• About Us

• Milestones

• Global Footprint

• Our Leading Customers

• Semiconductors

o Wire Bonders

o Consumables

• Customized Fine Machining

• Thin Film Coating

• Quality Assurance

• Why Choose MPP ?

• Young, dynamic company with YOY growth of 15 – 20%

• Formerly a division of K&S “Micro Swiss”

• The foundation of MPP is the know-how, technology and experienced engineering and

sales teams acquired from K&S “Micro Swiss”

• A leading provider of wire bonding machinery and consumable tools for the semiconductor

and microelectronic device assembly industry

• Providing uniquely designed and standard tools and parts for the Medical, Aerospace and

Military Industries

• Headquarters and manufacturing sites are located in northern Israel

• 120 employees

• Sales and distribution networks support more than 500 customers in over 20 countries

around the globe.

• Ongoing research and development in collaboration with leading establishments in Israel:

o The Israeli Chief Scientist

o The Israeli Investment Center

o Technion – The Israel Institute of Technology

2010 - MPP is founded. Multiple production lines were purchased from KNS

2013 - USP Patent filed

2014 - Acquisition of Thin Films

2015 - Cornerstone laid for MPP’s new facility is Israel

2016 - Acquisition of MWB

Experienced technical and sales teams support customers worldwide

NA Sales Office

Headquarters Yokneam, Israel

Application support China

Manual Wire Bonders

• Offering top-of-the-line bench top wire bonding systems

The advanced IBOND 5000 series includes four models:

• Ball

• Wedge

• Dual

• HWW

The 4500 Series includes two models:

• Ball

• Wedge

• High yield and excellent repeatability for a wide variety of

• Easy implementation and low operating costs

• Designed for a wide range of wire diameters

Heavy Wire Wedge

• Suitable for all wedge bonder models

• Innovative, customized and unique designs that optimize bonding performance

• Competitive pricing

• Flexible production and short lead time

• Wire diameters ranging from 75 um to 300 um

• Applications : power devices, automotive, solar, home appliances

Wedge Bonding Tools

• For standard and customized applications: fine pitch, deep access, COB, Ribbon

• For accurate and consistent bonding

• Suitable for all types of bonders

• For gold or aluminum wire applications

• Patented wedge bonding tool (UFP) for ultra fine pitch applications

Consumable Tooling for All Your Packaging and Wire Bonding

Requirements

Die Collets

• For high accuracy in die positioning

• Closed or open collet designs are available (4 or 2 side walls)

• Minimum contact with die surface

• Strong grip

Pick up Tools

• For use with all pick and place equipment

• Wide variety of materials are available (plastics, ceramics, carbides and metals)

as per customers’ requirements

• Can achieve accurate die positioning

• Designed for use in environments with a range of temperatures

• Suitable for variety of die attach processes

Push up needles

• For automatic die bonding machines

• Designed as per customer’s specifications

Die Bonding Tools for Die Attach and Flip Chip Processes

Four-Point Probe Heads

• For measuring resistivity during the wafer incoming procedure

• A wide range of needle tip radii, spacing and arrays are available

• Independently adjusted pressure of each needle eliminates tolerance variables

• High breakdown voltage with low leakage

SJB Tools

• Leading designer and manufacturer of dispensing tools for Solder Jet Bonding

• For use with highly accurate “capillary” manufactured from WC

• Minimum ID is 40µ

• Applications include HGA & HSA assembly in the HDD industry, Bumping

processes in Flip Chip applications

High Precision Solutions

• Cutting edge precision technologies provide customized, complex machined

components and tooling to aerospace, medical, automotive and military

industries.

• Skilled and creative engineering facilitates optimization of design and process

while meeting stringent tolerances and quality requirements

• Machine line-up includes 5 axis CNC, lathing and turning machines, EDM

• Variety of material options are available as per customers’ requirements

• From prototype volumes to serial production

• Short lead times

Unique Patented Process

• Thin protective glasslike coatings using HVCS technology (high voltage cold

sputtering)

• HVCS Technology operates at low temperatures of 30˚-150˚C and creates an

amorphous thin film

• Variety of ceramic and metal coatings available

• Successful application in microelectronics, optics, medical, aerospace, machining

tools and precision mechanics

Advantages

• Increases wear resistance and therefore prolongs life span of bonding tools,

cutting/machining tools, gears, bearings and plastic molds

• Increases resistivity to contamination on die handling tools, bonding tools and

vacuum tip tools

• Provides anti-corrosive coating and increases surface protection in aggressive

environmental conditions.

• Coating thickness ranges from 0.2 – 3 µ

• Operates as an optical reflector

Commitment to deliver best-in-class quality

Customized control features throughout the entire production process

State-of-the-art measuring equipment

Continuous improvements for environmental protection and minimization of waste.

International Standards:

Certified:

ISO 9001:2008

ISO 14001:2004

In process:

ISO 18001

AS9100

ISO 13485

RoHS Compliance

Outstanding Quality:

• High Quality products

• Consistent results

• Conformance with the highest international standards

Advanced Engineering:

• Experts in our field

• Continuous development of new products and processes

• State-of-the-art machinery

Service excellence:

• Competitive pricing

• Short lead times

• Localized sales and technical support

• Customized solutions