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Copyright © 2011, Elsevier Inc. All rights Reserved. 1 Chapter 3 Methods for Monitoring and Measuring Cleanliness of Surfaces Rajiv Kohli

1 Copyright © 2011, Elsevier Inc. All rights Reserved. Chapter 3 Methods for Monitoring and Measuring Cleanliness of Surfaces Rajiv Kohli

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Page 1: 1 Copyright © 2011, Elsevier Inc. All rights Reserved. Chapter 3 Methods for Monitoring and Measuring Cleanliness of Surfaces Rajiv Kohli

Copyright © 2011, Elsevier Inc. All rights Reserved. 1

Chapter 3

Methods for Monitoring and Measuring Cleanliness of

Surfaces

Rajiv Kohli

Page 2: 1 Copyright © 2011, Elsevier Inc. All rights Reserved. Chapter 3 Methods for Monitoring and Measuring Cleanliness of Surfaces Rajiv Kohli

Copyright © 2011, Elsevier Inc. All rights Reserved. 2

FIGURE 3.1 Dust tape test kit. Courtesy of Elcometer, U.K.

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FIGURE 3.2 Contact angle as an indicator of surface cleanliness. The right figure has a lowcontact angle indicating a clean surface, while the left figure shows a high contact angle ona contaminated surface.

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FIGURE 3.3 Schematic diagram of the DOCC system [82].

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FIGURE 3.4 MESERAN calibration curve for Krytox fluorinated grease on 304 L stainless steel [88].

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FIGURE 3.5 GA-FTIR device on a tripod oriented to analyze the underside of a wing of an A-10aircraft [105].

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FIGURE 3.6 Integrated circuit in (a) bright field, (b) dark field, and (c) differential interferencecontrast with reflected light. Courtesy of Nikon, Japan.

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FIGURE 3.7 Appearance of TEM asbestos specimens prepared by direct-transfer (left) andindirect-transfer (right) preparation methods from an air filter collected during abrasion ofa gasket. Courtesy of E. Chatfield.

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FIGURE 3.8 Schematic arrangement of a hot-electron microcalorimeter system.

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FIGURE 3.9 Microcalorimeter EDS spectrum of a tungsten particle on a silicon substrate [176].Courtesy of NIST.

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FIGURE 3.10 Schematic diagram of a plasma chromatography-mass spectrometry system for monitoring cleanliness of surfaces [212].

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FIGURE 3.11 High-sensitivity depth profiling of phosphorus on a silicon substrate. A sputter ratehigher than 0.5 μm/min and a detection limit of 5 1013 at/ cm3 (1 ppb) were achieved [246].

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FIGURE 3.12 Raman image of polystyrene (PS) beads demonstrates the spatial resolution of thetechnique at sub-micrometer scale. Courtesy of Horiba, Japan.

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FIGURE 3.13 White contaminant particle found in a factory producing resin identified as a titanium

species by micro-XRF, and TiO2 by Raman microscopy. (a) Optical image. (b) Micro-XRF

image. (c) Raman spectrum of the particle and reference TiO2 spectrum. Courtesy of Horiba, Japan.

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FIGURE 3.14 Micro-CT scan of a used filter from a vacuum cleaner with dust particles. (a) SEMsecondary electron image. (b) X-ray image through the sample; (c) 3D rendered front view withthe particles shown in red; (d) semi-transparent 3D rendered side view. Courtesy of SKYSCAN,Kontich, Belgium.

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FIGURE 3.15 Hafnium silicate spectrum with Ir–Lα source irradiation. The sample was a 2 nm

hafnium silicate film intentionally contaminated with 5 × 1011 atoms of Ti, Cr, Fe, Ni, and Cu [300].