The Future of Urban Mobility Connected, Autonomous,Electric and Wireless

Thomas WürzSr. Director EngineeringQUALCOMM CDMA Technologies GmbH12 April 2018

2Qualcomm Technologies, Inc.

Intelligent connectivity

Greaterautonomy

Increasing electrification

Sharingeconomy

Major Trends Influencing the Future of Automotive

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Dynamic EV Charging (DEVC)

Semi-Dynamic EV Charging

Static EV Charging

Wireless charging

Energy & Environment

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Power Transfer Components

Vehicle controller

Power supply

AC‐DC converter/ power factorcorrection (PFC)

InverterTuning and matching Base bad /

Primary coil

Vehicle pad / Secondary coil

DC to DC converter

Vehicle battery

AC source 1 phase/3 phase

Tuning and rectifier

Primary side

Secondary side

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Static Charging System Specification

Maximum Input Power : 3.7/7.4/11 kWAlignment Tolerance X: ±75 mmAlignment Tolerance Y: ±100 mmZ-Gap: Z1 = 100-150 mm

Z2 = 140-210 mmZ3 = 170-250 mm

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Wireless Power Transfer Magnetics Simulation• B/H field simulation (ANSYS MAXWELL)

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DEVC System Design

DSRC

DSRCStub Stub

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DEVC System Power Flow

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Wireless Power Transfer Magnetics Simulation• DEVC track – Magnetic flux density (ANSYS MAXWELL)

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DEVC - System Specification

Maximum Power into Vehicle: 20 kWMaximum Speed: 120 km/hAlignment Tolerance Y: ±200 mm

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20 kW DEVC

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DEVC Primary Side Control

Vehicle Status

Stub StatusPrimary Side Status

Base Pad StatusInput Power

Output Power

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DEVC Special Design FeaturesBase Controller

Base pad needs to turn on and off in <50 ms at 120 km/h◦ Base pad automatically detects when vehicle is close◦ Base pad turns on to transfer power ◦ Base pad automatically turns off once vehicle leaves

Base pads act independently to cover many use cases

• Automatic base control for high speed

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DEVC Special Design Features: Magnetics

Multi-coil base pad magnetics are designed to always couple power along the track to minimize power variation

DD vehicle pad gives highest coupling for its size and Z-gap

Vehicle pad magnetics compatible with Qualcomm Halo™ static charging reference designs

• Multi-coil base pad magnetics with double D (DD) vehicle pad magnetics

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DEVC Trailer (https://www.qualcomm.com/videos/devc-an-invention-story)

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Communication in WEVC Systems

Static Charging• WiFi 802.11n: between base controller and vehicle controller Step 1: Qualcomm proprietary messaging Step 2: migration to ISO15118 conductive plus inductive modifications Step 3: adoption of full inductive ISO15118

• Bluetooth: between vehicle and smart phone• CAN: between vehicle and vehicle controller• Ethernet:/LTE: betwen base controller and infrastructure

DEVC• WiFi 802.11p (DSRC/WSMP): betweeen primary side and secondary side• CAN: between stubs• Ethernet: between roadside power supply cabinets and logging PC

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Standardization of Communication for Wireless Power Transfer

ISO15118 – 2: 2018 Road vehicles - Vehicle-to-Grid Communication Interface (not yet

published)

• Includes wireless power transfer

• Main objective is interoperability

• Avoid mistakes of DC Charging (CCS, CHaDeMo, Tesla, etc.) for second edition

• Agree on message catalog

SAE J2954 JSON messages for automatic control (published for SAE members only)

• Preliminary testing of WPT message catalog with various charging systems via

SAE JSON messages

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Qualcomm Halo – A Complete WEVC Solution

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Powering the next wave of electric cars

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CES, EVS27, eCarTech

Follow us on:For more information, visit us at: www.qualcomm.com & www.qualcomm.com/blog

Nothing in these materials is an offer to sell or license any of the technology, components or devices referenced herein.

Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Qualcomm Halo is a trademark of Qualcomm Incorporated. All Qualcomm Incorporated trademarks are used with permission. Other product and brand names may be trademarks or registered trademarks of their respective owners.

References in this presentation to “Qualcomm” may mean Qualcomm Incorporated, Qualcomm Technologies, Inc., and/or other subsidiaries or business units within the Qualcomm corporate structure, as applicable.

Qualcomm Incorporated includes Qualcomm’s licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm’s engineering, research and development functions, and substantially all of its product and services businesses, including its semiconductor business, QCT.

Qualcomm Halo WEVC technology is licensed by Qualcomm Incorporated. Prototype charging systems, functional prototypes and reference designs are products of Qualcomm Technologies, Inc.

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