 MICROPROCESSOR [17 Hrs]

8086 Microprocessor – architecture – pipe line architecture – 8086 pin configuration –functions of individual pins – 8086 addresses and memory organization (segmentations) operat-ing modes of 8086 – pin descriptions of minimum mode and maximum mode, interrupt opera-tions – interrupt priorities – clock generation.

UNIT-V 8086 PROGRAMMING [16 Hrs]

Instruction set – addressing modes – simple programs of 8086 – addition, subtraction,multiplication, Division.

Advanced Microprocessors Features of Intel Pentium Processor – Itanium Processor – CeleronProcessor – Embedded Systems.

43

REFERENCE BOOKS:1. Mohammed Rafiquzzman, “Microprocessers and Microcontroller Based System Design”,

Prentice Hall of India, New Delhi, 1st Edition.

2. Yu - Cheng Liu & Glenn A.Gibson, “Micro Computer Systems: The 8086 / 8088 Family”,Prentice Hall of India, 2nd Edition, 1999.

3. B.P.Singh, “Mocrocontroller and its Applications”, Dhanpatrai & Sons, 2nd Edition, 2001.4. Mohammed Alimazidi, “Microcontroller and Embedded System, Person Education, 1st

Edition.5. Kennett J.Agala, “8051 Microcontroller Architecture, Programming and Applications”,

Penram International Publications, Mumbai, Edition 1.

44

4401-A - MICRO CONTROLLERS AND ADVANCED MICROPROCESSORS





I A 1. Compare the features of 8051 with 8085.

2. Explain power on reset circuit in 8051.

B 1. Draw and explain the pin configuration of 8051.

2. Explain about SFRs available in 8051.

II A 1 . Explain about the memory organisation in 8051.

2. Write a program to add two 8-bit numbers.

B 1. Explain in detail about the memory organisation in 8051.

2. Write a program to sort a set of numbers in ascending order.

III A 1 . Write the control word format for 8255.

2. Draw the block diagram of 8259.

B 1. Draw the block diagram of 8255 and explain.

2. Explain how ADC interfacing with 8051.

IV A 1. What do you mean by pipeline architecture.

2 Write short notes on memory segmentation.

B 1. Briefly explain the internal architecture of 8086.

2. Explain the different means of giving priority to interrupts.

V A 1. Given that EA of a data is 2359 and the (DS)= 490 B, What is thephysical address of the data?

2. Write short notes on

1. based indexed addressing 2. direct addressing

B 1. Write a program to add and multiply two 8 bit data using 8086

2 . Write short notes on embedded system.

45

4401 - B - BIO MEDICAL INSTRUMENTATION

V TERM ( Diversified Course -I )


MAJOR DIVISIONS

UNIT TOPIC

I PHYSIOLOGICAL MEASUREMENT

II MEASURING INSTRUMENTS AND BIO–MEDICAL RECORDERS:

III PATIENT CARE AND MONITORING SYSTEM:

IV BIO–TELEMETRY AND PATIENT SAFETY

V MODERN IMAGING TECHNIQUES:

UNIT –1 PHYSIOLOGICAL MEASUREMENT ( 17 Hrs )

Bio–potential and their generation, resting and active potential.

Electrodes, Micro, Skin surface, needle electrodes.

Measurement of:

Blood pressure (direct, indirect) – instantaneous flow (Electro magnetic flow meter, ultra-sonic blood flowmeter). Blood pH

Respiration rate, lung volume, heart rate, Temperature (body temperature, Skin temperature)

UNIT – 2 MEASURING INSTRUMENTS AND BIO–MEDICAL RECORDERS:( 17 Hrs )

Electro cardiograph (ECG), Lead system. ECG electrodes, ECG amplifiers, ECG recordingunits, analysis of ECG curves nervous system, EEG recorder, recording techniques, EEG wavetypes, clinical use of EEG, brain tumour.

Electro–myograph (EMG) 10-20 Lead system, EMG waves – EMG recording techniques,Electro-retinograph (ERG).

Audiometer – principle–types, Basic audiometer working.

UNIT 3 PATIENT CARE AND MONITORING SYSTEM: ( 17 Hrs )

Cardiac pacemaker:

External pace makers, implantable pacemaker, programmable pacemaker power sources ofimplantable pacemakers (Hg batteries, nuclear batteries, Lithium cells) cardiac defibrillators AC,DC defibrillators. Heart lung machine, Oxygenators – Blood pump – peristaltic pump.

Dialysis:

Hemo dialysis – peritoneal dialysis – Endoscopy – principle of working, applications – Heartvalves, problems of artificial heart valves.

46

UNIT -4 BIO–TELEMETRY AND PATIENT SAFETY ( 17 Hrs )

Introduction–physiological parameter – adaptable to bio–telemetry– components of a biotelemetry system – application of telemetry in patient care – Telemetry of ECG’s from extendedcoronary care patients – Telemetry for ECG measurements during exercise – Telemetry foremergency patient monitoring.

Fluid balance, electrolytic balance, acid base balance.

Physiological efforts of electric current – Micro and macro shock– leakage current –shockhazards from electrical equipment.

Safety aspects in electro surgical units – burns, high frequency current hazards, Explosionhazards.

Telemedicine – Introduction.

UNIT-5 MODERN IMAGING TECHNIQUES: ( 16 Hrs )

Laser beam properties: Applications of lasers in medicine.

Ultrasonic imaging techniques – Tomogram – computerized Axial tomography – Echo car-diography – special techniques in X-ray imaging – Angiography – magnetic resonance imagingtechniques.

REFERENCE:

1. M.Arumugam, “Biomedical Instrumentation”, Anuradha Agencies, Kumbakonam, 2nd Edn.

2. Khandpur.R.S, Hand Book of BioMedical Instruments”, Tata McGraw - Hill Publishing,1st Edition.

3. Raja Roo.C, “Principles of Medical Electronics & Biomedical Instruments”, UniversitiesPress, 1st Edition.

47

4401 -B - BIO – MEDICAL INSTRUMENTATION





I A ) 1. Define resting and active potential

2. List the values of

1. Blood pressure 2.Heart rate

3. Respiration rate 4. Body temperature 5. Skin Temperature.

B) 1. How Blood pressure is measured indirectly

2. Explain the operation of ultrasonic blood flow meter.

II A) 1. Write short notes on ECG amplifier.

2. Explain the principle of operation of Audiometer

B) 1. Explain the principle of operation of EEG recorder and recording

techniques

2. Explain the principle of EMG – recording techniques.

III A) 1. Differentiate between external pace maker and implantable pacemaker

2. Write short notes on problems of artificial heart valves

B) 1. Explain the principle of operation of oxygenates

2. Differentiate between hemo dialysis and peritoneal dialysis

IV A) 1. Write short notes on fluid balance, acid base balance.

2. Write short notes on micro and macro shock.

B) 1. What do you know about telemetry of ECG’s from extended coronarycare patients.

2. Write elaborately about the safety aspects in electro surgical units.

V A) 1. List the applications of Laser in medicine .

2. Write short notes on tomogram.

B) 1. Explain the special techniques in X – ray imaging

2. Explain the principle of magnetic resonance imaging techniques.

48

4401-C - POWER ELECTRONICS

V TERM ( Diversified Course -I )


MAJOR DIVISIONS

UNIT TOPIC

I INTRODUCTION TO POWER ELECTRONICS AND POWER DEVICES

II AC VOLTAGE CONTROLLERS, CYCLO CONVERTERS AND AC DRIVES

III PWM INVERTERS

IV DC CHOPPER AND DC DRIVES

V PROTECTION AND CONTROL CIRCUIT

UNIT 1: INTRODUCTION TO POWER ELECTRONICS AND POWER

DEVICES ( 17 hrs )

Introduction – application of power electronics – types of power electronics circuits – powersemi conductor devices – control characteristics of power devices – VI characteristics of IGBTpower MOSFET – SIT – GTO – isolation of gate and base drives – pulse transformers – optocouplers.

UNIT 2: AC VOLTAGE CONTROLLERS, CYCLO CONVERTERS AND AC DRIVES( 17 hrs )

Principle of ON – OFF control – principle of phase control – single-phase bi-directionalcontroller with resistive load and with Inductive loads – three phase unidirectional (half wave)controller – single-phase transformer top changer.

Cyclo converter:

Single-phase cyclo converter – three phase cyclo converter – reduction of output harmonics– control circuit for cyclo converter – cyclo converter drives – applications.

AC drives:

Voltage and frequency – control of AC motor (induction motor) – brush less DC and ACmotor drives.

UNIT 3: PWM INVERTERS 16 hrs )

Applications- single phase inverter – three phase bridge inverters – 180 degree conduction120degree conduction – voltage control of single phase inverters – single pulse width modulation– multiple pulse width modulation – sinusoidal pulse width modulation – modified sinusoidalpulse width modulation – phase displacement control – harmonic reduction forced commutatedthyristor inverters – auxiliary commutator inverters – complementary – commutated inverters –current source inverters – UPS – types – comparison – circuit description & half line UPS.

49

UNIT 4: DC CHOPPER AND DC DRIVES ( 17 hrs )

Principle of chopper operation – constant frequency system – variable frequency system– TYPE A., TYPE B, TYPE C, TYPE D, TYPE E Chopper – circuit diagram – workingprinciple – waveform – step-up chopper – circuit diagram – working principle – switching moderegulators – qualitative treatment – buck regulator

1. Boost regulator

2. Buck boost regulator

3. Cuk regulator

One – quadrant single phase SCR drive – circuit diagram – explanation – speed control of DCmotor using half control bridge connection – thyristor – chopper and commutation circuit

UNIT 5: PROTECTION AND CONTROL CIRCUIT ( 17 hrs )

USING MICROCONTROLLERS

Protection of power device:

1. Cooling and heat sinks

2. Snubber circuits

3. Reverse recovery transients

Control circuits:

UJT firing pulse generator – basic transistorized firing circuit – PLL oscillator pulse timingcontrolled firing circuit.

Control circuit using micro controllers:

Gate timing control of control rectifier – PWM signal generation.

REFERENCE BOOKS:1. Bimal.K.Bose, “Modern Power Electronics & Ac Drives”, Pearson Education, 1st Edn.2. Muhammad.H.Rashid, “Power Electronics Circuits Devices & Applications”, PHI New

Delhi, 2nd Edition.

50

4401 -C - POWER ELECTRONICS


TIME : 3 Hrs MARKS : 75Note : 1. Answer all questions


I A) 1. Mention the applications of power electronics.

2. Write short notes on opto couplers.

B) 1. Explain the VI characteristics of IGBT power MOSFET.

2. Explain how gate and base drives are isolated.

II A) 1. Explain the principle of ON / OFF control

2. Write short notes on brush less DC motor drive.

B) 1. Explain the principle of operation single – phase bidirectional controller withresistive

2. Explain the operation of single phase cyclo – converter.

III A) 1. List the applications of three phase bridge inverter’s

2. Explain the function of forced commutated thyristor inverter’s

B) 1. Explain how multiple pulse width modulation is achieved.

2. List the types of UPS, compare them and explain the operation of half line UPS

IV A) 1. Explain the principle of chopper operation.

2. Explain the operation of buck regulator.

B) 1. Explain the working principle wave form of step up chopper.

2. Explain the speed control of DC motor using half – control bridge connection.

V A) 1. Explain how the power device is protected by reverse recovery trasients.2. Explain the operation of UJT firing pulse generator.

B) 1. Explain the operation of PLL oscillator pulse timing controlled firing circuit.

2. Explain the operation of PWM signal generation.

51

4401-D - SURFACE MOUNT TECHNOLOGY

V term ( Diversified Course-I )


MAJOR DIVISIONS

UNIT TOPIC

I SMT PACKAGES AND SOLDERING FUNDAMENTALS

II SMT ASSEMBLY – I

III SMT ASSEMBLY – II

IV REWORK

V TESTING

UNIT 1: SMT PACKAGES AND SOLDERING FUNDAMENTALS: ( 17 Hrs )

Assembly, Testing and Repair

An overview of principles, methods and processes

Introduction : Surface mounting Vs through – hole mounting - illustration Differentiate betweenIC – chip and IC package Illustration of 40-pin DIP lead frame package Vs 68 pin SMD leadframe package. Explain SMT advantages: better high frequencies (list some application), minia-turization (list some applications). Explain SMT disadvantages: unforgiving process, costliercapital equipment Relative comparison graph of: automation Vs capital equipment cost, labourcontent and process controlOverview of SMT packages (4periods) Benefits and limitations ofGull Wing lead and J lead Ball joints, their advantages and limitations Definitions, diagrammaticrepresentation and examples of: MELF, CHIP, SOT, SOIC, PLCC, LCCC, QFP, BGA & CSPpackages.

Pitch – land pattern illustration of standard, fine, and very fine pitch device. Definition (withoutline diagram) of BGA, micro BGA and chip scale package Comparison of BGA/CSP withQFP device in terms of performance, size and assembly yield.Overview of soldering fundamen-tals (8periods) Brief explanations of terms – reliability, quality and repeatability (with referenceto solder joint), first pass yield, defect PPM levels, process control Eutectic solders – tin – leadratio – their melting and solidification points, typical time and temperature values recommendedabove liquidus. Solderability of pads and component leads – meaning of wetting and rewetting,capillarity and its effects, oxide layer, coatings, leaching effects. Brief explanation of criticalfactor related to pin by pin – hand – soldering: lack of process control, cold solder joint, brittlejoint, thermal shock, differential expansion. Difficulties of hand soldering densely populatedSMT PCBs; first passed yield, accessibility, static control, fine pitch. Brief explanation of criticalfactor related to IC by IC soldering: simultaneous soldering of IC pins, focusing the heat on ICleads, adjacent component heating, overheating of PCB substrate, need for preheating of thick/multilayer PCBs, keeping the IC lead and package temperature lower than the pin temperature,reducing delta T across the device process control and repeatability by controlling time andtemperature of heating. Advantage of mass machine soldering: repeatability, process controlthroughput.

52

Unit 2: SMT ASSEMBLY – I ( 17 Hrs )

Overview of solder paste

Constituents of solder paste, tin/lead particles size, shape and distribution Benefits of tacki-ness of solder paste Different types of flux used in solder paste: water soluble, no – clean andRMA typeOverview of solder paste deposition process (5periods) Dispensing Relationshipsgraph between dispensing volume – pressure – time – size of tip Solder paste selection criteria fordispensing Comparisons of throughput, advantages and limitations of: hand held – dispensers,fixture syringe dispensers, microprocessor controlled dispensers, fully automatic robotic dis-pensers Brief introduction to adhesive dispensing Stencil printing Illustration and principle ofoperation, material used for stencils, difference between chemical etched and laser etched stencils– component pitched stencils opening relationship – solder paste selection criteria.

Factors affecting solder paste deposition: stencil – PCB alignment, printing pressure, wipespeed, stencil – PCB separation. Comparison of cost, speed and process control of manual, semiautomatic and fully automatic stencil printersOverview of component placement process (5peri-ods) Component lead to pad alignment standards Cost, process control and placement ratecomparison of: tweezers, vacuum pencil, manual pick and place, semi-automatic pick and placeand fully automatic robotic pick and place.

Brief introduction to tape, stick and tray methods of presenting SMT components to fully auto-matic pick and place machines. Difficulties in naked eye alignment and placement of fine pitch,BGA and CSP components Manual vision systems –principle of operation of: Angled viewmagnifier vision, angled view-CCD camera vision, dual image overlay vision using prism andmirror optics Brief introduction to automatic vision based placement systems.Overview of wavesoldering process (5periods) Wave soldering – construction and principle of operation of thesoldering unit and solder wave – chip waves – dual wave soldering of SMT chips and TH jointssimultaneously. The role of adhesives in SMT wave soldering – applying and curing the adhesive– glass transisition temperature and removing a glued SMT device from the board. Limitationswhy wave soldering cannot be used for bigger SMT ICs.

Unit 3: SMT ASSEMBLY – II ( 17 Hrs )

Overview of reflow soldering

Time Vs temperature profile of a solder joint (solder paste on PCB pad) Equilibrium and non-equilibrium heating methods Effects of overheating the substrate, solder pads/lands, lid seat-ing, IC package Thermal profiling of a reflow cycle – setup, recording and plotting – sensors usedto measure solder joint temperature. Solder fillet standards Working principles of conduction,convection, radiation methods of reflow heating.Full board reflows, selective component-by-component reflow Graphic characterization and comparison of IR and convection reflow Con-struction and control system difference between batch oven and conveyorized oven Summary(survey) of various reflow soldering methods Flux types and their residues – brief explanation ofaqueous and solvent cleaning. (manual cleaning only)Types of SMT PCBs and their assemblyprocess (6periods) Type I, Type IIA, Type IIB, Type III. Process flow diagram of assemblingthe above types.Typical equipment configuration for: prototyping and low volume assembly; lowand medium volume assembly; high speed automated assembly.

53

Unit 4: REWORK ( 17 Hrs )

Overview of rework process

Complexities of reworking dense multilayer PCBs – difficulty of repairing PCB substratedamage and track damages – need for process control in rework. Construction of a resistiveheated soldering iron – closed loop control of idle tip temperature – compensating for drop in tiptemperature during soldering – overshoot and undershoot of tip temperature during soldering –using high-mass tips to store heat – variations of thermal demand/load from joint to joint –soldering to heavy ground planes – tip recovery – effect of delayed tip temperature recovery onsolder joint quality; on throughput; Construction of a induction heated soldering iron – curie pointand skin effect on magnetic material – self regulating physical structure of induction heatedsoldering iron, principle of operation and behavior of induction heated soldering iron whileworking with solder joints of varying thermal loads – benefits of induction heated soldering iron– safety aspects of low temperature – high heat delivery soldering Vs high temperature – low heatdelivery soldering. Construction of a desoldering gun with vacuum suction – selecting the rightnozzle dimensions for PTH desoldering Conduction heating for SMT removal – construction ofHot thermal tweezers (and tips) for removing simple SMT chips and SO packs – construction ofhot IC tip sockets for removing PLCCs, QFPs – Tip selection during rework – limitations ofconduction rework – with specific reference to PLCCs and QFPs Focused convection heating forQFP and PLCC removal – construction of the focused convection nozzle – construction of a FCtool with integrated vacuum pick up – benefits of focused convection – controlling time, tempera-ture and air flow for optimum thermal performance – the need for pre-heating multilayer boardsfrom the bottom.

Unit 5: TESTING ( 16 Hrs )

Overview of testing

The types of faults encountered in manufacturing process testing – most frequent faults onSMT boards – ln-circuit testing strategies of a manufacturing process tester – principle of opera-tion of ln-circuit passive device testing and analog guarding – principle of vector based truth tableverification of digital devices – need for vector less testing – principle of operation of vector lesstest method for SMT boards – junction current testing method – capacitive coupling method –illustration of test node access using bed of nails fixtures – vacuum and pneumatic fixtures –probes used in fixtures – introduction to principle of operation of boundary scan testing. Typesof faults encountered in PCB diagnostics and repair (servicing) – digital ln-circuit testing –illustration and principle of operation of ln-circuit testing – back driving – digital guarding –developing test vectors for simple 74XX TTL gates – developing test vector for 8255 and 8279.Illustration and principle of operation of ln-circuit impedance signature analysis – accessingdevices using IC clips and probes.

54

REFERENCE BOOKS:1. Surface mount technology by Rudolf Strauss 1994 - Butter worth/ Heinemann –Linacre

House –Jordan Hill –Oxford – Ox28DP (Call No: 621-3815)

2. Introduction to low volume SMT assembly and rework – process and methods – trainingmanual - Jay Boyd 1994 OK industries Yonkers New York

3. Introduction to ln-circuit testing -Raja Balakrishnan – MELSS Training Division –173Developed plots perungudi Chennai 600096

4. Conduction and convection rework -Theory methods and application - (Tutorial) SMTA –IC Annual convention Ban galore 1998 Available as PowerPoint presentation CD as well asphotocopies of laser printed slides.

5. IPC-S-816 – Process control guidelines for SMT assembly and rework (available as aphotocopy of IPC standard) 1and 2 can be obtained from Zonal co-coordinator – southernregion – surface mount technology association – India chapter –12, thirumalai nagar secondcross street perungudi Chennai 600096

6. SMT special – electronics for you – November 19987. Surface mount technology with fine pitch components - manufacturing issues (chapter

4,5,6and 7) – Hans Danielson – Chapman and Hall, 2-6 Boundary row, London SEI 8HNUK

8. ln-circuit testing by Allen Buck Royd 1994 – Butter worth – Heinemann

9. Introduction to Digital Board testing RG Benneth 1982 -Crane Russak and company Inc, 3East 44th street NY 10017

10. Management of electronics assembly (chapter 6 and 7) -IAN OAKES Butter worth –Heinemann

11. Board test strategy – Craig Pynn

55

4401- D - SURFACE MOUNT TECHNOLOGY




I A. 1. Define solderability.

2. Illstrate a J lead SMT Device.

B. 1. Draw the relative graph of cost, process control and labour content with respect toautomation, in surface mount technology assembly.

2. Describe the critical factors relating to pin by pin hand soldering.

II A. 1. Explain the role of adhesive in SMT soldering ( Why and When it is used. )

2. Explain how the quantity of solder paste deposition could be varied in the pnuematicdispensing process

B. 1. Explain the principle of operation of a stencil / screen printer used in SMT assembly.

2. Describe the construction and principle of operation of dual wave soldering machineused in SMT Assembly.

III A. 1. Explain the method used for plotting thermal profile on a SMT Board while it is undergoing reflow

2. Explain the principle of operation of convection type reflow soldering.

B. 1. Suggest a suitable configuration of SMT equipment for assembling an SMT Boardwhen Varieties of Boards = 2

Board 1 : 5 discretes and 20 Ics per board – 30 boards per day

Board 2 : 40 discretes and 3 Ics per board – 5 boards per day

2. Draw the Block diagram and explain the process for a mixed technology board withSMT discretes on bottom side. SMT Ics on top side and through hole devices onTopside.

IV A. 1. Draw and explain the construction of a induction heated Iron.

2. Explain the principle of operation of conduction rework.

B 1. Explain the term tip recovery. How does it affect solder joint quality and productivityduring hand soldering.

2. Explain why high mass tips are required in resistive heated irons.

V A. 1. Explain what you understand by the term Bed of Nail Fixture with an Illustration

2. What is a test vector ?

B. 1. Draw a test vector diagram for TTL gate

2. Explain with illustration – impedance signature analysis method of PCB troubleshooting.

56

4303 - MEASUREMENTS AND INSTRUMENTS LAB

V TERM ( APPLIED COURSE )


1. Calibration of an ammeter and a voltmeter2. Converting a galvanometer into a voltmeter and its calibration.3. Extending the range of an ammeter and voltmeter.4. Construction of Wheat stone bridge to measure an unknown resistance.

5. Using an RLC bridge and to measure the resistance, inductance of a coiland the capacitance of a coil.

6. Measurement of frequency and phase angle using CRO by Lissajous figures.7. Measurement of strain in a beam using strain gauge.8. Measurement of output (mv) of load cell at various loads(increasing and

decreasing load) and plot the graph.9. Characteristics of any one type of photoelectric transducer.10.a) Using the digital frequency counter for frequency and time measurement. b) Use of transistor tester for the measurement of Icbo and hfe.11. Using a dual trace CRO for display of two different waveforms simultaneously

and to measure the amplitude and frequency of both waveforms.12. Study of Thermocouple and Thermistor.13. Measurement of temperature using RTD.14. Use of LVDT as displacement transducer. SCHEME OF EXAMINATION

S.No Topics Marks

1 Exercise 7 0

2 Viva – Voice 5

Total 7 5

57

4304- COMMUNICATION ENGINEERING LAB

V TERM ( APPLIED COURSE )

6 Hrs / Week Total Hrs : 721. Frequency response characteristics of pre-emphasis and De-emphasis circuits Waveform

observation at appropriate places2. Construct and testing of an audio amplifier circuit using IC CA810.3. Construct and testing of mixer stage of super heterodyne receiver.4. Cold check and in-circuit check of receiver -components.5. Methods of receiver fault diagnosis Voltage and current check at appropriate

places. Resistance checks at appropriate places6. Construct and test the performance of (a) Low pass filter (b) High pass filter and(c) Band

pass filter, Draw the characteristic curve and calculate the cut-off frequency.7. Construct and test the performance of series Equalizer Circuit and draw the characteristic

curves.8. Construct and test the performance of shunt equalizer and draw the characteristic curves.9. Study of beat frequency oscillator.10. Determine the directional characteristics of a given moving coil microphone and draw the

directional pattern.11. Determine the frequency response characteristics of the given loudspeaker and the response

curve over the audio range.12. Construct and test the performance of cross over network for a three-way system. Draw

the response curve over audio range.13. Construct and test the performance of amplitude modulated circuit and draw the output

waveforms , also calculate the modulation index.14. Construct and test the performance of AM detector circuit. Draw the output waveforms.15. Construct and test the performance of phase discriminator circuit.16. Construct and test the performance of an IF amplifier stage in a super heterodyne receiver,

and draw the response curve.17. Construct an IF amplifier stage and test its performance over AGC bias.18. Construct and test the performance of a ratio detector circuit.19. Standard servicing procedures:

(I) Sight, touch and smell method

(ii) Signal injection method

(iii) Signal tracking method

SCHEME OF EXAMINATION S.No Topics Marks

1 Exercise 70

2 Viva – Voice 5

Total 75

58

4402 -A - MICROCONTROLLER & ADVANCEDMICROPROCESSOR LABORATORY

V TERM ( Diversified Course -II )6 Hrs / Week Total Hrs : 72

1. Study of 8051 microcontroller2. Program for 8/16 bit addition3. Program for 8/16 bit subtraction4. Program for 8/16 bit multiplication.5. Program for 8/16 bit division

6. Program for sum of elements in an array.7. Program for ascending order.8. Program for descending order.9. Program for finding largest number.10. Program for finding smallest number.

11. Program for interfacing 8051 with 827912. Program for interfacing 8051 with 8253.13. Conversion of hexadecimal to decimal.14. Conversion of decimal to hexadecimal.15. Study of 8086 micrprocessor

16. LED ON / OFF Control17. Program for 16 bit addition/subtraction.18. Program for 16 bit multiplication/division


S.No Topics Marks

1 Exercise 70

2 Viva – Voice 5

Total 75

59

4402 -B - BIOMEDICAL INSTRUMENTATION LABV TERM ( Diversified Course-II )

6 Hrs / Week Total Hrs : 721. Construction and Testing of Differential amplifier.2. Construction and Testing of Instrumentation amplifier.3. Measurement of PH of the given solution.4. Measurement of Blood pressure.5. Measurement of ECG waveform.6. Construction and verification of pacemaker circuit.7. Construction and testing of high gain amplifier.8. Measurement of Body temperature.9. Measurement of Skin temperature.10. Analysis of ECG curves nervous system11. Analysis of EEG recorder, recording techniques12. Measurement of EEG waveform13. Study the clinical use of EEG14. Measurement of brain tumour.15. Measurement of Electro–myograph (EMG)16. Measurement of EMG wave forms17. Study the EMG recording techniques, and Electro-retinograph (ERGStudy,

Handle and use the following Instruments/equipments:a. Cardiac monitor.b. Vascular probe with vasoline monitor.c. ECG stimulator.d. Muscle stimulator.e. Vectorodyne electrotherapy equipment.f. Vascular Doppler recorder.g. Pressure plethysmograph.h. Skin sympathetic response meter.


S.No Topics Marks

1 Exercise 7 0

2 Viva – Voice 5

Total 7 5

60

4402-C - POWER ELECTRONICS LABV TERM ( Diversified Course -II )


1. Diode bridge rectifier with R & RL loads.2. Single phase half controlled bridge rectifier.3. Three phase half-controlled bridge converter.4. Single phase fully controlled bridge converter5. Three phase fully controlled bridge converter

6. Single phase AC voltage regulator with R,RL load7. Three phase AC voltage regulator with R load8. Switching characteristics of power transistor/power MOSFET9. Switching characteristics of IGBT GTO10. Switching characteristics of SIT

11. Simple commutation circuits for thyristors.12. DC chopper with R, RL load.13. Single phase single pulse PWM inverter.14. Single phase multiple phase PWM inverter.15. Single phase sinusoidal pulse PWM inverter.

16. PSPICE simulation of simple power electronic circuits.17. Study of UPS.18. Construct a control circuit for experiments from 2 to 7.


S.No Topics Marks

1 Exercise 7 0

2 Viva – Voice 5

Total 7 5

61

4402 -D - SURFACE MOUNT TECHNOLOGY LAB V TERM ( Diversified Course - II )

6 Hrs / Week Total Hrs : 721. SMT SOLDERING

• Dispense a dot of Solder paste on a substrate and heat it with hot air and watch the process.• Dispense a line of solder paste perpendicular to the QFP pads (all four sides – on a bare

SMT• Training Board), and heat it with a focused convection nozzle and watch the process.

• Use a Blade type Dewicking tip on a soldering iron and copper wick to clean the QFP pads• Dispense Solder paste dots for discrete Chips• Place the Chips with a Tweezer2. REFLOW CHIPS ( Using Focussed convection )• Reflow the Chips using Focused Convection – Discrete nozzle

• Remove an SMT Chip using HOT THERMAL TWEEZER method• Clean the pads with Wick and Dewicking tip3. SOLDERING• Dispense a line of solder paste on SOIC pads• Place the SOIC using Tweezer (Also practice placing the SOIC using

integrated Vacuum pick Up in FCT Tool)• Solder the SOIC using FCT Tool (SOIC Nozzle)4. REMOVING SOICs• Remove the SOIC using HOT THERMAL TWEEZER method

• Clean the pads5. SOLDERING QFP STENCIL• Align the 100-pin QFP stencil with PCB lands on the single IC stencilprinter• Print Solder paste• Place the QFP using hand (Also practice placing the QFP using integrated

vacuum pick up In FCT Tool)• Solder the QFP using FCT Tool (QFP 100 nozzle)6. REMOVING QFPs• Remove the QFP using FCT Tool and integrated Vacuum pick up in manual mode• Clean the pads

• Drag Solder the QFP using Hoof Tip (Multilead speed soldering tip)• Remove the QFP using FCT Tool and integrated vacuum pick up in Automatic mode

62

7. INDUCTION TYPE SOLDERING• Study the construction of a induction type soldering Tip Catridge (Cross Section view)• Take readings of Net power consumption from the Netpower meter while soldering/

desoldering• Various types of joints with varying thermal loads.8. DESOLDERING• Remove a DIP IC using Desolder gun from a Multilayer PCB and Solder it back• Remove a Connector using Desolder from a Multilayer PCB and solder it back

9. THERMAL PROFILING• Deposit solder paste on couple of pads meant for QFP 100 on a bare PCB Setup a bail type• Solder Joint Temperature sensor to touch the solder paste and the land/ pad beneath it and• Connect the sensor to a temperature indicator• Preheat the bottom of the PCB using Hot air or Hot plate ‘M’ minutes

• Record the temperature at the end of ‘M’ minutes10. THERMAL PROFILING• Use a Focused convection Tool and QFP nozzle to heat the pins of QFP lands from top• X seconds at Y Temperature setting and Z Air flow• Take readings of temperature every 15 seconds during the heating as well as after the

heating Is stopped (cooling) and Plot time Vs temperature graph• Vary the time of pre-heating (M), time of reflow heating (X), Source Temperature

(Y) and Air• Flow (Z) and repeat the above experiments as per the time below

This experiment cand be done over 2 sessions (3 per session)M X Y Z5 20 Sec 1 10L/Min10 20 Sec 1 10L/Min10 20 Sec 2 15L/Min

10 20 Sec 2 15L/Min15 40 Sec 3 20L/Min

11. THERMAL PROFILING• Setup the temperature sensor to measure the package temperature of the QFP (One of its

Accessible comers).• Monitor and plot the Thermal profile experienced by the package while removing it with

a Focused Convection tool.12. MEASUREMENT OF TEMPERATURE

• Setup the temperature sensor to measure the PCB substrate temperature near the QFP.• Monitor and Plot the Thermal profile experienced by the PCB substrate while the QFP is• Being removed with a FCT

63

13. IN – CIRCUIT TEST VECTOR DEVELOPMENT14. TESTING TTL GATEs15. IN – CIRCUIT TEST VECTOR DEVELOPMENT

Tristate Buffers with Guarding16. TESTING

Tristate Buffers with Guarding17. ICT Experiments – VI Trace18. STUDY THE FAULTS ON SMT BOARD.


S.No Topics Marks

1 Exercise 7 0

2 Viva – Voice 5

Total 7 5

64

4305 - COMMUNICATION SYSTEMSVI TERM ( APPLIED COURSE )

6 Hrs / Week Total Hrs : 72MAJOR DIVISIONS

UNIT TOPIC I RADAR AND NAVIGATIONAL AIDS II DIGITAL COMMUNICATION III FIBER OPTIC COMMUNICATION IV SATELLITE COMMUNICATION V COMPUTER COMMUNICATION SYSTEM

UNIT-I: [17 Hrs]RADAR AND NAVIGATIONAL AIDS

Radar – frequency ranges – Radar system – Basic principles – Development of Radarfrequencies and powers used in radar – Radar performance factors – Factors influencing maxi-mum range – Target properties – -Pulsed system – Basic Pulsed Radar System – Plan PositionIndicator – Automatic Target detection – Radio aids to navigation – Direction finding – Radioranges – Radio compass – Radio Telemetry – Instrument landing system – Ground controlledapproach system.TELEPHONY AND FAX

Telephone system – Electronic Exchange – Facsimile communication systems – Introduction– Facsimile sender – Cylindrical scanning – Tape Scanning - Scanning spot – Facsimile receiver– Transmission of facsimile telegraph signals .

TELEVISION

Television fundamentals - Scanning principles - Synchronization - Aspect ratio - Compos-ite video signal - VSB Transmission -Intercarrier Sound Modulation-TV Standards-CCIRB,NTSC,PAL,SECAM-Block diagram of a TV transmitter and TV Receiver.

UNIT-II: DIGITAL COMMUNICATION [12 Hrs]Digital transmission system – Sources and signals – Processing operation in digital commu-

nication – Characteristics – Bandwidth requirement – Speed, Noise, Baud rate – Cross talk –Distortion – Digital codes – Baudot code – Error detection and correction codes – Parity checkcodes - error correction codes – Digital systems – Classification – Digital modulation techniques– FSK modulation / Demodulation – PSK modulation / Demodulation.

Digital Image Processing – block diagram of Image Processing system - Image Enhancement –Image Restoration – Image Data Compression – Image Analysis.UNIT-III: FIBER OPTIC COMMUNICATION [14 Hrs]

Introduction to fiber propagation using a ray model – Material Dispersion – Attenuation InOptic Fiber – Fiber Production Methods – Cables – Step Index Fibers – Graded Index Fibers –Optical Fiber Connection Joints and Couplers – Optical Sources –LED – Semiconductor LA-SER for Optical Communication – Optical Detector - PIN – APD - Regeneration of DigitalSignals – Optical Transmitters and Receiver – Merits of Optical Fiber Communication –Telecommunication – Local Distribution Services – Local data Transmission and telemetry –Optical Fiber Digital Communication System –Applications – Civil, Industry &MilitaryApplications (with descriptive block diagram)

65

UNIT – IV SATELLITE COMMUNICATION [14 Hrs]Satellite System - Frequency allocation for satellite services – Orbits – Kepler’s Law –

Apogee – Perigee – Orbit Perturbation – Active and passive Satellite – Geostationary Orbit –Earth Eclipse of Satellite – Launching Orbits – Launch Vehicles – Parabolic Reflector – Offsetfeed –Double Reflector AntennaTHE SPACE SEGMENT

Power Supply – Altitude Control – Station Keeping – Thermal Control - TT&C Subsystem– Transponders – Antenna SubsystemEARTH SEGMENT

Receive Only Home TV System – Transmit – Receive Earth Station.

SATELLITE SERVICESINSAT – INTELSAT- INMARSAT- Global Positioning System (GPS)

UNIT – V [15 hrs]COMPUTER COMMUNICATION SYSTEM

Introduction – Types of Network – LAN ,WAN - MODEMS – Integrated Service DigitalNetwork – Internet Protocols – Types of Packet Switching – Internet – Web Browsing – E-MAILMOBILE COMMUNICATION

Cellular Communication – Frequency allocation –Cellular phones – Cordless Phones –Video Phones - Satellite Multiple Access Techniques- TDMA- FDMA –CDMA –VideoConfreencing- Wireless Local Loop (WLL)

REFERENCE BOOKS1. Denni Roaddy, John Coolen, “Electronic Communication Systems”, Prentice - Hall of

India Private Limited, New Delhi, 4th Edition, 2005.2. Roy Blake, “Electronic Communication Systems”, Adivision of Thomson Learning,

Inc, 2nd Edition.3. Louis E.Fronzel, “Communication Electronics Principle & Applications”, Tata

McGraw - Hill , 3rd Edition, 2002.

66

4305: COMMUNICATION SYSTEMSMODEL QUESTION PAPER



I A. 1. What are the factors that influence the maximum range of radars?2. Write about Instrument landing system.

B. 1. Write block diagram, explain the Pulsed Radar system2. With a neat sketch, explain the operation of a facsimile receiver

II A 1. write briefly about parity check code.2. what are the types of error correcting codes.

B 1. Draw the block diagram of Digital Image Processing and explain.2. Describe PSK modulation and demodulation.

III. A 1. What are the advantages of fiber optic communication?2. Explain the driver circuitry for the LED.

B 1. Explain the working of LASER.

2. Draw the block diagram of Optical receiver and explain.IV. A. 1. Explain about kepler’s law

2. Write briefly about Transponder.B. 1. Explain about receive only Home TV system.

2. Describe in detail about earth station.

V A 1. Write about MODEM 2. Distinguish between LAN and WAN.

B . 1. Write about i. Video Phone ii. INTERNET2. Explain in detail about the cellular communication system.

67

4306 - TELEVISION ENGINEERING

VI TERM ( Applied Course )


MAJOR DIVISIONS

UNIT TOPIC

I T.V. FUNDAMENTALS

II CAMERA AND PICTURE TUBES

III TELEVISION RECEIVERS

IV SYNC, DEFLECTION, EHT & REMOTE CONTROL

V TV TRANSMITTER AND MISCELLANEOUS TOPICS

UNIT I - T.V. FUNDAMENTALS [17 Hrs]

Simple block diagrams of TV transmission and reception - Scanning process - Sequential -Horizontal and vertical scanning - Flicker and Interlaced scanning - Need and details of synchro-nization, Blanking and Equalising pulses - Aspect ratio – Vertical resolution, Horizontal resolu-tion, Video Bandwidth – Relationship among them - Composite video signal - Serrated verticalsync pulse - Positive and negative transmission - Vestigial side band transmission of videosignal - Merits and demerits – Inter-carrier sound – Signal frequencies for any one channel - TVbroadcast channel allocation – Different TV standards - CCIR system B in detail.

Additive mixing of colors - Color perception- Chromaticity diagram - Luminance and chromi-nance signals - I & Q signals - their polarity - Bandwidth for color transmission – Simple blockdiagrams of NTSC/SECAM Encoder and Decoder.

UNIT II - CAMERA AND PICTURE TUBES [16 Hrs]

Elements and characteristics of a camera tube – Construction, working principle and char-acteristics of plumbicon - Silicon diode array - CCD image sensors - Comparison of vidicon,plumbicon, saticon, newvicon, chalnicon camera tubes - Camera tube deflection and focussing- Processing of camera signal – Production of Y and color difference signals from a color TVcamera.

Picture tube specification - Working and characteristics of monochrome picture tube - Phosphorscreen - screen burns – aluminium layer - Picture tube mountings for monochrome and color TVincluding yoke - Types of color picture tubes – Working principle of delta gun, precision inline,trinitron color picture tubes - Color convergence – static and dynamic - Color purity - Screengrid adjustment - Automatic degaussing - Pincushion distortion - Flat panel display- Largescreen display methods – LCD projector.

68

UNIT III - TELEVISION RECEIVERS [17 Hrs]

Block diagram of monochrome TV receiver - functions of various blocks - RF tuner - types- Block diagram of frequency synthesized Electronic tuner – Need for AGC - block diagram ofa keyed AGC system - Video IF amplifier response curve requirements – Block diagram of ICTA 7611 – functions alone and names of IC TDA 3540, TA 7660 - Video amplifier requirementsand circuit with HF and LF compensation – Coupling methods - Block diagram of sound section– Block diagram of IC CA 1190 – functions alone and names IC TDA 3190, ìPC 1353 - Blockdiagram of PAL colour receiver - functions of various blocks - Block diagram of a digitalcolor TV receiver.

UNIT IV - SYNC, DEFLECTION, EHT & REMOTE CONTROL (17 Hrs]

Need for sync pulse separator with block diagram - Sync separator circuit with noise gate– Need for trapezoidal voltage for deflection coils – Block diagram of horizontal output stage withEHT - HAFC block diagram with anti hunt network – Horizontal drive, width linearity controls– Typical horizontal output circuit with EHT – function of PAL chroma decoder ICTA 7699–functions and pin connections of IC TA 7680 – functions alone and IC names of TDA 8362,M51308SP.

Schematic diagrams of a remote control IR Transmitter and IR Receiver – Synthesis ofremote control signals – Synchronization of receiver - Functions of remote transmitter andreceiver ICs – M 50463P, M 50142P, ìPC 1373HA – functions of system control ICs MN15287, PCA 84C440P, MN 15284.

UNIT V - TV TRANSMITTER AND MISCELLANEOUS TOPICS [17 Hrs]

Block diagram of a Low level IF modulated TV transmitter - visual exciter - aural exciter -diplexer - Color compatibility - color synchronization - Color plexed compoite videosignal(CCVS) and weighting factor - Typical layout of TV station - PAL Color Coder –functional blocks and working of each block – output waveforms – Modern cable TV systemschematic diagram - Scrambling – descrambling – block diagram of a basic descrambler – DigitalCCD telecine system – Steps involved in VCD making process – Block diagram of VCD playerin playback mode – Advantages of DVD over laser disc, video tape, VCD – DVD player blockdiagram in play mode.

TEXT BOOKS:

1. R.R. Gulati - Modern T.V Practice

2. Arvind M. Dhake - TV and Video engineering

3. Bernard Grob - Basic Television & Video systems

REFERENCE BOOKS:1. R.P.Gulafi, “Modern TV Practice”.2. Arvind M.Dhake, “TV and Vidio Engg”.3. Bernald Grob, “Basic Tv & Video System”.4. Maini.A.K, “Colour Television and Video Technology”, CBS Publishers, 2nd Edition.

5. Jim Talor, “DVD Demystified”, Tata McGraw - Hill Publishing, 2nd Edition.

69

4306 : TELEVISION ENGINEERING



Note : 1. Answer all questions2. Answer any one from Part A(5 marks) and any one from Part B

(10 marks )

I A. 1. What is the purpose of sync .pulses ? What is the frequency of horizontal sync. Pulse.

2. Explain the terms luminance and chrominance.

B. 1. Explain interlaced scanning. How does it help reducing bandwidth and flickering.

2. What is VSB ? Why is it used in TV?

II A. 1. Compare the characteristics of any two camera tubes.

2. What is meant by Degaussing? Explain a method of degaussing.

B. 1. Describe the construction and working of CCD image sensors.

2. Describe the construction and working of delta gun colour picturetube

III A. 1. Draw the block diagram of monochrome TV receiver.

2. What are the requirements of video amplifier.

B. 1. What is the need for AGC ? Explain the working of keyed AGCsystem.

2. Explain the working of a digital colour TV receiver with its blockdiagram.

IV A. 1. Sketch and explain the driving voltage waveform for vertical deflection.

2. Draw the block diagram of PAL chroma decoder

B. 1. Explain the working of sync separator with noise gate.

2. Explain the working of IR remote control transmitter and receiverwith necessary diagram.

V A. 1. Draw the layout of TV station.

2. Write notes on digital CCD telecine system.

B. 1. Explain the working of PAL color coder with its block diagram

2. Explain the working of VCD player in play back mode.

70

4403 -A - INDUSTRIAL ELECTRONICS

VI TERM ( Diversified Course -III )


MAJOR DIVISIONS

UNIT TOPIC

I BASICS OF THYRISTORS AND APPLICATIONS II CONVERTERS AND INVERTORS III ROBOTICS AND ULTRASONICS IV PROGRAMMABLE LOGIC CONTROLLER

V NUMERICAL CONTROL OF MACHINESUNIT 1: BASICS OF THYRISTORS AND APPLICATIONS ( 14 hrs )

CHARACTERISTICS OF SCR:

Turn on (characteristics and measurements) – turn off(characteristics and

measurements) – voltage and current ratings – triggering circuits for SCRs – thyristors types –series and Parallel operations of SCRs.

Protection of SCRs:

Di/dt protection – dv/dt protection – gate circuit protection – over voltage and over currentprotection – over current protections – contactors for protection – protection by limiting junctiontemperatures.

Applications of SCR:

Integral cycle triggering – over voltage protection – static circuit breaker regulated supply DCand AC – emergency light using SCR – automatic battery charger circuit.

UNIT 2: CONVERTERS AND INVERTORS (Qualitative treatment only) ( 14 hrs )

Converters:

Single phase semi converters R, RL and fly wheel diode – single phase converters with R, RLand fly wheel diode – input – output characteristics of bridge circuits – effect source inductance– discontinuous current operation – effect of overlap angles – line communication.

a. Self commutations

b. Forced communications (mention of types only)

Polyphase converters with resistive load only

a. 3 Phase semi converters

b. 3 Phase full converter Dual converter.

71

Inverters:

Single phase inverters using thyristros with R, RL loads – output voltage control in inverter– method of obtaining sine wave output from an inverter – typical inverter circuit – three phaseinverter circuit – inverter characteristics – through pass inverter – applications of inverters – DCtransmission – block schematic – advantages.

UNIT 3: ROBOTICS AND ULTRASONICS ( 16 hrs )

Robotics:

Classification – parts of robots – uses of robots. Mechanisms of robots – position andorientation – joints and links – degree of freedom – forward kinematics – inverse kinematics –Jacobean – dynamics – trajectory – position control – force control – servo mechanism – syn-chronous – control transformer – receiver servo motor – drive mechanisms – hydraulic andpneumatic drives – DC electric motor drives - stepper motor – unipolar operation – 2 phasescheme – half stepping scheme – stepper motor drive circuit – open loop and closed loop controlof stepper motors – comparison between DC motors and stepper motors – electronic timers – DCtimer – AC timer, 555IC timer – 555IC sequence timer.

Ultrasonics:

Piezoelectric ultrasonic oscillator – applications – SONAR – flaw detector – drilling –soldering – cleaning – medical applications – saw filter – applications.

UNIT 4: PROGRAMMABLE LOGIC CONTROLLER ( 14 hrs )

Evaluation of PLCs – hardwire control system definition – programmable logic controlsystem: advantages of PLCs. Block diagram of PLC system symbols used – relays and logicfunctions – OR, AND, Comparator, Counters review.

Programming of PLCs – different methods – ladder STL and CSF, ladder programming ofsimple system like traffic light controller – conveyors – list of various PLCs available

UNIT 5: NUMERICAL CONTROL OF MACHINES ( 14 hrs )

Basic concepts of numerical control – driving devices – hydraulic systems – data processingunit – data reading – tape reader – photoelectric type – typical reading circuit – tape formats –programming – part programming – general information – post processor elements – wordaddressing format with the simple programme as example – other programming systems –ADAPT/EXAPT, AUTOSPOT – characteristics of N/C system – CNC/DNC – CNC typicalsystem block diagram – adaptive control systems – ACC-ACO.

72

REFERENCE BOOKS:

Power electronics: P.C. Sen.

Industrial electronics: G.K. Mithal

Numerical: Yoram koren and Joseph Ben

Robotics and image processing: P.A. Jamakiraman

Thyrsitors and their applications: M. Ramamoorthy

Power Electronics – circuits device and applications: Rashid

Industrial electronics and control: S.K. Bhattacharya and S.chatterjee SCRManual – 6th edition GE

Programmable controllers hardware software and applications– George L. Battin

Industrial robotics: Grower & others MGH

73

4403-A - INDUSTRIAL ELECTRONICSMODEL QUESTION PAPER



(10 marks )I A. 1. Explain voltage and current rating in SCR.

2. Explain the need for series and parallel combination of SCR.B. 1. Explain integral cycle triggering circuit using SCR.

2. Explain the circuit diagram of an automatic battery charger unit.II A. 1. Briefly explain the I/O characteristics of a bridge controlled converter.

2. What are the advantages of D.C. transmission. Draw the block schematic of it.B. 1. Explain a single phase semi converter with RL load and a flywheel diode. Draw

the waveforms.2. Draw and explain a typical inverter circuit.

III A. 1. Name the different parts of the robot.2. State the applications of ultrasonic waves used in flaw detection.

B. 1. Explain the kinematics in robot system.2. Explain the operation of sequence timer using 555 IC.

IV A. 1. What is PLC?2. Describe briefly the various methods of programming PLC’s

B. 1. Describe the evolution of PLC’s2. Develop a program to use PLC system is conveyor system using ladder method.

V A. 1. What are the basic concepts of numerical control?2. What are the characteristics of N/ c systems

B. 1. What are the driving devices used in N/C machines ? Explain any one in detail.2. Explain a typical CNC system with block diagram.

74

4403 - B- COMPUTER NETWORKS



MAJOR DIVISIONS

UNIT TOPIC

I NETWORK TRANSMISSION LINKS AND PROCEDURESII TOPOLOGICAL DESIGNIII ROUTINGIV FLOW CONTROL

V NETWORK SERVICES UNIT I – NETWORK TRANSMISSION LINKS AND PROCEDURES ( 14 Hrs )

Network perspective- objective of networks- network components-host, nodes, links, termi-nal controller, user sub network, communication network- Message transport technologies-circuit switching networks, message- switching networks, packet switched networks- transmis-sion links- terrestrial links- switched and leased link, satellite links- propagation delay, Thecollision problem on satellite channel, pure aloha, slotted aloha, frequency division multipleaccess, time division multiple access- radio links- carrier sense multiple access, optical fiber-transmission modes- half duplex method, full duplex method, polling- transmission protocols-asynchronous serial transmission, synchronous serial transmission, binary synchronous trans-mission, synchronous data link control.

UNIT II – TOPOLOGICAL DESIGN ( 16 Hrs )

Selection of terminal concentrator locations- dysart-georganes algorithm- multipoint connec-tions between a terminal and neighbouring terminals- minimum spanning tree- Chandy Russellalgorithm, heuristic algorithm, Esau Williams algorithm, Kruskal algorithm.

UNIT III – ROUTING ( 14 Hrs )

Requirements of routing- classification of routing algorithm- deterministic routing-shortestpath algorithm, minimum delay algorithm, and reliability in deterministic routing, disjoint deter-ministic routing- flooding- adoptive routing strategies- centralized adoptive routing, randomadoptive routing, hierarchical adoptive routing.

UNIT IV -FLOW CONTROL ( 14 Hrs )

Network congession- flow control techniques- centralised flow control, flow deviation method,distributed flow control, end to end flow control, comparison of flow control techniques- adopt-ers, couplers and modem.

UNIT V – NETWORK SERVICES ( 14 Hrs )

PC networks- network interface unit, active hub, passive hub- introduction to Novell NetWareand its usage- supervisor tasks- user management, file management, installation of applications,writing login scripts utilities available- introduction to internet concepts, windows NT, networkserver- printing techniques in a network environment.

75

Reference books:

1. Local networks- An introduction to the technology by McNamara John.E

2. Introductions to computer communication- part I - Basic concepts, Electronics for you, march- 1991.

3. Data communication- part I & II, Basandra Suresh. D, Electronics for you,March, April, May-1991.

4. Computers today by Suresh k Basandra.

76

4403 -B - COMPUTER NETWORKSMODEL QUESTION PAPER



I. A. 1. Write short notes on frequency division multiple access.2. Explain briefly about carrier sense multiple access.

B. 1. Explain in detail about message transport technologies.2. Write in detail about pure aloha and slotted aloha.

II. A. 1. Give a brief note on dysart -georganes algorithm.2. Write briefly about multipoint connections between a terminal and neighbouring

terminals.B. 1. Explain in detail about heuristic algorithm.

2. Explain in detail about Chandy Russell algorithm.III. A. 1. Give a brief note on flooding.

2. What are requirements of routing?B. 1. Explain in detail about a) Shortest path algorithm b) Minimum delay algorithm2. Write in detail about adoptive routing strategies.

IV. A. 1. Give short notes on network congession.2. Write short notes on centralised flow control.

B. 1. Explain in detail about a) flow deviation method b) distributed flow control2. Write the comparison of flow control techniques between adopter, modem and

couplers.V. A. 1. Write short notes on file management in Novel NetWare.

2. Write the difference between active hub and passive hub.B. 1. Explain in detail about a) Supervisor tasks b) User management

2. Write in detail about printing techniques in a network environment.

77

4403 -C - DIGITAL COMMUNICATION



MAJOR DIVISIONS

UNIT TOPIC

I LOCAL AREA NETWORKII PULSE COMMUNICATIONIII DATA COMPRESSIONIV SPEECH COMPRESSION

V DIGITAL IMAGE PROCESSING

UNIT 1: LOCAL AREA NETWORK ( 14 hrs )

Benefits and pitfalls of LAN- applications- OSI layer model- LAN topologies- Transmis-sion media- twisted wire, coaxial cable, fiber optic cable- flow control- Ethernet- Arcnet- Router-flow control- Token ring- TCP/IP.

UNIT 2: PULSE COMMUNICATION ( 14 hrs )

Characteristics of data transmission- Hartley law- capacity of noisy channel- Error detec-tion- Error correction- Redundant code, constant ratio code, parity check code, Hamming code,Hagelberger code- Retransmission.

Pulse modulation- sampling theorem- generation and demodulation of PAM, PWM,PPM, PCM- quantization noise- companding- delta modulation- DPCM.

UNIT 3: DATA COMPRESSION ( 14 hrs )

Coding-Shannon Fano algoritham, Huffman code - Adaptive Huffman coding- Escapecode- Overflow - Dictionary Based Compression.

UNIT 4: SPEECH COMPRESSION ( 15 hrs )

Digital audio concepts- fundamentals- sampling variables- PC based sound- loss less com-pression of sound- lossy compression- silence compression- Companding.

UNIT 5: DIGITAL IMAGE PROCESSING ( 15 hrs )

Image fundamentals- a simple image model- sampling- quantization- basic relationshipbetween pixels-image enhancements- Histogram processing- image subtraction- image averag-ing- spatial filtering.

REFERENCE BOOKS:

1. Data compression book II edition by Mark Nelson Jean- Loup Gailly

2. Digital image processing by Richard E. woods Addision Wesley 1998

78

4403 -C - DIGITAL COMMUNICATION




(10 marks )

I A. 1. Mention few applications of LAN

2. Write short notes on LAN topologies

B 1. Explain OSI layer model

2. Explain TCP / IP

II A. 1. Explain Hartley Law.

2. Briefly discuss about constant ratio code.

B. 1. What are different methods used to correct the error ? Explain any one.

2. Explain the generation and demodulation of PAM.

III A. 1. Explain shannon fano algoritham.

2. Write short notes on huffman code.

B. 1. Explain adaptive huffman coding.

2. Explain dictionary based compression.

IV A. 1. Explain basic concepts of digital audio.

2. Explain companding.

B. 1. Explain PC based sound system.

2. Explain silence compression.

V A. 1. Write short notes on simple image model.

2. Explain quantization.

B. 1. Explain histogram processing.

2. Explain spatial filtering.

79

4403 -D - DIGITAL SIGNAL PROCESSING

( VI term Diversified Course - III)


MAJOR DIVISIONS

UNIT TOPIC I DISCRETE TIME SIGNALS SYSTEMS II Z TRANSFORM AND THE DISCRETE FOURIER TRANSFORMIII DIGITAL FILTER DESIGN TECHNIQUESIV EFFECTS OF FINITE REGISTERS LENGTH IN DIGITAL SIGNAL PROCESSING V HOMOMORPHIC SIGNAL PROCESSING UNIT 1: DISCRETE TIME SIGNALS SYSTEMS ( 14 Hrs )

Discrete – time signals sequence – linear shift invariant system – stability and casualty –linear constants – co-efficient difference equations – frequency domain representation of discretetime system and signals. Two dimensional sequences and systems sampling of continuous timesignals.

UNIT 2: Z TRANSFORM AND THE DISCRETE FOURIER TRANSFORM ( 14 Hrs )

Z transform – inverse Z transform – Z transform theorems and properties – system function– representations of periodic sequences – the discrete Fourier series – properties of discreteFourier series – summary of properties of the DFS representation of periodic sequences –sampling the Z-transform – Fourier representation of finite duration sequence – the discreteFourier transform – properties of the discrete Fourier transform – summary of properties of theDFT - linear convolution using the DFT

UNIT 3: DIGITAL FILTER DESIGN TECHNIQUES ( 14 Hrs )

Design of IIR digital filter from analog filter – design examples: analog to digital transfor-mation – properties of FIR digital filters – design of FIR filters using windows – a comparisonof IIR & FIR digital filters.

UNIT 4: EFFECTS OF FINITE REGISTERS LENGTH IN DIGITAL SIGNALPROCESSING ( 15 Hrs )

Introduction – effect of number representation on quantization – finite – register – length –effects in realization of IIR digital filters – finite - register– length – effects in realization ofFIR digital filters – effect of finite register length in discrete Fourier transform computations.

UNIT 5: HOMOMORPHIC SIGNAL PROCESSING ( 15 Hrs )

Generalized superposition – multiplicative homomorphic system -homomorphic imageprocessing- homomorphic systems for convolution – properties of the complex cepstrum –computational realizations of the characteristic system D* - applications of homomorphicdeconvolutions.

Reference Books:

Digital signal processing: V.Oppenheim and Ronald W. Schafer.

Digital signal processing: Proakias

80

4403 -D - DIGITAL SIGNAL PROCESSING





I A. 1. Define : Unit sample signal , Unit step signal

2. Define : Linear Time Invariant system

B. 1. Differentiate Time Invariant & Time varient systems

2. Test the stability of the following systems y (n) = x( -n-2)

II A. 1. What is Linear convolution & write its properties

2. Perform the circular convolution of the two sequences X1 ( n ) =

{ 1,2,3 } & X2 ( N ) = { 4,5,6 }

B. 1. Why FFT ( Fast Fouries Transform ) is needed

2. Write the steps involved in FIR filter design.

III A. 1. Compose the rectangular window & hamming window

2. What is gibb’s phenomenon.

B 1. Write the characteristics of rectangular window and sketch themagnitude window.

2. write the equation for hamming window function.

IV A. 1. Mention the important features of IIR filter.

2. List some of the finite word length effects in digital filters.

B. 1. Compare the fixed point & floating point arithmetic

2. What is limit cycle.

V A. 1. Sketch the various tolerance limits to approximate an ideal low pass & high pass filter.

2. What are the energy & power siganls

B. 1. List the different types of structures for realizing of FIR systems.

2. Convert the analog filter with system function Ha ( s) into difital filterusing bilinear transformation.

81

4307 - COMMUNICATION SYSTEMS LAB

VI TERM ( APPLIED COURSE )


1. Construct a Transistor video amplifier and find the frequency response characteristic.

2. Construction and testing of a sync separator.

3. Construction and testing of a saw tooth generator for 3 different time constant.

4. To find deflection sensitivity of TV picture tube.

5. Study of TV receiver adjustments. Assembling and testing of Yagi antenna.

8. Simple faults in sound section and rectification.

11. Simple faults in video section and rectification.

12. Simple faults in picture tube deflection section and rectification.

13. Study of CCTV system.

14. Study of Composite video signal from video IF IC .

15. Observe the waveforms of FSK Transmitter and Receiver.

16. Observe the waveforms of PSK Transmitter and Receiver.

17. Setting up a fiber optic Analog link.

18. Setting up a fiber optic Digital link.

19. Losses in Optical Fiber

20. Measurement of Numerical Aperture

21. TDM of Signals.

22. Manchester Coding and Decoding

23. Analog Transmitter and Receiver.

Scheme of Examination

S.No Topics Marks

1 Exercise 7 0

2 Viva – Voice 5

Total 7 5

82

4404 -A - INDUSTRIAL ELECTRONICS LAB

VI TERM ( Diversified -IV )


1. Construct A.C. timer circuit using transistor to operate a switching circuit after a time–delay. (Time can be specified depending on the components available). Test its perfor-mance with a standard stopwatch.

2. Construct a D.C. timer circuit-using transistor to operate a switching circuit after a time-delay. Test its performance with a standard stopwatch.

3. Construct a sequence timer using 555-timer chip.

4. Construct and test the performance of the photo relay using LDR.

5. Construct a bias controlled half rectifier using SCR. Plot the firing angle output currentgraph for resistive load.

6. Construct and test the performance of a bias controlled full wave rectifier using SCR forresistive load. Plot the output waveform for different firing angles.

7. Construct and test the performance of a SCR triggering circuit using UJT.

8. Construct & test the performance of a battery charger circuit using SCR.

9. Construct and test the performance of a SCR speed control circuit for universal motor.

10. Speed control of stepper motor using micro controller.

11. Construct and test SCR regulated DC power supply.

12. PSPICE Simulation of SCR circuit.

13. Construct and test TL emergy light.

14. Construct and test lamp dimmer using TRIAC.

15. Simulation of traffic light controller using PLC.

16. Construct and test temperature controller using UJT and TRIAC(using a thermistor).

17. Study of servo stabilizer.

18. Study of UPS.


S.No Topics Marks

1 Exercise 7 0

2 Viva – Voice 5

Total 7 5

83

4308 – PROJECT WORK, ENTREPRENEURSHIP AND PERSONAL SKILLS

( VI TERM Applied course )

4 Hours /Week Total Hrs : 48

I. PROJECT WORK - INCLUDING REPORT

1. PROJECT WORK

A Project is a task in a selected area engaged by an individual or group of Studentswith guidance of one or two faculty and / or from an Industry.

2. REPORT

The students should submit project report for evaluation. The project report shouldcontain synopsis, description, detailed work and drawings, cost particulars, performance studyreport, any improvements needed, conclusion and bibliography.

II. PERSONAL SKILLS

The student is evaluated in the following areas are related to his project.

1. COMMUNICATION SKILL (PROJECT PRESENTATION)

Each student is to give a seminar in the project work.Presentation by OHP / Powerpoint is preferred.

2. GROUP DISCUSSION

The students will be evaluated by 1.participation 2. Respecting others view 3. Accept-ing ones own mistakes 4. Reaction 5. Team sprit.

3. INTERVIEW / VIVA VOCE

The students will be asked to answer the questions for the interview may be the projector any other relevant subject. regarding the project in English only.

III. ENTREPRENEURSHIP

Objective type questions may be asked in the Examination for a period of 1Hour.

MAJOR DIVISIONS

UNIT 1 Entrepreneurship

UNIT 2 Business Counseling

UNIT 3 Finance

UNIT 4 Marketing

UNIT 5 Industry

84

UNIT 1 : ENTREPRENEURSHIP

Definitions of Entrepreneurship – Characteristics of Entrepreneurship – Traits of aentrepreneur – Types of entrepreneur – Functions of an entrepreneur – Behavioral patterns ofentrepreneurs.

UNIT 2 : BUSINESS COUNSELLING

Business opportunity guidance – Project identification – Techno-economic survey –Market research – Project formulation – Project selection – Project report format – Contents ofproject report.

UNIT 3 : FINANCE

Sources of finance – Types of loans available – Financial Institutions – Institutionsassisting entrepreneurs.

UNIT 4 : MARKETING

Marketing channels – Channel design – choice of channel – Alternative channels ofdistribution – Mercantile agents – Merchant middlemen – Wholesalers – Retailers.

UNIT 5 : INDUSTRY

Types of industries – Steps for starting a small industry – preparation of project report– Guidelines, procedures, and formalities for registration – Selection of type of organisation –Sole proprietorship – partnership – Joint stock company – Factors influencing the choice of anorganisation.

SCHEME OF EXAMINATIONS

` S.No Topics Marks

1 Exercise 7 0

2 Viva – Voice 5

Total 7 5

Documents

1. FOUNDATION COURSE - nptc.ac.in · 1. FOUNDATION COURSE Course Code Course Name Credits 0101 English – I 3 0102 Basics of Computer Science – I 4 0103 Mathematics – I 7