Publication# 08140 Rev. H Amendment /0Issue Date: May 19952-44

AdvancedMicro

DevicesAm27C512512 Kilobit (65,536 x 8-Bit) CMOS EPROM

FINAL

DISTINCTIVE CHARACTERISTICSn Fast access time

55 nsn Low power consumption

20 m A typical CMOS standby currentn JEDEC-approved pinout n Single +5 V power supplyn 10% power supply tolerance availablen 100% Flashrite programming

Typical programming time of 8 seconds

n Latch-up protected to 100 mA from 1 V toVCC + 1 V

n High noise immunityn Versatile features for simple interfacing

Both CMOS and TTL input/outputcompatibility

Two line control functionsn Standard 28-pin DIP, PDIP, 32-pin TSOP, and

PLCC packages

GENERAL DESCRIPTIONThe Am27C512 is a 512 K-bit ultraviolet erasable pro-grammable read-only memory. It is organized as 64Kwords by 8 bits per word, operates from a single +5 Vsupply, has a static standby mode, and features fast sin-gle address location programming. Products are avail-able in windowed ceramic DIP packages as well as plas-tic one time programmable (OTP) PDIP, TSOP, andPLCC packages.Typically, any byte can be accessed in less than 55 ns,allowing operation with high-performance microproces-sors without any WAIT states. The Am27C512 offersseparate Output Enable (OE) and Chip Enable (CE)

controls, thus eliminating bus contention in a multiplebus microprocessor system.AMDs CMOS process technology provides high speed,low power, and high noise immunity. Typical power con-sumption is only 80 mW in active mode, and 100 m W instandby mode.All signals are TTL levels, including programming sig-nals. Bit locations may be programmed singly, in blocks,or at random. The Am27C512 supports AMDs Flashriteprogramming algorithm (100 m s pulses) resulting in atypical programming time of 8 seconds.

BLOCK DIAGRAM

VSSVCC

Output EnableChip Enable

andProg Logic

YDecoder

XDecoder

CE

OE/VPP OutputBuffers

YGating

524,288Bit CellMatrix

A0A15AddressInputs

Data OutputsDQ0DQ7

08140H-1

AMD

2-45Am27C512

PRODUCT SELECTOR GUIDEFamily Part No. Am27C512

Ordering Part No:VCC 5% -55 -255

VCC 10% -70 -90 -120 -150 -200

Max Access Time (ns) 55 70 90 120 150 200 250CE (E) Access Time (ns) 55 70 90 120 150 200 250OE (G) Access Time (ns) 55 40 40 50 50 75 75

CONNECTION DIAGRAMSTop View

DIP

Notes:1. JEDEC nomenclature is in parentheses.

PLCC

A15 VCC

A9A11

A12 A14

A8

DQ7

1

3

5

7

9

11

12

10

2

4

8

6

13

14

28

26

24

22

20

18

17

19

27

25

21

23

16

15

A7

A6A5A4

A3

A2A1

A0

VSS

DQ2DQ1DQ0

OE (G)/VPPA10CE (E)

DQ6DQ5DQ4DQ3

A13

08140H-2

08140H-3

1 31 302345678910111213

17 18 19 20161514

292827262524232221

32A6A5A4A3A2A1A0NC

DQ0

A8A9A11NCOE (G)A10CE (E)DQ7

A7 A12

A15

DU

VCC

A14

A13

DQ1

DQ2 VS

S

DU

DQ3

DQ4 DQ

5

DQ6

/VPP

TSOP*

08140H-4*Contact local AMD sales office for package availability.

1

16

23456789101112131415

32

17

3130292827262524232221201918

OE/VPPA11A9A8

A13NC

A14

VCC

A15NC

A12A7A6A5A4A3

NCA10CE/PGMO7O6O5O4O3

O2VSS

O1O0NCA0A1A2

Standard Pinout

AMD

2-46 Am27C512

LOGIC SYMBOLPIN DESIGNATIONS

A0A15

CE (E)

OE (G)/VPP

8DQ0DQ7

A0A15 = Address Inputs CE (E) = Chip Enable Input DQ0DQ7 = Data Inputs/Outputs DU = No External Connection

(Do Not Use) NC = No Internal Connection OE (G)/VPP = Output Enable Input/

Program Voltage Input VCC = VCC

Supply VoltageVSS = Ground

08140H-5

16

AMD

2-47Am27C512

ORDERING INFORMATIONUV EPROM Products

PACKAGE TYPED = 28-Pin Ceramic DIP (CDV028)

Valid Combinations

AMD Standard products are available in several packages and operating ranges. The order number (Valid Combination) isformed by a combination of:

BCD-55AM27C512

OPTIONAL PROCESSINGBlank = Standard Processing

B = Burn-in

TEMPERATURE RANGEC = Commercial (0 C to +70 C)I = Industrial (40 C to +85 C)E = Extended Commercial (55 C to +125 C)

SPEED OPTIONSee Product Selector Guide and Valid Combinations

DEVICE NUMBERAm27C512512 Kilobit (65,536 x 8-Bit) CMOS UV EPROM

AM27C512-70 DC, DCBAM27C512-90AM27C512-120AM27C512-150AM27C512-200AM27C512-250AM27C512-255

DC, DCB, DI, DIB,DE, DEB

Valid CombinationsValid Combinations list configurations planned to besupported in volume for this device. Consult the lo-cal AMD sales office to confirm availability of specificvalid combinations and to check on newly releasedcombinations.

AM27C512-55 DC

DC, DCB, DI, DIB

AMD

2-48 Am27C512

ORDERING INFORMATIONOTP Products

DEVICE NUMBERAm27C512512 Kilobit (65,536 x 8-Bit) CMOS OTP EPROM

Valid Combinations list configurations planned to besupported in volume for this device. Consult the lo-cal AMD sales office to confirm availability of specificvalid combinations and to check on newly releasedcombinations.

Valid CombinationsAM27C512-70AM27C512-90AM27C512-120AM27C512-150AM27C512-200AM27C512-255

PACKAGE TYPEP = 28-Pin Plastic DIP (PD 028)J = 32-Pin Rectangular Plastic Leaded Chip

Carrier (PL 032)E = 32-Pin TSOP (TS 032)

AMD Standard products are available in several packages and operating ranges. The order number (Valid Combination) isformed by a combination of:

Valid Combinations

CP-70AM27C512

OPTIONAL PROCESSINGBlank = Standard Processing

TEMPERATURE RANGEC = Commercial (0 C to +70 C)I = Industrial (40 C to + 85 C)

SPEED OPTIONSee Product Selector Guide and Valid Combinations

PC, JC, ECPI, JI, EI

AMD

2-49Am27C512

FUNCTIONAL DESCRIPTIONErasing the Am27C512In order to clear all locations of their programmed con-tents, it is necessary to expose the Am27C512 to anultraviolet light source. A dosage of 15 W seconds/cm2is required to completely erase an Am27C512. Thisdosage can be obtained by exposure to an ultravioletlampwavelength of 2537 A with intensity of12,000 m W/cm2 for 15 to 20 minutes. The Am27C512should be directly under and about one inch from thesource and all filters should be removed from the UVlight source prior to erasure.It is important to note that the Am27C512 and similardevices will erase with light sources having wavelengthsshorter than 4000 A . Although erasure times will bemuch longer than with UV sources at 2537 A , exposureto fluorescent light and sunlight will eventually erase theAm27C512 and exposure to them should be preventedto realize maximum system reliability. If used in such anenvironment, the package window should be coveredby an opaque label or substance.Programming the Am27C512Upon delivery or after each erasure the Am27C512 hasall 524,288 bits in the ONE or HIGH state. ZEROsare loaded into the Am27C512 through the procedureof programming.The programming mode is entered when 12.75 V 0.25V is applied to the OE/VPP and CE is at VIL.For programming, the data to be programmed is applied8 bits in parallel to the data output pins.The Flashrite algorithm reduces programming time byusing 100 m s programming pulses and by giving eachaddress only as many pulses as is necessary in order toreliably program the data. After each pulse is applied toa given address, the data in that address is verified. Ifthe data does not verify, additional pulses are given untilit verifies or the maximum is reached. This process is re-peated while sequencing through each address of theAm27C512. This part of the algorithm is done atVCC = 6.25 V to assure that each EPROM bit is pro-grammed to a sufficiently high threshold voltage. Afterthe final address is completed, the entire EPROM mem-ory is verified at VCC = 5.25 V.Please refer to Section 6 for programming flow chartand characteristics.

Program InhibitProgramming of multiple Am27C512 in parallel with dif-ferent data is also easily accomplished. Except for CE,all like inputs of the parallel Am27C512 may be com-mon. A TTL low-level program pulse applied to anAm27C512 CE input and OE/VPP = 12.75 V 0.25 V, will

program that Am27C512. A high-level CE input inhibitsthe other Am27C512 devices from being programmed.Program VerifyA verify should be performed on the programmed bits todetermine that they were correctly programmed. Theverify should be performed with CE at VIL and OE/VPPat VIL. Data should be verified tDV after the falling edgeof CE.Auto Select ModeThe auto select mode allows the reading out of a binarycode from an EPROM that will identify its manufacturerand type. This mode is intended for use by programmingequipment for the purpose of automatically matchingthe device to be programmed with its correspondingprogramming algorithm. This mode is functional in the25 C 5 C ambient temperature range that is requiredwhen programming the Am27C512.To activate this mode, the programming equipmentmust force 12.0 0.5 V on address line A9 of theAm27C512. Two identifier bytes may then be se-quenced from the device outputs by toggling addressline A0 from VIL to VIH. All other address lines must beheld at VIL during auto select mode.Byte 0 (A0 = VIL) represents the manufacturer code, andbyte 1 (A0 = VIH), the device code. For the Am27C512,these two identifier bytes are given in the Mode SelectTable. All identifiers for manufacturer and device codeswill possess odd parity, with the MSB (DQ7) defined asthe parity bit.Read ModeThe Am27C512 has two control functions, both of whichmust be logically satisfied in order to obtain data at theoutputs. Chip Enable (CE) is the power control andshould be used for device selection. Output Enable(OE/VPP) is the output control and should be used togate data to the output pins, independent of device se-lection. Assuming that addresses are stable, addressaccess time (tACC) is equal to the delay from CE to out-put (tCE). Data is available at the outputs tOE after the fall-ing edge of OE/VPP, assuming that CE has been LOWand addresses have been stable for at least tACCtOE.Standby ModeThe Am27C512 has a CMOS standby mode which re-duces the maximum VCC current to 100 m A. It is placed inCMOS-standby when CE is at VCC 0.3 V. TheAm27C512 also has a TTL-standby mode which re-duces the maximum VCC current to 1.0 mA. It is placed inTTL-standby when CE is at VIH. When in standby mode,the outputs are in a high-impedance state, independentof the OE input.

AMD

2-50 Am27C512

Output OR-TieingTo accommodate multiple memory connections, a two-line control function is provided to allow for:n Low memory power dissipationn Assurance that output bus contention will not occurIt is recommended that CE be decoded and used as theprimary device-selecting function, while OE/VPP bemade a common connection to all devices in the arrayand connected to the READ line from the system controlbus. This assures that all deselected memory devicesare in low-power standby mode and that the output pinsare only active when data is desired from a particularmemory device.

System ApplicationsDuring the switch between active and standby condi-tions, transient current peaks are produced on the risingand falling edges of Chip Enable. The magnitude ofthese transient current peaks is dependent on the out-put capacitance loading of the device. At a minimum, a0.1-m F ceramic capacitor (high frequency, low inherentinductance) should be used on each device betweenVCC and VSS to minimize transient effects. In addition, toovercome the voltage drop caused by the inductive ef-fects of the printed circuit board traces on EPROM ar-rays, a 4.7-m F bulk electrolytic capacitor should be usedbetween VCC and VSS for each eight devices. The loca-tion of the capacitor should be close to where the powersupply is connected to the array.

MODE SELECT TABLECE OE/VPP A0 A9 Outputs

Read VIL VIL X X DOUT

Output Disable X VIH X X Hi-Z

Standby (TTL) VIH X X X Hi-ZStandby (CMOS) VCC 0.3 V X X X Hi-ZProgram VIL VPP X X DIN

Program Verify VIL VIL X X DOUT

Program Inhibit VIH VPP X X Hi-Z

ManufacturerCode VIL VIL VIL VH 01H

Device Code VIL VIL VIH VH 91H

Auto Select(Note 3)

ModePins

Notes:1. VH = 12.0 0.5 V2. X = Either VIH or VIL3. A1A8 = A10A15 = VIL4. See DC Programming Characteristics for VPP voltage during programming.

AMD

2-51Am27C512

ABSOLUTE MAXIMUM RATINGSStorage Temperature

OTP Products 65 C to +125 C. . . . . . . . . . . . . . . All Other Products 65 C to +150 C. . . . . . . . . . . .

Ambient Temperaturewith Power Applied 55 C to +125 C. . . . . . . . . . . . . Voltage with Respect To VSS

All pins except A9,VPP,VCC 0.6 V to VCC + 0.5 V. . . . . . . . . . . . . . . A9

and VPP 0.6 V to +13.5 V. . . . . . . . . . . . . . . . VCC 0.6 V to +7.0 V. . . . . . . . . . . . . . . . . . . . . . .

Notes:1. Minimum DC voltage on input or I/O pins is 0.5 V. During

transitions, the inputs may overshoot VSS to 2.0 V for pe-riods of up to 20 ns. Maximum DC voltage on input and I/Opins is VCC + 0.5 V which may overshoot to VCC + 2.0 V forperiods up to 20 ns.

2. For A9 and VPP the minimum DC input is 0.5 V. Duringtransitions, A9 and VPP may overshoot VSS to 2.0 V forperiods of up to 20 ns. A9 and VPP

must not exceed 13.5 Vfor any period of time

.

Stresses above those listed under Absolute Maximum Rat-ings may cause permanent damage to the device. This is astress rating only; functional operation of the device at theseor any other conditions above those indicated in the opera-tional sections of this specification is not implied. Exposure ofthe device to absolute maximum rating conditions for ex-tended periods may affect device reliability.

OPERATING RANGESCommercial (C) Devices

Ambient Temperature (TA) 0 C to +70 C. . . . . . . Industrial (I) Devices

Ambient Temperature (TA) 40 C to +85 C. . . . . Extended Commercial (E) Devices

Ambient Temperature (TA) 55 C to +125 C. . . . Supply Read Voltages

VCC for Am27C512-XX5 +4.75 V to +5.25 V. . . . . VCC

for Am27C512-XX0 +4.50 V to +5.50 V. . . . . VCC for Am27C512-55 +4.75 V to +5.25 V. . . . . .

Operating ranges define those limits between which the func-tionality of the device is guaranteed.

AMD

2-52 Am27C512

DC CHARACTERISTICS over operating range unless otherwise specified.(Notes 1, 2 and 4)

ParameterSymbol Parameter Description Test Conditions Min Max Unit

VOH Output HIGH Voltage IOH = 400 m A 2.4 V

VOL Output LOW Voltage IOL = 2.1 mA 0.45 V

VIH Input HIGH Voltage 2.0 VCC + 0.5 V

VIL Input LOW Voltage 0.5 +0.8 V1.0 m A

ICC1 VCC Active Current CE = VIL, f = 10 MHz, IOUT = 0 mA, 30 mA(Note 3)

ICC2 VCC TTL Standby Current CE = VIH 1.0 mA

ICC3 VCC CMOS Standby Current CE = VCC 0.3 V 100 m A

C/I Devices

E Devices

1.0

5.0

ILI Input Load Current VIN = 0 V to +VCC

m A

ILO Output Leakage Current VOUT = 0 V to +VCC

Notes:1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP.2. Caution: The Am27C512 must not be removed from (or inserted into) a socket when VCC or VPP is applied.3. ICC1 is tested with OE/VPP = VIH to simulate open outputs.4. Minimum DC Input Voltage is 0.5 V. During transitions, the inputs may overshoot to 2.0 V for periods less than 20 ns.

Maximum DC Voltage on output pins is VCC + 0.5 V, which may overshoot to VCC + 2.0 V for periods less than 20 ns.

75 50 25 0 25 50 75 100 125 150

30

25

20

15

10

Frequency in MHz1 2 3 4 5 6 7 8 9 10

30

25

20

15

10

Supp

ly Cu

rrent

in

mA

Supp

ly Cu

rrent

in

mA

Temperature in CFigure 1. Typical Supply Current

vs. FrequencyVCC = 5.5 V, T = 25 C

Figure 2. Typical Supply Currentvs. Temperature

VCC = 5.5 V, f = 10 MHz08140H-6 08140H-7

AMD

2-53Am27C512

CAPACITANCEParameter Test

Symbol Parameter Description Conditions Typ Max Typ Max Typ Max Typ Max Unit

CIN Input Capacitance VIN = 0 10 12 10 12 9 12 6 10 pF

COUT Output Capacitance VOUT = 0 12 14 10 13 9 12 6 10 pF

Notes:1. This parameter is only sampled and not 100% tested.2. TA = +25 C, f = 1 MHz

CDV028 PL 032 PD 028TS 032

SWITCHING CHARACTERISTICS over operating range unless otherwise specified(Notes 1, 3, 4 and 5)

Parameter TestJEDEC Standard Description Conditions -55 -70 -90 -120 -150 -200 -255 UnittAVQV tACC Address to CE = OE = Min

Output Delay VIL Max 55 70 90 120 150 200 250 nstELQV tCE Chip Enable to OE = VIL Min

Output Delay Max 55 70 90 120 150 200 250 nstGLQV tOE Output Enable to CE = VIL Min

Output Delay Max 35 40 40 50 50 75 75 nstEHQZ tDF Min tGHQZ (Note 2) Max 25 25 30 30 30 30 30 ns

tAXQX tOH Output Hold from Min 0 0 0 0 0 0 0Addresses, CE, Max nsor OE, whichever occurred first

ParameterSymbols

Am27C512

Notes:1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP.2. This parameter is only sampled and not 100% tested.3. Caution: The Am27C512 must not be removed from (or inserted into) a socket or board when VPP or VCC is applied.4. Output Load: 1 TTL gate and CL = 100 pF

Input Rise and Fall Times: 20 nsInput Pulse Levels: 0.45 V to 2.4 VTiming Measurement Reference Level: 0.8 V and 2 V inputs and outputs

For the Am27C512-55:Output Load: 1 TTL gate and CL = 30 pFInput Rise and Fall Times: 20 nsInput Pulse Levels: 0 V to 3 VTiming Measurement Reference Level: 1.5 V for inputs and outputs

Chip Enable HIGH orOutput Enable HIGH,whichever comesfirst, to Output Float

AMD

2-54 Am27C512

SWITCHING TEST CIRCUIT

DeviceUnderTest

CL

+5.0 V

CL = 100 pF including jig capacitance (30 pF for -55)

6.2 kW

2.7 kW

Diodes = IN3064or Equivalent

08140H-8

SWITCHING TEST WAVEFORM

2.4 V

0.45 V

2.0 V0.8 V

2.0 V0.8 VTest Points

Input Output

3 V

0 V1.5 V 1.5 V

Input Output

Test Points

AC Testing: Inputs are driven at 2.4 V for a logic 1 and 0.45 V for a logic 0. Input pulse rise and fall times are 20 ns.

08140H-9

AC Testing: Inputs are driven at 3.0 V for a logic 1 and 0 V for a logic 0. Input pulse rise and fall times are 20 ns for -55 device.

AMD

2-55Am27C512

KEY TO SWITCHING WAVEFORMS

Must BeSteady

MayChangefrom H to L

MayChangefrom L to H

Does Not Apply

Dont CareAny ChangePermitted

Will BeSteady

Will BeChangingfrom H to L

Will Be Changing from L to H

ChangingStateUnknown

Center Line is HighImpedenceOff State

WAVEFORM INPUTS OUTPUTS

KS000010

SWITCHING WAVEFORMS

Notes:1. OE/VPP may be delayed up to tACCtOE after the falling edge of the addresses without impact on tACC.2. tDF is specified from OE or CE, whichever occurs first.

08140H-10

Addresses

CE

OE/VPP

Output

Addresses Valid

High Z High Z

tCE

Valid Output

2.4

0.45

2.00.8

2.00.8

tACC(Note 1)

tOEtDF

(Note 2)tOH