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RECENT DEVELOPMENTS ON MICRO-P ATTERN GASEOUS DETECTORS TECHNOLOGY Gabriele Croci (CERN & University of Siena) on behalf of RD51 Collaboration 11 th ICATTP Como (Villa Olmo) 05-09/10/2009 Electrons Ions 60 % 40 % Micromegas GEM THGEM MHSP Ingrid 0.18 mm CMOS VLSI CMOS high density readout electronics

0.18 mm CMOS VLSI -PATTERN GASEOUS DETECTORS …rd51-public.web.cern.ch/RD51-Public/Documents/Conference... · Ageing Gas, Gas system, ... Set of tiny metal strips engraved on a thin

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RECENT DEVELOPMENTS ON

MICRO-PATTERN GASEOUS DETECTORS

TECHNOLOGY

Gabriele Croci (CERN & University of Siena) on behalf of RD51 Collaboration

11th ICATTP – Como (Villa Olmo) – 05-09/10/2009

Electrons

Ions

60 %

40 %

Micromegas GEM THGEM MHSP Ingrid

0.18 mm CMOS VLSI

CMOS high density

readout electronics

OUTLINE

Short history of gaseous detectors

Introduction to MPGDs

GEM and MicroMegas

Current and future trends of MPGDs

Large Area detectors

RD51 collaboration

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SHORT HISTORY OF GASEOUS DETECTORS11th

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(MICRO-PATTERN) GAS DETECTORS11th

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Advantages of gas detectors:

• low radiation length

• large areas at low price

• flexible geometry

• spatial, energy resolution …

Problem:

• rate capability limited by space charge defined by

the time of evacuation of positive ions

Solution Introduction of Micro Pattern Gas

Detectors

• reduction of the size of the detecting cell (limitation

of the length of the ion path) using chemical

etching techniques developed for microelectronics

and keeping at same time similar field shape.

MWPC

MSGC

MGD

scale factor

1

5

10

R. Bellazzini et al.

Semiconductor Industry technology:

• Photolithography

• Etching

• Coating

• Doping

MSGC - MICROSTRIP GAS CHAMBER11th

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Surface charging

Bulk resistivity of the support material

Surface modification by doping or deposition

Ageing

Gas, Gas system, MSGC support, Construction

material

Discharges

Set of tiny metal strips engraved on a thin insulating support,

and alternatively connected as anodes and cathodes, the MSGC

relies for its operation on the same processes of avalanche

Multiplication as the multi-wire devices.

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MSGC - MICROSTRIP GAS CHAMBER

-30

-25

-20

-15

-10

-5

0

5

10

0 10 20 30 40 50 60

Strip number (200 µm pitch)

MSGC Beam Event BW

fwhm~350µm

1.1

1.0

0.9

0.8

0.7

0.6

Re

lati

ve g

ain

6 7 8 9

0.12 3 4 5 6 7 8 9

12 3 4 5

Rate (MHz/mm2)

Vd= -3000V, V

c= -460V

Pestov glass coating

bulk

=1010

cm

bulk

=1011

cm

MSGC

INFN - Pisa

Source: 5.4 KeV Cr X-rays

Ne-DME (50/50)

Vd= -1000V, V

c= -564V

D263 uncoated

surface

=51017 /square

Spatial resolution = 34.5 0.4 mm

2-track resolution ~400 mm

Ne(25)-DME(75)

Vcath= -530 V

Vdrift= -3000 V

Rate capability > 1 MHz/mm2

Energy resolution ~11% for 5.9 keV

Single event display

Surface resistivity !!

MICROMEGAS – MICROMESH GASEOUS

STRUCTURE11th

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Micromesh mounted above readout structure (typically

strips). E field similar to parallel plate detector.

Ea/Ei ~ 50 to secure electron transparency and positive ion

flowback supression.

Y.Giomataris et al, NIM A 376 (1996) 29

Ionanis Giomataris

MICROMEGAS – MICROMESH GASEOUS

STRUCTURE11th

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D.Thers et al NIM A 469 (2001) 133

energy resolution ~ 10%

55 Fe

Ar + 10% C4H10

High voltage [V]

350 450400 500 550 600 650

103

102

104

105

gain

Gain

1

0.9

0.8

0.7

0.6

10-4

10-5

10-6

10-7

10-8

discharge probability

effic

ienc

y

efficiency & discharge probability

High Voltage [V]

1000 10000 20000 30000 Time[min]

ageing:Ar-iC4H10 94-6% up to 24.3mC/mm2

10 years LHC

1

0.8

0.6

1.8*1012 particles/mm2

MICROMEGAS – MICROMESH GASEOUS

STRUCTURE11th

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s = 9 ns

420 V operating point

~3-4.103 Gain

Large efficiency plateau > 400 V

s =70 µm

Spatial resolution < 70 µm

Time resolution : 9 nsD.Thers et al NIM A 469 (2001) 133

GEM - GAS ELECTRON MULTIPLIER11th

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Induction gap

e-

e-

I+

70 µm

55 µm

5 µm

50 µm

Thin, metal coated polyimide foil perforated

with high density holes.

Electrons are collected on patterned readout board.

A fast signal can be detected on the lower GEM electrode

for triggering or energy discrimination.

All readout electrodes are at ground potential.

Positive ions partially collected on the GEM electrodes.

Electrons

Ions

60 %

40 %

Fabio Sauli

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A. Bressan et al, Nucl. Instr. and Meth. A425(1999)254

Full decoupling of the charge amplification

structure from the charge collection and

readout structure.

Both structures can be independently !

optimized

Compass Totem

Both detectors use three GEM foils in cascade for amplification

to reduce discharge probability by reducing field strenght.

Cartesian

Compass

Small angle

Hexaboard, pads

MICE

Mixed

Totem

33 cm

GEM - GAS ELECTRON MULTIPLIER

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4.5 ns 4.8 ns

5.3 ns9.7 ns

Time resolution

Charge corellation (cartesian readout)

GEM - GAS ELECTRON MULTIPLIER

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Efficiency for minimum ionizing particles with 3 mm gap

Space resolution ~ 40 mm rmsCluster size ~ 500 mm FWHM

A. B

ressan

et al, N

ucl. In

str

. A

nd

Meth

. A

42

5(1

99

9)2

62

Rate capability > 106 Hz mm-2

GAIN ~ 104

Ar-CO2 70-30

1 mC~2.1010 min.ion. particles

C. Altunbas et al, DESY Aging Workshop (Nov. 2001) Nucl. Instr. and Meth. A

J. Benlloch et al, IEEE NS-45(1998)234

3.106 particles/mm2

GEM - GAS ELECTRON MULTIPLIER

CURRENT TRENDS IN MICRO-PATTERN GAS

DETECTORS (TECHNOLOGIES)11th

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• MSGC

• Micromegas

• GEM

• Thick-GEM, Hole-Type Detectors and RETGEM

• MPDG with CMOS pixel ASICs

• Ingrid Technology

Electrons

Ions

60 %

40 %

Micromegas GEM THGEM MHSP Ingrid

0.18 mm CMOS VLSI

CMOS high density

readout electronics

CURRENT AND FUTURE APPLICATIONS OF MPGDS11th

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COMPASS

NA48 / KABES

CAST (CERN Axial Solar Telescope)

nTOF (neutron beam profiles)

Laser MegaJoule

DEMIN (inertial confinement fusion)

Picollo (in-core neutron measurement)

T2K Time Projection Chamber

Linear Collider TPC (?)

ATLAS Muon System Upgrade (?)

COMPASS

LHCb Muon Detector

TOTEM Telescope

HBD (Hadron Blind Detector)

Cascade neutron detection

NA49 - upgrade

X-Ray Polarimeter (XEUS)

GEM TPC for LEGs, BoNuS

Linear Collider TPC (?)

KLOE2 vertex detector

LARGE AREA DETECTORS

DEVELOPMENT OF LARGE AREA DETECTORS11th

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Bulk Micromegas Single mask GEM

Electrons

Ions

60 %

40 %

THGEM

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Read-out

board

Laminated

Photo-image-

able cover lay

frame

Stretched mesh

on frame

Laminated

Photo-

image-able

cover lay

Raw material

Single side copper patterning

Polyimide etching

Copper reduction

Bulk Micromegas Single mask GEM

DEVELOPMENT OF LARGE AREA DETECTORS

SINGLE MASK GEM: FOIL SPLICING & FIRST

PROTOTYPE

The limit in width (~45 cm) due to the available

material is overcome “splicing” together two foils

with a ~3 mm wide local efficiency loss

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S. Duarte Pinto et al,

IEEE Nucl. Sci. Symp. Conf. Rec. (Dresden, Oct. 2008)

TWO-SECTORS TRIPLE-GEM PROTOTYPE FOR TOTEM T1

UPGRADE (60x60 cm2)

60 cm

Energy Resolution ~ 9.5 % (σ) at 8.9 keV

LARGE AREA MICROMEGAS FOR ATLAS MUON

CHAMBER UPGRADE11th

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MAMMA Micromegas Prototype

Gain and efficiency of the first prototype Space Resolution

SUMMARY AND..

MPGD are nowadays well-established technologies

New structures are under development, as well as

new studies to increase the maximum size of such

detectors

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Such R&D projects can take advantages by the sharing

of the resourses and the infrastructures, and many

groups joined in an international collaboration...

RD51: DEVELOPMENT OF

MPGD TECHNOLOGIES

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Collaboration of ~60 institutes

worldwide.

Approved by CERN’s Research

Board December 5, 2008

Collaboration Board Chair: Silvia Dalla Torre

Spokesman: Leszek Ropelewski, Maxim Titov

Workshops:

Amsterdam April 16-18, 2008 http://indico.cern.ch/conferenceDisplay.py?confId=25069

Paris, October 13-15, 2008 http://indico.cern.ch/conferenceDisplay.py?confId=35172

Crete (Greece), June 12-16, 2009 http://candia.inp.demokritos.gr/mpgd2009/

Public Web Site: http://rd51-public.web.cern.ch/RD51-Public/

“RD51 aims at facilitating the development of advancedgas-avalanche detector technologies and associated electronic-readout systems, for applications in basic and applied research.”

RD51 ORGANIZATION

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SPARE SLIDES

RD51 WORKING GROUP 4: SOFTWARE AND

SIMULATIONS

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Garfield GEMs Simulations

Garfield Micromegas Simulations Nebem Field Solver

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RD51 WORKING GROUP 5: ELECTRONICS

Medipix 3

Development of Scalable ReadOut-System

H. Van der Graaf ,

IEEE Nucl. Sci. Symp. Conf. Rec. (Dresden, October 2008)

ELECTRON TRACKS FROM 90Sr IN MAGNETIC FIELD (0.2 T):

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RD51 WORKING GROUP 6: PRODUCTION

NEW flex technology

South CoreaCIRE Group,

France

Large Area MPGD production and idustrialization

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RD51 WORKING GROUP 7: BEAM

TEST AND IRRADIATION FACILITIESRD51 Test Beam Area @ CERN (H4-SPS)

Goliath Magnet

Pictures from first

RD51 Beam Test in

June 2009

Next RD51 Beam

Test: from 22nd

October to 1st

November 2009

BACK UP SLIDES

29

INTRODUCTION OF MICRO-PATTERN

GAS DETECTORS (TECHNOLOGIES)11th

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Semiconductor Industry technology:

• Photolithography

• Etching

• Coating

• Doping

Operational instabilities:

Substrate charging-up

Discharges

Polymer deposition (ageing)

Rate Capability>106/mm2

Position Resolution ~40mm

2-track Resolution ~400mm

MWPCMSGC

Amplifying cell

reduction by

factor of 10

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MSGC - MICROSTRIP GAS CHAMBER11th

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Charge pre-amplification for ionization

released in high field close to cathode

MSGC: Discharge mechanisms

Field emission from the cathode edge

Very high ionization release:

avalanche size exceeds Reather’s limit

Q ~ 107

Uncoated MSGCCoated MSGC

Electric field strength close to support plane in MSGC

Surface resistivity modification