© Quicktronics PCB & Electronic Service GmbH 2009 Company profile Shantou Lucky Star PCB Co., Ltd

© Quicktronics PCB & Electronic Service GmbH 2009

Company profile

Shantou Lucky Star PCB Co., Ltd.



General Information

• Established Time : Year 2000(was Gaohui PCB until Aug. 2008)

• Number of Staff : at the average of 500

• Specialized in : double-sided and multi-layer PCB with high density and top grade quality

• Production Capacity : 250,000FT2 /month

• Total plant scale : approx. 15,000M2



Equiptment & Plant

• DRILL ROOM• SCHMOLL DRILLER

Six-spindle NC Drill Machine

Usage :

finish hole processing of PCB

Feature :

1)Spindle Speed : 20～180krpm

2)Drilling Accuracy : +/-0.8mil


Equiptment & Plant

• COPPER PLATING SYSTEM

DESMEAR+PTH+PP

Usage :

finish the process of PTH of PCB

Feature :

COV<=8%




Equiptment & Plant

• INTECH INNERLAYER PRE-TREATMENT

Usage :finish the pre- processing of inner layer film lamination or coating Feature :capability of produce 0.1~2.0mm (not include cu. )board stably


• UNIVERSAL OUTLAYER PRE-TREATMENT

Usage:finish the pre-treatment of outer layer film lamination Feature:produce 0.4~3.2mm board stably


Equiptment & Plant



Equiptment & Plant

• EXPOSAL ROOM• BACHER CCD EXPOSAL

MACHINE

CCD adjustment

Usage:

finish exposal process of inner layer board

Feature:

accuracy : +/-10um


• INNER DES LINE, TAIWAN INTECHUsage :finish process of developing, etching, stripping of inner layer of board

Feature :1)produce 0.1~2.0mm(not include cu.) board stably 2)min. width &space of line can be 3/3 mil


Equiptment & Plant


• INSPECTION ROOM• ORBOTECH AOI

Inspection System SPIRON & SK-75&VRS

Usage :scan the integrity of pattern by optical principle

Feature :effective and with capability of inspecting min. line width of 45um


Equiptment & Plant



Equiptment & Plant

• INTECH HORIZONTAL BROWN OXIDE TREATMENT

Usage :finish brown oxide treatment of inner layer board

Feature :produce 0.1~2.0mm(not include cu.) board stably



Equiptment & Plant

• 5 OPEN LAMINATION MACHINES,TAIWAN LIENCHIENUsage :link with vacuum hot-press system

Feature :totally hot stove 20 open , cold stove 10 open



Equiptment & Plant

• SILK SCREEN

• SOLDER-MASK EXPOSURE

Silk Screen Machines

Usage :finish process of solder mask of PCBFeature :oblique arm type , horizontal type, etc.



Equiptment & Plant

• BAKING TUNNEL

Auto-Temperature-Control System

Usage :finish pre-baking process after liquid film

Feature :be able to reach the temperature of +/-1 under continuously producing ℃



Equiptment & Plant

• AUTOMATIC ROUTING MACHINE

Six Spindle NC Routing Machine

Usage :finish routing PCB

Feature :accuracy of +/-3mil



Equiptment & Plant

• PHYSICAL ANALYSIS LAB

CHEMICAL ANALYSIS LAB



Equiptment & Plant

• JAPANESE EMMA ELX6146 Automatic Fly PCB Test

Usage :quickly E-Test sample without testing moldFeature :1)min. Pad Pitch test can reach 180um 2)min. Pad Size test reach 100um

E-Test Machine

Types : 10240 & 6144 testVoltage : 50~300V Continuity Test : 5~100Ω Insulation Test : 1M~100M Ω

• MASON E-TESTER



Equiptment & Plant

• FINAL QC ROOM



Equiptment & Plant

• WAREHOUSE



CapabilityItem Technical Parameter Remark

Layers 2～ 20 14~20 sample

Min. Inner Layer Board Thickness 0.1mm Core

Max. Board Size 570mm×490mm

Min. Line Width 4mil

Min. Space 4mil

Min. Through Hole Size 0.15mm

PTH Wall Thickness 0.025mm

PTH Hole Dia. Tolerance

±0.05mm φ≤0.8mm

±0.08mm φ＞ 0.8mm

NPTH Hole Dia. Tolerance ±0.05mm



CapabilityItem Technical Parameter Remark

Hole Position Deviation ±0.05mm

Outline Tolerance ±0.10mm

Insulation Resistance 1012ΩNormal

Aspect Ratio ≤10:1

Thermal Stress 288 10Sec 3 Cycles℃

Bow and Twist ≤0.7%

Dielectric Strength ＞ 1.3KV/mm

Peel Strength ＞ 1.4N/mm

Solder Mask Hardness ＞ 6H

Flammability 94V-0



Technical Road Map

2008 2009 2010

10 12 14

8L 8 7 712L 9 8 8

Plating AR 9:1 10:1 10:1

1/2OZ 3mil/3mil 2.5mil/2.5mil 2.5mil/2.5mil

1OZ 3.5mil/3.5mil 3mil/3mil 3mil/3mil

2OZ 5.5/5.5mil 5mil/5mil 5mil/5mil

3OZ 9mil/9mil 8mil/8mil 8mil/8mil

Min. Space Between Hole and Line

Machine Drilliing

0.15mmMin. Drilling Dia.

Min. Line/Space (Final Cu.Thickness of

Inner Layer)

Year

6

Layer

4L 6,5 6

0.20mm 0.15mm



Technical Road Map

1OZ 3.5mil/3.5mil 3mil/3mil 3mil/3mil1.5OZ 4.5mil/4.5mil 4mil/4mil 4mil/4mil2OZ 5.5mil/5.5mil 5mil/5mil 5mil/5mil3OZ 9mil/9mil 8mil/8mil 8mil/8mil4OZ 11mil/11mil 10mil/10mil 10mil/10mil

0.2-4.0mm

punch ,bevel edge±3mil ±2mil ±2milMolding Tolerance

Final Board thickness 0.2mm-6.0mm

Special ProcessesCeramic Board

HDIAluminum

Base Board

Molding Process ---

Chemical Tin,Immersi

on silver Surface Treatment ENIG ---

Min. Line/Space (Final Cu.Thickness of

Outer Layer)


• Advanced Technology• Exact Workmanship• Continuous Improvement• Customer Satisfaction

Quality Policy




Quality Target

• Rate of outgoing product accepted 99% • Rate of on time delivery ≥ 95%• Rate of Customer satisfaction ≥ 95%

Documents

© Quicktronics PCB & Electronic Service GmbH 2009 Company profile Shantou Lucky Star PCB Co., Ltd