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RECENT DEVELOPMENTS ON
MICRO-PATTERN GASEOUS DETECTORS
TECHNOLOGY
Gabriele Croci (CERN & University of Siena) on behalf of RD51 Collaboration
11th ICATTP – Como (Villa Olmo) – 05-09/10/2009
Electrons
Ions
60 %
40 %
Micromegas GEM THGEM MHSP Ingrid
0.18 mm CMOS VLSI
CMOS high density
readout electronics
OUTLINE
Short history of gaseous detectors
Introduction to MPGDs
GEM and MicroMegas
Current and future trends of MPGDs
Large Area detectors
RD51 collaboration
11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
SHORT HISTORY OF GASEOUS DETECTORS11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
(MICRO-PATTERN) GAS DETECTORS11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
Advantages of gas detectors:
• low radiation length
• large areas at low price
• flexible geometry
• spatial, energy resolution …
Problem:
• rate capability limited by space charge defined by
the time of evacuation of positive ions
Solution Introduction of Micro Pattern Gas
Detectors
• reduction of the size of the detecting cell (limitation
of the length of the ion path) using chemical
etching techniques developed for microelectronics
and keeping at same time similar field shape.
MWPC
MSGC
MGD
scale factor
1
5
10
R. Bellazzini et al.
Semiconductor Industry technology:
• Photolithography
• Etching
• Coating
• Doping
MSGC - MICROSTRIP GAS CHAMBER11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
Surface charging
Bulk resistivity of the support material
Surface modification by doping or deposition
Ageing
Gas, Gas system, MSGC support, Construction
material
Discharges
Set of tiny metal strips engraved on a thin insulating support,
and alternatively connected as anodes and cathodes, the MSGC
relies for its operation on the same processes of avalanche
Multiplication as the multi-wire devices.
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
MSGC - MICROSTRIP GAS CHAMBER
-30
-25
-20
-15
-10
-5
0
5
10
0 10 20 30 40 50 60
Strip number (200 µm pitch)
MSGC Beam Event BW
fwhm~350µm
1.1
1.0
0.9
0.8
0.7
0.6
Re
lati
ve g
ain
6 7 8 9
0.12 3 4 5 6 7 8 9
12 3 4 5
Rate (MHz/mm2)
Vd= -3000V, V
c= -460V
Pestov glass coating
bulk
=1010
cm
bulk
=1011
cm
MSGC
INFN - Pisa
Source: 5.4 KeV Cr X-rays
Ne-DME (50/50)
Vd= -1000V, V
c= -564V
D263 uncoated
surface
=51017 /square
Spatial resolution = 34.5 0.4 mm
2-track resolution ~400 mm
Ne(25)-DME(75)
Vcath= -530 V
Vdrift= -3000 V
Rate capability > 1 MHz/mm2
Energy resolution ~11% for 5.9 keV
Single event display
Surface resistivity !!
MICROMEGAS – MICROMESH GASEOUS
STRUCTURE11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
Micromesh mounted above readout structure (typically
strips). E field similar to parallel plate detector.
Ea/Ei ~ 50 to secure electron transparency and positive ion
flowback supression.
Y.Giomataris et al, NIM A 376 (1996) 29
Ionanis Giomataris
MICROMEGAS – MICROMESH GASEOUS
STRUCTURE11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
D.Thers et al NIM A 469 (2001) 133
energy resolution ~ 10%
55 Fe
Ar + 10% C4H10
High voltage [V]
350 450400 500 550 600 650
103
102
104
105
gain
Gain
1
0.9
0.8
0.7
0.6
10-4
10-5
10-6
10-7
10-8
discharge probability
effic
ienc
y
efficiency & discharge probability
High Voltage [V]
1000 10000 20000 30000 Time[min]
ageing:Ar-iC4H10 94-6% up to 24.3mC/mm2
10 years LHC
1
0.8
0.6
1.8*1012 particles/mm2
MICROMEGAS – MICROMESH GASEOUS
STRUCTURE11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
s = 9 ns
420 V operating point
~3-4.103 Gain
Large efficiency plateau > 400 V
s =70 µm
Spatial resolution < 70 µm
Time resolution : 9 nsD.Thers et al NIM A 469 (2001) 133
GEM - GAS ELECTRON MULTIPLIER11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
Induction gap
e-
e-
I+
70 µm
55 µm
5 µm
50 µm
Thin, metal coated polyimide foil perforated
with high density holes.
Electrons are collected on patterned readout board.
A fast signal can be detected on the lower GEM electrode
for triggering or energy discrimination.
All readout electrodes are at ground potential.
Positive ions partially collected on the GEM electrodes.
Electrons
Ions
60 %
40 %
Fabio Sauli
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
A. Bressan et al, Nucl. Instr. and Meth. A425(1999)254
Full decoupling of the charge amplification
structure from the charge collection and
readout structure.
Both structures can be independently !
optimized
Compass Totem
Both detectors use three GEM foils in cascade for amplification
to reduce discharge probability by reducing field strenght.
Cartesian
Compass
Small angle
Hexaboard, pads
MICE
Mixed
Totem
33 cm
GEM - GAS ELECTRON MULTIPLIER
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
4.5 ns 4.8 ns
5.3 ns9.7 ns
Time resolution
Charge corellation (cartesian readout)
GEM - GAS ELECTRON MULTIPLIER
11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
Efficiency for minimum ionizing particles with 3 mm gap
Space resolution ~ 40 mm rmsCluster size ~ 500 mm FWHM
A. B
ressan
et al, N
ucl. In
str
. A
nd
Meth
. A
42
5(1
99
9)2
62
Rate capability > 106 Hz mm-2
GAIN ~ 104
Ar-CO2 70-30
1 mC~2.1010 min.ion. particles
C. Altunbas et al, DESY Aging Workshop (Nov. 2001) Nucl. Instr. and Meth. A
J. Benlloch et al, IEEE NS-45(1998)234
3.106 particles/mm2
GEM - GAS ELECTRON MULTIPLIER
CURRENT TRENDS IN MICRO-PATTERN GAS
DETECTORS (TECHNOLOGIES)11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
• MSGC
• Micromegas
• GEM
• Thick-GEM, Hole-Type Detectors and RETGEM
• MPDG with CMOS pixel ASICs
• Ingrid Technology
Electrons
Ions
60 %
40 %
Micromegas GEM THGEM MHSP Ingrid
0.18 mm CMOS VLSI
CMOS high density
readout electronics
CURRENT AND FUTURE APPLICATIONS OF MPGDS11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
COMPASS
NA48 / KABES
CAST (CERN Axial Solar Telescope)
nTOF (neutron beam profiles)
Laser MegaJoule
DEMIN (inertial confinement fusion)
Picollo (in-core neutron measurement)
T2K Time Projection Chamber
Linear Collider TPC (?)
ATLAS Muon System Upgrade (?)
COMPASS
LHCb Muon Detector
TOTEM Telescope
HBD (Hadron Blind Detector)
Cascade neutron detection
NA49 - upgrade
X-Ray Polarimeter (XEUS)
GEM TPC for LEGs, BoNuS
Linear Collider TPC (?)
KLOE2 vertex detector
DEVELOPMENT OF LARGE AREA DETECTORS11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
Bulk Micromegas Single mask GEM
Electrons
Ions
60 %
40 %
THGEM
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
Read-out
board
Laminated
Photo-image-
able cover lay
frame
Stretched mesh
on frame
Laminated
Photo-
image-able
cover lay
Raw material
Single side copper patterning
Polyimide etching
Copper reduction
Bulk Micromegas Single mask GEM
DEVELOPMENT OF LARGE AREA DETECTORS
SINGLE MASK GEM: FOIL SPLICING & FIRST
PROTOTYPE
The limit in width (~45 cm) due to the available
material is overcome “splicing” together two foils
with a ~3 mm wide local efficiency loss
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
S. Duarte Pinto et al,
IEEE Nucl. Sci. Symp. Conf. Rec. (Dresden, Oct. 2008)
TWO-SECTORS TRIPLE-GEM PROTOTYPE FOR TOTEM T1
UPGRADE (60x60 cm2)
60 cm
Energy Resolution ~ 9.5 % (σ) at 8.9 keV
LARGE AREA MICROMEGAS FOR ATLAS MUON
CHAMBER UPGRADE11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
MAMMA Micromegas Prototype
Gain and efficiency of the first prototype Space Resolution
SUMMARY AND..
MPGD are nowadays well-established technologies
New structures are under development, as well as
new studies to increase the maximum size of such
detectors
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
Such R&D projects can take advantages by the sharing
of the resourses and the infrastructures, and many
groups joined in an international collaboration...
RD51: DEVELOPMENT OF
MPGD TECHNOLOGIES
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
Collaboration of ~60 institutes
worldwide.
Approved by CERN’s Research
Board December 5, 2008
Collaboration Board Chair: Silvia Dalla Torre
Spokesman: Leszek Ropelewski, Maxim Titov
Workshops:
Amsterdam April 16-18, 2008 http://indico.cern.ch/conferenceDisplay.py?confId=25069
Paris, October 13-15, 2008 http://indico.cern.ch/conferenceDisplay.py?confId=35172
Crete (Greece), June 12-16, 2009 http://candia.inp.demokritos.gr/mpgd2009/
Public Web Site: http://rd51-public.web.cern.ch/RD51-Public/
“RD51 aims at facilitating the development of advancedgas-avalanche detector technologies and associated electronic-readout systems, for applications in basic and applied research.”
RD51 ORGANIZATION
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
RD51 WORKING GROUP 4: SOFTWARE AND
SIMULATIONS
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
Garfield GEMs Simulations
Garfield Micromegas Simulations Nebem Field Solver
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
RD51 WORKING GROUP 5: ELECTRONICS
Medipix 3
Development of Scalable ReadOut-System
H. Van der Graaf ,
IEEE Nucl. Sci. Symp. Conf. Rec. (Dresden, October 2008)
ELECTRON TRACKS FROM 90Sr IN MAGNETIC FIELD (0.2 T):
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
RD51 WORKING GROUP 6: PRODUCTION
NEW flex technology
South CoreaCIRE Group,
France
Large Area MPGD production and idustrialization
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
RD51 WORKING GROUP 7: BEAM
TEST AND IRRADIATION FACILITIESRD51 Test Beam Area @ CERN (H4-SPS)
Goliath Magnet
Pictures from first
RD51 Beam Test in
June 2009
Next RD51 Beam
Test: from 22nd
October to 1st
November 2009
INTRODUCTION OF MICRO-PATTERN
GAS DETECTORS (TECHNOLOGIES)11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
Semiconductor Industry technology:
• Photolithography
• Etching
• Coating
• Doping
Operational instabilities:
Substrate charging-up
Discharges
Polymer deposition (ageing)
Rate Capability>106/mm2
Position Resolution ~40mm
2-track Resolution ~400mm
MWPCMSGC
Amplifying cell
reduction by
factor of 10
30
MSGC - MICROSTRIP GAS CHAMBER11th
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roci (C
ER
N &
Unive
rsity
of S
iena)
Charge pre-amplification for ionization
released in high field close to cathode
MSGC: Discharge mechanisms
Field emission from the cathode edge
Very high ionization release:
avalanche size exceeds Reather’s limit
Q ~ 107
Uncoated MSGCCoated MSGC
Electric field strength close to support plane in MSGC
Surface resistivity modification